CN114823650A - Package structure and method for manufacturing the same - Google Patents

Package structure and method for manufacturing the same Download PDF

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Publication number
CN114823650A
CN114823650A CN202210343559.9A CN202210343559A CN114823650A CN 114823650 A CN114823650 A CN 114823650A CN 202210343559 A CN202210343559 A CN 202210343559A CN 114823650 A CN114823650 A CN 114823650A
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CN
China
Prior art keywords
groove
transparent cover
trench
cover plate
chip
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Pending
Application number
CN202210343559.9A
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Chinese (zh)
Inventor
杨先方
田忠原
李鹏
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JCET Group Co Ltd
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Jiangsu Changjiang Electronics Technology Co Ltd
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Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN202210343559.9A priority Critical patent/CN114823650A/en
Publication of CN114823650A publication Critical patent/CN114823650A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0233—Structure of the redistribution layers
    • H01L2224/02331—Multilayer structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02373—Layout of the redistribution layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02381—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The invention provides a packaging structure and a manufacturing method thereof. The package structure includes: the chip packaging structure comprises a substrate, a chip, a plastic packaging layer and a transparent cover plate; the chip is arranged on the substrate and electrically connected with the substrate; the plastic packaging layer covers the substrate and wraps the side face of the chip, a groove-shaped window area is arranged on the surface of the plastic packaging layer, a groove-shaped cavity area is arranged on the bottom face of the window area, the opening area of the cavity area is smaller than that of the window area, and the window area and the cavity area at least expose partial surface area of the chip; the transparent cover plate is arranged in the window area, and the side surface and the bottom surface of the transparent cover plate are filled with adhesive between the plastic packaging layer and are sealed and fixed; at least one first groove is formed in at least one of the bottom surface and the side surface of the transparent cover plate, the adhesive is filled in the first groove, the first groove is provided with a first end located on the surface side of the transparent cover plate and a second end deviated from the first end, when the first groove is formed in the bottom surface of the transparent cover plate, the first groove is located above the bottom surface of the window area, and the width of the second end of the first groove is larger than that of the first end of the first groove.

Description

Package structure and method for manufacturing the same
Technical Field
The invention relates to the technical field of electronic packaging, in particular to a packaging structure and a manufacturing method thereof.
Background
With the development of light and shadow technologies such as photographing and shooting, the image sensing chip can be used in a camera of an electronic product as a functional image sensing chip capable of converting a received optical signal into an electrical signal, and has huge market demands. This kind of chip package structure needs cover transparent cover plate and play printing opacity and the effect of protection simultaneously in the chip top, forms the cavity between transparent cover plate and the chip, however this kind of package structure is at the reflow soldering in-process, and transparent cover plate is because the reason of inside and outside atmospheric pressure difference, easily receives the pressure differential effect and peels off.
Disclosure of Invention
The invention aims to provide a packaging structure and a manufacturing method thereof.
The present invention provides a package structure, comprising:
the chip packaging structure comprises a substrate, a chip, a plastic packaging layer and a transparent cover plate;
the chip is arranged on the substrate and electrically connected with the substrate;
the plastic packaging layer covers the substrate and wraps the side face of the chip, a groove-shaped window area is arranged on the surface of the plastic packaging layer, a groove-shaped cavity area is arranged on the bottom face of the window area, the opening area of the cavity area is smaller than that of the window area, and the window area and the cavity area at least expose partial surface area of the chip;
the transparent cover plate is arranged in the window area, and bonding agents are filled between the side surface and the bottom surface of the transparent cover plate and the plastic packaging layer and are sealed and fixed;
at least one first groove is formed in at least one of the bottom surface and the side surface of the transparent cover plate, the adhesive is filled in the first groove, the first groove is provided with a first end located on the surface side of the transparent cover plate and a second end away from the first end, when the first groove is formed in the bottom surface of the transparent cover plate, the first groove is located above the bottom surface of the window area, and the width of the second end of the first groove is larger than that of the first end of the first groove.
As a further improvement of the present invention, at least one second trench is formed in at least one of the inner wall surface and the bottom surface of the window region of the molding layer, the adhesive is filled in the second trench, the second trench has a first end located on the surface side of the molding layer and a second end facing away from the first end, and when the second trench is located on the bottom surface of the window region, the width of the second end of the second trench is greater than the width of the first end of the second trench.
