CN115052433A - Novel SMT (surface mount technology) chip mounting process for circuit board - Google Patents
Novel SMT (surface mount technology) chip mounting process for circuit board Download PDFInfo
- Publication number
- CN115052433A CN115052433A CN202210834418.7A CN202210834418A CN115052433A CN 115052433 A CN115052433 A CN 115052433A CN 202210834418 A CN202210834418 A CN 202210834418A CN 115052433 A CN115052433 A CN 115052433A
- Authority
- CN
- China
- Prior art keywords
- glue
- circuit board
- red
- soldering
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000005516 engineering process Methods 0.000 title claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 71
- 238000005476 soldering Methods 0.000 claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims abstract description 5
- 230000004888 barrier function Effects 0.000 claims abstract description 4
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 239000000945 filler Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000002950 deficient Effects 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Abstract
The invention provides a novel SMT (surface mount technology) chip mounting process for a circuit board, which comprises the following process steps: s1: coating solder paste on the PAD position on the circuit board by using a printing machine; s2, drawing a ring with red glue at the position close to the edge of the PCB base material by using a glue dispenser, and forming a barrier wall by using the fixed molding of the red glue; s3, covering the low-filling glue at the blank between the outer side of the red glue and the edge of the PCB substrate by using a glue dispenser, and discharging air at the junction by using the fluidity of the glue; s4: accurately mounting the chip component on a component preset position of the circuit board by using a mounting machine; s5: pressing and mounting the sheet component of S4 at the red glue position of S3; s6: and performing reflow soldering, and forming respective soldering by using the temperature difference of the solder paste and the low-filler adhesive to realize mechanical and electrical connection between the soldering end of the surface-assembled component and the circuit board soldering pad. Through the mode, the problems that multiple times of forming are needed, the production cost is high, the production efficiency is low, the defective product rate is high and the like in the traditional SMT (surface mount technology) process of the circuit board are solved.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a novel SMT (surface mount technology) chip mounting process for a circuit board.
Background
SMT Surface Mount Technology (Surface Mount Technology), known as Surface Mount Technology, is the most popular Technology and process in the electronic assembly industry. The surface-mounted component (SMC/SMD, chip component in Chinese) with no pins or short leads is mounted on the surface of a Printed Circuit Board (PCB) or other substrates, and is soldered and assembled by methods such as reflow soldering or dip soldering.
The traditional circuit board SMT paster technology is as follows:
s1: coating solder paste on a PAD (PAD) position of a circuit board by using a printing machine;
s2: using a dispenser to dispense a plurality of red glues at the blank position of the circuit board;
s3: accurately mounting the chip component on the surface of the solder paste in S1 by using a chip mounter;
s4: performing reflow soldering;
s5: using a dispenser to dispense low-filling glue around the chip component, and infiltrating the glue into the bottom of the chip component by utilizing the flowability of the glue;
s6: baking the product of S5 in an oven;
s7: and removing the glue, dispensing and baking the defective product generated in the step S6 again.
However, the conventional SMT pad process has the following disadvantages:
1. the phenomena of cavities, air holes, bubbles and the like are easy to occur in the glue sealing process, and a large amount of defective products are generated;
2. and for defective products, reworking is needed for many times, time and labor are consumed, the production cost is increased, and the production efficiency is reduced.
Disclosure of Invention
In order to solve the problems, the invention provides a novel circuit board SMT (surface mount technology), which solves the problems of multiple forming, high production cost, low production rate, high defective rate and the like in the traditional circuit board SMT process.
The main content of the invention comprises: a novel SMT (surface mount technology) chip mounting process for a circuit board comprises the following process steps:
s1: coating solder paste on the PAD position on the circuit board by using a printing machine;
s2, drawing a ring with red glue at the position close to the edge of the PCB base material by using a glue dispenser, and forming a barrier wall by using the fixed molding of the red glue;
s3, covering the low-filling glue at the blank between the outer side of the red glue and the edge of the PCB substrate by using a glue dispenser, and discharging air at the junction by using the fluidity of the glue;
s4: accurately mounting the chip component on a component preset position of the circuit board by using a mounting machine;
s5: pressing and mounting the chip component of S4 at the red glue position of S3 to ensure that the center of the chip component is superposed with the round dots of the red glue;
s6: and performing reflow soldering, and forming respective soldering by using the temperature difference of the solder paste and the low-filler adhesive to realize mechanical and electrical connection between the soldering end of the surface-assembled component and the circuit board soldering pad.
