CN115230287B - 一种覆铜板的制备方法 - Google Patents
一种覆铜板的制备方法 Download PDFInfo
- Publication number
- CN115230287B CN115230287B CN202210863381.0A CN202210863381A CN115230287B CN 115230287 B CN115230287 B CN 115230287B CN 202210863381 A CN202210863381 A CN 202210863381A CN 115230287 B CN115230287 B CN 115230287B
- Authority
- CN
- China
- Prior art keywords
- stirring
- parts
- copper
- clad plate
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 238000003756 stirring Methods 0.000 claims abstract description 62
- 238000006243 chemical reaction Methods 0.000 claims abstract description 37
- 239000003063 flame retardant Substances 0.000 claims abstract description 21
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 239000002994 raw material Substances 0.000 claims abstract description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 239000011256 inorganic filler Substances 0.000 claims abstract description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 10
- 239000003960 organic solvent Substances 0.000 claims abstract description 10
- 239000004744 fabric Substances 0.000 claims abstract description 8
- 239000003365 glass fiber Substances 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 230000001804 emulsifying effect Effects 0.000 claims abstract description 6
- 238000007731 hot pressing Methods 0.000 claims abstract description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 26
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 24
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 21
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 20
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 13
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 13
- 229920000570 polyether Polymers 0.000 claims description 13
- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 claims description 12
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 11
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 10
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- HAQLHRYUDBKTJG-UHFFFAOYSA-N 3,5-dihydroxybenzaldehyde Chemical compound OC1=CC(O)=CC(C=O)=C1 HAQLHRYUDBKTJG-UHFFFAOYSA-N 0.000 claims description 9
- 238000002390 rotary evaporation Methods 0.000 claims description 9
