TWI881021B - 樹脂組成物、樹脂片材、預浸體及印刷電路板 - Google Patents

樹脂組成物、樹脂片材、預浸體及印刷電路板 Download PDF

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TWI881021B
TWI881021B TW110102188A TW110102188A TWI881021B TW I881021 B TWI881021 B TW I881021B TW 110102188 A TW110102188 A TW 110102188A TW 110102188 A TW110102188 A TW 110102188A TW I881021 B TWI881021 B TW I881021B
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Taiwan
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group
general formula
resin composition
resin
mass
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TW110102188A
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TW202138463A (zh
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平野俊介
加藤禎啓
伊藤環
信國豪志
杉本憲明
久保孝史
古賀將太
上野至孝
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日商三菱瓦斯化學股份有限公司
日商Ｍｇｃ電子科技股份有限公司
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    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
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    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
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    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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    • B32—LAYERED PRODUCTS
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    • B32B2305/07—Parts immersed or impregnated in a matrix
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2353/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
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    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • H05K2201/012—Flame-retardant; Preventing of inflammation

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  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
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  • Compositions Of Macromolecular Compounds (AREA)
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TW110102188A 2020-01-24 2021-01-20 樹脂組成物、樹脂片材、預浸體及印刷電路板 TWI881021B (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2020-010181 2020-01-24
JP2020010181 2020-01-24
JP2020-011977 2020-01-28
JP2020011977 2020-01-28
JP2020-029924 2020-02-25
JP2020029924 2020-02-25
JP2020-029923 2020-02-25
JP2020029923 2020-02-25

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TW202138463A TW202138463A (zh) 2021-10-16
TWI881021B true TWI881021B (zh) 2025-04-21

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US (1) US20230098357A1 (https=)
EP (1) EP4094940A1 (https=)
JP (1) JP7660078B2 (https=)
KR (1) KR20220132535A (https=)
CN (1) CN115003716B (https=)
TW (1) TWI881021B (https=)
WO (1) WO2021149733A1 (https=)

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EP4112294A4 (en) 2020-02-25 2024-01-10 Mitsubishi Gas Chemical Company, Inc. RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FILM COATED LAMINATE BOARD, RESIN SHEET AND PRINTED CIRCUIT BOARD
TW202136418A (zh) * 2020-02-25 2021-10-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂片、及印刷配線板
JP7818201B2 (ja) * 2020-09-11 2026-02-20 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
TW202222875A (zh) * 2020-09-11 2022-06-16 日商松下知識產權經營股份有限公司 樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線板
CN115996843A (zh) * 2020-09-11 2023-04-21 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
CN116056893A (zh) * 2020-09-11 2023-05-02 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
KR102821176B1 (ko) * 2021-02-25 2025-06-17 니폰 가야꾸 가부시끼가이샤 경화성 수지 조성물, 프리프레그 및 그 경화물
WO2022210433A1 (ja) * 2021-03-30 2022-10-06 日本化薬株式会社 マレイミド樹脂混合物、硬化性樹脂組成物、プリプレグおよびその硬化物
JP2023015005A (ja) * 2021-07-19 2023-01-31 日本化薬株式会社 硬化性樹脂組成物、プリプレグおよびその硬化物
CN117881738A (zh) * 2021-09-03 2024-04-12 株式会社力森诺科 树脂组合物、预浸料、层叠板、树脂膜、印刷电路板及半导体封装
CN114276627B (zh) * 2021-11-30 2024-08-23 南亚新材料科技股份有限公司 含乙烯基共聚物的热固性树脂组合物及其应用
US12516032B2 (en) 2022-01-24 2026-01-06 Industrial Technology Research Institute Epoxy compound, composition and cured product thereof
TW202342605A (zh) * 2022-03-11 2023-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置
CN118922466A (zh) * 2022-03-14 2024-11-08 三菱瓦斯化学株式会社 树脂、树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板、以及半导体装置
KR20250107837A (ko) * 2022-10-26 2025-07-14 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판
WO2024090408A1 (ja) * 2022-10-26 2024-05-02 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板
TWI830461B (zh) * 2022-10-27 2024-01-21 南亞塑膠工業股份有限公司 樹脂組成物
WO2025115610A1 (ja) * 2023-12-01 2025-06-05 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2025187617A1 (ja) * 2024-03-08 2025-09-12 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

Citations (2)

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