CN115000026A - Optical chip packaging structure - Google Patents

Optical chip packaging structure Download PDF

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Publication number
CN115000026A
CN115000026A CN202210572376.4A CN202210572376A CN115000026A CN 115000026 A CN115000026 A CN 115000026A CN 202210572376 A CN202210572376 A CN 202210572376A CN 115000026 A CN115000026 A CN 115000026A
Authority
CN
China
Prior art keywords
optical chip
layer
light
transparent plastic
plastic envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210572376.4A
Other languages
Chinese (zh)
Inventor
孙瑜
石先玉
万里兮
吴昊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Wanying Microelectronics Co ltd
Original Assignee
Chengdu Wanying Microelectronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Wanying Microelectronics Co ltd filed Critical Chengdu Wanying Microelectronics Co ltd
Priority to CN202210572376.4A priority Critical patent/CN115000026A/en
Priority to PCT/CN2022/103335 priority patent/WO2023226153A1/en
Publication of CN115000026A publication Critical patent/CN115000026A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/124—Geodesic lenses or integrated gratings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12107—Grating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention discloses an optical chip packaging structure, comprising: optical chip, transparent plastic envelope layer, opaque plastic envelope layer and packaging substrate, optical chip fixes on the packaging substrate, transparent plastic envelope layer cladding optical chip, the upper surface of opaque plastic envelope layer cladding transparent plastic envelope layer, and a side of transparent plastic envelope layer is for going into the plain noodles, and optical chip's top is provided with examines the plain noodles, and transparent plastic envelope layer is provided with and is located and examines the plain noodles top, will follow the light that goes into the plain noodles and get into deflects extremely examine the light guide structure on plain noodles. The invention deflects the light entering from the light inlet surface of the side surface through the light guide structure, so that the light enters the light detecting surface on the upper surface of the optical chip. Thereby reducing the package thickness and providing a larger feed-in window for external light. Meanwhile, the optical fiber entering from the side face is deflected to the upper surface of the optical chip by the light guide structure, so that the light detection surface is not required to be arranged on the side face of the optical chip, the requirement on alignment precision is reduced, and great convenience can be provided for subsequent batch production.

