CN114999937A - Optical chip packaging method - Google Patents

Optical chip packaging method Download PDF

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Publication number
CN114999937A
CN114999937A CN202210574671.3A CN202210574671A CN114999937A CN 114999937 A CN114999937 A CN 114999937A CN 202210574671 A CN202210574671 A CN 202210574671A CN 114999937 A CN114999937 A CN 114999937A
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CN
China
Prior art keywords
layer
plastic package
packaging
transparent plastic
light guide
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Pending
Application number
CN202210574671.3A
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Chinese (zh)
Inventor
孙瑜
石先玉
万里兮
吴昊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Wanying Microelectronics Co ltd
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Chengdu Wanying Microelectronics Co ltd
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Publication date
Application filed by Chengdu Wanying Microelectronics Co ltd filed Critical Chengdu Wanying Microelectronics Co ltd
Priority to CN202210574671.3A priority Critical patent/CN114999937A/en
Priority to PCT/CN2022/103335 priority patent/WO2023226153A1/en
Publication of CN114999937A publication Critical patent/CN114999937A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/124—Geodesic lenses or integrated gratings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12107—Grating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention discloses an optical chip packaging method, which comprises the following steps: mounting a plurality of optical chips with light detection surfaces on the top on a packaging substrate; placing a plastic package mold on a package substrate and covering the optical chip, wherein the plastic package mold is provided with a light guide structure shape corresponding to the light guide structure, injecting a transparent plastic package material into the plastic package mold for plastic package, and forming a transparent plastic package layer containing the light guide structure after curing; plastic packaging the upper surface of the transparent plastic packaging layer by using an opaque plastic packaging material, and curing to form an opaque plastic packaging layer; and cutting between the two optical chips to obtain the single-packaged plastic package structure. The light guide structure is prepared in the transparent plastic package layer, so that the prepared plastic package structure can deflect light rays entering from the light incoming surface on the side surface through the light guide structure, and the light rays are made to enter the light detection surface on the upper surface of the optical chip. Thereby reducing the package thickness and providing a larger feed-in window for external light, reducing the alignment accuracy requirements.

Description

Optical chip packaging method
Technical Field
The invention relates to the related technical field of optical chips, in particular to a plastic package structure.
Background
In some sensing, communication, and computing scenarios, light is fed into the optical chip through optical fibers or other means. In many application scenarios, the light feed path is located on the side of the optical chip. However, the light detection surface of the optical chip is disposed on the front surface of the optical chip. Therefore, the prior art adopts a solution that light is incident on the light detection surface of the front surface of the optical chip from the upper part of the front surface of the optical chip by a prism steering mode or an optical fiber vertical steering mode. Such packaging requires deflecting the fiber 90 °, or deflecting the light with a prism or other device to enter the light detection surface on the front side of the optical chip. Therefore, the optical chip packaging structure in the prior art occupies a large space and is not easy to integrate.
Disclosure of Invention
Therefore, it is necessary to provide an optical chip package structure for solving the technical problems of large space occupation and difficulty in integration of the optical chip package structure in the prior art.
The invention provides an optical chip packaging method, which comprises the following steps:
mounting a plurality of optical chips with light detection surfaces on the top on a packaging substrate;
placing a plastic package mold on a package substrate and covering the optical chip, wherein the plastic package mold is manufactured with a light guide structure shape corresponding to the light guide structure, injecting a transparent plastic package material into the plastic package mold for plastic package, and forming a transparent plastic package layer which contains the light guide structure and coats the optical chip after curing;
the upper surface of the transparent plastic packaging layer is subjected to plastic packaging through a non-transparent plastic packaging material, and a non-transparent plastic packaging layer is formed after solidification;
and cutting the opaque plastic packaging layer, the transparent plastic packaging layer and the packaging substrate between the two optical chips to obtain the single packaged plastic packaging structure comprising the optical chips, the transparent plastic packaging layer, the opaque plastic packaging layer and the packaging substrate.
Further, the plastic package mold is provided with a plurality of light guide structure shapes corresponding to the light guide structures, and when the plastic package mold is placed on the package substrate, each light guide structure shape corresponding to the light guide structure covers or partially covers one optical chip.
Further, the light guide structure is a grating structure, and the plastic package mold is manufactured with a light guide structure shape corresponding to the grating structure.
Further, the plastic package is performed on the upper surface of the transparent plastic package layer through an opaque plastic package material, and the opaque plastic package layer is formed after curing, which specifically comprises:
sputtering a reflecting layer on the upper surface of the transparent plastic packaging layer;
and carrying out plastic packaging on the upper surface of the reflecting layer through a non-transparent plastic packaging material, and curing to form a non-transparent plastic packaging layer.
Furthermore, the sputtering of a reflective layer on the upper surface of the transparent plastic packaging layer specifically comprises:
precutting the upper surface of the transparent plastic packaging layer to form a cutting groove;
and sputtering a reflecting layer on the upper surface of the transparent plastic packaging layer and in the cutting groove.
Furthermore, the plastic package mold is placed on the package substrate and covers the optical chip, the plastic package mold is manufactured with a light guide structure shape corresponding to the light guide structure, a transparent plastic package material is injected into the plastic package mold for plastic package, and a transparent plastic package layer containing the light guide structure is formed after curing, and the method specifically comprises the following steps:
placing a plastic package mold on a package substrate and covering the optical chip, wherein the plastic package mold is provided with a light guide structure shape corresponding to the light guide structure and a cutting groove shape corresponding to the cutting groove, injecting a transparent plastic package material into the plastic package mold for plastic package, and forming a transparent plastic package layer containing the light guide structure and the cutting groove after curing;
the sputtering of a layer of reflection stratum on the transparent plastic packaging layer upper surface specifically includes: and sputtering a reflecting layer on the upper surface of the transparent plastic packaging layer and in the cutting groove.
Still further, the depth of the cutting groove is less than or equal to the thickness of the transparent plastic package layer.
Furthermore, the cutting grooves have a preset distance with the middle line of two adjacent optical chips, and all the cutting grooves are close to the optical chips on the same side;
two cut between the optical chip, cut opaque plastic envelope layer, transparent plastic envelope layer and packaging substrate, obtain the single plastic envelope structure who encapsulates including optical chip, transparent plastic envelope layer, opaque plastic envelope layer and packaging substrate, specifically include:
and cutting along the central lines of two adjacent optical chips, and cutting the opaque plastic packaging layer, the transparent plastic packaging layer and the packaging substrate to obtain the single packaged plastic packaging structure comprising the optical chips, the transparent plastic packaging layer, the opaque plastic packaging layer and the packaging substrate.
Still further, the sputtering of a reflective layer specifically includes: sputtering a layer of metal as a reflecting layer.
Still further, the metal is titanium, tungsten, aluminum, gold, copper, silver, or the like.
The light guide structure is prepared in the transparent plastic package layer, so that the prepared plastic package structure can deflect light rays entering from the light incoming surface on the side surface through the light guide structure, and the light rays are made to enter the light detection surface on the upper surface of the optical chip. Thereby reducing the package thickness and providing a larger feed-in window for external light. Meanwhile, the optical fiber entering from the side face is deflected to the upper surface of the optical chip by the light guide structure, so that the light detection surface is not required to be arranged on the side face of the optical chip, the requirement on alignment precision is reduced, and great convenience can be provided for subsequent batch production.
Drawings
FIG. 1 is a flowchart illustrating a method for packaging an optical chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a plastic package structure according to an embodiment of the invention;
FIG. 3 is a flowchart illustrating a method for packaging an optical chip according to another embodiment of the present invention;
fig. 4 is a schematic structural diagram of a plastic package structure according to another embodiment of the present invention;
fig. 5 is a schematic view of a die mounting process in a process of manufacturing a plastic package structure according to an embodiment of the present invention;
fig. 6 is a schematic diagram illustrating a transparent plastic package layer during a plastic package structure manufacturing process according to an embodiment of the present invention;
fig. 7 is a schematic pre-cutting diagram illustrating a process of manufacturing a plastic package structure according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a reflective layer preparation process in a plastic package structure preparation process according to an embodiment of the invention;
fig. 9 is a schematic diagram illustrating a manufacturing process of an opaque plastic package layer in a manufacturing process of a plastic package structure according to an embodiment of the invention;
fig. 10 is a schematic diagram illustrating a finished product cutting process in a process of manufacturing a plastic package structure according to an embodiment of the present invention;
FIG. 11 is a flowchart illustrating a method for packaging an optical chip according to a preferred embodiment of the present invention.
Description of the marks
1-an optical chip; 11-light detecting surface; 2-transparent plastic packaging layer; 21-a light guiding structure; 22-a light incident surface; 23-a reflective surface; 24-cutting the groove; 3-opaque plastic sealing layer; 4-a package substrate; 5-a reflective layer; 6-a bonding wire; 7-light; 8-middle cutting lane.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. In which like parts are designated by like reference numerals. It should be noted that as used in the following description, the terms "front," "back," "left," "right," "upper" and "lower" refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Fig. 1 is a flowchart illustrating a method for packaging an optical chip according to an embodiment of the present invention, including:
step S101, a plurality of optical chips 1 with light detection surfaces 11 arranged on the top are attached to a packaging substrate 4;
step S102, placing a plastic package mold on a package substrate 4 and covering the optical chip 1, wherein the plastic package mold is manufactured with a light guide structure shape corresponding to the light guide structure 21, injecting a transparent plastic package material into the plastic package mold for plastic package, and curing to form a transparent plastic package layer 2 which contains the light guide structure 21 and covers the optical chip 1;
step S103, plastic packaging is carried out on the upper surface of the transparent plastic packaging layer 2 through an opaque plastic packaging material, and an opaque plastic packaging layer 3 is formed after solidification;
and step S104, cutting between the two optical chips 1, and cutting the opaque plastic package layer 3, the transparent plastic package layer 2 and the packaging substrate 4 to obtain a single packaged plastic package structure comprising the optical chips 1, the transparent plastic package layer 2, the opaque plastic package layer 3 and the packaging substrate 4.
Fig. 2 is a schematic structural diagram of a plastic package structure according to an embodiment of the present invention, which includes: optical chip 1, transparent plastic envelope layer 2, opaque plastic envelope layer 3 and packaging substrate 4, optical chip 1 is fixed on packaging substrate 4, transparent plastic envelope layer 2 cladding optical chip 1, opaque plastic envelope layer 3 cladding the upper surface of transparent plastic envelope layer 2, a side of transparent plastic envelope layer 2 is for going into plain noodles 22, optical chip 1's top is provided with examines plain noodles 11, transparent plastic envelope layer 2 is provided with and is located examine 11 tops of plain noodles, will follow the light that goes into plain noodles 22 and get into deflects extremely examine the light guide structure 21 of plain noodles 11.
Specifically, step S101 is executed, the optical chip 1 is fixed on the package substrate 4, and the connection manner between the optical chip 1 and the package substrate 4 may be the prior art. For example, the optical chip 1 may be assembled on the package substrate 4 in a flip-chip manner or a flip-chip manner, and signal connection is performed with the package substrate 4 through flip-chip bumps or bonding wires 6. The top of the optical chip 1, for example, the upper surface, is provided with a light detection surface 11. The package substrate 4 is an organic substrate, a ceramic substrate or a frame substrate.
Then, step S102 is executed to package the transparent molding compound on the optical chip 1 through the pre-manufactured plastic mold to form the transparent molding layer 2. The transparent molding compound layer 2 may cover the optical chip 1 and the upper surface of the package substrate 4. The light guide structure shape corresponding to the light guide structure 21 may be manufactured in a plastic package mold by using an existing mold manufacturing method. The mold is placed on the package substrate 4 and covers the optical chip 1, and then the transparent molding compound is injected, so that the transparent molding compound encapsulates the optical chip 1 and forms the transparent molding layer 2 including the light guide structure 21. The light guide structures 21 with different light guide structure shapes and different density degrees can be designed according to requirements. Preferably, a light guide structure shape corresponding to the light guide structure 21 is disposed on the top of the plastic package mold, so that the light guide structure 21 is formed on the top of the transparent plastic package layer 2 after curing.
Then, step S103 is performed to encapsulate the opaque molding compound on the transparent molding layer 2 to form an opaque molding layer 3. For example, an opaque molding compound is coated on the upper surface of the transparent molding layer 2 to form the opaque molding layer 3. The opaque molding compound is preferably a black molding compound, and forms a black opaque molding layer 3 after curing.
And finally, executing step S104, cutting between the two optical chips 1, and cutting the opaque plastic package layer 3, the transparent plastic package layer 2 and the packaging substrate 4 to obtain a single packaged plastic package structure comprising the optical chips 1, the transparent plastic package layer 2, the opaque plastic package layer 3 and the packaging substrate 4.
Preferentially, the center line between the two optical chips 1 is cut to obtain the plastic package structure of single package. Specifically, the cutting can be performed according to the requirement of a single package. If the plastic package structure of a single package comprises one optical chip 1, the plastic package structure is cut to comprise one optical chip 1. If the plastic package structure of a single package includes a plurality of optical chips 1, the plastic package structure is cut to include a plurality of optical chips 1.
As shown in fig. 2, when in use, one side surface of the transparent plastic package layer 2 is used as a light incident surface 22, and the light ray 7 enters from the light incident surface 22 of the transparent plastic package layer 2 and is deflected by the light guide structure 21 located above the light detection surface 11, so that the light ray 7 enters the light detection surface 11.
Compared with the conventional packaging mode that the light incident surface is arranged on the front surface of the chip packaging structure, the light incident surface is arranged on the side surface of the packaging structure, so that the angle of an external optical fiber is not required to be deflected, light deflection devices such as a prism and the like are not required, and the packaging volume is reduced.
Meanwhile, the light detection surface 11 of the present embodiment is disposed on the top of the optical chip 1 (i.e., the front surface of the optical chip 1), so that the area of the light detection surface 11 of the present invention is larger than that of the side surface of the optical chip 1. Because light enters from the light incident surface 22 on the side surface of the transparent plastic package layer 2, and the area of the side surface of the chip is small, if the light detection surface is arranged on the side surface of the optical chip 1, the requirement for aligning the optical fiber is high, and the alignment precision is easily influenced by error parameters of the packaging process. In the embodiment, the light is deflected by the light guide structure 21 without being aligned to the side surface of the optical chip, so that the feed-in window is larger, the optical fiber is assembled with larger error tolerance, and meanwhile, the plastic package material forms good protection for the optical chip.
The light guide structure is prepared in the transparent plastic package layer, so that the prepared plastic package structure can deflect light rays entering from the light incoming surface on the side surface through the light guide structure, and the light rays are made to enter the light detection surface on the upper surface of the optical chip. Thereby reducing the package thickness and providing a larger feed-in window for external light. Meanwhile, the optical fiber entering from the side face is deflected to the upper surface of the optical chip by the light guide structure, so that the light detection surface is not required to be arranged on the side face of the optical chip, the requirement on alignment precision is reduced, and great convenience can be provided for subsequent batch production.
Fig. 3 is a flowchart illustrating a method for packaging an optical chip according to another embodiment of the present invention, including:
step S301, mounting a plurality of optical chips 1 with light detection surfaces 11 on the top on a packaging substrate 4;
step S302, a plastic package mold is placed on a package substrate 4 and covers the optical chip 1, the plastic package mold is manufactured with a light guide structure shape corresponding to the light guide structure 21, a transparent plastic package material is injected into the plastic package mold for plastic package, a transparent plastic package layer 2 which contains the light guide structure 21 and covers the optical chip 1 is formed after curing, the plastic package mold is manufactured with a plurality of light guide structure shapes corresponding to the light guide structure 21, when the plastic package mold is placed on the package substrate 4, each light guide structure shape corresponding to the light guide structure 21 covers or partially covers one optical chip 1, the light guide structure 21 is a grating structure, and the plastic package mold is manufactured with a light guide structure shape corresponding to the grating structure;
step S303, sputtering a reflecting layer 5 on the upper surface of the transparent plastic packaging layer 2;
in one embodiment, the sputtering of a reflective layer 5 on the upper surface of the transparent plastic package layer 2 specifically includes:
precutting the upper surface of the transparent plastic packaging layer 2 to form a cutting groove 24;
and sputtering a reflecting layer 5 on the upper surface of the transparent plastic packaging layer 2 and in the cutting groove 24.
In one embodiment, the depth of the cutting groove 24 is less than or equal to the thickness of the transparent plastic package layer 2.
In one embodiment, the sputtering of the reflective layer 5 specifically includes: a layer of metal is sputtered as the reflective layer 5.
In one embodiment, the metal is titanium, tungsten, aluminum, gold, copper, or silver.
Step S304, plastic packaging is carried out on the upper surface of the reflecting layer 5 through an opaque plastic packaging material, and an opaque plastic packaging layer 3 is formed after solidification;
step S305, cutting is carried out between the two optical chips 1, and the opaque plastic package layer 3, the transparent plastic package layer 2 and the packaging substrate 4 are cut to obtain a single packaged plastic package structure comprising the optical chips 1, the transparent plastic package layer 2, the opaque plastic package layer 3 and the packaging substrate 4.
In one embodiment, the cutting grooves 24 have a preset distance from the middle line of two adjacent optical chips 1, and all the cutting grooves 24 are close to the optical chip 1 on the same side;
two cut between the optical chip 1, cut opaque plastic envelope layer 3, transparent plastic envelope layer 2 and packaging substrate 4, obtain the plastic envelope structure including optical chip 1, transparent plastic envelope layer 2, opaque plastic envelope layer 3 and packaging substrate 4 of single encapsulation, specifically include:
and cutting along the central line of the two adjacent optical chips 1, and cutting the opaque plastic package layer 3, the transparent plastic package layer 2 and the packaging substrate 4 to obtain the single packaged plastic package structure comprising the optical chips 1, the transparent plastic package layer 2, the opaque plastic package layer 3 and the packaging substrate 4.
Specifically, as shown in fig. 4, a schematic structural diagram of a plastic package structure in another embodiment of the present invention includes: the light chip comprises a light chip 1, a transparent plastic package layer 2, an opaque plastic package layer 3 and a packaging substrate 4, wherein the light chip 1 is fixed on the packaging substrate 4, the transparent plastic package layer 2 covers the light chip 1, the opaque plastic package layer 3 covers the upper surface of the transparent plastic package layer 2, one side surface of the transparent plastic package layer 2 is a light incident surface 22, the top of the light chip 1 is provided with a light detection surface 11, the transparent plastic package layer 2 is provided with a light guide structure 21 which is positioned above the light detection surface 11 and deflects light entering from the light incident surface 22 to the light detection surface 11, the light guide structure 21 is a grating structure protruding towards the direction of the light chip 1, the light guide structure 21 covers or partially covers the light detection surface 11, the other side surface of the transparent plastic package layer 2 opposite to the light incident surface 22 is a reflecting surface 23, the opaque plastic package layer 3 covers the reflecting surface 23, the non-transparent plastic package layer 3 is a black plastic package layer;
a reflecting layer 5 is sputtered between the transparent plastic packaging layer 2 and the opaque plastic packaging layer 3, the reflecting layer 5 is metal sputtered on the surface of the transparent plastic packaging layer 2, and the metal is titanium, tungsten, aluminum, gold, copper or silver;
the package substrate 4 is an organic substrate, a ceramic substrate or a frame substrate.
Specifically, the light guide structure 21 is a grating structure. Meanwhile, in order to increase the incidence rate of light on the light detection surface 11, a layer of metal is sputtered on the reflecting surface 23 opposite to the upper surface and/or incident light of the transparent plastic packaging layer 2 to serve as the reflecting layer 5, and the incident light loss is reduced. Preferably, the reflective layer 5 is sputtered on the upper surface of the transparent molding layer 2 including the light guide structure 21 and the outer surface of the reflective surface 23. The reflecting layer 5 is metal sputtered on the outer surface of the transparent plastic packaging layer 2. The metal material may be titanium (Ti), tungsten (W), aluminum (Al), gold (Au), copper (Cu), silver (Ag), or the like.
