CN115802606A - SMT (surface mount technology) patch circuit board and manufacturing method thereof - Google Patents
SMT (surface mount technology) patch circuit board and manufacturing method thereof Download PDFInfo
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- CN115802606A CN115802606A CN202211688203.5A CN202211688203A CN115802606A CN 115802606 A CN115802606 A CN 115802606A CN 202211688203 A CN202211688203 A CN 202211688203A CN 115802606 A CN115802606 A CN 115802606A
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Abstract
The invention discloses an SMT chip circuit board and a manufacturing method thereof, wherein the circuit board comprises a substrate and chip components, the chip components are welded with bonding pads on the substrate through tin paste, the chip components are further bonded with the substrate through red glue, glue supplementing holes are formed in the substrate, the glue supplementing holes penetrate through the front side surface and the back side surface of the substrate, and the glue supplementing holes are arranged close to the middle of a chip component mounting area on the substrate. According to the invention, the glue supplementing holes are formed in the substrate, glue is supplemented through the glue supplementing holes in the manufacturing process, red glue can be conveniently injected into the middle position where the chip component and the substrate are attached, the chip component and the substrate are firmly fixed after secondary curing, the chip component is not easy to displace and fall off in subsequent processes, and the improvement of the quality of a finished product of the circuit board is facilitated.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to an SMT chip circuit board and a manufacturing method thereof.
Background
SMT surface mount Technology (surface mount Technology), collectively called surface mount Technology, is a circuit connecting Technology in which a leadless or short-lead surface mount component (SMC/SMD, which is called a chip component in chinese) is mounted on a surface of a Printed Circuit Board (PCB) or a surface of another substrate, and is soldered and assembled by a method such as reflow soldering or dip soldering.
In a typical manufacture procedure of SMT, solder paste is printed on a bonding pad of a substrate through a steel mesh jig, then red glue is distributed on the substrate at the pasting position of a chip component in a glue dispensing mode and the like, then the chip component is pasted on the substrate in an alignment mode, the red glue is solidified through a curing oven, the chip component is pre-fixed, and then solder paste welding is carried out through reflow soldering.
In above-mentioned typical process, because there is the bubble (especially the great chip components in area, the bubble of production more easily) between chip components and the base plate, red glue mouth trouble leads to gluing the volume and so on reason not enough, all can lead to chip components fixed not firm, probably leads to chip components displacement because of fixed not firm in the follow-up processing procedure, even drops. Therefore can increase the testing procedure and mend gluey to fixed not firm chip components and parts usually after the solidification, current mend gluey mode or add gluey at chip components and parts side, mend between chip components and parts and the base plate with red glue through the mobility of glue self, or take off chip components and parts, beat again after the clearance and glue. The side adds the mode of gluing, and glue is difficult to flow to chip components and parts middle part by the side, takes off the mode operation complicacy that chip components and parts beat glue again, all is not ideal mends gluey mode.
Disclosure of Invention
The invention aims to provide an SMT chip circuit board and a manufacturing method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a SMT paster circuit board, includes base plate, chip components and parts pass through the tin cream with pad welding on the base plate, chip components and parts still through red glue with the base plate bonds, be equipped with on the base plate and mend the gluey hole, mend the gluey hole and run through the positive and negative both sides surface setting of base plate, mend gluey hole and be close to the regional middle part setting of chip components dress on the base plate.
According to the technical scheme for further improvement of the chip component, a first adhesive layer which is arranged in a staggered mode with the glue supplementing hole is arranged between the chip component and the substrate, and a second adhesive layer formed by injecting glue into the glue supplementing hole is further arranged between the chip component and the substrate.
A manufacturing method of an SMT patch circuit board comprises the following steps:
s1: opening holes, namely forming glue supplementing holes penetrating through the surfaces of the front side and the back side of the substrate on the substrate, wherein the glue supplementing holes are arranged close to the middle of a chip element mounting area on the substrate;
s2: tin coating, namely printing tin paste on a bonding pad of the substrate through a steel mesh jig;
s3: gluing, namely distributing red glue in a mounting area of the substrate through a glue dispensing or printing process;
s4: mounting, namely aligning and mounting the chip component on a mounting area of the substrate by using a chip mounter;
s5: curing once, namely curing the red glue distributed on the substrate in the step S3 through a curing oven to form a first adhesive layer;
s6: glue filling, namely filling red glue between the chip component and the substrate through a needle nozzle type glue filling machine;
s7: secondary curing, namely curing the red glue injected in the step S6 through a curing furnace to form a second adhesive layer;
s8: and reflow soldering, wherein the chip component and the substrate are connected in a soldering manner through a reflow soldering process.