As a further improvement of the invention, the chip surface is provided with a photosensitive area, and the window area and the cavity area expose the photosensitive area.
As a further improvement of the present invention, the first trench is disposed on the bottom surface of the transparent cover plate, and the second trench is disposed on the bottom surface of the window region.
As a further improvement of the present invention, the transparent cover plate is quadrilateral, the shape of the window area corresponds to that of the transparent cover plate, the first grooves are distributed along four side areas of the bottom surface of the transparent cover plate in a shape like a Chinese character 'kou' in the plane direction, and the second grooves are distributed along four side areas of the bottom surface of the window area in a shape like a Chinese character 'kou'.
As a further improvement of the present invention, a bottom surface of the transparent cover plate is formed with one of the first trenches, and a bottom surface of the window region is formed with two of the second trenches.
As a further improvement of the invention, the first grooves and the second grooves are distributed in a staggered and spaced mode.
As a further improvement of the present invention, the first trench and the second trench have trapezoidal longitudinal cross-sectional shapes, the first end of the first trench and the first end of the second trench respectively form a short side of the trapezoid, and the second end of the first trench and the second end of the second trench respectively form a long side of the trapezoid.
The invention also provides a manufacturing method of the packaging structure, which comprises the following steps:
providing a substrate and a chip, placing the chip on the substrate, and leading bonding wires to electrically connect the substrate and the chip;
placing the substrate and the chip in a plastic package mold, forming a plastic package layer by injection molding, and forming a cavity area and a window area with gradually increased opening areas in an area above the chip;
providing a transparent cover plate, cutting at least one first groove at one position of the bottom surface and the side surface of the transparent cover plate, wherein the first groove is provided with a first end positioned on the surface of the transparent cover plate and a second end away from the first end, when the first groove is cut and formed on the bottom surface of the transparent cover plate, the first groove is correspondingly positioned above the bottom surface of the window area, and the width of the second end of the first groove is larger than that of the first end of the first groove;
and the transparent cover plate is fixedly arranged in the window area through an adhesive, and the adhesive is filled in the first groove.
As a further improvement of the invention, the method also comprises the following steps: at least one second groove is formed in the inner wall surface and the bottom surface of the window area in a cutting mode, the second groove is provided with a first end located on the surface of the plastic package layer and a second end deviating from the first end, and when the second groove is formed in the bottom surface of the window area in a cutting mode, the width of the second end of the second groove is larger than that of the first end of the second groove;
and filling the adhesive into the second groove.
As a further improvement of the present invention, the cutting at least one first groove at one of the bottom surface and the side surface of the transparent cover plate specifically includes:
and completely cutting a circle along four side areas of the bottom surface of the transparent cover plate to obtain a first groove.
As a further improvement of the present invention, the cutting at least one second groove at one of the inner wall surface and the bottom surface of the window region specifically includes:
completely cutting a circle along four side areas of the bottom surface of the window area to obtain a first second groove;
and relative to the first second groove, retracting inwards to continuously and completely cut a circle to obtain a second groove.
As a further improvement of the invention, the second grooves and the first grooves are alternately distributed at intervals.
As a further improvement of the present invention, the first trench and the second trench have trapezoidal longitudinal cross-sectional shapes, the first end of the first trench and the first end of the second trench respectively form a short side of the trapezoid, and the second end of the first trench and the second end of the second trench respectively form a long side of the trapezoid.
The invention has the beneficial effects that: through cutting the slot at transparent cover to further cut the slot in the plastic envelope layer, make the binder solid glue piece in the slot rather than forming the structure similar to buckle and draw-in groove, strengthened the adhesive strength between transparent cover, tie coat and the plastic envelope layer, can effectively reduce reflow soldering in-process transparent cover because of inside and outside atmospheric pressure difference change and the circumstances that is washed away by atmospheric pressure appears.
Drawings
Fig. 1 is a schematic diagram of a package structure in embodiment 1 of the present invention.
Fig. 2 is an enlarged schematic view at a in fig. 1.
Fig. 3 is a bottom view of the transparent cover plate in embodiment 1 of the present invention.
Fig. 4 is a top view of a molding layer in example 1 of the present invention.
Fig. 5 is a schematic diagram of a package structure in embodiment 2 of the present invention.
Fig. 6 is a schematic step diagram of a method for manufacturing a package structure according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the technical solutions of the present application will be clearly and completely described below with reference to the detailed description of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
For convenience in explanation, the description herein uses terms indicating relative spatial positions, such as "upper," "lower," "rear," "front," and the like, to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "above" other elements or features would then be oriented "below" or "above" the other elements or features. Thus, the exemplary term "below" can encompass both a spatial orientation of below and above.
Example 1
As shown in fig. 1, a package structure provided in embodiment 1 of the present invention includes: the chip package structure comprises a substrate 1, a chip 2, a plastic package layer 3 and a transparent cover plate 4.
The chip 2 includes at least a sensor chip such as a photo-sensing chip, and the surface area of the sensor chip is provided with a photo-sensing area, and the photo-sensing area may include a plurality of photodiode arrays arranged for converting optical signals irradiated to the photo-sensing area into electrical signals. The chip 2 is disposed on the substrate 1 and electrically connected to the substrate 1.
Specifically, in the present embodiment, the chip 2 includes an ASIC (Application Specific Integrated Circuit) chip 21 and a sensor chip 22 stacked thereon, the ASIC chip 21 and the sensor chip 22 are electrically connected by a solder ball, and the sensor chip 22 is electrically connected to the substrate 1 by a metal lead.
The plastic sealing layer 3 takes epoxy resin as a matrix, is added with additives such as curing agents, coupling agents and the like, covers the substrate 1 and coats the side face of the chip 2, and therefore the functions of mechanical support and sealing protection are achieved. The surface of plastic envelope layer 3 is provided with window area 31 that is the recess form, and window area 31 bottom surface is provided with the cavity area 32 that is the recess form, and cavity area 32 opening area is less than window area 31, and window area 31 and cavity area 32 expose 2 partial surface area of chip at least, and window area 31 and cavity area 32 expose 2 photosensitive areas of chip at least promptly.
The transparent cover plate 4 can be made of inorganic glass, organic glass or other light-transmitting materials with specific strength, and plays a role in protecting and transmitting light to the photosensitive area. The upper and lower surfaces of the transparent cover plate 4 are smooth surfaces to avoid scattering, diffuse reflection and other effects on incident light, thereby affecting the sensing accuracy of the sensor chip 22. The transparent cover plate 4 is arranged in the window area 31, and the bonding agent 5 is filled between the side surface and the bottom surface of the transparent cover plate and the plastic packaging layer 3, and the side surface and the bottom surface are sealed and fixed through the bonding agent 5. The adhesive 5 may be a polymer adhesive material, such as a polymer material, e.g., silicone, epoxy, benzocyclobutene, etc.
Further, the window region 31 is formed in a shape corresponding to the transparent cover 4, and has a length, width and depth slightly larger than those of the transparent cover 4, thereby providing a flow space for the adhesive 5. Cavity area 32 extends downwards along window area 31 bottom surface and sets up, exposes chip 2 photosensing zone, and its opening area size is less than window area 31 and is less than chip 2 surface area to make plastic-sealed layer 3 cover in the region of chip 2 edge no photosensing zone, in order to strengthen the support guard action to chip 2.
As shown in fig. 1 and fig. 2, at least one first trench 41 is formed in at least one of the bottom surface and the side surface of the transparent cover plate 4, the adhesive 5 is filled in the first trench 41, the first trench 41 has a first end 411 located on the surface side of the transparent cover plate 4 and a second end 412 facing away from the first trench, when the first trench 41 is formed on the bottom surface of the transparent cover plate 4, the first trench 41 is located above the bottom surface of the window region 31, and the width of the second end 412 of the first trench is greater than the width 411 of the first end of the first trench.
Specifically, in the present embodiment, the first groove 41 is disposed on the bottom surface of the transparent cover plate 4, and the longitudinal cross-sectional shape thereof is trapezoidal, the first end 411 of the first groove forms a short side of the trapezoid, and the second end 412 of the first groove forms a long side of the trapezoid, so that the first groove is in a structure with an inverted trapezoid shape with a large top and a small bottom, when the adhesive 5 is filled therebetween and solidified, a solid glue block with a corresponding shape is formed, besides the adhesive function, the solid glue block and the first groove 41 form an assembly relationship similar to a buckle and a clamping groove, when the transparent cover plate 4 is subjected to an upward pressure due to an air pressure difference during a reflow process, the transparent cover plate 4 and the solid glue block of the adhesive 5 are clamped, and the inverted trapezoid long side of the solid glue block exerts a resistance on the transparent cover plate 4, thereby preventing the transparent cover plate 4 from falling off.
