CN115195018A - 一种微电子芯片超高速立注精密封装装置及方法 - Google Patents
一种微电子芯片超高速立注精密封装装置及方法 Download PDFInfo
- Publication number
- CN115195018A CN115195018A CN202210790622.3A CN202210790622A CN115195018A CN 115195018 A CN115195018 A CN 115195018A CN 202210790622 A CN202210790622 A CN 202210790622A CN 115195018 A CN115195018 A CN 115195018A
- Authority
- CN
- China
- Prior art keywords
- packaging
- cavity
- piston
- fluid
- ultra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000002347 injection Methods 0.000 title claims abstract description 26
- 239000007924 injection Substances 0.000 title claims abstract description 26
- 238000004377 microelectronic Methods 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 42
- 239000012530 fluid Substances 0.000 claims abstract description 29
- 238000004080 punching Methods 0.000 claims abstract description 23
- 238000003860 storage Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000012858 packaging process Methods 0.000 claims abstract description 8
- 238000005516 engineering process Methods 0.000 claims abstract description 7
- 238000001125 extrusion Methods 0.000 claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims abstract description 3
- 238000000465 moulding Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 238000007906 compression Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 229920006342 thermoplastic vulcanizate Polymers 0.000 claims 1
- 239000005022 packaging material Substances 0.000 abstract description 4
- 239000004974 Thermotropic liquid crystal Substances 0.000 abstract 1
- 238000004925 denaturation Methods 0.000 abstract 1
- 230000036425 denaturation Effects 0.000 abstract 1
- 239000011553 magnetic fluid Substances 0.000 abstract 1
- 238000001746 injection moulding Methods 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 7
- 230000006835 compression Effects 0.000 description 6
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000004100 electronic packaging Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/13—Injection moulding apparatus using two or more injection units co-operating with a single mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