Description

Optical chip packaging structure
Technical Field
The invention relates to the related technical field of optical chips, in particular to an optical chip packaging structure.
Background
In some sensing, communication, and computing scenarios, light is fed into the optical chip through optical fibers or other means. In many application scenarios, the light feed path is located on the side of the optical chip. However, the light detection surface of the optical chip is disposed on the front surface of the optical chip. Therefore, the prior art adopts a mode of turning light rays through a prism or vertically turning light fibers, and the light rays enter the light detection surface of the front surface of the optical chip from the upper part of the front surface of the optical chip. Such packaging requires deflecting the fiber 90 °, or deflecting the light with a prism or the like to be incident on the light detection surface of the front side of the chip. Therefore, the optical chip packaging structure in the prior art occupies a large space and is not easy to integrate.
Disclosure of Invention
Therefore, it is necessary to provide an optical chip package structure for solving the technical problems of large space occupation and difficulty in integration of the optical chip package structure in the prior art.
The invention provides an optical chip packaging structure, comprising: optical chip, transparent plastic-sealed layer, opaque plastic-sealed layer and packaging substrate, optical chip fixes on the packaging substrate, transparent plastic-sealed layer cladding optical chip, opaque plastic-sealed layer cladding the upper surface of transparent plastic-sealed layer, a side of transparent plastic-sealed layer is for going into the plain noodles, optical chip's top is provided with examines the plain noodles, transparent plastic-sealed layer is provided with and is located examine the plain noodles top, will follow the light that goes into the plain noodles and get into deflects extremely examine the light-directing structure on plain noodles.
Further, the light guide structure is a grating structure protruding towards the direction of the optical chip.
Furthermore, the other side face, opposite to the light incident face, of the transparent plastic package layer is a reflecting face, and the opaque plastic package layer covers the reflecting face.
Furthermore, a reflecting layer is sputtered between the transparent plastic packaging layer and the opaque plastic packaging layer.
Furthermore, the reflecting layer is metal sputtered on the surface of the transparent plastic package layer.
Still further, the metal is titanium, tungsten, aluminum, gold, copper or silver.
Further, the light guide structure covers or partially covers the light detection surface.
Furthermore, the opaque plastic packaging layer is a black plastic packaging layer.
Further, the packaging substrate is an organic substrate, a ceramic substrate or a frame substrate.
Furthermore, a plurality of optical chips are fixed on the package substrate, and one or more light guide structures are arranged on the transparent plastic package layer.
The invention deflects the light entering from the light inlet surface of the side surface through the light guide structure, so that the light enters the light detecting surface on the upper surface of the optical chip. Thereby reducing the package thickness and providing a larger feed-in window for external light. Meanwhile, the optical fiber entering from the side surface is deflected to the upper surface of the optical chip by the light guide structure, so that the light detection surface is not required to be arranged on the side surface of the optical chip, the requirement on alignment precision is reduced, and great convenience can be provided for subsequent batch production.
Drawings
Fig. 1 is a schematic structural diagram of an optical chip package structure according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an optical chip package structure according to another embodiment of the present invention;
FIG. 3 is a schematic diagram of a die attach process for manufacturing a die package structure according to an embodiment of the invention;
fig. 4 is a schematic diagram illustrating a transparent plastic encapsulation layer during a manufacturing process of an optical chip package structure according to an embodiment of the invention;
FIG. 5 is a pre-cut schematic diagram illustrating a manufacturing process of an optical chip package structure according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating a reflective layer of a process for fabricating an optical chip package structure according to an embodiment of the present invention;
FIG. 7 is a schematic diagram illustrating a non-transparent molding compound layer during a manufacturing process of an optical chip package structure according to an embodiment of the invention;
fig. 8 is a schematic diagram illustrating a finished product cutting process in a manufacturing process of an optical chip package structure according to an embodiment of the invention.
Description of the marks
1-an optical chip; 11-a light detection surface; 2-transparent plastic packaging layer; 21-a light guiding structure; 22-a light incident surface; 23-a reflective surface; 24-cutting the groove; 3-opaque plastic sealing layer; 4-a package substrate; 5-a reflective layer; 6-a bonding wire; 7-light; 8-middle cutting path.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Fig. 1 is a schematic structural diagram of an optical chip package structure according to an embodiment of the present invention, which includes: optical chip 1, transparent plastic envelope layer 2, opaque plastic envelope layer 3 and packaging substrate 4, optical chip 1 is fixed on packaging substrate 4, transparent plastic envelope layer 2 cladding optical chip 1, opaque plastic envelope layer 3 cladding the upper surface of transparent plastic envelope layer 2, a side of transparent plastic envelope layer 2 is for going into plain noodles 22, optical chip 1's top is provided with examines plain noodles 11, transparent plastic envelope layer 2 is provided with and is located examine plain noodles 11 top, will follow the light that goes into plain noodles 22 and get into deflects extremely examine the light guide structure 21 of plain noodles 11.
Specifically, the embodiment of the invention provides an optical chip packaging structure with a compact structure, which can improve the integration level, reduce the difficulty of optical fiber feeding, and directly feed optical fiber signals from the side surface of the package. The optical chip 1 is fixed on the package substrate 4, and the connection mode between the optical chip 1 and the package substrate 4 may adopt the prior art. For example, the optical chip 1 may be assembled on the package substrate 4 in a normal mounting manner, and the bonding wires 6 are in signal connection with the package substrate 4.
