CN114981963A - 系统级封装及电子设备 - Google Patents
系统级封装及电子设备 Download PDFInfo
- Publication number
- CN114981963A CN114981963A CN202080093295.5A CN202080093295A CN114981963A CN 114981963 A CN114981963 A CN 114981963A CN 202080093295 A CN202080093295 A CN 202080093295A CN 114981963 A CN114981963 A CN 114981963A
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- China
- Prior art keywords
- heat dissipation
- electronic device
- substrate
- heat
- package
- Prior art date
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Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 255
- 239000000758 substrate Substances 0.000 claims abstract description 126
- 238000004519 manufacturing process Methods 0.000 claims abstract description 66
- 238000000465 moulding Methods 0.000 claims abstract description 61
- 150000001875 compounds Chemical class 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims description 35
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000000227 grinding Methods 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 8
- 238000003892 spreading Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 7
- 230000007480 spreading Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract 1
- 230000008569 process Effects 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 239000010408 film Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 12
- 239000000945 filler Substances 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 8
- 238000012858 packaging process Methods 0.000 description 8
- 230000003071 parasitic effect Effects 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 238000000748 compression moulding Methods 0.000 description 4
- 229940125782 compound 2 Drugs 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 241000237858 Gastropoda Species 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一种系统级封装及电子设备，能够在保证系统级封装中的大功率器件有效散热的基础上，提高大功率器件的电学性能，降低系统级封装的制作成本。该系统级封装包括基板(1)、散热器件(5)、第一电子器件(3)及第二电子器件(4)；散热器件(5)、第一电子器件(3)、第二电子器件(4)塑封在模塑料(2)中；第一电子器件(3)和第二电子器件(4)设置在基板(1)的一侧、并与基板(1)连接；散热器件(5)包括散热块(50)以及从散热块(50)的侧面延伸出的散热延伸部(51)；散热块(50)通过导热胶(6)粘贴在第一电子器件(3)远离基板(1)一侧的表面。
Description
PCT国内申请，说明书已公开。
Claims (12)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/082230 WO2021195903A1 (zh) | 2020-03-31 | 2020-03-31 | 系统级封装及电子设备 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114981963A true CN114981963A (zh) | 2022-08-30 |
Family
ID=77927032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080093295.5A Pending CN114981963A (zh) | 2020-03-31 | 2020-03-31 | 系统级封装及电子设备 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114981963A (zh) |
| WO (1) | WO2021195903A1 (zh) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232294A (ja) * | 1993-02-03 | 1994-08-19 | Hitachi Ltd | 半導体集積回路装置 |
| US6458626B1 (en) * | 2001-08-03 | 2002-10-01 | Siliconware Precision Industries Co., Ltd. | Fabricating method for semiconductor package |
| JP2008130706A (ja) * | 2006-11-20 | 2008-06-05 | Sony Corp | 半導体装置の製造方法 |
| CN201623107U (zh) * | 2010-01-30 | 2010-11-03 | 江苏长电科技股份有限公司 | 印刷线路板芯片倒装散热块外接散热板封装结构 |
| CN103117275A (zh) * | 2013-01-31 | 2013-05-22 | 华为技术有限公司 | 一种芯片封装结构及芯片封装方法 |
| TW201735291A (zh) * | 2016-01-11 | 2017-10-01 | 英特爾公司 | 帶有多種熱界面材料之多晶片封裝體 |
| CN109860131A (zh) * | 2019-03-22 | 2019-06-07 | 西安微电子技术研究所 | 一种具有内散热装置的系统级封装结构 |
| KR20190130946A (ko) * | 2018-05-15 | 2019-11-25 | 주식회사 네패스 | 히트싱크를 탑재한 반도체 패키지 |
| CN110828407A (zh) * | 2019-11-19 | 2020-02-21 | 华进半导体封装先导技术研发中心有限公司 | 一种SiP封装结构及其制备方法 |
| CN110911365A (zh) * | 2019-10-28 | 2020-03-24 | 北京时代民芯科技有限公司 | 一种倒装焊封装散热结构及制造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104241218A (zh) * | 2014-06-25 | 2014-12-24 | 中国科学院微电子研究所 | 一种带有散热结构的倒装芯片塑封结构及制造方法 |
| CN105489597B (zh) * | 2015-12-28 | 2018-06-15 | 华为技术有限公司 | 系统级封装模块组件、系统级封装模块及电子设备 |
| CN110707081A (zh) * | 2019-11-12 | 2020-01-17 | 中南大学 | 用于系统级封装的散热结构 |
-
2020
- 2020-03-31 CN CN202080093295.5A patent/CN114981963A/zh active Pending
- 2020-03-31 WO PCT/CN2020/082230 patent/WO2021195903A1/zh active Application Filing
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232294A (ja) * | 1993-02-03 | 1994-08-19 | Hitachi Ltd | 半導体集積回路装置 |
| US6458626B1 (en) * | 2001-08-03 | 2002-10-01 | Siliconware Precision Industries Co., Ltd. | Fabricating method for semiconductor package |
| JP2008130706A (ja) * | 2006-11-20 | 2008-06-05 | Sony Corp | 半導体装置の製造方法 |
| CN201623107U (zh) * | 2010-01-30 | 2010-11-03 | 江苏长电科技股份有限公司 | 印刷线路板芯片倒装散热块外接散热板封装结构 |
| CN103117275A (zh) * | 2013-01-31 | 2013-05-22 | 华为技术有限公司 | 一种芯片封装结构及芯片封装方法 |
| TW201735291A (zh) * | 2016-01-11 | 2017-10-01 | 英特爾公司 | 帶有多種熱界面材料之多晶片封裝體 |
| KR20190130946A (ko) * | 2018-05-15 | 2019-11-25 | 주식회사 네패스 | 히트싱크를 탑재한 반도체 패키지 |
| CN109860131A (zh) * | 2019-03-22 | 2019-06-07 | 西安微电子技术研究所 | 一种具有内散热装置的系统级封装结构 |
| CN110911365A (zh) * | 2019-10-28 | 2020-03-24 | 北京时代民芯科技有限公司 | 一种倒装焊封装散热结构及制造方法 |
| CN110828407A (zh) * | 2019-11-19 | 2020-02-21 | 华进半导体封装先导技术研发中心有限公司 | 一种SiP封装结构及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021195903A1 (zh) | 2021-10-07 |
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