- B29C45/2606—Guiding or centering means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/53—Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston
- B29C45/54—Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston and plasticising screw
- B29C45/544—Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston and plasticising screw the plasticising unit being connected to a transfer chamber in the injection unit at the upstream side of the injection piston
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C45/67—Mould opening, closing or clamping devices hydraulic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C2045/1784—Component parts, details or accessories not otherwise provided for; Auxiliary operations not otherwise provided for
- B29C2045/1785—Movement of a part, e.g. opening or closing movement of the mould, generating fluid pressure in a built-in fluid pressure generator
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
本发明公开一种微电子芯片超高速立注精密封装装置及方法,装置包括对顶双塑化装置、超高速冲料装置、微电子锁模装置、塑化流体储料阀、封装基体传送带、加热管、气体通入管、惰性气体定量输出装置。本技术利用热致性液晶高分子聚合物TLCP作为微电子芯片的封装材料,流动性好,材料本身所具有优异特性;利用双塑化系统对顶共挤真空加料技术,保证料源充足。超高速冲料装置将储料阀塑化后TLCP流体充填到精密封装模腔,能够实现连续超高速微电子芯片封装过程。装置采用高纯气保护磁流体密封,在封装过程中通入高纯气体以防止TLCP塑化封装过程中发生材料变性。并在封装基体传送带输送下,连续高速实现封装作业,该装置可应用于微电子芯片以及电子元件封装。
Description
技术领域
本发明涉及注射成型所用的注塑机领域,尤其涉及为一种微电子芯片超高速立注精密封装装置及方法。
背景技术
电子封装是将一个或多个电子元器件芯片相互电连接,然后封装在一个保护结构中,其目的是为电子芯片提供电连接、机械保护、化学腐蚀保护等。此保护结构的基板用于承载芯片和导入/导出电源和电信号。封装技术的发展趋势,就是要封装外形越来越小,功能越来越多,成本越来越低。
目前电子封装过程多采用活塞注塑方式,将定量颗粒原料在注射腔内加热熔融后,注入模腔内部。其注射速度较慢,并且颗粒不均匀注射量难以控制。专利CN114023734A公开了LED和IC高密度集成封装结构、工艺及LED灯带,包括IC芯片和LED芯片,IC芯片和LED芯片之间电性连接;还包括封装层,所述IC芯片和LED芯片通过注塑封装方式被包封在封装层内,且IC芯片的无源面和LED芯片的正发光面均朝向同一临空面。还包括设置在封装层外壁面上的可导电的对外端子,对外端子和IC芯片之间电性连接。主要针对封装工艺做了技术创新。专利CN114083747A公开了注塑装置技术领域的一种锂电池用低压注塑封装装置,包括底座、下模座、安装臂、上模座、驱动单元、注塑腔、异形流体通道、注料口、橡胶塞、密封槽、弹性复位单元、顶块、通槽,上模座朝上翻转时,顶块由升降单元驱动其朝上移动,且上模座朝下翻转时,升降单元驱动顶块下移,使顶块顶面与注塑腔内底壁齐平。上模座朝下翻转能够驱动橡胶塞在密封槽内朝上滑动,使异形流体通道与注塑腔连通,使得注塑原料输送机构能够将注塑原料输送到注塑腔内,进而便于进行注塑,注塑完毕后,通过上模座的朝上翻转,使得橡胶塞能够朝下移动,并封闭异形流体通道,其并没有在封装速度和封装速率做创新。
