CA3160512C - High-frequency line structure, subassembly, line card, and method for manufacturing high-frequency line structure - Google Patents

High-frequency line structure, subassembly, line card, and method for manufacturing high-frequency line structure Download PDF

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Publication number
CA3160512C
CA3160512C CA3160512A CA3160512A CA3160512C CA 3160512 C CA3160512 C CA 3160512C CA 3160512 A CA3160512 A CA 3160512A CA 3160512 A CA3160512 A CA 3160512A CA 3160512 C CA3160512 C CA 3160512C
Authority
CA
Canada
Prior art keywords
frequency line
lines
signal
lead frame
lead pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA3160512A
Other languages
English (en)
French (fr)
Other versions
CA3160512A1 (en
Inventor
Hiromasa Tanobe
Josuke OZAKI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Publication of CA3160512A1 publication Critical patent/CA3160512A1/en
Application granted granted Critical
Publication of CA3160512C publication Critical patent/CA3160512C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Waveguide Connection Structure (AREA)
CA3160512A 2019-11-13 2019-11-13 High-frequency line structure, subassembly, line card, and method for manufacturing high-frequency line structure Active CA3160512C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/044530 WO2021095163A1 (ja) 2019-11-13 2019-11-13 高周波線路構造、サブアセンブリ、ラインカード、および高周波線路構造の製造方法

Publications (2)

Publication Number Publication Date
CA3160512A1 CA3160512A1 (en) 2021-05-20
CA3160512C true CA3160512C (en) 2024-06-11

Family

ID=75912064

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3160512A Active CA3160512C (en) 2019-11-13 2019-11-13 High-frequency line structure, subassembly, line card, and method for manufacturing high-frequency line structure

Country Status (6)

Country Link
US (1) US12407074B2 (https=)
EP (1) EP4060804B1 (https=)
JP (1) JP7255705B2 (https=)
CN (1) CN114730980B (https=)
CA (1) CA3160512C (https=)
WO (1) WO2021095163A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5938058Y2 (ja) * 1977-03-14 1984-10-22 富士通株式会社 配線フイルム
JPS5636176U (https=) * 1979-08-29 1981-04-07
JPS5636176A (en) * 1979-09-03 1981-04-09 Hitachi Cable Ltd Light emission diode drive circuit
JPS58141464A (ja) 1982-08-27 1983-08-22 Sanyo Electric Co Ltd テ−プ装架機構
JPS6171969A (ja) * 1984-09-13 1986-04-12 Okuma Mach Works Ltd 旋回式修正工具付き数値制御研削盤
JPS6171969U (https=) * 1984-10-17 1986-05-16
JPS61259467A (ja) * 1985-05-13 1986-11-17 富士通株式会社 ジヤンパ−チツプ
JPH08222657A (ja) * 1995-02-17 1996-08-30 Hitachi Ltd 半導体集積回路装置
JP5263286B2 (ja) * 2008-03-11 2013-08-14 富士通オプティカルコンポーネンツ株式会社 接続装置および光デバイス
US7906730B2 (en) * 2008-09-29 2011-03-15 Amphenol Corporation Ground sleeve having improved impedance control and high frequency performance
JP2012151365A (ja) * 2011-01-20 2012-08-09 Three M Innovative Properties Co 基板及びそれを含む電子部品
JP2013012967A (ja) * 2011-06-30 2013-01-17 Hitachi Ltd プリント基板伝送系
JP6122380B2 (ja) 2013-11-26 2017-04-26 日本電信電話株式会社 光モジュール
US9754864B1 (en) * 2016-06-23 2017-09-05 Alpha And Omega Semiconductor Incorporated Semiconductor power device having single in-line lead module and method of making the same
EP3477693A4 (en) * 2016-06-27 2019-06-12 NGK Electronics Devices, Inc. HIGH FREQUENCY CERAMIC SUBSTRATE AND HIGH FREQUENCY SEMICONDUCTOR ELEMENTS
CN208820680U (zh) * 2018-09-06 2019-05-03 武汉市华天电力自动化有限责任公司 一种上电抗冲击装置以及直流高压发生器

Also Published As

Publication number Publication date
CN114730980B (zh) 2024-03-19
EP4060804B1 (en) 2024-08-21
US20220399624A1 (en) 2022-12-15
EP4060804A1 (en) 2022-09-21
CN114730980A (zh) 2022-07-08
CA3160512A1 (en) 2021-05-20
WO2021095163A1 (ja) 2021-05-20
EP4060804A4 (en) 2023-08-09
JP7255705B2 (ja) 2023-04-11
US12407074B2 (en) 2025-09-02
JPWO2021095163A1 (https=) 2021-05-20

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