As a further improved technical solution of the present invention, in the step S3, the red glue is distributed in the mounting area of the substrate and the glue filling holes in a staggered manner.
As a further improved technical scheme of the present invention, in step S6, the outer diameter of the needle nozzle type glue injection machine for injecting glue is slightly smaller than the aperture of the glue injection hole.
As a further improved technical solution of the present invention, step S6 further includes step S51, and step S51: detecting to identify the chip component which is not firmly fixed by the first adhesive layer;
after step S51 is executed, steps S6, S6: and (5) glue filling, namely filling red glue between the unfixed and firm chip component and the substrate through a needle nozzle type glue filling machine from the glue filling hole.
As a further improved technical scheme of the invention, in step S6, glue injection is kept when the needle nozzle of the needle nozzle type glue injection machine is pulled out from the glue filling hole, so that the red glue fills the glue filling hole.
Compared with the prior art, the invention has the technical effects that:
according to the invention, the glue supplementing holes are formed in the substrate, glue is supplemented through the glue supplementing holes in the manufacturing process, red glue can be conveniently injected into the middle position where the chip component and the substrate are attached, the chip component and the substrate are firmly fixed after secondary curing, the chip component is not easy to displace and fall off in subsequent processes, and the improvement of the quality of a finished product of the circuit board is facilitated.
Drawings
Fig. 1 is a schematic top view of an SMT patch circuit board according to an embodiment of the present invention;
fig. 2 is a schematic top view of an SMT patch circuit board with a chip component removed according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of an SMT chip circuit board according to an embodiment of the invention;
fig. 4 is a schematic flow chart illustrating an implementation of a method for manufacturing an SMT patch circuit board according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes in accordance with the embodiments are within the scope of the present invention.
Referring to fig. 1 to 3, the SMT patch circuit board comprises a substrate 1 and a sheet component 2, wherein the sheet component 2 is welded with a bonding pad 3 on the substrate 1 through solder paste, the sheet component 2 is further bonded with the substrate 1 through red glue, a glue supplementing hole 6 is formed in the substrate 1, the glue supplementing hole 6 penetrates through the surfaces of the front side and the back side of the substrate 1, and the glue supplementing hole 6 is arranged close to the middle of a mounting area of the sheet component 2 on the substrate 1.
In the present embodiment, the substrate 1 is a PCB.
It should be noted that the red glue is a polyolefin compound, is a common SMT material, and has a characteristic of thermal curing, and the red glue is insulating.
The glue filling hole 6 is arranged close to the middle of the mounting area of the chip component 2 on the substrate 1, wherein the "mounting area of the chip component 2 on the substrate 1" refers to an area corresponding to each chip component 2 on the substrate 1 according to the design of a circuit board, and the middle of the mounting area corresponds to the center of each chip component 2.
When the area of the chip component 2 is large, a plurality of glue filling holes 6 may be formed in the mounting area corresponding to the chip component 2.
Further, be equipped with between chip components 2 and the base plate 1 with mend the first viscose layer 4 of glue hole 6 dislocation set, still include between chip components 2 and the base plate 1 by mend the second viscose layer 5 that 6 injecting glue in glue hole formed.
Referring to fig. 4, a method for manufacturing an SMT chip circuit board includes the following steps:
s1: the method comprises the following steps of (1) forming a hole, wherein a glue supplementing hole penetrating through the surfaces of the front side and the back side of the substrate is formed in the substrate, and the glue supplementing hole is arranged close to the middle of a chip component mounting area on the substrate;
s2: tin coating, namely printing tin paste on a bonding pad of the substrate through a steel mesh jig;
s3: gluing, namely distributing the red glue in a mounting area of the substrate through a glue dispensing or printing process;
s4: mounting, namely aligning and mounting the chip component on a mounting area of the substrate by using a chip mounter;
s5: curing once, namely curing the red glue distributed on the substrate in the step S3 through a curing oven to form a first adhesive layer;
s6: glue filling, namely filling red glue between the chip component and the substrate through a needle nozzle type glue filling machine;
s7: secondary curing, namely curing the red glue injected in the step S6 through a curing furnace to form a second adhesive layer;
s8: and reflow soldering, wherein the chip component and the substrate are connected in a soldering manner through a reflow soldering process.
Because the steps of glue filling and secondary curing through the glue filling holes are added in the manufacturing process, the chip component can be more firmly attached to the substrate, and the phenomena of displacement and falling are not easy to occur.
Further, in the step S3, the red glue is distributed in the mounting area of the substrate and the glue filling holes in a staggered manner. The staggered distribution is to prevent the first adhesive layer formed by one-time curing from blocking the adhesive filling holes.
Further, in the step S6, the outer diameter of the needle nozzle type glue injection machine for injecting glue is slightly smaller than the aperture of the glue filling hole. The first viscose layer that once solidifies and forms probably forms closed-loop type in mending gluey hole periphery for form the bubble cavity through mending gluey hole and outside intercommunication only between chip components and parts and the base plate, adopt thinner needle mouth, make the air in the bubble cavity when mending gluey, can borrow the fit clearance in needle mouth and the gluey hole and discharge.
Further, step S6 is preceded by step S51, and step S51: detecting to identify the chip component which is not firmly fixed by the first adhesive layer;
after step S51 is executed, step S6, S6: and (5) glue filling, namely filling red glue between the unfixed and firm chip component and the substrate through a needle nozzle type glue filling machine from the glue filling hole.
Further, in step S6, glue injection is maintained when the needle nozzle of the needle nozzle type glue injection machine is pulled out from the glue filling hole, so that the glue filling hole is filled with the red glue.
Compared with the prior art, the invention has the technical effects that:
according to the invention, the glue supplementing holes are formed in the substrate, glue is supplemented through the glue supplementing holes in the manufacturing process, so that red glue can be conveniently injected into the middle position where the chip component and the substrate are attached, the chip component and the substrate are firmly fixed after secondary curing, the chip component is not easy to displace and fall off in subsequent manufacturing processes, and the quality of a finished product of a circuit board is favorably improved.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may be modified or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. The utility model provides a SMT paster circuit board, includes base plate, slice components and parts pass through the tin cream with pad welding on the base plate, slice components and parts still through red glue with the base plate bonds, a serial communication port, be equipped with on the base plate and mend the gluey hole, it runs through to mend the gluey hole the positive and negative both sides surface setting of base plate, it sets up to mend gluey hole near the middle part that slice components and parts pasted the region on the base plate.
2. An SMT patch circuit board according to claim 1, wherein a first adhesive layer is disposed between the chip component and the substrate and is staggered with the glue filling holes, and a second adhesive layer formed by glue filling of the glue filling holes is further included between the chip component and the substrate.
3. A manufacturing method of an SMT patch circuit board is characterized by comprising the following steps:
s1: the method comprises the following steps of (1) forming a hole, wherein a glue supplementing hole penetrating through the surfaces of the front side and the back side of the substrate is formed in the substrate, and the glue supplementing hole is arranged close to the middle of a chip component mounting area on the substrate;
s2: tin coating, namely printing tin paste on a bonding pad of the substrate through a steel mesh jig;
s3: gluing, namely distributing red glue in a mounting area of the substrate through a glue dispensing or printing process;
s4: mounting, namely aligning and mounting the chip component on a mounting area of the substrate by using a chip mounter;
s5: curing once, namely curing the red glue distributed on the substrate in the step S3 through a curing oven to form a first adhesive layer;
s6: glue filling, namely filling red glue between the chip component and the substrate through a needle nozzle type glue filling machine;
s7: secondary curing, namely curing the red glue injected in the step S6 through a curing furnace to form a second adhesive layer;
s8: and reflow soldering, wherein the chip component and the substrate are connected in a soldering manner through a reflow soldering process.
4. An SMT patch circuit board manufacturing method according to claim 3, wherein in the step S3, the red glue is distributed in a staggered manner in the mounting area of the substrate and the glue filling holes.
5. An SMT patch circuit board manufacturing method according to claim 3, wherein in the step S6, an outer diameter of a needle nozzle of the needle nozzle type glue injector for injecting glue is slightly smaller than an aperture of the glue injection hole.
6. An SMT patch circuit board manufacturing method according to claim 3, wherein step S6 is preceded by steps S51, S51: detecting to identify the chip component which is not firmly fixed by the first adhesive layer;
after step S51 is executed, steps S6, S6: and (5) glue filling, namely filling red glue between the unfixed and firm chip component and the substrate through a needle nozzle type glue filling machine from the glue filling hole.
7. An SMT chip circuit board manufacturing method according to claim 3, wherein in step S6, glue is kept injected when the needle nozzle of the needle nozzle type glue injector is pulled out of the glue filling hole, so that the glue filling hole is filled with red glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211688203.5A CN115802606A (en) | 2022-12-28 | 2022-12-28 | SMT (surface mount technology) patch circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211688203.5A CN115802606A (en) | 2022-12-28 | 2022-12-28 | SMT (surface mount technology) patch circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115802606A true CN115802606A (en) | 2023-03-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211688203.5A Pending CN115802606A (en) | 2022-12-28 | 2022-12-28 | SMT (surface mount technology) patch circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115802606A (en) |
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- 2022-12-28 CN CN202211688203.5A patent/CN115802606A/en active Pending
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