针对当前微电子芯片封装存在封装速度的不足,本发明提出一种微电子芯片超高速立注精密封装装置及方法。
发明内容
本发明所要解决的技术问题在于,针对现有技术的上述不足与电子行业微电子芯片的广泛需求,采用模塑成型的技术手段进行高速批量地电子封装方式,本发明公开一种采用双塑化系统对顶共挤真空加料技术的微电子芯片超高速立注精密封装装置。
本发明通过采取如下的技术方案实现:一种微电子芯片超高速立注精密封装装置,其特征在于,采用双塑化系统对顶共挤真空加料技术,将熔融流动的TLCP高分子聚合物供给到封装料腔内,通过曲轴高速立式冲料装置将原料采用活塞腔注射到模具腔内部。流体包裹填充到铜制芯片四周,曲轴高速冲料装置循环完成此过程,进而实现封装过程。铜制基体通过封装基体传送带,依次进入封装作业。
双塑化系统对顶共挤真空加料技术,采用两台TLCP挤出机对顶布置,共同将塑化料输送到熔料腔内,从挤出机出料口处通有惰性气体保护,以防止TLCP变性。
封装基带采用卡槽结构通过下模板,并通过销钉定位结构与基带定位孔机械组合,实现封装过程中的定位和稳定压合,上模板与下模板之间采用插销准确定位模板的对中压合。
快速冲料成型模腔结构,其冲压动力来自高速曲轴冲床结构。通过推板同时推动活塞杆将料注入到模腔内部,同时推动动模板在弹簧的组合下实现合模成型过程。铜制基板在传送带的带动下依次进入封装模腔位进行封装作业。其封装工作时间可控制在0.13纳秒。
本封装原料采用TLCP作为封装材料,TLCP高分子材料流动性好,其应用于电子封装领域具有特殊的材料优势,特别针对微细电子元件结构能够更大限度的保障充填封装的均匀性和紧密性。
一种微电子芯片超高速立注精密封装方法,两台挤出机通过控制单向阀将塑化完全的封装流体注入活塞组件内部,当活塞到达运动顶端,电机带动单向阀关闭,活塞腔组件完成TLCP流体的储存,冲头向下运动带动活塞杆和弹簧压板向下运动,储料活塞腔内部活塞向下快速运动冲注物料,并开始冲压注料过程,流体被初次挤压进入熔体腔,活塞将腔体内的流体高速注入模腔内部。此时成型上模板与下模板分离,弹簧压缩并推动上模板与下模板压合,同时压实定位条形封装基体,流体经过热流道填充满成型模腔。弹簧压缩过程,弹簧压紧上模板,保证封装模腔内部封闭性,提供成型所需要的保压压力。随着冲头上移,带动活塞上移动,电机带动转动阀打开,流体在压力的作用下流入活塞腔组件进入下一次储料过程。活塞上升过程中弹簧伸展,但依旧处于压缩状态,型腔压力依旧存在,此时成型模腔闭合,热流道浇口封闭,保证了流体只可以单向供给。储料完成,保压弹簧复位,下一时刻模腔打开,转阀电机带动转动阀关闭,储料腔满料,模腔打开,在基带送料电机定频驱动驱动传送带带动基带送料轮转动一定距离,更换铜质基材,在更换基带过程中,定模板设计有基带轨道保证基带更换过程减少震动平稳传动,当封装基体传送带转动完成封装基体的更换。进入下一个冲注循环,高速带轮带动冲料机曲柄高速转动,同时曲柄偏心特性使得曲柄带动冲料驱动板模板上直线轴承沿滑杆滑动冲料。带动动模板与定模板压合基带,动模板上定位销钉插入基带两侧定位孔中。经冷却后成型,依次循环完成此动作。
注射流道可采用热流道,单向阀结构采用转阀结构并由电机带动其高速转动,上模板与冲压头安装四组内套销柱的压缩弹簧组件,弹簧结构采用压缩弹簧,其实现方式包括圆柱弹簧或矩形压缩弹簧。
冲压模具安装在具有四组滑动轴承的滑杆上,保障高速运动过程冲压模具运动稳定性和顺畅。
与现有技术相比,本发明专利通过采用双挤出机共挤供料的方式将材料性能优异的TLCP熔融料供给高速封装模腔,在高速冲料装置的进料注射下实现对微电子的精密高速封装作业。该装置布局紧凑,借鉴冲床结构实现作业速度快。使得微电子芯片制品封装生产过程更加集成化,成型效率更高。
附图说明
图1为本发明一种微电子芯片超高速立注精密封装装置三维示意图。
图2为本发明一种微电子芯片超高速立注精密封装装置封装制具三维视图。
图3为本发明封装制具基带送料示意图。
图4为本发明封装制具基带送料定位固定示意图。
图5为本发明封装制具基带送料定位固定局部放大示意图。
图6为本发明一种微电子芯片超高速立注精密封装装置正视图。
图7为本发明超高速曲柄高速组件结构三维示意图。
图8为本发明超高速曲柄高速组件结构曲柄偏心结构剖视图。
图中:1.高速冲料机、2. 封装制具、3. 挤出机、4. 封装基体传送带、5. 冲料驱动板、6. 弹簧、7. 动模板、8. 定模板、9. 活塞腔组件、10. 熔体腔、11. 单向阀、12.加热板、13.惰性气体保护装置、14.基带送料轮、15.传送带 、16.基带进料电机 、17.定位销钉 、18.冲床曲柄 、19.曲柄连杆 、20.曲柄固定轴套、21.高速带轮 、22. 直线轴承、23.滑杆。