Preferably, in S2, the red glue is drawn at a position 0.6-1.2 cm away from the edge of the PCB substrate by using a dispenser.
Preferably, a blank position, which is 0.3-0.6 cm away from the edge of the PCB substrate, on the outer side of the red glue is covered by the low-filling glue through a glue dispenser.
In the invention, the red glue is ensured to form a complete circle, the low filling glue is arranged on the outer side of the red glue for one circle, the amount of the low filling glue does not need to be too much, the low filling glue only needs to surround the red glue, and the low filling glue is enabled to be fully distributed on the periphery of the red glue through the fluidity of the low filling glue, so that no holes, air holes and air bubbles appear in the glue sealing process, and the yield of the paster is ensured.
The invention has the beneficial effects that: the circuit board subjected to surface mounting by adopting the invention can achieve the effect of closed molding by one-step molding, thereby saving trouble and labor, saving production cost and greatly improving production efficiency; the phenomena of cavities, air holes, bubbles and the like can not occur in the glue sealing process, and the yield is high; the red glue has different positions and use amounts, the use amount of the red glue is larger, the use amount of the filling glue is reduced, and the cost can be reduced without baking because the red glue is cheaper than the low filling glue.
Drawings
FIG. 1 is a schematic structural diagram of a filling position in a novel SMT process for circuit boards according to the present invention;
reference numerals: 1. solder paste 2, red glue 3, low underfill 4, base material.
Detailed Description
The technical scheme protected by the invention is specifically explained in the following by combining the attached drawings.
As shown in fig. 1, a novel circuit board SMT chip mounting process includes the following process steps:
s1: coating solder paste on the PAD position on the circuit board by using a printing machine;
s2, drawing a red glue ring at a position 1cm away from the edge of the PCB substrate by using a glue dispenser, and forming a barrier wall by using the fixed molding of the red glue;
s3, covering the low filling glue at a blank position, which is 0.5cm away from the edge of the PCB substrate, outside the red glue by using a glue dispenser, and discharging air at the junction by using the fluidity of the glue;
s4: accurately mounting the chip component on a component preset position of the circuit board by using a mounting machine;
s5: pressing and mounting the chip component of S4 at the red glue position of S3 to ensure that the center of the chip component is superposed with the round dots of the red glue;
s6: and performing reflow soldering, and forming respective soldering by using the temperature difference of the solder paste and the low-filler adhesive to realize mechanical and electrical connection between the soldering end of the surface-assembled component and the circuit board soldering pad.
In the 3 components of the solder paste, the red glue and the low-filled glue, the red glue is cured firstly to form a separation wall, so that the low-filled glue is prevented from diffusing to the solder paste due to temperature rise and the welding effect of the solder paste is damaged. The second melting is the solder paste, the melting process is the process of welding with the chip component, the low-filled adhesive overflows to the edge of the product and is solidified in the welding process, and because no gas is in the adhesive, no defects such as holes and bubbles exist after solidification.
The related data of the traditional circuit board SMT paster process and the novel circuit board SMT paster process are shown in the table 1 under the same yield (1000 pieces).
Table 1: data comparison table
Through comparison, the circuit board subjected to surface mounting by adopting the method can achieve the effect of closed forming by one-step forming, thereby saving trouble and labor, saving production cost and greatly improving production efficiency; the phenomena of cavities, air holes, bubbles and the like are greatly reduced in the glue sealing process, and the yield is greatly improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (4)
1. A novel SMT (surface mount technology) chip technology for a circuit board is characterized by comprising the following processing steps of:
s1: coating solder paste on the PAD position on the circuit board by using a printing machine;
s2, drawing a ring with red glue at the position close to the edge of the PCB base material by using a glue dispenser, and forming a barrier wall by using the fixed molding of the red glue;
s3, covering the low-filling glue at the blank between the outer side of the red glue and the edge of the PCB substrate by using a glue dispenser, and discharging air at the junction by using the fluidity of the glue;
s4: accurately mounting the chip component on a component preset position of the circuit board by using a mounting machine;
s5: pressing and mounting the sheet component of S4 at the red glue position of S3;
s6: and performing reflow soldering, and forming respective soldering by using the temperature difference of the solder paste and the low-filler adhesive to realize mechanical and electrical connection between the soldering end of the surface-assembled component and the circuit board soldering pad.