In other embodiments of the present invention, the longitudinal cross-sectional shape of the first groove 41 can also be adjusted according to the difference of the process or the actual requirement, as long as it can make the solid block of adhesive 5 therein exert resistance in the vertical direction when it is pressed upward.
Specifically, as shown in fig. 3, in the present embodiment, the transparent cover plate 4 is quadrilateral, and in the plane direction, the first groove 41 is in a shape of "square" and is distributed along four side areas of the bottom surface of the transparent cover plate 4, so that in the four side areas, the first groove 41 and the buckle structure of the adhesive 5 can both play a role of strengthening adhesion, so that the stress of the transparent cover plate 4 is more uniform, and the reliability of the packaging structure is further improved.
In another embodiment of the present invention, the distribution position and the number of the first grooves 41 may be adjusted according to the size of the transparent cover 4, and the first grooves 41 may be formed in other shapes in the planar direction on the transparent cover 4, for example, two first grooves 41 may be formed on each of two opposite side surfaces of the transparent cover 4, or in short, the adhesive 5 may be filled in the first grooves 41.
Further, at least one second trench 33 is formed in the plastic package layer 3 at least at one of the inner wall surface and the bottom surface of the window region 31, the adhesive 5 is filled in the second trench 33, the second trench 33 has a first end 331 located on the surface side of the plastic package layer 3 and a second end 332 facing away from the first end 331, and when the second trench 33 is located on the bottom surface of the window region 31, the width of the second end 332 of the second trench is greater than the width of the first end 331 of the second trench.
Specifically, the second groove 33 has a trapezoidal longitudinal cross section, the first end 331 of the second groove forms a short side of the trapezoid, and the second end 332 of the second groove forms a long side of the trapezoid.
Here, by forming the second grooves 33 on the molding layer 3, which function in a similar manner to the first grooves 41, the adhesive strength between the adhesive 5 and the molding layer 3 can be enhanced, thereby preventing the transparent cover 4 from falling off together with the adhesive 5.
Specifically, as shown in fig. 4, in the present embodiment, two second grooves 33 are provided on the bottom surface of the window region 31, and in the plane direction, the two second grooves 33 are respectively in a shape of "square" and are distributed along four side regions of the bottom surface of the window region 31, and the whole is in a shape of "square", and the two second grooves 33 are formed to further enhance the bonding strength. And, crisscross interval distribution between two second grooves 33 and the first groove 41, look on transversely promptly, be first groove 41, second groove 33 and first groove 41 in proper order to the distribution that the buckle structure that forms between messenger's slot and the 5 solid glue blocks of binder is more even between plastic envelope layer 3, binder 5 and transparent cover plate 4, also makes the three atress more even simultaneously, improves packaging structure's structural strength, increases the reliability.
In other embodiments of the present invention, the longitudinal cross-sectional shape of the second groove 33 can be adjusted according to the difference of the process or the actual requirement, as long as the adhesive 5 can be vertically resisted by the solid block of adhesive 5 therein when the adhesive 5 is pulled upwards by the transparent cover 4. The distribution position and number of the second grooves 33 may be adjusted depending on the number of chips 2, the size of the package structure, and the like, and the second grooves 33 may be formed in other shapes on the molding layer 3 in the planar direction, for example, two second grooves 33 may be formed on each of two opposite sides of the bottom surface of the window region 31, and in short, the adhesive 5 may be filled in the second grooves 33.
Example 2
As shown in fig. 5, a package structure is provided for embodiment 2 of the present invention, which has a similar general structure to embodiment 1, except that:
the second slot 33 is located window district 31 lateral wall region, and this second slot 33 is the wedge, and when transparent cover plate 4 atress had the trend that together drops with binder 5, it can play the interference barrier effect to its motion to extend to the inside 5 solid gum pieces of binder of window district 31 lateral wall wholly in vertical direction, consequently need not to set up to the trapezoidal structure of similar falling, only need form the groove structure can.
In other embodiments of the present invention, the second grooves 33 may be formed on both sides of the window region 31 and the bottom surface of the window region 31, or the first grooves 41 may be formed on the sides of the transparent cover 4 when the transparent cover 4 is thick. The distribution positions of the first trenches 41 and the second trenches 33 may be appropriately combined to form other embodiments as will be understood by those skilled in the art according to the package structure size and other factors in different embodiments.
As shown in fig. 6, the present invention further provides a method for manufacturing a package structure, which includes the steps of:
s1: providing a substrate 1 and a chip 2, placing the chip 2 on the substrate 1, and electrically connecting the two by bonding wires.
S2: the substrate 1 and the chip 2 are placed in a plastic package mold, a plastic package layer 3 is formed through injection molding, and a cavity area 32 and a window area 31 with gradually increased opening areas are formed in the area above the chip 2.
S3: providing a transparent cover plate 4, cutting at least one first groove 41 at one of the bottom surface and the side surface of the transparent cover plate 4, wherein the first groove 41 has a first end located on the surface of the transparent cover plate 4 and a second end facing away from the first end, when the first groove 41 is cut at the bottom surface of the transparent cover plate 4, the first groove 41 is correspondingly located above the bottom surface of the window area 31, and the width of the second end of the first groove 41 is greater than the width of the first end 411 of the first groove.
Specifically, a circle of first grooves 41 is completely cut along four side regions of the bottom surface of the transparent cover plate 4.
Further, in some embodiments of the present invention, step S3 further includes:
at least one second groove 33 is formed by cutting at least one of the inner wall surface and the bottom surface of the window region 31, the second groove 33 has a first end located on the surface of the molding layer 3 and a second end facing away from the first end, and when the second groove 33 is formed by cutting at the bottom surface of the window region 31, the width of the second end 332 of the second groove is larger than the width of the first end 331 of the second groove.
Specifically, a circle of second grooves 33 is completely cut along four side areas of the bottom surface of the window area 31 to obtain a first groove; the inward recess continues to cut a complete turn with respect to the first second groove 33 to obtain a second groove 33.
Specifically, the first grooves 41 and the second grooves 33 are alternately arranged at intervals. The first trench 41 and the second trench 33 have trapezoidal longitudinal cross-sectional shapes, the first trench first end 411 and the second trench first end 331 respectively form a short side of the trapezoid, and the first trench 41 second end and the second trench second end 332 respectively form a long side of the trapezoid.
The first groove 41 and the second groove 33 may be cut by laser cutting or the like.
S4: the transparent cover 4 is fixed in the window region 31 by the adhesive 5, and the adhesive 5 is filled in the first groove 41.
Further, in some embodiments of the present invention, step S4 further includes:
the adhesive 5 is filled in the second trench 33.
In summary, the grooves are cut in the transparent cover plate, and the grooves are further cut in the plastic package layer, so that the adhesive solid glue blocks in the grooves and the adhesive solid glue blocks form a structure similar to a buckle and a clamping groove, the adhesive strength among the transparent cover plate, the adhesive layer and the plastic package layer is enhanced, and the situation that the transparent cover plate is broken by air pressure due to the change of the air pressure difference between the inside and the outside in the backflow process can be effectively reduced.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention and is not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are included in the scope of the present invention.

Claims (14)

1. A package structure, comprising:
the chip packaging structure comprises a substrate, a chip, a plastic packaging layer and a transparent cover plate;
the chip is arranged on the substrate and electrically connected with the substrate;
the plastic packaging layer covers the substrate and wraps the side face of the chip, a groove-shaped window area is arranged on the surface of the plastic packaging layer, a groove-shaped cavity area is arranged on the bottom face of the window area, the opening area of the cavity area is smaller than that of the window area, and the window area and the cavity area at least expose partial surface area of the chip;
the transparent cover plate is arranged in the window area, and bonding agents are filled between the side surface and the bottom surface of the transparent cover plate and the plastic packaging layer and are sealed and fixed;
at least one first groove is formed in at least one of the bottom surface and the side surface of the transparent cover plate, the adhesive is filled in the first groove, the first groove is provided with a first end located on the surface side of the transparent cover plate and a second end away from the first end, when the first groove is formed in the bottom surface of the transparent cover plate, the first groove is located above the bottom surface of the window area, and the width of the second end of the first groove is larger than that of the first end of the first groove.
2. The package structure according to claim 1, wherein at least one second trench is formed in the molding layer at least at one of the inner wall surface and the bottom surface of the window region, the adhesive is filled in the second trench, the second trench has a first end located on the molding layer surface side and a second end facing away from the first end, and when the second trench is located on the bottom surface of the window region, the second end width of the second trench is greater than the first end width of the second trench.
3. The package structure of claim 2, wherein the chip surface is provided with a photosensitive region, and the window region and the cavity region expose the photosensitive region.
4. The package structure according to claim 3, wherein the first trench is disposed on the bottom surface of the transparent cover, and the second trench is disposed on the bottom surface of the window region.
5. The package structure according to claim 4, wherein the transparent cover has a quadrilateral shape, the window area has a shape corresponding to the quadrilateral shape, and the first grooves are distributed along four side regions of the bottom surface of the transparent cover in a shape of a Chinese character 'kou' in a planar direction, and the second grooves are distributed along four side regions of the bottom surface of the window area in a shape of a Chinese character 'kou'.
6. The package structure according to claim 5, wherein the bottom surface of the transparent cover is formed with one of the first trenches, and the bottom surface of the window region is formed with two of the second trenches.
7. The package structure of claim 5, wherein the first trenches and the second trenches are staggered.
8. The package structure according to claim 2, wherein the first trench and the second trench have trapezoidal longitudinal cross-sectional shapes, the first trench first end and the second trench first end respectively form a short trapezoidal side, and the first trench second end and the second trench second end respectively form a long trapezoidal side.
9. A manufacturing method of a packaging structure is characterized by comprising the following steps:
providing a substrate and a chip, placing the chip on the substrate, and leading bonding wires to electrically connect the substrate and the chip;
placing the substrate and the chip in a plastic package mold, forming a plastic package layer by injection molding, and forming a cavity area and a window area with gradually increased opening areas in an area above the chip;
providing a transparent cover plate, cutting at least one first groove at one position of the bottom surface and the side surface of the transparent cover plate, wherein the first groove is provided with a first end positioned on the surface of the transparent cover plate and a second end away from the first end, when the first groove is cut and formed on the bottom surface of the transparent cover plate, the first groove is correspondingly positioned above the bottom surface of the window area, and the width of the second end of the first groove is larger than that of the first end of the first groove;
and the transparent cover plate is fixedly arranged in the window area through an adhesive, and the adhesive is filled in the first groove.
10. The method for manufacturing a package structure according to claim 9, further comprising the steps of: at least one second groove is formed in the inner wall surface and the bottom surface of the window area in a cutting mode, the second groove is provided with a first end located on the surface of the plastic package layer and a second end deviating from the first end, and when the second groove is formed in the bottom surface of the window area in a cutting mode, the width of the second end of the second groove is larger than that of the first end of the second groove;
and filling the adhesive into the second groove.
11. The method for manufacturing the package structure according to claim 10, wherein the cutting at least one first groove at one of the bottom surface and the side surface of the transparent cover plate specifically includes:
and completely cutting a circle along four side areas of the bottom surface of the transparent cover plate to obtain a first groove.
12. The method for manufacturing the package structure according to claim 11, wherein the cutting at least one of the inner wall surface and the bottom surface of the window region to form at least one second trench specifically comprises:
completely cutting a circle along four side areas of the bottom surface of the window area to obtain a first second groove;
and relative to the first second groove, retracting inwards to continuously and completely cut a circle to obtain a second groove.
13. The method for manufacturing the package structure of claim 11, wherein the second trenches and the first trenches are alternately arranged at intervals.
14. The method for manufacturing a package structure according to claim 10, wherein the first trench and the second trench have trapezoidal longitudinal cross-sectional shapes, the first end of the first trench and the first end of the second trench respectively form a short side of a trapezoid, and the second end of the first trench and the second end of the second trench respectively form a long side of a trapezoid.
CN202210343559.9A 2022-03-31 2022-03-31 Package structure and method for manufacturing the same Pending CN114823650A (en)

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CN202210343559.9A CN114823650A (en) 2022-03-31 2022-03-31 Package structure and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210343559.9A CN114823650A (en) 2022-03-31 2022-03-31 Package structure and method for manufacturing the same

Publications (1)

Publication Number Publication Date
CN114823650A true CN114823650A (en) 2022-07-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
CN (1) CN114823650A (en)

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