The top, e.g. the upper surface, of the optical chip 1 is provided with a light detection surface 11. Then, a transparent molding compound is encapsulated on the optical chip 1 to form a transparent molding layer 2. The transparent molding compound layer 2 may cover the optical chip 1 and the upper surface of the package substrate 4. And packaging the non-transparent plastic packaging material on the transparent plastic packaging layer 2 to form a non-transparent plastic packaging layer 3. For example, an opaque molding compound is coated on the upper surface of the transparent molding layer 2 to form the opaque molding layer 3.
One side surface of the transparent plastic package layer 2 is used as a light incident surface 22, and a light guide structure 21 located above the light detection surface 11 is arranged in the transparent plastic package layer 2. Preferably, a light guiding structure 21 is provided on top of the transparent molding layer 2. A plastic package mold may be fabricated, a shape corresponding to the light guide structure 21 is fabricated on the plastic package mold, the mold is placed on the package substrate 4 and covers the optical chip 1, and then a transparent plastic package material is injected, so that the transparent plastic package material packages the optical chip 1, and the transparent plastic package layer 2 including the light guide structure 21 is formed. The light guide structures 21 with different shapes and different density degrees can be designed according to requirements.
The light ray 7 enters from the light incident surface 22 of the transparent plastic package layer 2 and is deflected by the light guide structure 21, so that the light ray 7 enters the light detecting surface 11.
Compared with the conventional packaging mode that the light incident surface is arranged on the front surface of the chip packaging structure, the light incident surface is arranged on the side surface of the packaging structure, so that the angle of an external optical fiber is not required to be deflected, light deflection devices such as a prism and the like are not required, and the packaging volume is reduced.
Meanwhile, the light detection surface 11 of the present embodiment is disposed on the top of the optical chip 1 (i.e., the front surface of the optical chip 1), so that the area of the light detection surface 11 of the present invention is larger than that of the side surface of the optical chip 1. Because light enters from the light incident surface 22 on the side surface of the transparent plastic package layer 2, and the area of the side surface of the chip is small, if the light detection surface is arranged on the side surface of the optical chip 1, the optical fiber alignment requirement is high, and the alignment precision is easily influenced by the error parameters of the packaging process. In the embodiment, the light is deflected by the light guide structure 21 without being aligned to the side surface of the optical chip, so that the feed-in window is larger, the optical fiber assembly has larger error tolerance, and meanwhile, the plastic package material forms good protection for the optical chip.
The invention deflects the light entering from the light inlet surface of the side surface through the light guide structure, so that the light enters the light detecting surface on the upper surface of the optical chip. Thereby reducing the package thickness and providing a larger feed-in window for external light. Meanwhile, the optical fiber entering from the side surface is deflected to the upper surface of the optical chip by the light guide structure, so that the light detection surface is not required to be arranged on the side surface of the optical chip, the requirement on alignment precision is reduced, and great convenience can be provided for subsequent batch production
Fig. 2 is a schematic structural diagram of an optical chip package structure according to another embodiment of the present invention, which includes: an optical chip 1, a transparent plastic package layer 2, an opaque plastic package layer 3 and a package substrate 4, wherein the optical chip 1 is fixed on the package substrate 4, the transparent plastic package layer 2 covers the optical chip 1, the opaque plastic package layer 3 covers the upper surface of the transparent plastic package layer 2, one side surface of the transparent plastic package layer 2 is an incident surface 22, the top of the optical chip 1 is provided with a light detection surface 11, the transparent plastic package layer 2 is provided with a light guide structure 21 which is positioned above the light detection surface 11 and deflects the light entering from the incident surface 22 to the light detection surface 11, the light guide structure 21 is a grating structure protruding towards the direction of the optical chip 1, the light guide structure 21 covers or partially covers the light detection surface 11, the other side surface of the transparent plastic package layer 2 opposite to the incident surface 22 is a reflection surface 23, the opaque plastic package layer 3 covers the reflection surface 23, the non-transparent plastic package layer 3 is a black plastic package layer;
a reflecting layer 5 is sputtered between the transparent plastic packaging layer 2 and the opaque plastic packaging layer 3, the reflecting layer 5 is metal sputtered on the surface of the transparent plastic packaging layer 2, and the metal is titanium, tungsten, aluminum, gold, copper or silver;
the package substrate 4 is an organic substrate, a ceramic substrate or a frame substrate.
Specifically, the light guide structure 21 is a grating structure. Meanwhile, in order to increase the incidence rate of light on the light detection surface 11, a layer of metal is sputtered on the reflecting surface 23 opposite to the upper surface and/or incident light of the transparent plastic packaging layer 2 to serve as the reflecting layer 5, and the incident light loss is reduced. Preferably, the reflective layer 5 is sputtered on the upper surface of the transparent molding layer 2 including the light guide structure 21 and the outer surface of the reflective surface 23. The reflecting layer 5 is metal sputtered on the outer surface of the transparent plastic packaging layer 2. The metal material may be titanium (Ti), tungsten (W), aluminum (Al), gold (Au), copper (Cu), silver (Ag), or the like.
The non-transparent plastic package layer 3 is a black plastic package layer which is plastic-packaged by using black plastic package materials. The package substrate 4 may be an organic substrate, a ceramic substrate, or a frame substrate.