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 8
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 7
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 239000012279 sodium borohydride Substances 0.000 claims description 7
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 7
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims 2
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 8
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000000284 extract Substances 0.000 description 6
- 239000000706 filtrate Substances 0.000 description 6
- 238000001914 filtration Methods 0.000 description 6
- 230000007935 neutral effect Effects 0.000 description 6
- 238000007792 addition Methods 0.000 description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- SPAUYKHQVLTCOL-UHFFFAOYSA-N C1(=CC=CC=C1)OP(OC1=CC=CC=C1)(O)=O.C1(=CC=CC=C1)C Chemical group C1(=CC=CC=C1)OP(OC1=CC=CC=C1)(O)=O.C1(=CC=CC=C1)C SPAUYKHQVLTCOL-UHFFFAOYSA-N 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000003995 emulsifying agent Substances 0.000 description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 4
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- IMKCTLWSQVQFHW-UHFFFAOYSA-N C(C)C=1NC=CN1.C(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C(C)C=1NC=CN1.C(C1=CC=CC=C1)C1=CC=CC=C1 IMKCTLWSQVQFHW-UHFFFAOYSA-N 0.000 description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 239000012295 chemical reaction liquid Substances 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000010907 mechanical stirring Methods 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 2
- 239000012796 inorganic flame retardant Substances 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PAPPEKHULAQSEJ-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)propanenitrile Chemical compound N#CC(C)C1=NC=CN1 PAPPEKHULAQSEJ-UHFFFAOYSA-N 0.000 description 1
- QKVROWZQJVDFSO-UHFFFAOYSA-N 2-(2-methylimidazol-1-yl)ethanamine Chemical compound CC1=NC=CN1CCN QKVROWZQJVDFSO-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6666—Compounds of group C08G18/48 or C08G18/52
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2475/04—Polyurethanes
