KR19990082161A - Reflow soldering method for circuit board mounted with SMD components - Google Patents

Reflow soldering method for circuit board mounted with SMD components Download PDF

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Publication number
KR19990082161A
KR19990082161A KR1019980705886A KR19980705886A KR19990082161A KR 19990082161 A KR19990082161 A KR 19990082161A KR 1019980705886 A KR1019980705886 A KR 1019980705886A KR 19980705886 A KR19980705886 A KR 19980705886A KR 19990082161 A KR19990082161 A KR 19990082161A
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South Korea
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circuit board
smd components
reflow soldering
components
smd
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KR1019980705886A
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Korean (ko)
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안드레아스 노이텔
요악힘 쉬미트
옌스 사보케
프랑크-디터 하우쉴트
안스가르 그라엔
카롤라 바란
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클라우스 포스, 게오르그 뮐러
로베르트 보쉬 게엠베하
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Publication of KR19990082161A publication Critical patent/KR19990082161A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

본 발명은 SMD 부품들로 실장된 회로판(Circuit Board)의 리플로우 납땜(reflow soldering)을 위한 방법에 관한 것으로, 회로판의 첫 번째 면의 납땜 표면(soldering surface)위에 SMD 부품들이 놓여지게 되고 첫 번째 리플로우 납땜-단계에서 회로판과 함께 납땜 되며, 그런후에 회로판의 첫 번째 면을 아래로 뒤집고 이제 위로 놓여져 있는 두 번째 면의 납땜 표면위에 SMD 부품들이 놓여지게 된다. 이때 첫 번째 면위에 SMD 부품들은 두 번째 리플로우 단계에 앞서 회로판의 첫 번째 면에 접착된다. 첫 번째 리플로우 단계후에 회로판의 두 번째 면에서부터 항상 첫 번째 면위로 납땜된 실장 부품들의 장소에 있는, 회로판의 첫 번째 면에서 두 번째 면에까지 미치고 있는, 구멍을 통해 실장 부품과 회로판 사이의 공간안으로 접착제(glue)를 주입하는 것이 제안되어 있다.The present invention relates to a method for reflow soldering of a circuit board mounted with SMD components, wherein the SMD components are placed on the soldering surface of the first side of the circuit board and the first In the reflow soldering-stage, the solder is soldered together with the circuit board, and then the SMD components are placed on the solder surface of the second side, which is now turned upside down with the first side of the circuit board turned down. The SMD components on the first side are then glued to the first side of the circuit board prior to the second reflow step. After the first reflow step, into the space between the mounting component and the circuit board through holes extending from the first side to the second side of the circuit board, always in place of the mounting components soldered onto the first side from the second side of the circuit board. It is proposed to inject glue.

Description

ＳＭＤ 부품들로 실장된 회로판의 리플로우 납땜 방법Reflow soldering method for circuit board mounted with SMD parts

상기와 같은 종류의 방법들은 이미 오래전에 알려졌고 리플로우 납땜 방법으로 회로판을 양면에서 SMD 부품들(SMD=Surface Mounted Device)과 함께 납땜하기 위해, 회로판 제조에 있어서 사용된다. 예를 들자면 EP 0 419 065 A2에서 알려진 방법으로는, 우선 회로판은 납땜 페이스트 압축 스테이션에서 그것의 첫 번째 면위에서 SMD 부품들을 실장하기 위해 마련된 지점에 납땜 표면과 함께 프린팅된다. 이어서 회로판은 납땜 지점사이에 접착 스테이션에서 SMD 부품들을 고정하기 위해 접착제 방울이 마련되고 그런후 실장기에서는 납땜 표면과 접착제 위로 놓이게 되는, SMD 부품들로 실장된다. 실장 부품들이 접착제 안으로 압착되어야 하기 때문에, 실장 부품들의 정확한 놓임이 접착제에 의해 방해될 수 있다. 실장후에 접착제는 경화되고 첫 번째 면위로 형성된 납땜이 녹게 되고 실장 부품들이 회로판과 함께 납땜되는, 리플로우 납땜 스테이션에 회로판이 운반된다. 첫 번째 리플로우 납땜 단계후에 두 번째 면의 회로판은 위쪽으로 뒤집어지고 이제 새롭게 납땜 표면으로 프린팅되고 이어서 SMD 부품들로 실장된다. 두 번째 면의 실장후에 회로판은 새롭게 리플로우 납땜 스테이션에 운반된다. 두 번째 리플로우 납땜 단계 동안에 두 번째 면위의 솔더뿐만 아니라, 아래에 놓여있는 첫 번째 면위의 솔더도 녹게 된다. 그때 접착제는 첫 번째 면위에 있는 SMD 부품들과 회로판 사이에서, 이미 첫 번째 면과 함께 납땜된 SMD 부품들이 납땜 결합이 새롭게 녹게될 때에 그것들의 중력에 의해 회로판에서 분리되는 것을 방지한다. EP 0 419 065 A2에서 알려진 방법에 있어서의 단점은, 첫 번째 리플로우 납땜 단계에 앞서 접착제가 회로판위에 발라지게 되면, 그때 녹은 솔더 페이스트는 접착제로 고정된 실장 부품들의 아래에서 수축될 수 있고 또는 접착제를 이용한 실장 부품들이 녹은 솔더 페이스트 밖으로 밀리게 될 수 있는 것이다. "고정 : settling" 으로써 알려진 이 효과는 회로판위의 납땜된 랜드와 SMD 부품들 사이의 전기 결합이 전혀 발생하지 않거나 불충분하게 발생하도록 야기한다.Methods of this kind have already been known for a long time and are used in circuit board fabrication to solder the circuit board with SMD components (SMD = Surface Mounted Device) on both sides by the reflow soldering method. For example, in the method known from EP 0 419 065 A2, a circuit board is first printed with a solder surface at a point provided for mounting SMD components on its first side in a solder paste compression station. The circuit board is then mounted with SMD components, which are provided with glue droplets to hold the SMD components at the bonding station between the soldering points and then placed on the solder surface and the adhesive in the mounter. Since the mounting parts must be pressed into the adhesive, the precise placement of the mounting parts can be hindered by the adhesive. After mounting, the adhesive is cured, the solder formed on the first side is melted and the circuit board is transported to a reflow soldering station where the mounting components are soldered with the circuit board. After the first reflow soldering step, the circuit board on the second side is turned upside down and is now printed onto the new solder surface and subsequently mounted with SMD components. After mounting on the second side, the circuit board is newly delivered to the reflow soldering station. During the second reflow soldering step, not only the solder on the second side but also the solder on the first side beneath it melts. The adhesive then prevents the SMD components on the first side and the circuit board from being separated from the circuit board by their gravity when the solder joint is newly melted with the solder components already soldered with the first side. A disadvantage of the method known from EP 0 419 065 A2 is that if the adhesive is applied onto the circuit board prior to the first reflow soldering step, then the molten solder paste can shrink under the mounting parts fixed with the adhesive or the adhesive Mounting components can be pushed out of the molten solder paste. This effect, known as "settling", causes the electrical bond between the soldered lands on the circuit board and SMD components to occur at all or insufficiently.

이 기술 상태에서 달리 알려진 방법으로는, 그 때문에 실장 부품과 회로판사이에서 SMD 부품들의 첫 번째 리플로우 납땜 후에야 비로소 접착제를 바르도록 하고 있다. 이 방법에 있어서, 접착제는 그것이 SMD 부품들과 그것들의 테두리에서 회로판 윗면을 결합하도록, 실장 부품들의 측면 테두리의 범위에서 불룩하게 발라진다. 이것에 있어서의 단점은, 접착제를 바를 때 납땜 표면위에까지 미치게 되면 이로써 납땜 표면이 오염되고 더럽혀지게 되는 것이다. 이어서 실행되는 두 번째 리플로우 납땜 단계에서는 SMD 부품과 회로판사이의 전기 결합의 품질이 오염으로 인해 저하된다.Another known method in this state of the art is that adhesives are only applied after the first reflow soldering of SMD components between the mounting component and the circuit board. In this method, the adhesive is applied bulging in the range of the side edges of the mounting components, such that it joins the circuit board top surface at the SMD components and their edges. The disadvantage with this is that when the adhesive is applied, it even spreads over the soldering surface, thereby contaminating and soiling the soldering surface. In the subsequent reflow soldering step, the quality of the electrical bond between the SMD component and the circuit board is degraded due to contamination.

본 발명은 청구항 1의 대개념에서 제시된 바와같은 SMD 부품들로 실장된 회로판의 리플로우 납땜(reflow soldering)을 위한 방법에 관한 것이다.The present invention relates to a method for reflow soldering of a circuit board mounted with SMD components as presented in the general concept of claim 1.

본 발명의 방법은 예를들어, 회로판이 콘베이어 벨트위에서 차례로 개별 스테이션(station)을 통과하는, 자동 생산 라인에서 실행될 수 있다. 회로판들은 양면 모두 SMD 부품들로 실장되어야 하는, 첫 번째 면과 이것을 마주보고 있는 두 번째 면을 제시한다. 회로판의 첫 번째 면의 SMD 부품들을 실장하기 위해 정해진 지점에는 항상 회로판의 첫 번째 면에서 두 번째 면까지 미치고 있는, 구멍이 마련되어 있다. 이 구멍은 예를들어 약 1㎜ 직경의 구멍으로 형성될 수 있다. 본 방법은 양면에 SMD 부품들을 위한 랜드(land)와 서술된 구멍들이 마련된 회로판이 회로판의 첫 번째 면의 랜드위로 납땜 페이스트가 발라지는, 납땜 페이스트(solder paste) 압축 스테이션에 운반됨으로써 시작한다. 이어서 회로판은 흡입관을 이용해 SMD- 실장 부품들을 첫 번째 면의 납땜 표면위로 놓아 두는, SMD기에 운반된다. 실장후에 회로판은 첫 번째 면위에 실장된 실장 부품들이 랜드와 함께 납땜되는, 리플로우 스테이션에 운반된다. 이어서 회로판은 뒤집어지고 접착 스테이션에 운반된다. 접착 스테이션에서는 위로 놓여져 있는 회로판의 두 번째 면에서 이제 실장 부품들 위에 놓여 있는 구멍 안으로 끼워지는, 가는관을 이용해 접착제가 회로판의 첫 번째 면과 SMD 부품들의 랜드쪽 사이의 공간안으로 주입된다. 그렇게 실행된 방법에 있어서, 접착제는 실장 부품과 회로판 사이의 공간에서 밖으로 새어 나오지 않도록 정확히 정량이 투입되어야 한다. 이 때 실장 부품들은 랜드쪽의 한 가운데에 발라져 있는 개별 접착제 방울을 이용해 회로판에 접착되고, 측면 테두리에 마련된 납땜 표면의 오염이 방지된다. 필요한 경우, 접착제는 접착 스테이션 뒤에 경화 스테이션에서 경화된다. 하지만 리플로우 스테이션에서 경화되는, 접착제도 사용될 수 있다. 회로판은 이제 새롭게 납땜 페이스트 압축 스테이션으로 운반되고 위쪽을 제시하는 두 번째 회로판면의 랜드위에서 납땜 페이스트로 프린팅된다. 이어서 회로판은 실장기에서 두 번째 면위는 SMD 부품들로 실장되고 새로이 리플로우 스테이션에 운반된다. 이제 두 번째 리플로우 단계가 실행되는 동안에 두 번째 면위로 놓여진 실장 부품들은 회로판과 함께 납땜된다. 그때 이미 첫 번째 면의 랜드와 함게 납땜된 실장 부품들의 납땜은 새롭게 녹여지고, 이때 실장 부품과 회로판 사이의 접착제 방울들은 SMD 부품들이 그것들의 중력에 제한되어 회로판에서 분리되는 것을 방지한다. 두 번째 리플로우 납땜 단계를 실행한 후에 실장 부품들은 회로판의 양면위에서 랜드와 함께 납땜 된다.The method of the invention can be implemented, for example, in an automated production line, in which a circuit board passes through individual stations in turn on a conveyor belt. The circuit boards show the first side and the second side facing it, both sides of which must be mounted with SMD components. Dedicated points for mounting SMD components on the first side of the circuit board are always provided with holes, extending from the first side to the second side of the circuit board. This hole may for example be formed into a hole of about 1 mm diameter. The method begins by transporting a circuit board with lands for SMD components on both sides and the described holes to a solder paste compression station where solder paste is applied onto the land on the first side of the circuit board. The circuit board is then transported to the SMD machine, using suction tubes to place the SMD-mount components on the soldering surface of the first side. After mounting, the circuit board is transported to a reflow station where the mounting components mounted on the first side are soldered together with the lands. The circuit board is then flipped over and carried to the bonding station. At the gluing station, glue is injected into the space between the first side of the circuit board and the land side of the SMD components, using a thin tube that fits into the hole that is now placed on the mounting components on the second side of the circuit board that is placed up. In such a practice, the adhesive must be accurately metered in so that it does not leak out of the space between the mounting component and the circuit board. The mounting components are then glued to the circuit board using individual glue drops applied in the middle of the land side, to prevent contamination of the solder surface provided at the side edges. If necessary, the adhesive is cured in the curing station behind the bonding station. However, adhesives, which are cured in the reflow station, can also be used. The circuit board is now transported to the solder paste compression station and printed with solder paste on the land on the second circuit board surface that presents the top. The circuit board is then mounted with SMD components on the second side of the mounter and then transferred to the reflow station. Now, the mounting components placed on the second face during the second reflow phase are soldered together with the circuit board. The soldering of the mounting components already soldered together with the land on the first side is then melted fresh, with the adhesive drops between the mounting component and the circuit board preventing the SMD components from being separated from the circuit board by being limited to their gravity. After performing the second reflow soldering step, the mounting components are soldered with lands on both sides of the circuit board.

본 발명에 있어서, SMD 부품들로 실장된, 주청구항의 특징들이 있는, 회로판의 리플로우 납땜을 위한 방법은 그에 관한 장점으로는, 첫째 리플로우 납땜 단계 후에야 비로소 접착제가 접착되고 동시에 접착제가 마련되는 회로판의 첫 번째 면위에서의 납땜 표면의 오염이 방지된다는 점이다. 이것은 간단한 방식으로 달성되는데, 즉 접착제가 첫 번째 리플로우 납땜 후에 회로판의 자유롭게 접근할 수 있는 두 번째 면에서부터 그것을 위해 마련된 구멍을 통해 실장 부품과 회로판 사이의 좁은 공간안으로 주입되는 것이다. 이것을 통해 SMD 부품들의 고정뿐만 아니라, 실장 부품과 회로판 사이에 납땜 지점들의 접착제로 야기되는 전기 전도율의 방해도 방지된다. 본 발명의 방법은 제조 기계들과 진행 순서들의 근본적인 변경을 요구하지 않으므로, 이를 위한 추가적 비용이 발생되지 않는다. 아울러 SMD 부품들을 이용한 회로판 첫 번째 면의 실장은 접착제로 인해 방해되지 않으며 SMD 부품들은 문제없이 납땜 표면위로 놓이게 될 수 있다는 장점을 갖는다.In the present invention, the method for reflow soldering of a circuit board, which has the features of the claims, mounted with SMD components, has the advantage in that it is only after the first reflow soldering step that the adhesive is bonded and at the same time the adhesive is provided. Contamination of the solder surface on the first side of the circuit board is prevented. This is achieved in a simple manner, in which the adhesive is injected into the narrow space between the mounting component and the circuit board through the holes provided for it from the freely accessible second side of the circuit board after the first reflow soldering. This prevents not only the fixing of SMD components but also the disturbance of electrical conductivity caused by the adhesive of soldering points between the mounting component and the circuit board. The method of the present invention does not require a fundamental change of manufacturing machines and the order of progression, so no additional cost is incurred for this. In addition, the mounting of the first side of the circuit board with SMD components is not disturbed by the adhesive and the SMD components can be placed on the solder surface without any problem.

특히, 접착제를 시각적으로 정량을 재기위해, 회로판을 뒤집은 후에 구멍안으로 끼워지는 가는관을 이용해 SMD 부품의 랜드와 회로판의 첫 번째 면 사이의 공간안으로 접착제를 직접 주입하는 장점을 갖는다.In particular, to visually quantify the adhesive, it has the advantage of directly injecting the adhesive into the space between the land of the SMD component and the first side of the circuit board using a thin tube that is inserted into the hole after the circuit board is turned over.

Claims (2)

SMD 부품들은 회로판의 첫 번째 면의 납땜 표면위에 놓이게 되고 첫 번째 리플로우 납땜 단계에서 회로판과 함께 납땜되며, 다음에 첫 번째 면의 회로판은 아래쪽으로 뒤집어지고 이와 관련해 두 번째 리플로우 납땜 단계에서 회로판과 함께 납땜되는, SMD 부품들은 이제 위로 놓여있는 두 번째 면의 납땜 표면위에 놓여지게 되며, 이때 첫번째 면위의 SMD 부품들은 두 번째 리플로우 납땜 단계에 앞서 회로판의 첫 번째 면에 접착되는, SMD 부품들로 실장된 회로판의 리플로우 납땜 방법에 있어서,SMD components are placed on the soldering surface of the first side of the circuit board and soldered together with the circuit board in the first reflow soldering step, and then the circuit board on the first side is flipped down and related to the circuit board in the second reflow soldering step. SMD components, which are soldered together, are now placed on the soldering surface of the second side, which is placed upside, with the SMD components on the first side being bonded to the first side of the circuit board prior to the second reflow soldering step. In the reflow soldering method of the mounted circuit board, 상기 첫 번째 리플로우 납땜 단계후에 접착제는 회로판의 두 번째 면에서부터 항상 첫 번째 면위로 납땜되는 실장 부품들의 장소에 구비되며, 회로판의 첫 번째 면에서 두 번째 면에 이르는 구멍을 통해 실장 부품과 첫 번째 면 사이의 공간안으로 주입되는 것을 특징으로 하는 SMD 부품들로 실장된 회로판의 리플로우 납땜 방법.After the first reflow soldering step, the adhesive is placed in place of the mounting components which are always soldered onto the first side from the second side of the circuit board, through the holes from the first side to the second side of the circuit board and the first A reflow soldering method for a circuit board mounted with SMD components, which is injected into the space between the surfaces. 제 1항에 있어서, 상기 접착제는 회로판을 뒤집은 후에 구멍안으로 끼워 넣은 가는관을 이용해 SMD 부품의 랜드쪽과 회로판 첫 번째 면 사이의 공간 안으로 주입되는 것을 특징으로 하는 SMD 부품들로 실장된 회로판의 리플로우 납땜 방법.2. The ripple of a circuit board mounted with SMD components according to claim 1, wherein the adhesive is injected into the space between the land side of the SMD component and the first surface of the circuit board by using a thin tube inserted into the hole after the circuit board is turned over. Low soldering method.
KR1019980705886A 1996-12-13 1997-09-09 Reflow soldering method for circuit board mounted with SMD components KR19990082161A (en)

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