In one embodiment, a plurality of optical chips 1 are fixed on the package substrate 4, and one or more light guide structures 21 are disposed on the transparent plastic package layer 2.
Specifically, the optical chip package structure may be a multi-chip package, and a plurality of optical chips 1 may be fixed on the package substrate 4 by stacking, tiling, or the like.
Fig. 3 to 8 show a preparation method of the optical chip package structure of the present embodiment, which specifically includes:
(1) as shown in fig. 3, a plurality of optical chips 1 are respectively attached to a package substrate 4 and are in signal connection with the package substrate 4 through bonding wires 6, and the optical chips 1 may be stacked in multiple layers or tiled in multiple chips;
(2) as shown in fig. 4, the top of the plastic mold is formed into a shape corresponding to the grating structure, and grating structures with different shapes and different density degrees can be designed as required. And placing a plastic package mold on the package substrate 4, covering all the optical chips 1, injecting transparent plastic package material into the plastic package mold for plastic package, and curing to form a transparent plastic package layer 2 containing a grating structure, wherein the grating structure is used as a light guide structure 21. Since the plurality of optical chips 1 are covered, a plurality of shapes corresponding to the grating structure are set on the top of the mold. The projection of each shape corresponding to a grating structure onto the package substrate 4 covers or partially covers one photonic chip 1.
(3) As shown in fig. 5, after curing, offset precutting is performed on the transparent molding layer 2 to a cutting depth equal to or less than the thickness of the transparent molding layer 2, so as to form a cutting groove 24. The cutting groove 24 is close to the optical chip 1 on one side. The formation of the cutting groove can also be realized on a plastic package mold, the shape of the cutting groove 24 is manufactured on the mold, and the cutting groove 24 is directly formed after plastic package.
(4) As shown in fig. 6, a layer of metal is sputtered on the upper surface of the transparent plastic package layer 2 and in the cutting groove 24 as the reflective layer 5, the metal of the reflective layer 5 can increase light reflection, and the metal material is metal such as Ti, W, Al, Ag, Au, etc.
(5) As shown in fig. 7, after the sputtering of the reflective layer 5 is completed, the upper surface of the reflective layer 5 is further sealed by an opaque molding compound, such as a black molding compound, to cover the upper surface of the transparent molding compound 2 and the reflective layer 5 in the cutting groove 24, thereby forming the opaque molding compound 3.
(6) As shown in fig. 8, the finished product is cut along the middle dicing street 8 between the two optical chips 1, and the molding compound and the substrate are completely cut into individual packages.
The grating structure is manufactured in the optical chip packaging structure, a larger feed-in window is provided for external light, the requirement on alignment precision is reduced, and great convenience can be provided for subsequent batch production. Meanwhile, by adding a reflective layer, the loss of incident light is reduced.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An optical chip package structure, comprising: optical chip (1), transparent plastic envelope layer (2), opaque plastic envelope layer (3) and packaging substrate (4), optical chip (1) is fixed packaging substrate (4) are last, transparent plastic envelope layer (2) cladding optical chip (1), opaque plastic envelope layer (3) cladding the upper surface of transparent plastic envelope layer (2), a side of transparent plastic envelope layer (2) is income plain noodles (22), the top of optical chip (1) is provided with examines plain noodles (11), transparent plastic envelope layer (2) are provided with and are located examine plain noodles (11) top, will follow the light that goes into plain noodles (22) entering deflects extremely examine light guide structure (21) of plain noodles (11).
2. The photonic chip package structure of claim 1, wherein the light guiding structure (21) is a grating structure protruding towards the photonic chip (1).
3. The optical chip packaging structure according to claim 1, wherein the other side surface of the transparent plastic packaging layer (2) opposite to the light incident surface (22) is a reflection surface (23), and the non-transparent plastic packaging layer (3) covers the reflection surface (23).
4. Optical chip packaging structure according to any one of claims 1 to 3, characterized in that a reflective layer (5) is sputtered between the transparent molding layer (2) and the opaque molding layer (3).
5. The optical chip packaging structure according to claim 4, wherein the reflective layer (5) is a metal sputtered on the surface of the transparent molding layer (2).
6. The optical chip package structure of claim 5, wherein the metal is titanium, tungsten, aluminum, gold, copper, or silver.
7. The photonic chip package according to claim 1, wherein the light guiding structure (21) covers or partially covers the light sensing surface (11).
8. The optical chip packaging structure according to claim 1, wherein the opaque molding compound layer (3) is a black molding compound layer.
9. The photonic chip package structure of claim 1, wherein the package substrate (4) is an organic substrate, a ceramic substrate or a frame substrate.
10. The optical chip package structure according to claim 1, wherein a plurality of optical chips (1) are fixed on the package substrate (4), and the transparent molding compound (2) is provided with one or more light guide structures (21).
CN202210572376.4A 2022-05-24 2022-05-24 Optical chip packaging structure Pending CN115000026A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202210572376.4A CN115000026A (en) 2022-05-24 2022-05-24 Optical chip packaging structure
PCT/CN2022/103335 WO2023226153A1 (en) 2022-05-24 2022-07-01 Optical chip package structure and optical chip packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210572376.4A CN115000026A (en) 2022-05-24 2022-05-24 Optical chip packaging structure

Publications (1)

Publication Number Publication Date
CN115000026A true CN115000026A (en) 2022-09-02

Family

ID=83028848

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210572376.4A Pending CN115000026A (en) 2022-05-24 2022-05-24 Optical chip packaging structure

Country Status (1)

Country Link
CN (1) CN115000026A (en)

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