CN114787417A - 用于制造导电结构的方法 - Google Patents

用于制造导电结构的方法 Download PDF

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Publication number
CN114787417A
CN114787417A CN202080085464.0A CN202080085464A CN114787417A CN 114787417 A CN114787417 A CN 114787417A CN 202080085464 A CN202080085464 A CN 202080085464A CN 114787417 A CN114787417 A CN 114787417A
Authority
CN
China
Prior art keywords
laser radiation
carrier material
additive
carrier
irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080085464.0A
Other languages
English (en)
Chinese (zh)
Inventor
B.罗森纳
R.A.克鲁格
A.费舍尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPKF Laser and Electronics AG
Original Assignee
LPKF Laser and Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPKF Laser and Electronics AG filed Critical LPKF Laser and Electronics AG
Publication of CN114787417A publication Critical patent/CN114787417A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1667—Radiant energy, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1868—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
CN202080085464.0A 2019-12-11 2020-10-01 用于制造导电结构的方法 Pending CN114787417A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019133955.3A DE102019133955B4 (de) 2019-12-11 2019-12-11 Verfahren zur Herstellung einer Verbundstruktur aus mindestens einer leitfähigen Struktur
DE102019133955.3 2019-12-11
PCT/DE2020/100840 WO2021115518A1 (de) 2019-12-11 2020-10-01 Verfahren zur herstellung einer elektrisch leitfähigen struktur

Publications (1)

Publication Number Publication Date
CN114787417A true CN114787417A (zh) 2022-07-22

Family

ID=72915760

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080085464.0A Pending CN114787417A (zh) 2019-12-11 2020-10-01 用于制造导电结构的方法

Country Status (7)

Country Link
US (1) US20230026070A1 (de)
EP (1) EP4073286A1 (de)
JP (1) JP2023505869A (de)
KR (1) KR20220087531A (de)
CN (1) CN114787417A (de)
DE (1) DE102019133955B4 (de)
WO (1) WO2021115518A1 (de)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007130675A (ja) * 2005-11-11 2007-05-31 Seiko Epson Corp レーザスクライブ加工方法
WO2014085324A1 (en) * 2012-11-27 2014-06-05 President And Fellows Of Harvard College Crystal growth through irradiation with short laser pulses
CN108604575A (zh) * 2016-03-31 2018-09-28 伊雷克托科学工业股份有限公司 用于导电电镀的镭射种晶
CN109844178A (zh) * 2016-09-13 2019-06-04 国家科学研究所物理和技术科学中心 一种在聚合物制品表面上形成导电迹线的方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
US20070148420A1 (en) 2005-12-28 2007-06-28 Intel Corporation Method of making a substrate using laser assisted metallization and patterning with electroless plating without electrolytic plating
JP2007330995A (ja) * 2006-06-15 2007-12-27 Ricoh Co Ltd レーザ加工装置とレーザ加工方法とそれにより加工された液滴吐出ヘッド及び画像形成装置
JP5826027B2 (ja) * 2008-03-21 2015-12-02 イムラ アメリカ インコーポレイテッド レーザベースの材料加工方法及びシステム
WO2011024939A1 (ja) * 2009-08-28 2011-03-03 日本電気株式会社 半導体装置およびその製造方法
CN102812541B (zh) * 2011-03-24 2016-02-03 松下知识产权经营株式会社 挠性半导体装置及其制造方法、以及使用挠性半导体装置的图像显示装置及其制造方法
DE102012010635B4 (de) 2012-05-18 2022-04-07 Leibniz-Institut für Oberflächenmodifizierung e.V. Verfahren zur 3D-Strukturierung und Formgebung von Oberflächen aus harten, spröden und optischen Materialien
EP2925902A1 (de) * 2012-11-27 2015-10-07 DSM IP Assets B.V. Verfahren zur ablagerung einer metallischen struktur auf einem medium
DE102013100016A1 (de) 2013-01-02 2014-07-03 Lpkf Laser & Electronics Ag Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einem nichtleitenden Trägermaterial sowie ein hierzu bestimmtes Additiv und Trägermaterial
DE102014008963A1 (de) 2014-06-23 2016-01-07 Merck Patent Gmbh Additiv für LDS-Kunststoffe
KR101698159B1 (ko) * 2014-08-04 2017-01-19 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
DE102014114986A1 (de) 2014-10-15 2016-04-21 Lpkf Laser & Electronics Ag Verfahren zur Herstellung einer elektrisch leitfähigen Struktur sowie ein mit diesem Verfahren hergestelltes Trägermaterial
DE102015112151A1 (de) 2015-07-24 2017-02-09 Lpkf Laser & Electronics Ag Verfahren und Vorrichtung zur Laserbearbeitung eines Substrates mit mehrfacher Ablenkung einer Laserstrahlung
JP6768289B2 (ja) * 2015-12-01 2020-10-14 キヤノン株式会社 走査型顕微鏡
EP3211122A1 (de) * 2016-02-23 2017-08-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum sintern, kristallisieren und/oder vernetzen eines beschichtungsmaterials auf einem substrat
JP6841220B2 (ja) * 2017-06-28 2021-03-10 東レ株式会社 液晶性ポリエステル樹脂組成物、成形品および成形品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007130675A (ja) * 2005-11-11 2007-05-31 Seiko Epson Corp レーザスクライブ加工方法
WO2014085324A1 (en) * 2012-11-27 2014-06-05 President And Fellows Of Harvard College Crystal growth through irradiation with short laser pulses
CN108604575A (zh) * 2016-03-31 2018-09-28 伊雷克托科学工业股份有限公司 用于导电电镀的镭射种晶
CN109844178A (zh) * 2016-09-13 2019-06-04 国家科学研究所物理和技术科学中心 一种在聚合物制品表面上形成导电迹线的方法

Also Published As

Publication number Publication date
US20230026070A1 (en) 2023-01-26
JP2023505869A (ja) 2023-02-13
DE102019133955B4 (de) 2021-08-19
EP4073286A1 (de) 2022-10-19
WO2021115518A1 (de) 2021-06-17
KR20220087531A (ko) 2022-06-24
DE102019133955A1 (de) 2021-06-17

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