具体实施方式
以下结合附图对本发明作进一步描述。
本发明一种微电子芯片超高速立注精密封装装置,如图1所示,两台挤出机3对顶布置,同时向储料模腔2供料,在物料出口位置通过气体保护装置13自下向上对角方向通入惰性气体形成气体保护,以防止TLCP的变性。铜制封装基体通过送料轮在封装基体传送带4的进料下完成物料输送。超高速冲料装置1垂直布置在料腔和基体传送带位置,通过高速冲头将物料垂直注射在成型制具内部。
本发明一种微电子芯片超高速立注精密封装方法,如图1-2和图6所示,转动单向阀11打开熔融流体输送通过两台挤出机3将塑化完全的封装流体注入活塞组件9内部,转动单向阀11打开,通过活塞腔组件9的向上运动储存熔体封装料,当活塞到达运动顶端,电机带动单向阀11关闭,活塞腔组件9完成TLCP流体的储存,冲头5向下运动带动活塞杆和弹簧压板向下运动,储料活塞腔内部活塞向下快速运动冲注物料,并开始冲压注料过程,流体被初次挤压进入熔体腔10,活塞将腔体内的流体高速注入模腔内部。此时成型上模板7与下模板8分离,弹簧6压缩并推动上模板与下模板压合,同时压实定位条形封装基体4,流体经过热流道填充满成型模腔。弹簧压缩过程,弹簧6压紧上模板7,保证封装模腔内部封闭性,提供成型所需要的保压压力。随着冲头5上移,带动活塞上移动,电机带动转动阀11打开,流体在压力的作用下流入活塞腔组件9进入下一次储料过程。活塞上升过程中弹簧伸展,但依旧处于压缩状态,型腔压力依旧存在,此时成型模腔闭合,热流道浇口封闭,保证了流体只可以单向供给。储料完成,保压弹簧复位,下一时刻模腔打开,转阀电机带动转动阀11关闭,储料腔满料,模腔打开,如图3所示在基带送料电机定频驱动驱动传送带15带动基带送料轮14转动一定距离,更换铜质基材4,如图4、图5所示,在更换基带过程中,定模板8设计有基带轨道保证基带更换过程减少震动平稳传动,当封装基体传送带转动完成封装基体的更换。进入下一个冲注循环,如图6-7所示,高速带轮21带动冲料机曲柄18高速转动,同时如图8所示曲柄偏心特性使得曲柄带动冲料驱动板模板5上直线轴22承沿滑杆23滑动冲料。带动动模板与定模板压合基带,如图5所示动模板上定位销钉插入基带两侧定位孔中。经冷却后成型,依次循环完成此动作。
最后,还需要注意的是,以上所述的实施例只是本发明的一种较佳的方案,并非对本发明作任何形式上的限制,在不超出权利要求所记载的技术方案的前提下还有其它的变体及改型。
Claims (4)
1.一种微电子芯片超高速立注精密封装装置,其特征在于:采用双塑化系统对顶共挤真空加料技术,将熔融流动的TLCP高分子聚合物供给到封装料腔内,通过曲轴高速立式冲料装置将原料采用活塞腔注射到模具腔内部;流体包裹填充到铜制芯片四周,曲轴高速冲料装置循环完成此过程,进而实现封装过程;铜制基体通过封装基体传送带,依次进入封装作业。
2.根据权利要求1所述的一种微电子芯片超高速立注精密封装装置,其特征在于:双塑化系统对顶共挤真空加料技术,采用两台TLCP挤出机对顶布置,共同将塑化料输送到熔料腔内,从挤出机出料口处通有惰性气体保护。
3.根据权利要求1所述的一种微电子芯片超高速立注精密封装装置,其特征在于:封装基带采用卡槽结构通过下模板,并通过销钉定位结构与基带定位孔机械组合,实现封装过程中的定位和稳定压合,上模板与下模板之间采用插销准确定位模板的对中压合。
4.一种微电子芯片超高速立注精密封装方法,其特征在于:两台挤出机通过控制单向阀将塑化完全的封装流体注入活塞组件内部,当活塞到达运动顶端,电机带动单向阀关闭,活塞腔组件完成TLCP流体的储存,冲头向下运动带动活塞杆和弹簧压板向下运动,储料活塞腔内部活塞向下快速运动冲注物料,并开始冲压注料过程,流体被初次挤压进入熔体腔,活塞将腔体内的流体高速注入模腔内部;此时成型上模板与下模板分离,弹簧压缩并推动上模板与下模板压合,同时压实定位条形封装基体,流体经过热流道填充满成型模腔;弹簧压缩过程,弹簧压紧上模板,保证封装模腔内部封闭性,提供成型所需要的保压压力;随着冲头上移,带动活塞上移动,电机带动转动阀打开,流体在压力的作用下流入活塞腔组件进入下一次储料过程;活塞上升过程中弹簧伸展,但依旧处于压缩状态,型腔压力依旧存在,此时成型模腔闭合,热流道浇口封闭,保证了流体只可以单向供给;储料完成,保压弹簧复位,下一时刻模腔打开,转阀电机带动转动阀关闭,储料腔满料,模腔打开,在基带送料电机定频驱动驱动传送带带动基带送料轮转动一定距离,更换铜质基材,在更换基带过程中,定模板设计有基带轨道保证基带更换过程减少震动平稳传动,当封装基体传送带转动完成封装基体的更换;进入下一个冲注循环,高速带轮带动冲料机曲柄高速转动,同时曲柄偏心特性使得曲柄带动冲料驱动板模板上直线轴承沿滑杆滑动冲料;带动动模板与定模板压合基带,动模板上定位销钉插入基带两侧定位孔中;经冷却后成型,依次循环完成此动作。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210790622.3A CN115195018A (zh) | 2022-07-05 | 2022-07-05 | 一种微电子芯片超高速立注精密封装装置及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210790622.3A CN115195018A (zh) | 2022-07-05 | 2022-07-05 | 一种微电子芯片超高速立注精密封装装置及方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115195018A true CN115195018A (zh) | 2022-10-18 |
Family
ID=83580333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210790622.3A Pending CN115195018A (zh) | 2022-07-05 | 2022-07-05 | 一种微电子芯片超高速立注精密封装装置及方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115195018A (zh) |
-
2022
- 2022-07-05 CN CN202210790622.3A patent/CN115195018A/zh active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI593538B (zh) | 樹脂成型模具與樹脂成型裝置 | |
KR101643451B1 (ko) | 수지 밀봉 장치 및 수지 밀봉 방법 | |
CN1503339A (zh) | 树脂封装方法及装置、半导体器件及其制造方法及树脂材料 | |
CN111403303A (zh) | 树脂封装装置以及树脂封装方法 | |
US20220161469A1 (en) | Resin molding apparatus and method for manufacturing resin molded product | |
JP2014192362A (ja) | 成形品生産装置、成形品生産方法、及び成形品 | |
US20070069421A1 (en) | Method of resin-seal-molding electronic component and apparatus therefor | |
JP4855026B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
CN115195018A (zh) | 一种微电子芯片超高速立注精密封装装置及方法 | |
CN1806323A (zh) | 树脂密封型半导体封装及其制造方法以及制造装置 | |
US20070069422A1 (en) | Method of resin-seal-molding electronic component and apparatus therefor | |
CN115547857B (zh) | 一种用于sip芯片的自动化封装系统及封装工艺 | |
CN102785326A (zh) | 一种新型封装材料注射机 | |
WO2016125571A1 (ja) | 樹脂成形金型、樹脂成形方法、および成形品の製造方法 | |
CN101421835A (zh) | 电子器件的树脂密封成形方法及电子器件的树脂密封成形装置 | |
CN115863217A (zh) | 半导体封装胶封装置与方法 | |
CN113858529A (zh) | 一种用于生产瓶盖的注塑装置及其使用方法 | |
KR0160539B1 (ko) | 수지 패키징 장치 | |
JP2004235530A (ja) | 封止成形装置及びそれを用いた封止成形体の製造方法 | |
KR930006848B1 (ko) | 전자부품의 수지밀봉 성형방법과 그의 성형장치 및 그의 성형용 금형 | |
JP2694293B2 (ja) | 高圧縮成形樹脂タブレットの成形方法 | |
KR100822523B1 (ko) | 전자부품의 수지밀봉 성형 방법 및 장치 | |
JP4477306B2 (ja) | 半導体の封止成形装置及びそれを用いた樹脂封止型半導体装置の製造 | |
JP2004014936A (ja) | 封止成形装置 | |
JP2706914B2 (ja) | 電子部品の樹脂封止成形方法及び金型 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |