CN115136300A - 电子设备、芯片封装结构及其制作方法 - Google Patents

电子设备、芯片封装结构及其制作方法 Download PDF

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Publication number
CN115136300A
CN115136300A CN202080096746.0A CN202080096746A CN115136300A CN 115136300 A CN115136300 A CN 115136300A CN 202080096746 A CN202080096746 A CN 202080096746A CN 115136300 A CN115136300 A CN 115136300A
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chip
insulating layer
medium
interposer
adapter plate
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李珩
张晓东
戚晓芸
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种电子设备、芯片封装结构及其制作方法；其中，芯片封装结构包括第一芯片(10)、转接板(20)以及位于第一芯片(10)和转接板(20)之间的至少一个电连接件(30)，电连接件(30)的两端分别与第一芯片(10)和转接板(20)电连接；还包括：位于第一芯片(10)和转接板(20)之间且围设在电连接件(30)外周的高导热介质(40)，高导热介质(40)的一端与第一芯片(10)接触，以实现对第一芯片(10)以及电连接件(30)的有效散热，从而可提高芯片封装结构的集成度，高导热介质(40)与电连接件(30)之间设置绝缘层(50)，绝缘层(50)用于将高导热介质(40)与所述电连接件(30)隔开，以避免电连接件(30)上的电流扩散至高导热介质(40)上而造成漏电的情况，从而不仅确保了第一芯片(10)与转接板(30)之间的导通稳定性，而且不会对芯片封装结构外部的元器件造成电信号的干扰。

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PCT国内申请，说明书已公开。

Claims (27)

  1. PCT国内申请，权利要求书已公开。
CN202080096746.0A 2020-03-16 2020-03-16 电子设备、芯片封装结构及其制作方法 Pending CN115136300A (zh)

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118402058A (zh) * 2022-04-20 2024-07-26 华为技术有限公司 芯片及其制备方法、电子设备

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08115947A (ja) * 1994-10-17 1996-05-07 Hitachi Ltd 半導体装置の接合構造
WO2011008893A1 (en) * 2009-07-15 2011-01-20 Io Semiconductor Semiconductor-on-insulator with backside heat dissipation
CN102097339A (zh) * 2009-12-08 2011-06-15 瑞萨电子株式会社 半导体器件及其制造方法
CN102646645A (zh) * 2011-02-16 2012-08-22 三星半导体(中国)研究开发有限公司 封装结构及其制造方法
TW201250952A (en) * 2010-11-22 2012-12-16 Bridge Semiconductor Corp Stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
CN103779246A (zh) * 2014-02-21 2014-05-07 江阴长电先进封装有限公司 一种高可靠性的铜柱凸块封装方法及其封装结构
US20160247775A1 (en) * 2015-02-25 2016-08-25 Ali Corporation Chip packaging strcutre and manufaturing method thereof
CN107195605A (zh) * 2017-05-18 2017-09-22 上海交通大学 以薄镍层作为阻挡层的铜镍锡微凸点结构及其制备方法
TW201916280A (zh) * 2017-09-28 2019-04-16 台灣積體電路製造股份有限公司 積體扇出型封裝及其形成方法
CN110299329A (zh) * 2018-03-21 2019-10-01 华为技术有限公司 一种封装结构及其制作方法、电子设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7675157B2 (en) * 2006-01-30 2010-03-09 Marvell World Trade Ltd. Thermal enhanced package
TWI595613B (zh) * 2014-11-18 2017-08-11 矽品精密工業股份有限公司 半導體封裝件及其製法
CN106298732A (zh) * 2016-09-29 2017-01-04 中国电子科技集团公司第四十三研究所 一种用于系统级封装的转接板结构
CN107910315B (zh) * 2017-11-10 2020-09-25 深圳市盛路物联通讯技术有限公司 芯片封装
CN108598061B (zh) * 2018-05-04 2020-09-01 上海交通大学 一种陶瓷转接板结构及其制造方法
CN110620100A (zh) * 2019-09-25 2019-12-27 上海先方半导体有限公司 一种适用于高密度高功率的封装结构及制造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08115947A (ja) * 1994-10-17 1996-05-07 Hitachi Ltd 半導体装置の接合構造
WO2011008893A1 (en) * 2009-07-15 2011-01-20 Io Semiconductor Semiconductor-on-insulator with backside heat dissipation
CN102097339A (zh) * 2009-12-08 2011-06-15 瑞萨电子株式会社 半导体器件及其制造方法
TW201250952A (en) * 2010-11-22 2012-12-16 Bridge Semiconductor Corp Stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
CN102646645A (zh) * 2011-02-16 2012-08-22 三星半导体(中国)研究开发有限公司 封装结构及其制造方法
CN103779246A (zh) * 2014-02-21 2014-05-07 江阴长电先进封装有限公司 一种高可靠性的铜柱凸块封装方法及其封装结构
US20160247775A1 (en) * 2015-02-25 2016-08-25 Ali Corporation Chip packaging strcutre and manufaturing method thereof
CN107195605A (zh) * 2017-05-18 2017-09-22 上海交通大学 以薄镍层作为阻挡层的铜镍锡微凸点结构及其制备方法
TW201916280A (zh) * 2017-09-28 2019-04-16 台灣積體電路製造股份有限公司 積體扇出型封裝及其形成方法
CN110299329A (zh) * 2018-03-21 2019-10-01 华为技术有限公司 一种封装结构及其制作方法、电子设备

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