CN115003716B - 树脂组合物、树脂片材、预浸体及印刷电路板 - Google Patents

树脂组合物、树脂片材、预浸体及印刷电路板 Download PDF

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Publication number
CN115003716B
CN115003716B CN202180009886.4A CN202180009886A CN115003716B CN 115003716 B CN115003716 B CN 115003716B CN 202180009886 A CN202180009886 A CN 202180009886A CN 115003716 B CN115003716 B CN 115003716B
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group
general formula
resin composition
resin
mass
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CN115003716A (zh
Inventor
平野俊介
加藤祯启
伊藤环
信国豪志
杉本宪明
久保孝史
古贺将太
上野至孝
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Mitsubishi Gas Chemical Co Inc
MGC Electrotechno Co Ltd
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Mitsubishi Gas Chemical Co Inc
MGC Electrotechno Co Ltd
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    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
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    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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CN202180009886.4A 2020-01-24 2021-01-20 树脂组合物、树脂片材、预浸体及印刷电路板 Active CN115003716B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2020-010181 2020-01-24
JP2020010181 2020-01-24
JP2020-011977 2020-01-28
JP2020011977 2020-01-28
JP2020-029924 2020-02-25
JP2020029924 2020-02-25
JP2020-029923 2020-02-25
JP2020029923 2020-02-25
PCT/JP2021/001889 WO2021149733A1 (ja) 2020-01-24 2021-01-20 樹脂組成物、樹脂シート、プリプレグ及びプリント配線板

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CN115003716A CN115003716A (zh) 2022-09-02
CN115003716B true CN115003716B (zh) 2025-04-11

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US (1) US20230098357A1 (https=)
EP (1) EP4094940A1 (https=)
JP (1) JP7660078B2 (https=)
KR (1) KR20220132535A (https=)
CN (1) CN115003716B (https=)
TW (1) TWI881021B (https=)
WO (1) WO2021149733A1 (https=)

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EP4112294A4 (en) 2020-02-25 2024-01-10 Mitsubishi Gas Chemical Company, Inc. RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FILM COATED LAMINATE BOARD, RESIN SHEET AND PRINTED CIRCUIT BOARD
TW202136418A (zh) * 2020-02-25 2021-10-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂片、及印刷配線板
JP7818201B2 (ja) * 2020-09-11 2026-02-20 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
TW202222875A (zh) * 2020-09-11 2022-06-16 日商松下知識產權經營股份有限公司 樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線板
CN115996843A (zh) * 2020-09-11 2023-04-21 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
CN116056893A (zh) * 2020-09-11 2023-05-02 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
KR102821176B1 (ko) * 2021-02-25 2025-06-17 니폰 가야꾸 가부시끼가이샤 경화성 수지 조성물, 프리프레그 및 그 경화물
WO2022210433A1 (ja) * 2021-03-30 2022-10-06 日本化薬株式会社 マレイミド樹脂混合物、硬化性樹脂組成物、プリプレグおよびその硬化物
JP2023015005A (ja) * 2021-07-19 2023-01-31 日本化薬株式会社 硬化性樹脂組成物、プリプレグおよびその硬化物
CN117881738A (zh) * 2021-09-03 2024-04-12 株式会社力森诺科 树脂组合物、预浸料、层叠板、树脂膜、印刷电路板及半导体封装
CN114276627B (zh) * 2021-11-30 2024-08-23 南亚新材料科技股份有限公司 含乙烯基共聚物的热固性树脂组合物及其应用
US12516032B2 (en) 2022-01-24 2026-01-06 Industrial Technology Research Institute Epoxy compound, composition and cured product thereof
TW202342605A (zh) * 2022-03-11 2023-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置
CN118922466A (zh) * 2022-03-14 2024-11-08 三菱瓦斯化学株式会社 树脂、树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板、以及半导体装置
KR20250107837A (ko) * 2022-10-26 2025-07-14 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판
WO2024090408A1 (ja) * 2022-10-26 2024-05-02 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板
TWI830461B (zh) * 2022-10-27 2024-01-21 南亞塑膠工業股份有限公司 樹脂組成物
WO2025115610A1 (ja) * 2023-12-01 2025-06-05 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
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