2. A novel circuit board SMT paster process according to claim 1, wherein in S2, a dispenser is used to draw a red glue circle at a distance of 0.6-1.2 cm from the edge of the PCB substrate.
3. A novel circuit board SMT chip technology according to claim 1, wherein a glue dispenser is used to cover the low-fill glue at a margin 0.3-0.6 cm away from the edge of the PCB substrate outside the red glue.
4. A novel circuit board SMT chip technology according to claim 1, wherein in S5 it is ensured that the center of the chip component coincides with the dots of the red glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210834418.7A CN115052433A (en) | 2022-07-14 | 2022-07-14 | Novel SMT (surface mount technology) chip mounting process for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210834418.7A CN115052433A (en) | 2022-07-14 | 2022-07-14 | Novel SMT (surface mount technology) chip mounting process for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115052433A true CN115052433A (en) | 2022-09-13 |
Family
ID=83164497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210834418.7A Pending CN115052433A (en) | 2022-07-14 | 2022-07-14 | Novel SMT (surface mount technology) chip mounting process for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115052433A (en) |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5109269A (en) * | 1991-07-08 | 1992-04-28 | Ofer Holzman | Method and means for positioning surface mounted electronic components on a printed wiring board |
| JP2014075399A (en) * | 2012-10-03 | 2014-04-24 | Panasonic Corp | Electronic component mounting system and electronic component mounting method |
| CN203788575U (en) * | 2014-01-06 | 2014-08-20 | 中达电子零组件(吴江)有限公司 | Hole in assembled plastic net board |
| CN204168608U (en) * | 2014-10-20 | 2015-02-18 | 深圳市海和电子有限公司 | A kind of circuit board efficient quality guaranteeing printing ladder steel mesh |
| CN105510338A (en) * | 2016-01-07 | 2016-04-20 | 苏州市璟硕自动化设备有限公司 | Solder paste and red glue detection method |
| WO2016192452A1 (en) * | 2015-05-29 | 2016-12-08 | 广州市鸿利光电股份有限公司 | Encapsulation method of csp led and csp led |
| CN206164964U (en) * | 2016-08-30 | 2017-05-10 | 河源中光电通讯技术有限公司 | FPC board |
| CN106686905A (en) * | 2016-12-26 | 2017-05-17 | 苏州维信电子有限公司 | Surface mount technology for sheet components |
| CN108288610A (en) * | 2018-04-20 | 2018-07-17 | 深圳市锐钜科技有限公司 | It a kind of design of novel chip tin tailing solder pad and its is applied in red adhesive process |
| CN108521722A (en) * | 2018-07-12 | 2018-09-11 | 贵州贵安新区众鑫捷创科技有限公司 | A kind of SMT paster techniques |
| CN209309687U (en) * | 2018-07-22 | 2019-08-27 | 中山市成源光电科技有限公司 | A kind of LED light engine |
| US20200060025A1 (en) * | 2017-05-03 | 2020-02-20 | Huawei Technologies Co., Ltd. | Pcb, package structure, terminal, and pcb processing method |
| CN212519549U (en) * | 2020-07-28 | 2021-02-09 | 深圳市视景达科技有限公司 | Structure for improving welding quality of QFN (quad Flat No lead) packaging E-PAD (advanced lead Package) |
| WO2021042967A1 (en) * | 2019-09-05 | 2021-03-11 | 王定锋 | Led waterproof light strip and manufacturing method therefor |
| CN112770533A (en) * | 2020-12-31 | 2021-05-07 | 海纳川海拉电子(江苏)有限公司 | High-precision LED position precision assembling method based on dispensing technology |
| CN114641150A (en) * | 2022-03-25 | 2022-06-17 | 深圳市兆兴博拓科技股份有限公司 | Circuit board mounting method based on dispensing optimization |
-
2022
- 2022-07-14 CN CN202210834418.7A patent/CN115052433A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5109269A (en) * | 1991-07-08 | 1992-04-28 | Ofer Holzman | Method and means for positioning surface mounted electronic components on a printed wiring board |
| JP2014075399A (en) * | 2012-10-03 | 2014-04-24 | Panasonic Corp | Electronic component mounting system and electronic component mounting method |
| CN203788575U (en) * | 2014-01-06 | 2014-08-20 | 中达电子零组件(吴江)有限公司 | Hole in assembled plastic net board |