The non-transparent plastic package layer 3 is a black plastic package layer which is plastic-packaged by using black plastic package materials. The package substrate 4 may be an organic substrate, a ceramic substrate, or a frame substrate.
In one embodiment, a plurality of optical chips 1 are fixed on the package substrate 4, and one or more light guide structures 21 are disposed on the transparent molding layer 2.
Specifically, the plastic package structure may be a multi-chip package, and the optical chips 1 may be fixed on the package substrate 4 by stacking, spreading, or the like.
Fig. 5 to 10 show a preparation method of the plastic package structure of the present embodiment, which specifically includes:
(1) step S301 is executed, as shown in fig. 5, a plurality of optical chips 1 with light detection surfaces 11 arranged on the top are respectively mounted on the package substrate 4, and are in signal connection with the package substrate 4 through bonding wires 6, and the optical chips 1 may be stacked in multiple layers or tiled in multiple chips;
(2) step S302 is executed, as shown in fig. 6, plastic package molding is performed, a light guide structure shape corresponding to the grating structure is manufactured on the top of the plastic package mold, and grating structures with different light guide structure shapes and different density degrees can be designed according to needs. And placing a plastic package mold on the package substrate 4, covering all the optical chips 1, injecting a transparent plastic package material into the plastic package mold for plastic package, and curing to form a transparent plastic package layer 2 containing a grating structure, wherein the grating structure is used as a light guide structure 21. Since the plurality of optical chips 1 are covered, a plurality of light guide structure shapes corresponding to the grating structure are set at the top of the plastic mold. The projection of each light guide structure shape corresponding to the grating structure on the package substrate 4 covers or partially covers one optical chip 1.
(3) Step S303 is executed, as shown in fig. 7, after the curing, offset pre-cutting is performed on the transparent plastic package layer 2, and the cutting depth is less than or equal to the thickness of the transparent plastic package layer 2, so as to form the cutting groove 24. The cutting groove 24 is close to the optical chip 1 on one side. The formation of the cutting groove can also be realized on a plastic package mold, the light guide structure shape of the cutting groove 24 is manufactured on the mold, and the cutting groove 24 is directly formed after plastic package.
In one embodiment, the placing of the plastic package mold on the package substrate 4 and covering the optical chip 1, the manufacturing of the plastic package mold having the shape of the light guide structure corresponding to the light guide structure 21, injecting a transparent plastic package material into the plastic package mold for plastic package, and curing to form the transparent plastic package layer 2 containing the light guide structure 21 specifically includes:
placing a plastic package mold on a package substrate 4 and covering the optical chip 1, wherein the plastic package mold is provided with a light guide structure shape corresponding to the light guide structure 21 and a cutting groove shape corresponding to the cutting groove 24, injecting a transparent plastic package material into the plastic package mold for plastic package, and curing to form a transparent plastic package layer 2 containing the light guide structure 21 and the cutting groove 24;
the sputtering of a layer of reflecting layer 5 on the upper surface of the transparent plastic packaging layer 2 specifically comprises: and sputtering a reflecting layer 5 on the upper surface of the transparent plastic packaging layer 2 and in the cutting groove 24.
The cutting groove 24 is arranged according to a single package requirement, for example, if the plastic package structure of a single package only includes one optical chip 1, the cutting groove 24 is arranged between two adjacent optical chips 1. If the single packaged plastic package structure comprises a plurality of optical chips 1, a cutting groove 24 is arranged beside the optical chip 1 at the edge of the plastic package structure, and the cutting groove 24 is positioned at the edge of the cut plastic package structure.
In addition, the cutting grooves 24 have a preset distance from the middle line of two adjacent optical chips 1, and all the cutting grooves 24 are close to the optical chip 1 on the same side. For example, all of the dicing channels 24 are between two adjacent optical chips 1 and are close to the left optical chip 1, or all of the dicing channels 24 are between two adjacent optical chips 1 and are close to the right optical chip 1. Meanwhile, the preset distance between the cutting groove 24 and the central line of two adjacent optical chips 1 is greater than the thickness of the middle cutting path 8, and the middle cutting path 8 is arranged along the central line of two adjacent optical chips 1. Therefore, when cutting along the middle cutting path 8, the same sides of the plastic package structure all include the cutting grooves 24, and the other sides do not include the cutting grooves 24. As shown in fig. 10, when the two adjacent optical chips 1 are cut along the middle cutting path 8, the left sides of all the plastic package structures have no cutting groove 24, and the right sides of all the plastic package structures have the cutting groove 24, so that light can be fed into the left sides of the plastic package structures to be used as the light incident surface 22, and the right side surfaces of the cutting grooves 24 are used as the reflection surfaces 23.
Then, as shown in fig. 8, a layer of metal is sputtered on the upper surface of the transparent plastic package layer 2 and in the cutting groove 24 as the reflective layer 5, the metal of the reflective layer 5 can increase light reflection, and the metal material is metal such as Ti, W, Al, Ag, Au, etc. Wherein this step can be omitted if the final product is not provided with the reflective layer 5.
(4) Step S304 is executed, as shown in fig. 9, after the sputtering of the reflective layer 5 is completed, an opaque molding compound, such as a black molding compound, is continuously used to mold on the upper surface of the reflective layer 5, so as to cover the upper surface of the transparent molding compound 2 and the reflective layer 5 in the cutting groove 24, thereby forming an opaque molding compound 3.
(6) Step S305 is executed, as shown in fig. 10, the finished product is cut, and the plastic package material and the substrate are completely cut along the middle dicing street 8 between the two optical chips 1 to form a single package.
As shown in fig. 11, a method for packaging an optical chip according to a preferred embodiment of the present invention includes:
step S1101, as shown in fig. 5, die mounting and wire bonding;
step S1102, as shown in fig. 6, plastic-packaging the transparent plastic-packaging material, molding the grating, and curing to form a transparent plastic-packaging layer;
step S1103, as shown in fig. 7, precutting the transparent plastic packaging layer to form a cutting groove;
step S1104, as shown in fig. 8, sputtering a metal layer on the surface of the transparent plastic package layer as a reflective layer;
step S1105, as shown in FIG. 9, a second plastic package is performed by using an opaque plastic package material, and an opaque plastic package layer is formed after curing;
in step S1106, as shown in fig. 10, cutting and sorting are performed.
The grating structure is manufactured in the plastic package structure, a larger feed-in window is provided for external light, the requirement on alignment precision is reduced, and great convenience can be provided for subsequent batch production. Meanwhile, by adding a reflective layer, the loss of incident light is reduced.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An optical chip packaging method, comprising:
a plurality of optical chips (1) with light detecting surfaces (11) arranged on the top are attached to a packaging substrate (4);
placing a plastic package mold on a package substrate (4) and covering the optical chip (1), wherein the plastic package mold is manufactured with a light guide structure shape corresponding to the light guide structure (21), injecting a transparent plastic package material into the plastic package mold for plastic package, and forming a transparent plastic package layer (2) which contains the light guide structure (21) and coats the optical chip (1) after curing;
the upper surface of the transparent plastic packaging layer (2) is subjected to plastic packaging through a non-transparent plastic packaging material, and a non-transparent plastic packaging layer (3) is formed after solidification;
and cutting the optical chips (1), and cutting the non-transparent plastic package layer (3), the transparent plastic package layer (2) and the packaging substrate (4) to obtain the single-packaged plastic package structure comprising the optical chips (1), the transparent plastic package layer (2), the non-transparent plastic package layer (3) and the packaging substrate (4).
2. The photonic chip packaging method according to claim 1, wherein the plastic package mold is fabricated with a plurality of light guide structure shapes corresponding to the light guide structures (21), and when the plastic package mold is placed on the package substrate (4), each light guide structure shape corresponding to a light guide structure (21) covers or partially covers one of the photonic chips (1).
3. The optical chip packaging method according to claim 1, wherein the light guide structure (21) is a grating structure, and the plastic package mold is manufactured with a light guide structure shape corresponding to the grating structure.
4. The optical chip packaging method according to claim 1, wherein the opaque plastic package material is used for plastic package on the upper surface of the transparent plastic package layer (2), and the opaque plastic package layer (3) is formed after curing, specifically comprising:
sputtering a reflecting layer (5) on the upper surface of the transparent plastic packaging layer (2);
and (3) carrying out plastic package on the upper surface of the reflecting layer (5) through an opaque plastic package material, and forming an opaque plastic package layer (3) after curing.
5. The optical chip packaging method according to claim 4, wherein sputtering a reflective layer (5) on the upper surface of the transparent molding compound layer (2) specifically comprises:
precutting the upper surface of the transparent plastic packaging layer (2) to form a cutting groove (24);
and sputtering a reflecting layer (5) on the upper surface of the transparent plastic packaging layer (2) and in the cutting groove (24).
6. The optical chip packaging method according to claim 4, wherein the plastic package mold is placed on the package substrate (4) and covers the optical chip (1), the plastic package mold is manufactured with a light guide structure shape corresponding to the light guide structure (21), a transparent plastic package material is injected into the plastic package mold for plastic package, and after curing, a transparent plastic package layer (2) containing the light guide structure (21) is formed, which specifically comprises:
placing a plastic package mold on a package substrate (4) and covering the optical chip (1), wherein the plastic package mold is provided with a light guide structure shape corresponding to the light guide structure (21) and a cutting groove shape corresponding to the cutting groove (24), injecting a transparent plastic package material into the plastic package mold for plastic package, and curing to form a transparent plastic package layer (2) containing the light guide structure (21) and the cutting groove (24);
the sputtering of a layer of reflecting layer (5) on the upper surface of the transparent plastic packaging layer (2) specifically comprises the following steps: and sputtering a reflecting layer (5) on the upper surface of the transparent plastic packaging layer (2) and in the cutting groove (24).
7. The optical chip packaging method according to claim 5 or 6, wherein the depth of the cutting groove (24) is less than or equal to the thickness of the transparent plastic packaging layer (2).
8. The optical chip packaging method according to claim 5 or 6, wherein the cutting grooves (24) have a predetermined distance from the middle line of two adjacent optical chips (1), and all the cutting grooves (24) are close to the optical chip (1) on the same side;
two cut between optical chip (1), cut opaque plastic envelope layer (3), transparent plastic envelope layer (2) and packaging substrate (4), obtain the plastic envelope structure including optical chip (1), transparent plastic envelope layer (2), opaque plastic envelope layer (3) and packaging substrate (4) of single encapsulation, specifically include:
and cutting along the central lines of the two adjacent optical chips (1), and cutting the non-transparent plastic packaging layer (3), the transparent plastic packaging layer (2) and the packaging substrate (4) to obtain the single-packaged plastic packaging structure comprising the optical chips (1), the transparent plastic packaging layer (2), the non-transparent plastic packaging layer (3) and the packaging substrate (4).
9. The optical chip packaging method according to any one of claims 4 to 6, wherein sputtering a reflective layer (5) specifically comprises: sputtering a layer of metal as a reflective layer (5).
10. The optical chip packaging method of claim 9, wherein the metal is titanium, tungsten, aluminum, gold, copper, or silver.
CN202210574671.3A 2022-05-24 2022-05-24 Optical chip packaging method Pending CN114999937A (en)

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CN202210574671.3A CN114999937A (en) 2022-05-24 2022-05-24 Optical chip packaging method
PCT/CN2022/103335 WO2023226153A1 (en) 2022-05-24 2022-07-01 Optical chip package structure and optical chip packaging method

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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115831736A (en) * 2023-02-13 2023-03-21 成都万应微电子有限公司 Cutting method of semiconductor material product
CN116299850A (en) * 2023-05-15 2023-06-23 甬矽电子(宁波)股份有限公司 Silicon photon packaging structure and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115831736A (en) * 2023-02-13 2023-03-21 成都万应微电子有限公司 Cutting method of semiconductor material product
CN115831736B (en) * 2023-02-13 2023-05-05 成都万应微电子有限公司 Cutting method of semiconductor material product
CN116299850A (en) * 2023-05-15 2023-06-23 甬矽电子(宁波)股份有限公司 Silicon photon packaging structure and preparation method thereof
CN116299850B (en) * 2023-05-15 2023-09-05 甬矽电子(宁波)股份有限公司 Silicon photon packaging structure and preparation method thereof

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