- C08J2475/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K3/2279—Oxides; Hydroxides of metals of antimony
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34922—Melamine; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明涉及一种覆铜板的制备方法,属于覆铜板制备领域,包括以下步骤:准备以下重量份原料:双酚A型环氧树脂120‑180份、增粘组分15‑25份、阻燃剂20‑25份、无机填料5‑15份、有机溶剂20‑40份、固化剂25‑30份、固化促进剂1‑5份;将上述原料加入反应釜中,25‑30℃下搅拌,乳化,静置,得到胶液;将胶液涂覆于玻璃纤维布上,在120‑250℃下烘烤1.5‑2.5min,得到半固化片;将半固化片裁剪与铜箔叠合,热压,得到覆铜板;本发明在传统环氧树脂胶液中加入增韧组分,增韧树脂和环氧树脂之间形成互穿网络,基于增粘组分中柔性链和功能组分的存在,不仅提高环氧树脂的韧性,还能提高其粘性。
Description
技术领域
本发明属于覆铜板制备技术领域,具体地,涉及一种覆铜板的制备方法。
背景技术
覆铜箔层压板(简称覆铜板Copper Clad Laminate,CCL)广泛用于制造各类家用电器、电子信息产品及工业电子产品所用印刷电子板(简称PCB)。覆铜板作为印刷电路板的基板材料必须具备一定的阻燃性能才能满足电子类产品的需求,常规的覆铜板由树脂、玻璃纤维布、铜箔等组成,其中玻璃纤维布、铜箔是不燃或难燃的,所述要实现覆铜板的阻燃就必须从提高树脂的阻燃性入手,随着人们环保意识的提高,含溴等含卤阻燃树脂被淘汰,代替的是加入大量有机阻燃剂或者无机阻燃剂,目前有机阻燃剂分子量较低,容易迁移,无机阻燃剂的过量加入会降低环氧树脂与基材的粘接面积,进而使得粘接强度下降,因此,提供一种无卤阻燃且剥离强度大的覆铜板是目前需要解决的技术问题。
发明内容
为了解决背景技术中提到的技术问题,本发明提供一种覆铜板的制备方法。
本发明的目的可以通过以下技术方案实现:
一种覆铜板的制备方法,包括以下步骤:
第一步、准备以下重量份原料:双酚A型环氧树脂120-180份、增粘组分15-25份、阻燃剂20-25份、无机填料5-15份、有机溶剂20-40份、固化剂25-30份、固化促进剂1-5份;将上述原料加入反应釜中,25-30℃下搅拌3-5h,然后利用高速乳化剂进行乳化1.5-2.5h,最后在反应釜中放置8-10h,得到胶液;
第二步、将胶液涂覆于玻璃纤维布上,上胶线速控制为10-20m/min,然后在120-250℃下烘烤1.5-2.5min,得到半固化片;将半固化片裁剪成同样尺寸大小,再与铜箔叠合,一起置于压机钢板模具内经压力20-25MPa、180-190℃下热压1.5-2h,冷却,得到覆铜板。
进一步地,增粘组分由以下步骤制成:
将聚醚二元醇在105-110℃下真空旋蒸4h备用,氮气保护下,将甲苯二异氰酸酯加入反应器中,搅拌下升温至80℃,加入旋蒸后的聚醚二元醇和二月硅酸二丁基锡,搅拌反应0.5-1h后,升温至85-88℃,加入功能组分,搅拌反应3-4h,反应结束后,冷却至室温,得到增粘组分;
其中,聚醚二元醇的分子量为1000-2000,甲苯二异氰酸酯、聚醚二元醇和功能组分的质量比为5.8-6.1:14.5-15:3.2-3.5,二月硅酸二丁基锡用量为甲苯二异氰酸酯、聚醚二元醇和功能组分质量和的0.3%。
进一步地,功能组分由以下步骤制成:
步骤X1、将3,5-二羟基苯甲醛和环氧氯丙烷加入装有机械搅拌、冷凝回流、加料漏斗以及氮气入口的圆底烧瓶中,边搅拌边升温至90-95℃,加入苄基三乙基氯化铵,搅拌反应5-6h,减压蒸馏去除反应液中过量的环氧氯丙烷,然后加入甲苯搅拌0.5h,控制反应温度33℃,加入氢氧化钠,保温搅拌2h后升温至73-75℃搅拌反应2h,反应结束后,过滤,加入去离子水调节滤液呈中性,分液,有机层由无水硫酸钠干燥后,旋蒸去除甲苯,得到中间体1,3,5-二羟基苯甲醛、环氧氯丙烷和氢氧化钠摩尔比为1:6-8:2.4,苄基三乙基氯化铵用量为3,5-二羟基苯甲醛质量的2%,先利用3,5-二羟基苯甲醛的酚羟基与环氧氯丙烷发生脱去HCI反应,得到中间体1;
步骤X2、向三口烧瓶中加入中间体1、氯仿和甲醇,搅拌10-15min后,控制反应温度0℃,分三次等量加入硼氢化钠,每次间隔3-5min,保温搅拌饭4h,随后加入去离子水搅拌0.5h,反应结束后,用氯仿多次萃取,合并萃取液,用蒸馏水洗涤萃取液至中性,加入无水硫酸钠干燥,再旋蒸去除氯仿,得到中间体2,中间体1、氯仿、甲醇和硼氢化钠的用量比为2.49g:40-50mL:20-30mL:1.1-1.4g,以硼氢化钠为还原剂,将中间体1的羧基还原成羟基,得到中间体2;
步骤X3、将中间体2、3-氨基丙烷-1-磷酸和DMF加入三口烧瓶中,搅拌2-3min后加入碳酸钾,搅拌10-15min后升温至60-70℃,搅拌反应8-10h,反应结束后,冷却至室温后,过滤,滤液减压蒸馏去除DMF,得到功能组分,中间体2、3-氨基丙烷-1-磷酸、DMF和碳酸钾用量为2.5-2.8g:3.2-3.6g:60-80mL:3.5g,在碱性条件下,使中间体2中的环氧基与3-氨基丙烷-1-磷酸的氨基发生开环反应,得到含有苯环、多个羟基和磷酸基的功能组分。