| CN204168608U (en) * | 2014-10-20 | 2015-02-18 | 深圳市海和电子有限公司 | A kind of circuit board efficient quality guaranteeing printing ladder steel mesh |
| WO2016192452A1 (en) * | 2015-05-29 | 2016-12-08 | 广州市鸿利光电股份有限公司 | Encapsulation method of csp led and csp led |
| CN105510338A (en) * | 2016-01-07 | 2016-04-20 | 苏州市璟硕自动化设备有限公司 | Solder paste and red glue detection method |
| CN206164964U (en) * | 2016-08-30 | 2017-05-10 | 河源中光电通讯技术有限公司 | FPC board |
| CN106686905A (en) * | 2016-12-26 | 2017-05-17 | 苏州维信电子有限公司 | Surface mount technology for sheet components |
| US20200060025A1 (en) * | 2017-05-03 | 2020-02-20 | Huawei Technologies Co., Ltd. | Pcb, package structure, terminal, and pcb processing method |
| CN108288610A (en) * | 2018-04-20 | 2018-07-17 | 深圳市锐钜科技有限公司 | It a kind of design of novel chip tin tailing solder pad and its is applied in red adhesive process |
| CN108521722A (en) * | 2018-07-12 | 2018-09-11 | 贵州贵安新区众鑫捷创科技有限公司 | A kind of SMT paster techniques |
| CN209309687U (en) * | 2018-07-22 | 2019-08-27 | 中山市成源光电科技有限公司 | A kind of LED light engine |
| WO2021042967A1 (en) * | 2019-09-05 | 2021-03-11 | 王定锋 | Led waterproof light strip and manufacturing method therefor |
| CN212519549U (en) * | 2020-07-28 | 2021-02-09 | 深圳市视景达科技有限公司 | Structure for improving welding quality of QFN (quad Flat No lead) packaging E-PAD (advanced lead Package) |
| CN112770533A (en) * | 2020-12-31 | 2021-05-07 | 海纳川海拉电子(江苏)有限公司 | High-precision LED position precision assembling method based on dispensing technology |
| CN114641150A (en) * | 2022-03-25 | 2022-06-17 | 深圳市兆兴博拓科技股份有限公司 | Circuit board mounting method based on dispensing optimization |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20120051017A1 (en) | Electronic Component and Method of Manufacturing the Same | |
| US20080202804A1 (en) | Printed circuit board and method of producing the same | |
| TW201426932A (en) | Circuit board and manufacturing method thereof | |
| CN103582302A (en) | Printed circuit board and method for manufacturing printed circuit board | |
| CN211630498U (en) | PCB and common bonding pad thereof | |
| CN110113877B (en) | Method for manufacturing metal-based circuit board by laser cutting method | |
| CN115052433A (en) | Novel SMT (surface mount technology) chip mounting process for circuit board | |
| CN202075772U (en) | Contact-type integrated card (IC) module | |
| CN108463053B (en) | PCB design method and PCB | |
| US20090250507A1 (en) | Soldering method and system thereof | |
| CN105357899B (en) | A kind of two-sided welding method that anti-large chip comes off | |
| CN115119411A (en) | Packaging body steel mesh-free printing welding method and prefabricated substrate | |
| CN202695546U (en) | Light emitting diode (LED) support with surface mount device resistors and LED device with same | |
| TWI782601B (en) | Surface mount micro components, assemblies and methods for batch production of components or assemblies | |
| CN110351962A (en) | A kind of secondary via hole reflow method | |
| JP2003142898A (en) | Method for manufacturing electronic circuit unit | |
| CN215379337U (en) | Reinforced stepped welding pad PCB | |
| KR20060037236A (en) | A shield can for shielding electronic components on a pwb | |
| JP2007214332A (en) | Semiconductor packaging module and manufacturing method thereof | |
| CN216146519U (en) | Connecting structure of surface-mounted element | |
| JP2021114495A (en) | Module and manufacturing method of the same | |
| US20140251668A1 (en) | Automatic manufacturing process for providing buffer pads for a pcb and pcb structure using the same | |
| CN115802606A (en) | SMT (surface mount technology) patch circuit board and manufacturing method thereof | |
| CN102291944A (en) | Method for pasting electronic components by groups by using SMT | |
| CN1722937A (en) | Surface mounting method for electronic element and printed circuit board applying same mounting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |