CN114730980B - 高频线路结构、子组件、线路卡、以及高频线路结构的制造方法 - Google Patents

高频线路结构、子组件、线路卡、以及高频线路结构的制造方法 Download PDF

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Publication number
CN114730980B
CN114730980B CN201980102186.2A CN201980102186A CN114730980B CN 114730980 B CN114730980 B CN 114730980B CN 201980102186 A CN201980102186 A CN 201980102186A CN 114730980 B CN114730980 B CN 114730980B
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China
Prior art keywords
frame
frequency
signal
frequency wiring
ground
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CN201980102186.2A
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English (en)
Chinese (zh)
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CN114730980A (zh
Inventor
田野边博正
尾崎常祐
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Entiti Corp
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Nippon Telegraph and Telephone Corp
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Publication of CN114730980A publication Critical patent/CN114730980A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Waveguide Connection Structure (AREA)
CN201980102186.2A 2019-11-13 2019-11-13 高频线路结构、子组件、线路卡、以及高频线路结构的制造方法 Active CN114730980B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/044530 WO2021095163A1 (ja) 2019-11-13 2019-11-13 高周波線路構造、サブアセンブリ、ラインカード、および高周波線路構造の製造方法

Publications (2)

Publication Number Publication Date
CN114730980A CN114730980A (zh) 2022-07-08
CN114730980B true CN114730980B (zh) 2024-03-19

Family

ID=75912064

Family Applications (1)

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CN201980102186.2A Active CN114730980B (zh) 2019-11-13 2019-11-13 高频线路结构、子组件、线路卡、以及高频线路结构的制造方法

Country Status (6)

Country Link
US (1) US12407074B2 (https=)
EP (1) EP4060804B1 (https=)
JP (1) JP7255705B2 (https=)
CN (1) CN114730980B (https=)
CA (1) CA3160512C (https=)
WO (1) WO2021095163A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53125054U (https=) * 1977-03-14 1978-10-04
JPS5636176A (en) * 1979-09-03 1981-04-09 Hitachi Cable Ltd Light emission diode drive circuit
JPS58141464A (ja) * 1982-08-27 1983-08-22 Sanyo Electric Co Ltd テ−プ装架機構
JPS6171969A (ja) * 1984-09-13 1986-04-12 Okuma Mach Works Ltd 旋回式修正工具付き数値制御研削盤
JPS61259467A (ja) * 1985-05-13 1986-11-17 富士通株式会社 ジヤンパ−チツプ
CN101841107A (zh) * 2008-09-29 2010-09-22 安费诺公司 具改良的阻抗控制及高频特性的接地套管
CN109417054A (zh) * 2016-06-27 2019-03-01 Ngk电子器件株式会社 高频用陶瓷基板及高频用半导体元件收纳封装体
CN208820680U (zh) * 2018-09-06 2019-05-03 武汉市华天电力自动化有限责任公司 一种上电抗冲击装置以及直流高压发生器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636176U (https=) * 1979-08-29 1981-04-07
JPS6171969U (https=) * 1984-10-17 1986-05-16
JPH08222657A (ja) * 1995-02-17 1996-08-30 Hitachi Ltd 半導体集積回路装置
JP5263286B2 (ja) * 2008-03-11 2013-08-14 富士通オプティカルコンポーネンツ株式会社 接続装置および光デバイス
JP2012151365A (ja) * 2011-01-20 2012-08-09 Three M Innovative Properties Co 基板及びそれを含む電子部品
JP2013012967A (ja) * 2011-06-30 2013-01-17 Hitachi Ltd プリント基板伝送系
JP6122380B2 (ja) 2013-11-26 2017-04-26 日本電信電話株式会社 光モジュール
US9754864B1 (en) * 2016-06-23 2017-09-05 Alpha And Omega Semiconductor Incorporated Semiconductor power device having single in-line lead module and method of making the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53125054U (https=) * 1977-03-14 1978-10-04
JPS5636176A (en) * 1979-09-03 1981-04-09 Hitachi Cable Ltd Light emission diode drive circuit
JPS58141464A (ja) * 1982-08-27 1983-08-22 Sanyo Electric Co Ltd テ−プ装架機構
JPS6171969A (ja) * 1984-09-13 1986-04-12 Okuma Mach Works Ltd 旋回式修正工具付き数値制御研削盤
JPS61259467A (ja) * 1985-05-13 1986-11-17 富士通株式会社 ジヤンパ−チツプ
CN101841107A (zh) * 2008-09-29 2010-09-22 安费诺公司 具改良的阻抗控制及高频特性的接地套管
CN109417054A (zh) * 2016-06-27 2019-03-01 Ngk电子器件株式会社 高频用陶瓷基板及高频用半导体元件收纳封装体
CN208820680U (zh) * 2018-09-06 2019-05-03 武汉市华天电力自动化有限责任公司 一种上电抗冲击装置以及直流高压发生器

Also Published As

Publication number Publication date
EP4060804B1 (en) 2024-08-21
US20220399624A1 (en) 2022-12-15
CA3160512C (en) 2024-06-11
EP4060804A1 (en) 2022-09-21
CN114730980A (zh) 2022-07-08
CA3160512A1 (en) 2021-05-20
WO2021095163A1 (ja) 2021-05-20
EP4060804A4 (en) 2023-08-09
JP7255705B2 (ja) 2023-04-11
US12407074B2 (en) 2025-09-02
JPWO2021095163A1 (https=) 2021-05-20

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Address after: Tokyo, Japan

Patentee after: Entiti Corp.

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Patentee before: NIPPON TELEGRAPH AND TELEPHONE Corp.

Country or region before: Japan

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