进一步地,阻燃剂为磷酸甲苯二苯酯、三氧化二锑和三聚氰胺按照质量比1-3:2:1-3组成。
进一步地,固化剂为双氰胺或二氨基二苯砜。
进一步地,固化促进剂为咪唑、1-苄基苯-2-乙基咪唑、2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、1-氨基乙基-2-甲基咪唑和1-氰乙基咪唑中一种或多种按照任意比例混合。
进一步地,无机填料为氢氧化镁、氢氧化铝、滑石粉和硫酸钡中一种或多种按照任意比例混合。
进一步地,有机溶剂为丙二醇甲醚、丙二醇甲醚醋酸酯、环己酮、丁酮、丙酮、甲醇和二甲苯中一种或多种按照任意比例混合。
本发明的有益效果:
为了克服现有覆铜板由于大量阻燃剂加入导致粘接性差的问题,本发明在传统环氧树脂胶液中加入增韧组分,该增粘组分为功能组分改性的聚氨酯树脂,增韧树脂和环氧树脂之间形成互穿网络,基于增粘组分中柔性链和功能组分的存在,不仅提高环氧树脂的韧性,还能提高其粘性,粘性具体体现于功能组分中磷酸基的存在,基于磷酸基能够与金属发生螯合作为特性,在金属铜箔表面形成一层稳定的有机磷酸盐膜,提高胶料与铜箔之间的附着力,并且磷酸基的存在能够发挥磷系阻燃剂的特性,与胶料中阻燃剂协同发挥阻燃作用,综上,本发明制备的覆铜板不仅具有优异的阻燃性,还具有较强的粘接性。
具体实施方式
下面将结合本发明实施例,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
实施例1
一种功能组分,由以下步骤制成:
步骤X1、将0.1mol 3,5-二羟基苯甲醛和0.6mol环氧氯丙烷加入装有机械搅拌、冷凝回流、加料漏斗以及氮气入口的圆底烧瓶中,边搅拌边升温至90℃,加入0.27g苄基三乙基氯化铵,搅拌反应5h,减压蒸馏去除反应液中过量的环氧氯丙烷,然后加入甲苯搅拌0.5h,控制反应温度33℃,加入9.6g氢氧化钠,保温搅拌2h后升温至73-75℃搅拌反应2h,反应结束后,过滤,加入去离子水调节滤液呈中性,分液,有机层由无水硫酸钠干燥后,旋蒸去除甲苯,得到中间体1;
步骤X2、向三口烧瓶中加入2.5g中间体1、40mL氯仿和20mL甲醇,搅拌10min后,控制反应温度0℃,分三次等量加入共1.1g硼氢化钠,每次间隔3min,保温搅拌饭4h,随后加入去离子水搅拌0.5h,反应结束后,用氯仿多次萃取,合并萃取液,用蒸馏水洗涤萃取液至中性,加入无水硫酸钠干燥,再旋蒸去除氯仿,得到中间体2;
步骤X3、将2.5g中间体2、3.2g 3-氨基丙烷-1-磷酸和60mL DMF加入三口烧瓶中,搅拌2min后加入3.5g碳酸钾,搅拌10min后升温至60℃,搅拌反应8h,反应结束后,冷却至室温后,过滤,滤液减压蒸馏去除DMF,得到功能组分。
实施例2
一种功能组分,由以下步骤制成:
步骤X1、将0.1mol 3,5-二羟基苯甲醛和0.8mol环氧氯丙烷加入装有机械搅拌、冷凝回流、加料漏斗以及氮气入口的圆底烧瓶中,边搅拌边升温至95℃,加入0.27g苄基三乙基氯化铵,搅拌反应6h,减压蒸馏去除反应液中过量的环氧氯丙烷,然后加入甲苯搅拌0.5h,控制反应温度33℃,加入9.6g氢氧化钠,保温搅拌2h后升温至75℃搅拌反应2h,反应结束后,过滤,加入去离子水调节滤液呈中性,分液,有机层由无水硫酸钠干燥后,旋蒸去除甲苯,得到中间体1;
步骤X2、向三口烧瓶中加入2.5g中间体1、50mL氯仿和30mL甲醇,搅拌15min后,控制反应温度0℃,分三次等量加入共1.4g硼氢化钠,每次间隔5min,保温搅拌饭4h,随后加入去离子水搅拌0.5h,反应结束后,用氯仿多次萃取,合并萃取液,用蒸馏水洗涤萃取液至中性,加入无水硫酸钠干燥,再旋蒸去除氯仿,得到中间体2;
步骤X3、将2.8g中间体2、3.6g 3-氨基丙烷-1-磷酸和80mL DMF加入三口烧瓶中,搅拌3min后加入3.5g碳酸钾,搅拌15min后升温至70℃,搅拌反应10h,反应结束后,冷却至室温后,过滤,滤液减压蒸馏去除DMF,得到功能组分。
实施例3
一种增粘组分,由以下步骤制成:
将聚醚二元醇在105℃下真空旋蒸4h备用,氮气保护下,将5.8g甲苯二异氰酸酯加入反应器中,搅拌下升温至80℃,加入14.5g旋蒸后的聚醚二元醇和二月硅酸二丁基锡,搅拌反应0.5h后,升温至85℃,加入3.2g实施例1功能组分,搅拌反应3h,反应结束后,冷却至室温,得到增粘组分,二月硅酸二丁基锡用量为甲苯二异氰酸酯、聚醚二元醇和功能组分质量和的0.3%。
实施例4
一种增粘组分,由以下步骤制成:
将聚醚二元醇在110℃下真空旋蒸4h备用,氮气保护下,将6.1g甲苯二异氰酸酯加入反应器中,搅拌下升温至80℃,加入15g旋蒸后的聚醚二元醇和二月硅酸二丁基锡,搅拌反应1h后,升温至88℃,加入3.5g实施例2功能组分,搅拌反应4h,反应结束后,冷却至室温,得到增粘组分,二月硅酸二丁基锡用量为甲苯二异氰酸酯、聚醚二元醇和功能组分质量和的0.3%。
对比例1
将实施例3中功能组分去除,其余原料及制备过程同实施例3。
对比例2
将实施例4中功能组分替换成3-氨基丙烷-1-磷酸,其余原料及制备过程同实施例4。
实施例5
一种覆铜板的制备方法,包括以下步骤:
第一步、准备以下重量份原料:双酚A型环氧树脂120份、实施例3增粘组分15份、阻燃剂20份、无机填料5份、有机溶剂20份、固化剂25份、固化促进剂1份;将上述原料加入反应釜中,25℃下搅拌3h,然后利用高速乳化剂进行乳化1.5h,最后在反应釜中放置8h,得到胶液;
第二步、将胶液涂覆于玻璃纤维布上,上胶线速控制为10m/min,然后在120℃下烘烤2.5min,得到半固化片;将半固化片裁剪成同样尺寸大小,再与铜箔叠合,一起置于压机钢板模具内经压力20MPa、190℃下热压1.5h,冷却,得到覆铜板。
其中,阻燃剂为磷酸甲苯二苯酯、三氧化二锑和三聚氰胺按照质量比1:2:1组成,固化剂为双氰胺,固化促进剂为咪唑,无机填料为氢氧化镁,有机溶剂为丙二醇甲醚。
实施例6
一种覆铜板的制备方法,包括以下步骤:
第一步、准备以下重量份原料:双酚A型环氧树脂160份、实施例4增粘组分20份、阻燃剂23份、无机填料10份、有机溶剂30份、固化剂28份、固化促进剂3份;将上述原料加入反应釜中,28℃下搅拌4h,然后利用高速乳化剂进行乳化2h,最后在反应釜中放置9h,得到胶液;
第二步、将胶液涂覆于玻璃纤维布上,上胶线速控制为15m/min,然后在200℃下烘烤2.3min,得到半固化片;将半固化片裁剪成同样尺寸大小,再与铜箔叠合,一起置于压机钢板模具内经压力22MPa、185℃下热压1.8h,冷却,得到覆铜板。
其中,阻燃剂为磷酸甲苯二苯酯、三氧化二锑和三聚氰胺按照质量比2:2:2组成,固化剂为二氨基二苯砜,固化促进剂为1-苄基苯-2-乙基咪唑,无机填料为氢氧化铝和滑石粉为质量比1:1组成,有机溶剂为丙二醇甲醚醋酸酯。
实施例7
一种覆铜板的制备方法,包括以下步骤:
第一步、准备以下重量份原料:双酚A型环氧树脂180份、实施例3增粘组分25份、阻燃剂25份、无机填料15份、有机溶剂40份、固化剂30份、固化促进剂5份;将上述原料加入反应釜中,30℃下搅拌5h,然后利用高速乳化剂进行乳化2.5h,最后在反应釜中放置10h,得到胶液;
第二步、将胶液涂覆于玻璃纤维布上,上胶线速控制为10-20m/min,然后在250℃下烘烤2.5min,得到半固化片;将半固化片裁剪成同样尺寸大小,再与铜箔叠合,一起置于压机钢板模具内经压力25MPa、190℃下热压2h,冷却,得到覆铜板。
其中,阻燃剂为磷酸甲苯二苯酯、三氧化二锑和三聚氰胺按照质量比3:2:3组成,固化剂为二氨基二苯砜,固化促进剂为1-苄基苯-2-乙基咪唑,无机填料为氢氧化铝,有机溶剂为丙二醇甲醚醋酸酯。
对比例3
将实施例5中增粘组分替换成对比例1中物质,其余原料及制备过程同实施例5。
对比例4
将实施例6中增粘组分替换成对比例2中物质,其余原料及制备过程同实施例6。
将实施例5-7和对比例3-4所制备的覆铜板进行测试,参考标准GB/T4723-1992进行检测,检测结果如表1所示:
表1
项目 | 阻燃性(UL94) | 剥离强度(N/mm) |
实施例5 | V-0 | 1.94 |
实施例6 | V-0 | 1.96 |
实施例7 | V-0 | 1.91 |
对比例3 | V-1 | 1.32 |
对比例4 | V-0 | 1.46 |
由表1可知,相比于对比例3-4,实施例5-7所制备的覆铜板具有更高的阻燃性和剥离强度。
在说明书的描述中,参考术语“一个实施例”、“示例”、“具体示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上内容仅仅是对本发明所作的举例和说明,所属本技术领域的技术人员对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,只要不偏离发明或者超越本权利要求书所定义的范围,均应属于本发明的保护范围。
Claims (2)
1.一种覆铜板的制备方法,其特征在于,包括以下步骤:
第一步、准备以下重量份原料:双酚A型环氧树脂120-180份、增粘组分15-25份、阻燃剂20-25份、无机填料5-15份、有机溶剂20-40份、固化剂25-30份、固化促进剂1-5份;将上述原料加入反应釜中,25-30℃下搅拌3-5h,乳化1.5-2.5h,静置8-10h,得到胶液;
第二步、将胶液涂覆于玻璃纤维布上,在120-250℃下烘烤1.5-2.5min,得到半固化片;将半固化片裁剪与铜箔叠合,在20-25MPa、180-190℃下热压1.5-2h,冷却,得到覆铜板;
所述增粘组分由以下步骤制成:
氮气保护下,将甲苯二异氰酸酯加入反应器中,搅拌下升温至80℃,加入旋蒸后的聚醚二元醇和二月桂酸二丁基锡,搅拌反应0.5-1h后,升温至85-88℃,加入功能组分,搅拌反应3-4h,得到增粘组分;
功能组分由以下步骤制成:
步骤X1、将3,5-二羟基苯甲醛和环氧氯丙烷混合,边搅拌边升温至90-95℃,加入苄基三乙基氯化铵,搅拌反应5-6h,减压蒸馏,加入甲苯搅拌0.5h,控制反应温度33℃,加入氢氧化钠,保温搅拌2h后升温至73-75℃搅拌反应2h,得到中间体1;
步骤X2、向三口烧瓶中加入中间体1、氯仿和甲醇,搅拌后控制反应温度0℃,分三次等量加入硼氢化钠,保温搅拌4h,随后加入去离子水搅拌0.5h,得到中间体2;
步骤X3、将中间体2、3-氨基丙烷-1-磷酸和DMF混合,搅拌后加入碳酸钾,搅拌后升温至60-70℃,搅拌反应8-10h,得到功能组分;
甲苯二异氰酸酯、聚醚二元醇和功能组分的质量比为5.8-6.1:14.5-15:3.2-3.5,二月桂酸二丁基锡用量为甲苯二异氰酸酯、聚醚二元醇和功能组分质量和的0.3%;
步骤X1中3,5-二羟基苯甲醛、环氧氯丙烷和氢氧化钠摩尔比为1:6-8:2.4,苄基三乙基氯化铵用量为3,5-二羟基苯甲醛质量的2%;
步骤X2中中间体1、氯仿、甲醇和硼氢化钠的用量比为2.49g:40-50mL:20-30mL:1.1-1.4g;
步骤X3中中间体2、3-氨基丙烷-1-磷酸、DMF和碳酸钾用量为2.5-2.8g:3.2-3.6g:60-80mL:3.5g。
2.根据权利要求1所述的一种覆铜板的制备方法,其特征在于,聚醚二元醇的分子量为1000-2000。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210863381.0A CN115230287B (zh) | 2022-07-20 | 2022-07-20 | 一种覆铜板的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210863381.0A CN115230287B (zh) | 2022-07-20 | 2022-07-20 | 一种覆铜板的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115230287A CN115230287A (zh) | 2022-10-25 |
CN115230287B true CN115230287B (zh) | 2024-04-02 |
Family
ID=83674772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210863381.0A Active CN115230287B (zh) | 2022-07-20 | 2022-07-20 | 一种覆铜板的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115230287B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116528509B (zh) * | 2023-04-28 | 2024-05-10 | 兴宁市精维进电子有限公司 | 一种嵌铜式线路板的生产加工工艺 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0782348A (ja) * | 1993-07-22 | 1995-03-28 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及びその硬化物 |
CN102093666A (zh) * | 2010-12-23 | 2011-06-15 | 广东生益科技股份有限公司 | 无卤树脂组合物及使用其的无卤覆铜板的制作方法 |
CN111072920A (zh) * | 2020-01-08 | 2020-04-28 | 福州大学 | 一种可降解且可热塑性加工的环氧热固性树脂及其制备方法 |
CN111363468A (zh) * | 2020-03-20 | 2020-07-03 | 温州盘虎新能源有限公司 | 一种用于汽车支架表面的油漆喷涂工艺 |
CN111718678A (zh) * | 2020-06-19 | 2020-09-29 | 林州致远电子科技有限公司 | 一种覆铜板用胶液、覆铜板及其制备方法 |
CN114316885A (zh) * | 2022-01-18 | 2022-04-12 | 李全 | 一种改性环氧树脂密封胶及其制备方法 |
CN114752129A (zh) * | 2022-04-27 | 2022-07-15 | 安徽超星新材料科技有限公司 | 一种基于hdpe导热复合材料及其制备方法与应用 |
CN114752038A (zh) * | 2022-03-16 | 2022-07-15 | 黄山天马新材料科技有限公司 | 一种无卤阻燃环氧树脂及其制备方法 |
-
2022
- 2022-07-20 CN CN202210863381.0A patent/CN115230287B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0782348A (ja) * | 1993-07-22 | 1995-03-28 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及びその硬化物 |
