CN114959565A - 蒸镀掩模、带框架的蒸镀掩模、有机半导体元件的制造方法及有机el显示器的制造方法 - Google Patents

蒸镀掩模、带框架的蒸镀掩模、有机半导体元件的制造方法及有机el显示器的制造方法 Download PDF

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Publication number
CN114959565A
CN114959565A CN202210442665.2A CN202210442665A CN114959565A CN 114959565 A CN114959565 A CN 114959565A CN 202210442665 A CN202210442665 A CN 202210442665A CN 114959565 A CN114959565 A CN 114959565A
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China
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mask
vapor deposition
metal mask
metal
resin
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Pending
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CN202210442665.2A
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Chinese (zh)
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川崎博司
武田利彦
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN202210442665.2A 2016-05-26 2017-05-23 蒸镀掩模、带框架的蒸镀掩模、有机半导体元件的制造方法及有机el显示器的制造方法 Pending CN114959565A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016105178A JP6465075B2 (ja) 2016-05-26 2016-05-26 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及びに有機ｅｌディスプレイの製造方法
JP2016-105178 2016-05-26
PCT/JP2017/019130 WO2017204194A1 (ja) 2016-05-26 2017-05-23 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及び有機ｅｌディスプレイの製造方法
CN201780030895.5A CN109154064A (zh) 2016-05-26 2017-05-23 蒸镀掩模、带框架的蒸镀掩模、有机半导体元件的制造方法、及有机el显示器的制造方法

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CN201780030895.5A Division CN109154064A (zh) 2016-05-26 2017-05-23 蒸镀掩模、带框架的蒸镀掩模、有机半导体元件的制造方法、及有机el显示器的制造方法

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CN114959565A true CN114959565A (zh) 2022-08-30

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CN201780030895.5A Pending CN109154064A (zh) 2016-05-26 2017-05-23 蒸镀掩模、带框架的蒸镀掩模、有机半导体元件的制造方法、及有机el显示器的制造方法
CN202210442665.2A Pending CN114959565A (zh) 2016-05-26 2017-05-23 蒸镀掩模、带框架的蒸镀掩模、有机半导体元件的制造方法及有机el显示器的制造方法

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Country Status (6)

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US (1) US20190203338A1 (enExample)
JP (1) JP6465075B2 (enExample)
KR (1) KR102365037B1 (enExample)
CN (2) CN109154064A (enExample)
TW (1) TWI747908B (enExample)
WO (1) WO2017204194A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109072411B (zh) * 2016-02-10 2021-04-06 鸿海精密工业股份有限公司 蒸镀掩模的制造方法、蒸镀掩模及有机半导体元件的制造方法
TWI664876B (zh) * 2018-01-17 2019-07-01 友達光電股份有限公司 遮罩、遮罩的製造方法及應用此遮罩之有機電激發光元件的蒸鍍方法
US11655536B2 (en) * 2018-03-20 2023-05-23 Sharp Kabushiki Kaisha Film forming mask and method of manufacturing display device using same
CN116024523A (zh) * 2018-03-30 2023-04-28 昆山国显光电有限公司 掩膜板及其制备方法
JP7187883B2 (ja) * 2018-08-09 2022-12-13 大日本印刷株式会社 蒸着マスクの製造方法
WO2020044547A1 (ja) * 2018-08-31 2020-03-05 シャープ株式会社 蒸着マスク
KR102642138B1 (ko) * 2018-09-04 2024-03-04 엘지이노텍 주식회사 증착용 마스크 및 이의 제조 방법
EP4016658A1 (en) * 2019-01-31 2022-06-22 Dai Nippon Printing Co., Ltd. Deposition mask group, manufacturing method of electronic device, and electronic device
CN110331377B (zh) * 2019-07-24 2021-10-29 京东方科技集团股份有限公司 掩膜片及其制作方法、开口掩膜板及其使用方法、薄膜沉积设备
WO2021036067A1 (zh) * 2019-08-28 2021-03-04 京东方科技集团股份有限公司 掩模板及制备方法、精细金属掩模板、掩模装置及使用方法
CN112501558B (zh) 2019-08-28 2024-12-13 京东方科技集团股份有限公司 掩膜版、掩膜装置及掩膜版的设计优化方法
JP2021066949A (ja) * 2019-10-28 2021-04-30 大日本印刷株式会社 蒸着マスクおよび蒸着マスクの製造方法
CN110993790A (zh) * 2019-11-14 2020-04-10 武汉华星光电半导体显示技术有限公司 金属掩模板及柔性oled面板
CN110777328A (zh) * 2019-11-21 2020-02-11 昆山国显光电有限公司 一种掩膜版、蒸镀系统及掩膜版的制备方法
CN110838565B (zh) * 2019-11-26 2022-07-29 京东方科技集团股份有限公司 金属掩模版、显示面板和显示装置
CN110911466B (zh) 2019-11-29 2022-08-19 京东方科技集团股份有限公司 一种基板及其制备方法、母板的制备方法、掩膜版和蒸镀装置
KR20210091382A (ko) 2020-01-13 2021-07-22 삼성디스플레이 주식회사 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
KR20220078007A (ko) * 2020-12-02 2022-06-10 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
US12239006B2 (en) * 2020-12-28 2025-02-25 Dai Nippon Printing Co., Ltd. Organic device having a first display area, and a second display area including a second electrode surrounding each of first and second adjacent transmission areas
TWI825405B (zh) * 2021-03-31 2023-12-11 達運精密工業股份有限公司 金屬遮罩檢測方法
US11939658B2 (en) * 2021-04-09 2024-03-26 Dai Nippon Printing Co., Ltd. Deposition mask, deposition mask apparatus, deposition apparatus, and manufacturing method for organic device
KR20230026586A (ko) * 2021-08-17 2023-02-27 삼성디스플레이 주식회사 마스크 조립체
CN114540787B (zh) * 2021-11-23 2024-08-09 京东方科技集团股份有限公司 一种掩膜板、其制作方法及显示面板

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013170301A (ja) * 2012-02-21 2013-09-02 Dainippon Printing Co Ltd 蒸着マスクの製造方法
JP2014125671A (ja) * 2012-12-27 2014-07-07 V Technology Co Ltd 蒸着マスク及びその製造方法
TW201438515A (zh) * 2013-03-29 2014-10-01 Sony Corp 罩框單元、罩裝置、及處理方法
JP2015017307A (ja) * 2013-07-11 2015-01-29 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP2015078441A (ja) * 2013-03-26 2015-04-23 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP2015092016A (ja) * 2013-09-30 2015-05-14 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、蒸着マスク準備体、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
CN105102668A (zh) * 2013-03-26 2015-11-25 大日本印刷株式会社 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法
CN105143497A (zh) * 2013-04-12 2015-12-09 大日本印刷株式会社 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法
JP2016014190A (ja) * 2013-11-14 2016-01-28 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
CN105322101A (zh) * 2012-01-12 2016-02-10 大日本印刷株式会社 蒸镀掩模及有机半导体元件的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101117645B1 (ko) * 2009-02-05 2012-03-05 삼성모바일디스플레이주식회사 마스크 조립체 및 이를 이용한 평판표시장치용 증착 장치
KR20120094112A (ko) * 2010-02-03 2012-08-23 샤프 가부시키가이샤 증착 마스크, 증착장치 및 증착 방법
JP2015074826A (ja) 2013-10-11 2015-04-20 株式会社ブイ・テクノロジー 成膜マスク及びその製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105322101A (zh) * 2012-01-12 2016-02-10 大日本印刷株式会社 蒸镀掩模及有机半导体元件的制造方法
JP2013170301A (ja) * 2012-02-21 2013-09-02 Dainippon Printing Co Ltd 蒸着マスクの製造方法
JP2014125671A (ja) * 2012-12-27 2014-07-07 V Technology Co Ltd 蒸着マスク及びその製造方法
JP2015078441A (ja) * 2013-03-26 2015-04-23 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、及び有機半導体素子の製造方法
CN105102668A (zh) * 2013-03-26 2015-11-25 大日本印刷株式会社 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法
TW201438515A (zh) * 2013-03-29 2014-10-01 Sony Corp 罩框單元、罩裝置、及處理方法
CN105143497A (zh) * 2013-04-12 2015-12-09 大日本印刷株式会社 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法
JP2015017307A (ja) * 2013-07-11 2015-01-29 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP2015092016A (ja) * 2013-09-30 2015-05-14 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、蒸着マスク準備体、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
JP2016014190A (ja) * 2013-11-14 2016-01-28 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、及び有機半導体素子の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
赵品等: "材料科学基础教程", 31 January 2016, 哈尔滨工业大学出版社, pages: 299 *

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TW201809326A (zh) 2018-03-16
US20190203338A1 (en) 2019-07-04
JP2017210657A (ja) 2017-11-30
CN109154064A (zh) 2019-01-04
JP6465075B2 (ja) 2019-02-06
TWI747908B (zh) 2021-12-01
WO2017204194A1 (ja) 2017-11-30
KR102365037B1 (ko) 2022-02-18
KR20190013852A (ko) 2019-02-11

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