CN114746585A - 电镀系统 - Google Patents

电镀系统 Download PDF

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Publication number
CN114746585A
CN114746585A CN201980102341.0A CN201980102341A CN114746585A CN 114746585 A CN114746585 A CN 114746585A CN 201980102341 A CN201980102341 A CN 201980102341A CN 114746585 A CN114746585 A CN 114746585A
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CN
China
Prior art keywords
plating
plating tank
tank
magnetic
medium
Prior art date
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CN201980102341.0A
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English (en)
Chinese (zh)
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CN114746585B (zh
Inventor
饭森雅之
竹田谅佑
岩田芳一
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YKK Corp
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YKK Corp
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Publication of CN114746585A publication Critical patent/CN114746585A/zh
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Publication of CN114746585B publication Critical patent/CN114746585B/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
    • B24B31/112—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work using magnetically consolidated grinding powder, moved relatively to the workpiece under the influence of pressure
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201980102341.0A 2019-12-24 2019-12-24 电镀系统 Active CN114746585B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/050715 WO2021130873A1 (fr) 2019-12-24 2019-12-24 Système de placage électrolytique

Publications (2)

Publication Number Publication Date
CN114746585A true CN114746585A (zh) 2022-07-12
CN114746585B CN114746585B (zh) 2024-06-25

Family

ID=76575821

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980102341.0A Active CN114746585B (zh) 2019-12-24 2019-12-24 电镀系统

Country Status (3)

Country Link
JP (1) JP7196337B2 (fr)
CN (1) CN114746585B (fr)
WO (1) WO2021130873A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7196337B2 (ja) * 2019-12-24 2022-12-26 Ykk株式会社 電気めっきシステム

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413896A (ja) * 1990-05-02 1992-01-17 Jidosha Kiki Co Ltd 連続電着塗装装置
US5316642A (en) * 1993-04-22 1994-05-31 Digital Equipment Corporation Oscillation device for plating system
JPH07316887A (ja) * 1994-05-31 1995-12-05 Japan Tobacco Inc メッキ工程の搬送装置
CN1300882A (zh) * 1999-12-21 2001-06-27 住友特珠金属株式会社 电镀处理装置和电镀处理方法
CN1323731A (zh) * 2000-03-28 2001-11-28 佳能株式会社 卷材输送装置以及利用卷材输送装置进行电镀的装置和方法
TW200835819A (en) * 2007-01-29 2008-09-01 Semitool Inc Apparatus and methods for electrochemical processing of wafers
US20100006444A1 (en) * 2008-07-10 2010-01-14 Ebara Corporation Plating apparatus and plating method for forming magnetic film
CN104233422A (zh) * 2013-06-24 2014-12-24 马悦 一种用于在衬底上沉积金属的设备
WO2016075828A1 (fr) * 2014-11-14 2016-05-19 合同会社ナポレ企画 Procédé de traitement électrolytique de surface pour éléments d'accessoire vestimentaire, accessoires vestimentaires, et leur procédé de production
TW201731007A (zh) * 2016-02-19 2017-09-01 斯庫林集團股份有限公司 鍍覆裝置及鍍覆方法
CN108977871A (zh) * 2018-08-28 2018-12-11 杨胜 一种锌镀层电镀系统
CN208328162U (zh) * 2018-04-14 2019-01-04 江阴道达汽车饰件有限公司 一种带有清污装置的电镀槽
CN110475913A (zh) * 2017-04-14 2019-11-19 Ykk株式会社 电镀方法和装置
WO2021130873A1 (fr) * 2019-12-24 2021-07-01 Ykk株式会社 Système de placage électrolytique
CN114761624A (zh) * 2019-12-24 2022-07-15 Ykk株式会社 电镀装置和镀覆物的制造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246710A (ja) * 1988-08-08 1990-02-16 Fukuda Shigeo 希土類磁石材の表面処理方法

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413896A (ja) * 1990-05-02 1992-01-17 Jidosha Kiki Co Ltd 連続電着塗装装置
US5316642A (en) * 1993-04-22 1994-05-31 Digital Equipment Corporation Oscillation device for plating system
JPH07316887A (ja) * 1994-05-31 1995-12-05 Japan Tobacco Inc メッキ工程の搬送装置
CN1300882A (zh) * 1999-12-21 2001-06-27 住友特珠金属株式会社 电镀处理装置和电镀处理方法
CN1323731A (zh) * 2000-03-28 2001-11-28 佳能株式会社 卷材输送装置以及利用卷材输送装置进行电镀的装置和方法
TW200835819A (en) * 2007-01-29 2008-09-01 Semitool Inc Apparatus and methods for electrochemical processing of wafers
US20100006444A1 (en) * 2008-07-10 2010-01-14 Ebara Corporation Plating apparatus and plating method for forming magnetic film
CN104233422A (zh) * 2013-06-24 2014-12-24 马悦 一种用于在衬底上沉积金属的设备
WO2016075828A1 (fr) * 2014-11-14 2016-05-19 合同会社ナポレ企画 Procédé de traitement électrolytique de surface pour éléments d'accessoire vestimentaire, accessoires vestimentaires, et leur procédé de production
TW201731007A (zh) * 2016-02-19 2017-09-01 斯庫林集團股份有限公司 鍍覆裝置及鍍覆方法
CN110475913A (zh) * 2017-04-14 2019-11-19 Ykk株式会社 电镀方法和装置
CN208328162U (zh) * 2018-04-14 2019-01-04 江阴道达汽车饰件有限公司 一种带有清污装置的电镀槽
CN108977871A (zh) * 2018-08-28 2018-12-11 杨胜 一种锌镀层电镀系统
WO2021130873A1 (fr) * 2019-12-24 2021-07-01 Ykk株式会社 Système de placage électrolytique
CN114761624A (zh) * 2019-12-24 2022-07-15 Ykk株式会社 电镀装置和镀覆物的制造方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
RAJESH LUHARUKADENG: "Design of fully compliant, in-plane rotary, bistable micromechanisms for MEMS applications", 《SENSORS AND ACTUATORS A》, vol. 134, no. 2007, 2 June 2006 (2006-06-02), pages 231 *
赵晓明;轧钢;: "片式引线框架镀银设备的研制", 电子工艺技术, no. 04, 18 July 2008 (2008-07-18), pages 208 - 211 *

Also Published As

Publication number Publication date
JPWO2021130873A1 (fr) 2021-07-01
WO2021130873A1 (fr) 2021-07-01
CN114746585B (zh) 2024-06-25
JP7196337B2 (ja) 2022-12-26

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