CN102093666A (zh) * | 2010-12-23 | 2011-06-15 | 广东生益科技股份有限公司 | 无卤树脂组合物及使用其的无卤覆铜板的制作方法 |
CN111072920A (zh) * | 2020-01-08 | 2020-04-28 | 福州大学 | 一种可降解且可热塑性加工的环氧热固性树脂及其制备方法 |
CN111363468A (zh) * | 2020-03-20 | 2020-07-03 | 温州盘虎新能源有限公司 | 一种用于汽车支架表面的油漆喷涂工艺 |
CN111718678A (zh) * | 2020-06-19 | 2020-09-29 | 林州致远电子科技有限公司 | 一种覆铜板用胶液、覆铜板及其制备方法 |
CN114316885A (zh) * | 2022-01-18 | 2022-04-12 | 李全 | 一种改性环氧树脂密封胶及其制备方法 |
CN114752038A (zh) * | 2022-03-16 | 2022-07-15 | 黄山天马新材料科技有限公司 | 一种无卤阻燃环氧树脂及其制备方法 |
CN114752129A (zh) * | 2022-04-27 | 2022-07-15 | 安徽超星新材料科技有限公司 | 一种基于hdpe导热复合材料及其制备方法与应用 |
Also Published As
Publication number | Publication date |
---|---|
CN115230287A (zh) | 2022-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101735562B (zh) | 环氧树脂组合物及其制备方法及采用其制作的层压材料及覆铜箔层压板 | |
CN101418204B (zh) | 一种无卤阻燃胶粘剂及其在粘结片和覆铜箔层压板上的应用 | |
CN108485182B (zh) | 一种高频树脂组合物及使用其制作的半固化片和层压板 | |
CN101323703B (zh) | 一种聚氨双马来酰亚胺树脂组合物、制备方法及其在覆铜板中的应用 | |
CN113844128B (zh) | 一种无铅高耐热覆铜板及其制备方法 | |
CN115230287B (zh) | 一种覆铜板的制备方法 | |
KR20000062897A (ko) | 프리프렉 및 이로부터 제조된 적층판 | |
CN111718678B (zh) | 一种覆铜板用胶液、覆铜板及其制备方法 | |
CN113698738A (zh) | 一种阻燃型覆铜板及其制备方法 | |
CN111704785A (zh) | 一种无卤高cti覆铜板用胶液及其制备方法和应用 | |
CN110951216A (zh) | 一种热固性树脂组合物以及使用其的预浸料和层压板 | |
CN103030786B (zh) | 改性环氧树脂及阻燃型玻璃布纸复合基覆铜板的制备方法 | |
CN110724261B (zh) | 高耐热低介电聚苯醚型双马来酰亚胺树脂、层压板及其制备方法 | |
CN110183817B (zh) | 一种高耐热高韧性低介电芴基苯并噁嗪树脂组合物及其制备方法和用途 | |
CN109719967B (zh) | 高韧性高Tg无铅覆铜板及其制备方法 | |
JPH0819213B2 (ja) | エポキシ樹脂組成物および銅張積層板 | |
CN108219134B (zh) | 一种改性复合双马来酰亚胺树脂的预聚物、树脂组合物及使用其制作的半固化片及层压板 | |
CN113844130A (zh) | 一种高Tg高频覆铜板的制备方法 | |
JP4538873B2 (ja) | 熱硬化性樹脂組成物及びそれを用いたプリプレグ、電気配線板用積層板 | |
CN115505237B (zh) | 一种环氧树脂胶液、环氧基cem-3覆铜板及其制备方法 | |
CN112094480B (zh) | 一种树脂组合物及使用其制作的半固化片及层压板 | |
EP2374828B1 (en) | Preparation of a low dielectric brominated resin with a symmetric or saturated heterocyclic aliphatic molecular structure and composition comprising said resin | |
US8039560B1 (en) | Low dielectric brominated resin with a symmetric or saturated heterocyclic alphatic molecular structure and the preparation thereof | |
CN118255969A (zh) | 一种热固性树脂组合物及使用其的预浸料、层压板和印制电路板 | |
CN116554425A (zh) | 一种含磷苯并恶嗪树脂、树脂组合物及应用 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |