CN115244654A - 保护膜形成用片 - Google Patents
保护膜形成用片 Download PDFInfo
- Publication number
- CN115244654A CN115244654A CN202180020576.2A CN202180020576A CN115244654A CN 115244654 A CN115244654 A CN 115244654A CN 202180020576 A CN202180020576 A CN 202180020576A CN 115244654 A CN115244654 A CN 115244654A
- Authority
- CN
- China
- Prior art keywords
- protective film
- bump
- meth
- acrylate
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020043406 | 2020-03-12 | ||
JP2020-043406 | 2020-03-12 | ||
PCT/JP2021/009704 WO2021182554A1 (ja) | 2020-03-12 | 2021-03-11 | 保護膜形成用シート |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115244654A true CN115244654A (zh) | 2022-10-25 |
Family
ID=77670655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180020576.2A Pending CN115244654A (zh) | 2020-03-12 | 2021-03-11 | 保护膜形成用片 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2021182554A1 (ja) |
KR (1) | KR20220152208A (ja) |
CN (1) | CN115244654A (ja) |
TW (1) | TW202138190A (ja) |
WO (1) | WO2021182554A1 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4012375B2 (ja) * | 2001-05-31 | 2007-11-21 | 株式会社ルネサステクノロジ | 配線基板およびその製造方法 |
KR100958652B1 (ko) | 2005-07-01 | 2010-05-20 | 닛코킨조쿠 가부시키가이샤 | 고순도 주석 또는 주석 합금 및 고순도 주석의 제조방법 |
JP5822250B2 (ja) | 2010-03-31 | 2015-11-24 | Jx日鉱日石金属株式会社 | α線量が少ない銀又は銀を含有する合金及びその製造方法 |
WO2012120982A1 (ja) | 2011-03-07 | 2012-09-13 | Jx日鉱日石金属株式会社 | α線量が少ない銅又は銅合金及び銅又は銅合金を原料とするボンディングワイヤ |
JP5282113B2 (ja) * | 2011-03-22 | 2013-09-04 | リンテック株式会社 | 基材フィルムおよび該基材フィルムを備えた粘着シート |
-
2021
- 2021-03-11 JP JP2022507270A patent/JPWO2021182554A1/ja active Pending
- 2021-03-11 KR KR1020227029886A patent/KR20220152208A/ko unknown
- 2021-03-11 CN CN202180020576.2A patent/CN115244654A/zh active Pending
- 2021-03-11 WO PCT/JP2021/009704 patent/WO2021182554A1/ja active Application Filing
- 2021-03-12 TW TW110108840A patent/TW202138190A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20220152208A (ko) | 2022-11-15 |
TW202138190A (zh) | 2021-10-16 |
WO2021182554A1 (ja) | 2021-09-16 |
JPWO2021182554A1 (ja) | 2021-09-16 |
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Legal Events
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PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |