CN114695188A - Substrate processing apparatus, cleaning unit, and multi-valve cleaning method - Google Patents

Substrate processing apparatus, cleaning unit, and multi-valve cleaning method Download PDF

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Publication number
CN114695188A
CN114695188A CN202111586967.9A CN202111586967A CN114695188A CN 114695188 A CN114695188 A CN 114695188A CN 202111586967 A CN202111586967 A CN 202111586967A CN 114695188 A CN114695188 A CN 114695188A
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China
Prior art keywords
valve
cleaning
substrate
supply
tank
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Pending
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CN202111586967.9A
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Chinese (zh)
Inventor
胁田明日香
野村高幸
藤原友则
小路丸友则
东克荣
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication of CN114695188A publication Critical patent/CN114695188A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention provides a substrate processing apparatus, a cleaning unit and a multi-valve cleaning method for effectively cleaning a multi-valve. The substrate processing apparatus includes: a tank for supplying a chemical liquid; a multiple valve capable of selectively supplying a plurality of treatment liquids; and a processing liquid nozzle that processes the substrate using the processing liquid supplied from the multiple valve, and that is switchable between a substrate processing mode for processing the substrate and a cleaning mode for cleaning at least the multiple valve, wherein in the cleaning mode, the chemical liquid is supplied from the tank to the multiple valve in a cleaning path that is a path that passes through the tank and the multiple valve without passing through the processing liquid nozzle.

Description

Substrate processing apparatus, cleaning unit, and multi-valve cleaning method
Technical Field
The technology disclosed in the present specification relates to a substrate processing technology. Examples of the substrate to be processed include a semiconductor wafer, a glass substrate for a liquid crystal display device, a substrate for Flat Panel Display (FPD) such as an organic el (electroluminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a glass substrate for a photomask, a ceramic substrate, a substrate for Field Emission Display (FED), a substrate for a solar cell, and the like.
Background
In a substrate processing apparatus, a plurality of processing liquids are used for processing a substrate, and therefore, there is a case where a multiple valve unit capable of selectively supplying one of the plurality of processing liquids is provided (for example, see patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2019-012791
Disclosure of Invention
Problems to be solved by the invention
The multi-valve is configured to supply the processing liquid from each of a plurality of pipes connected to the upstream side, and is a portion where the pipes are connected together, so that dirt is likely to accumulate. On the other hand, since the structure is complicated, there is a problem that cleaning is easy and insufficient.
The technology disclosed in the present specification is made in view of the above-described problems, and is a technology for efficiently cleaning a multi-valve.
Means for solving the problems
In accordance with claim 1 of the technology disclosed in the present specification, there is provided a substrate processing apparatus comprising: a tank for supplying a chemical liquid; a multiple valve to which a plurality of kinds of processing liquids for processing a substrate are supplied and which can selectively supply at least one of the plurality of kinds of processing liquids; and a processing liquid nozzle configured to process the substrate using the processing liquid supplied from the multi-valve, and configured to be switchable between a substrate processing mode for processing the substrate and a cleaning mode for cleaning at least the multi-valve, wherein in the substrate processing mode, the substrate is processed by the processing liquid supplied to the processing liquid nozzle, and in the cleaning mode, the chemical liquid is supplied from the tank to the multi-valve in a cleaning path that is a path that passes through the tank and the multi-valve without passing through the processing liquid nozzle.
The substrate processing apparatus according to claim 2 of the present application relates to the substrate processing apparatus according to claim 1, and the chemical solution is one of a plurality of types of the processing solutions.
A substrate processing apparatus according to claim 3 of the present application discloses the substrate processing apparatus according to claim 1 or 2, further comprising, at a position downstream of the tank and upstream of the multiple valve in the cleaning path: a plurality of supply pipes to which the chemical liquid is supplied; and at least one connection pipe connected to the plurality of supply pipes so as to straddle the supply pipes.
A substrate processing apparatus according to claim 4 of the present invention is the substrate processing apparatus according to claim 3, wherein the connection pipe is accommodated in a tank housing the multiple valve.
The substrate processing apparatus according to claim 5 of the present application relates to the substrate processing apparatus according to claim 3 or 4, wherein the connection pipe is accommodated in a housing that accommodates the tank and the multiple valve.
A substrate processing apparatus according to claim 6 of the present application relates to the substrate processing apparatus according to any one of claims 1 to 5, wherein the multiple valve includes a plurality of selector valves for opening and closing each of the plurality of supply pipes, and at least one of the plurality of supply pipes is opened and closed by the corresponding selector valve in the cleaning mode.
A substrate processing apparatus according to claim 7 of the present application relates to any one of claims 1 to 6, and in the cleaning mode, the chemical solution circulates through the cleaning path.
A substrate processing apparatus according to claim 8 of the technology disclosed in the present specification relates to the substrate processing apparatus according to claim 7, and further includes: a rinse liquid supply source for supplying a rinse liquid; and a suction unit configured to suck the interior of the multiple valve, wherein in the cleaning mode, after circulation of the chemical liquid in the cleaning path, the rinse liquid is supplied to the multiple valve, and the interior of the multiple valve is further sucked by the suction unit.
A substrate processing apparatus according to claim 9 of the technology disclosed in the present specification relates to the substrate processing apparatus according to claim 8, and in the cleaning mode, the circulation of the chemical solution in the cleaning path, the supply of the rinse solution after the circulation of the chemical solution, and the suction in the multi-valve after the supply of the rinse solution are repeated a plurality of times.
A substrate processing apparatus according to claim 10 of the present application relates to any one of claims 1 to 7, and the supply pressure of the chemical solution is varied in the cleaning mode.
Claim 11 of the technology disclosed in the present specification is a cleaning unit including: a tank for supplying a chemical liquid; and a cleaning pipe that forms a cleaning path for cleaning at least a multi-valve to which a plurality of types of processing liquids are supplied and to which at least one of the plurality of types of processing liquids is selectively supplied, the cleaning path being configured to pass through the tank, the multi-valve being cleaned by the chemical liquid supplied from the tank in the cleaning path, the cleaning pipe being detachable from the multi-valve.
A cleaning unit according to claim 12 of the technology disclosed in the present specification relates to the cleaning unit according to claim 11, and further includes, at a position downstream of the tank and upstream of the multiple valve in the cleaning path: a plurality of supply pipes to which the chemical liquid is supplied; and at least one connection pipe connected to the plurality of supply pipes so as to straddle the supply pipes.
A cleaning unit according to claim 13 of the technology disclosed in the present specification relates to the cleaning unit according to claim 12, wherein the multiple valve includes a plurality of selector valves for opening and closing each of the plurality of supply pipes,
at least one of the plurality of supply pipes is opened and closed by the corresponding selector valve.
The cleaning unit according to claim 14 of the technology disclosed in the present specification relates to any one of claims 11 to 13, and the chemical solution circulates through the cleaning path.
The cleaning unit according to claim 15 of the technology disclosed in the present specification relates to the cleaning unit according to any one of claims 11 to 14, and further includes: a rinse liquid supply source for supplying a rinse liquid; and a suction unit configured to suck the interior of the multiple valve, wherein the flushing liquid is supplied to the multiple valve after the circulation of the chemical liquid in the cleaning path, and the interior of the multiple valve is further sucked by the suction unit.
A cleaning unit according to claim 16 of the technology disclosed in the present specification relates to the cleaning unit according to claim 15, and the circulation of the chemical solution in the cleaning path, the supply of the rinse solution after the circulation of the chemical solution, and the suction of the interior of the multi-valve after the supply of the rinse solution are repeated a plurality of times.
A solution 17 of the technology disclosed in the present specification is a multiple valve cleaning method for cleaning a multiple valve connected to a substrate processing apparatus in a state in which a plurality of processing liquids for processing a substrate are supplied and at least one of the plurality of processing liquids can be selectively supplied, the substrate processing apparatus including: a tank for supplying a chemical liquid; and a processing liquid nozzle for processing the substrate using the processing liquid supplied from the multi-valve, wherein the substrate processing apparatus is switchable between a substrate processing mode for processing the substrate and a cleaning mode for cleaning at least the multi-valve, wherein in the substrate processing mode, the substrate is processed by the processing liquid supplied to the processing liquid nozzle, in the cleaning mode, the chemical liquid is supplied from the tank to the multi-valve in a cleaning path which is a path passing through the tank and the multi-valve without passing through the processing liquid nozzle, and in the cleaning mode, the processing liquid nozzle includes a step of cleaning the multi-valve.
Effects of the invention
According to at least aspects 1, 11, and 17 of the technology disclosed in the present specification, the multi-valve can be efficiently cleaned by supplying the chemical solution to the cleaning path not via the treatment solution nozzle.
Further, objects, features, aspects and advantages related to the technology disclosed in the present specification will be further clarified by the detailed description and the accompanying drawings shown below.
Drawings
Fig. 1 is a plan view schematically showing an example of the structure of a substrate processing apparatus according to the embodiment.
Fig. 2 is a diagram showing an example of the configuration of the control unit illustrated in fig. 1.
Fig. 3 is a diagram showing an example of a structure of the substrate processing apparatus according to the embodiment, which is connected to each processing unit via a pipe.
Fig. 4 is a diagram showing an example of the configuration of the processing unit.
Fig. 5 is a modification example showing a structure of connection to each processing unit via a pipe in the configuration of the substrate processing apparatus according to the embodiment.
Fig. 6 is a diagram showing another modification of the structure of the substrate processing apparatus according to the embodiment, which is connected to each processing unit via a pipe.
Fig. 7 is a diagram showing an example of the configuration of a housing configured to accommodate a detached multiple valve in a cleaning mode.
Fig. 8 is a diagram showing an example of the structure of the cleaning unit configured to accommodate the multiple valve.
In the figure:
1. 1A, 1B-substrate processing apparatus, 10-spin chuck, 10A-spin base, 10C-spin shaft, 10D-spin motor, 12-processing cup, 20-processing liquid nozzle, 22-nozzle arm, 22A-arm, 22B-shaft, 22C-actuator, 30, 40, 50, 330-housing, 32, 42, 52, 82, 232, 332-liquid tank, 34, 44, 54, 81, 83, 84, 85, 234, 331, 333, 334, 335-valve, 36, 46, 56, 86, 236, 336-pump, 38, 48, 58, 88, 238, 338-filter, 39, 49, 59, 61, 71, 100, 239, 339, 404, 406, 408, 410, 414, 502, 506, 508, 510, 512-supply pipe, 60, 70, 160, 170, 260, 270-fluid tank, 62A, 62B, 62C, 62D, 67, 72A, 72B, 72C, 72D, 162A, 162B, 77 a, 162B, 77, 162B, and the like, 162C, 240, 241-supply valve, 64E, 64F, 64G, 74E, 74F, 74G, 164E, 164F, 164G, 412, 504-connection pipe, 65, 75, 87, 89, 337-open valve, 66E, 66F, 66G, 76E, 76F, 76G, 166E, 166F, 166G-connection valve, 68, 78-multiple valve, 68A, 78A-connection portion, 68B, 68C, 68D, 68E, 68F, 78B, 78C, 78D, 78E, 78F-selection valve, 69, 79-drain valve, 80-cleaning unit, 90-control portion, 91-CPU, 92-ROM, 93-94-storage device, 94P-processing program, 95-bus, 96-input portion, 97-display portion, 98-communication portion, 180-chamber, 230-cleaning housing, RAM, 272, 262-272-circulation valve, 264, 274, 402-circulation valve, 514-circulation pipe, 340-circulation pipe, 516-circulation pipe, 600. 600A, 600B-process unit, 601-load port, 602-indexing robot, 603-central robot, 604-substrate placement unit.
Detailed Description
Hereinafter, embodiments will be described with reference to the drawings. In the following embodiments, detailed features and the like are shown for technical explanation, but these are merely examples, and not all features are necessary for enabling the implementation of the embodiments.
Note that the drawings are schematically illustrated, and the structures are omitted or simplified as appropriate in the drawings for the convenience of description. In addition, the mutual relationship between the size and the position of the structures and the like shown in the different drawings is not always described accurately, and may be appropriately changed. In addition, in some drawings such as a plan view, which is not a cross-sectional view, hatching may be added to facilitate understanding of the contents of the embodiments.
In the following description, the same components are denoted by the same reference numerals and the same names and functions are given to the same components. Therefore, detailed descriptions thereof may be omitted to avoid redundancy.
In the description of the present application, when a certain structural element is described as being "provided", "included", or "having", unless otherwise specified, it is not an exclusive expression that excludes the presence of other structural elements.
In the description of the present application, even if ordinal numbers such as "first" and "second" are used in some cases, the terms are used for convenience of understanding the contents of the embodiments, and are not limited to the order in which the ordinal numbers may be generated.
In the description of the present application, even if terms indicating specific positions or directions such as "up", "down", "left", "right", "side", "bottom", "front" and "back" are used in some cases, these terms are used for convenience of understanding the contents of the embodiments and are not related to the positions or directions in actual implementation.
In the description of the present application, when the description is given as "the upper surface of …" or "the lower surface of …", etc., the description includes a state in which another component is formed on the upper surface or the lower surface of the target component in addition to the upper surface itself or the lower surface itself of the target component. That is, for example, in the case of "b provided on the upper surface of a", it does not prevent another component "c" from being interposed between a and b.
< embodiment >
The substrate processing apparatus and the cleaning unit according to the present embodiment will be described below.
< Structure relating to substrate processing apparatus >
Fig. 1 is a plan view schematically showing an example of the structure of a substrate processing apparatus 1 according to the present embodiment. The substrate processing apparatus 1 includes a load port 601, an index robot 602, a central robot 603, a control unit 90, and at least one processing unit 600 (four processing units in fig. 1).
The processing unit 600 is a single-wafer type device that can be used for substrate processing, and specifically, is a device that performs processing for removing organic substances adhering to the substrate W. The organic material adhering to the substrate W is, for example, a resist film after use. The resist film is used as an implantation mask for an ion implantation process, for example.
In addition, the process unit 600 can have a chamber 180. In this case, the processing unit 600 can perform substrate processing in a desired atmosphere by controlling the atmosphere in the chamber 180 by the control unit 90.
The control unit 90 can control the operations of the respective components of the substrate processing apparatus 1. The carrier C is a container that contains the substrate W. The load port 601 is a container holding mechanism that holds a plurality of carriers C. The index robot 602 can transfer the substrate W between the load port 601 and the substrate mounting portion 604. The central robot 603 can transfer the substrate W between the substrate mounting unit 604 and the processing unit 600.
With the above configuration, the index robot 602, the substrate loading unit 604, and the central robot 603 function as a transfer mechanism for transferring the substrate W between each processing unit 600 and the load port 601.
The unprocessed substrate W is taken out of the carrier C by the index robot 602. Then, the unprocessed substrate W is delivered to the central robot 603 via the substrate placing unit 604.
The central robot 603 carries the unprocessed substrate W into the processing unit 600. Then, the processing unit 600 processes the substrate W.
The substrate W processed in the processing unit 600 is taken out of the processing unit 600 by the central robot 603. The processed substrate W is transferred to the index robot 602 via the substrate placement unit 604 after passing through another processing unit 600 as necessary. The index robot 602 carries the processed substrate W into the carrier C. As described above, the substrate W is processed.
Fig. 2 is a diagram showing an example of the configuration of the control unit 90 illustrated in fig. 1. The control unit 90 may be constituted by a general computer having an electric circuit. Specifically, the control unit 90 includes a Central Processing Unit (CPU) 91, a Read Only Memory (ROM) 92, a Random Access Memory (RAM) 93, a storage device 94, an input unit 96, a display unit 97, a communication unit 98, and a bus 95 connecting these units.
The ROM92 stores basic programs. The RAM93 is used as a work area when the CPU91 performs predetermined processing. The storage device 94 is a nonvolatile storage device such as a flash memory or a hard disk drive. The input unit 96 is configured by various switches, a touch panel, and the like, and receives an input setting instruction such as a process recipe from a user. The display unit 97 is constituted by, for example, a liquid crystal display device, a lamp, and the like, and displays various information under the control of the CPU 91. The communication unit 98 has a data communication function via a Local Area Network (LAN) or the like.
A plurality of modes relating to control of the respective configurations of the substrate processing apparatus 1 of fig. 1 are set in advance in the storage device 94. By the CPU91 executing the processing program 94P, one of the above-described modes is selected, and each configuration is controlled in that mode. The processing program 94P may be stored in an external storage medium. By using this storage medium, the processing program 94P can be installed in the control unit 90. Note that a part or all of the functions executed by the control unit 90 need not necessarily be implemented by software, and may be implemented by hardware such as a dedicated logic circuit.
Fig. 3 is a diagram showing an example of a structure of the substrate processing apparatus 1 according to the present embodiment, which is connected to each processing unit 600 via a pipe.
As illustrated in fig. 3, the substrate processing apparatus 1 includes a casing 30, a casing 40, a casing 50, a fluid tank 60, a fluid tank 70, a processing unit 600A, and a processing unit 600B. Further, the number of housings is not limited to the number shown in fig. 3. In addition, one fluid tank may be provided for one processing unit. In addition, the process units 600A and 600B are equivalent to the process unit 600 shown in fig. 1.
The housing 30 includes a liquid medicine tank 32, a valve 34, a pump 36, and a filter 38. The chemical solution (e.g., H) for processing the substrate W is stored in the chemical solution tank 322O2、NH4OH、O3Or organic solvent such as IPA), a chemical used for cleaning a multi-valve described later, or a chemical used for both of them. The valve 34, the pump 36, and the filter 38 are provided in a supply pipe 39 as a pipe connected to the chemical liquid tank 32.
In a state where the valve 34 whose opening and closing are adjusted by the control of the control unit 90 is opened, the chemical liquid stored in the chemical liquid tank 32 passes through the filter 38 and flows through the supply pipe 39 by the pump 36 which operates similarly by the control of the control unit 90, flows into the downstream tank 60, and further flows into the processing unit 600A and the like.
The housing 40 includes a liquid medicine tank 42, a valve 44, a pump 46, and a filter 48. The chemical liquid tank 42 stores a chemical liquid used for processing the substrate W, a chemical liquid used for cleaning a multi-valve described later, or a chemical liquid used for both of them. The valve 44, the pump 46, and the filter 48 are provided in a supply pipe 49 serving as a pipe connected to the chemical liquid tank 42.
In a state where the valve 44 whose opening and closing are adjusted by the control of the control unit 90 is opened, the chemical liquid stored in the chemical liquid tank 42 passes through the filter 48, flows through the supply pipe 49, flows into the downstream tank 60, and further flows into the processing unit 600A and the like by the pump 46 which operates similarly by the control of the control unit 90.
The housing 50 includes a liquid medicine tank 52, a valve 54, a pump 56, and a filter 58. The chemical solution tank 52 stores a chemical solution used for processing the substrate W, a chemical solution used for cleaning a multi-valve described later, or a chemical solution used for both of them. The valve 54, the pump 56, and the filter 58 are provided in a supply pipe 59 as a pipe connected to the chemical liquid tank 52.
In a state where the valve 54 whose opening and closing are adjusted by the control of the control unit 90 is opened, the chemical liquid stored in the chemical liquid tank 52 passes through the filter 58, flows through the supply pipe 59, flows into the downstream tank 60, and further flows into the processing unit 600A and the like by the pump 56 which operates similarly by the control of the control unit 90.
Further, deionized water as the rinse liquid supplied from the deionized water supply source also flows through the supply pipe 100 connected to the deionized water supply source, flows into the downstream tank 60, and further flows into the processing unit 600A and the like.
The supply pipe 39 is also connected to a tank (for example, the tank 70 or another tank not shown) other than the tank 60, and allows the liquid medicine in the liquid medicine tank 32 to flow to each tank.
The supply pipe 49 is also connected to a fluid tank (for example, the fluid tank 70 or another fluid tank not shown) other than the fluid tank 60, and allows the drug in the drug solution tank 42 to flow to each fluid tank.
The supply pipe 59 is also connected to a fluid tank (for example, the fluid tank 70 or another fluid tank not shown) other than the fluid tank 60, and causes the liquid medicine in the liquid medicine tank 52 to flow to each fluid tank.
The supply pipe 100 is also connected to a fluid tank (for example, the fluid tank 70 or another fluid tank not shown) other than the fluid tank 60, and pure water as a rinse liquid is flowed to each fluid tank.
The fluid tank 60 includes a supply valve 62A, a supply valve 62B, a supply valve 62C, a supply valve 62D, a connection pipe 64E, a connection pipe 64F, a connection pipe 64G, a connection valve 66E, a connection valve 66F, a connection valve 66G, a multiple valve 68, an opening valve 65, a supply valve 67, and a drain valve 69.
The supply valves 62A, 62B, 62C, and 62D are valves provided in respective pipes (for example, the supply pipe 39, the supply pipe 49, the supply pipe 59, and the supply pipe 100) connected from the upstream side.
The connection pipe 64E is a pipe that spans between the pipe provided with the supply valve 62A and the pipe provided with the supply valve 62B downstream of the supply valves 62A and 62B.
The connection pipe 64F is a pipe that spans between the pipe provided with the supply valve 62B and the pipe provided with the supply valve 62C downstream of the supply valves 62B and 62C.
The connection pipe 64G is a pipe that spans between the pipe provided with the supply valve 62C and the pipe provided with the supply valve 62D downstream of the supply valves 62C and 62D.
The connection valve 66E is a valve provided in the connection pipe 64E. The connection valve 66F is a valve provided in the connection pipe 64F. The connection valve 66G is a valve provided in the connection pipe 64G.
The multi-valve 68 is a valve as follows: the plurality of pipes are connected to the supply valves 62A, 62B, 62C, and 62D, respectively, and at least one of the plurality of pipes can be selected to flow to the downstream supply pipe 61.
The opening valve 65 is a valve as follows: and a pipe provided downstream of the connection valve and branching upstream of the multi-valve 68 in any of the pipes provided with the supply valves. The opening valve 65 is a valve for introducing air or an inert gas (e.g., nitrogen gas) into the pipe or sucking the inside of the pipe (i.e., exhausting the inside of the pipe).
The supply valve 67 is a valve provided in the supply pipe 61 downstream of the multi-valve 68. The processing liquid supplied from the multi-valve 68 is supplied to the processing unit 600A with the supply valve 67 opened by the control of the control unit 90.
The drain valve 69 is a valve provided in the supply pipe 61 downstream of the multiple valve 68 and branching off upstream of the supply valve 67. The drain valve 69 is a valve for discharging the processing liquid in the pipe.
Here, the treatment liquid is not limited to the chemical liquid stored in the chemical liquid tank 32, the chemical liquid tank 42, and the chemical liquid tank 52, and may include a rinse liquid such as deionized water (DIW), or a mixture thereof.
The fluid tank 70 includes a supply valve 72A, a supply valve 72B, a supply valve 72C, a supply valve 72D, a connection pipe 74E, a connection pipe 74F, a connection pipe 74G, a connection valve 76E, a connection valve 76F, a connection valve 76G, a multiple valve 78, an opening valve 75, a supply valve 77, and a drain valve 79.
The supply valves 72A, 72B, 72C, and 72D are valves provided in respective pipes connected from the upstream side.
The connection pipe 74E is a pipe that spans between the pipe provided with the supply valve 72A and the pipe provided with the supply valve 72B downstream of the supply valves 72A and 72B.
The connection pipe 74F is a pipe that spans between the pipe provided with the supply valve 72B and the pipe provided with the supply valve 72C downstream of the supply valves 72B and 72C.
The connection pipe 74G is a pipe that spans between the pipe provided with the supply valve 72C and the pipe provided with the supply valve 72D downstream of the supply valves 72C and 72D.
The connection valve 76E is a valve provided in the connection pipe 74E. The connection valve 76F is a valve provided in the connection pipe 74F. The connection valve 76G is a valve provided in the connection pipe 74G.
The multi-valve 78 is a valve as follows: the plurality of pipes are connected to the supply valves 72A, 72B, 72C, and 72D, respectively, and at least one of the plurality of pipes can be selected to flow to the downstream supply pipe 71.
The opening valve 75 is a valve provided in a pipe branching off downstream of the connection valve and upstream of the multi-valve 78 in any of the pipes provided with the supply valves. The open valve 75 is a valve for introducing air or an inert gas (e.g., nitrogen gas) into the pipe or sucking the inside of the pipe.
The supply valve 77 is a valve provided in the supply pipe 71 downstream of the multiple valve 78. The processing liquid supplied from the multi-valve 78 is supplied to the processing unit 600B with the supply valve 77 opened by the control of the control unit 90.
The drain valve 79 is a valve provided in a pipe branching off downstream of the multiple valve 78 and upstream of the supply valve 77 in the supply pipe 71. The drain valve 79 is a valve for discharging the processing liquid in the pipe.
The multi-valve 68 includes: a connection portion 68A connected to a plurality of pipes (for example, the supply pipe 39, the supply pipe 49, the supply pipe 59, and the supply pipe 100) connected from the upstream side in a straddling manner; a selector valve 68B, a selector valve 68C, a selector valve 68D, and a selector valve 68E provided on the upstream side of the connection portion 68A for each of the plurality of pipes; and a selector valve 68F provided on the supply pipe 61 connected to the connection portion 68A on the downstream side of the connection portion 68A.
In a state where the selector valve 68F and at least one of the selector valve 68B, the selector valve 68C, the selector valve 68D, and the selector valve 68E in the multiple valve 68 are open, the processing liquid supplied from the upstream side is supplied to the processing unit 600A via the multiple valve 68.
The multi-valve 78 includes: a connection portion 78A connected to a plurality of pipes connected from the upstream side in a straddling manner; a selector valve 78B, a selector valve 78C, a selector valve 78D, and a selector valve 78E provided on the upstream side of the connection portion 78A for each of the plurality of pipes; and a selector valve 78F provided on the supply pipe 71 connected to the connection portion 78A on the downstream side of the connection portion 78A.
In a state where the selector valve 78F and at least one of the selector valve 78B, the selector valve 78C, the selector valve 78D, and the selector valve 78E in the multiple valve 78 are open, the processing liquid supplied from the upstream side is supplied to the processing unit 600B via the multiple valve 78. Here, when the multiple valve 68 is disposed such that a plurality of selector valves (i.e., the selector valve 68B, the selector valve 68C, the selector valve 68D, and the selector valve 68E) are arranged in parallel in the vertical direction, it is preferable to supply deionized water (DIW) from a deionized water supply source to the selector valve 68E.
The controller 90 controls the opening and closing of the valves and the output of the pump in the respective housings, thereby supplying the processing liquid to the fluid tank. Then, the control unit 90 controls the opening and closing of the valves in the fluid tank and the opening and closing of the valves provided in the multi-valve 68 to adjust the flow rates of the processing liquids supplied to the multi-valve 68, thereby supplying the processing liquids to the corresponding processing units 600.
< about processing Unit >
Fig. 4 is a diagram showing an example of the configuration of the processing unit 600. As illustrated in fig. 4, the processing unit 600 includes: a spin chuck 10 that rotates the substrate W about a vertical rotation axis Z1 passing through the center of the substrate W while holding one substrate W in a substantially horizontal posture; a treatment liquid nozzle 20 for discharging a treatment liquid toward the substrate W; a nozzle arm 22 having the treatment liquid nozzle 20 attached to an end thereof; and a cylindrical processing cup 12 surrounding the spin chuck 10 around the rotation axis Z1 of the substrate W.
When a plurality of treatment liquids are assumed, a plurality of treatment liquid nozzles 20 may be provided corresponding to each treatment liquid. The treatment liquid nozzle 20 discharges the treatment liquid onto the upper surface of the substrate W.
The spin chuck 10 includes: a disk-shaped spin base 10A for vacuum-sucking the lower surface of a substrate W in a substantially horizontal posture, a rotation shaft 10C extending downward from the center of the spin base 10A, and a rotation motor 10D for rotating the rotation shaft 10C to rotate the substrate W sucked on the spin base 10A. Instead of the spin chuck 10, a chuck of a clamp type may be used, which includes a plurality of chuck pins protruding upward from the outer peripheral portion of the upper surface of the spin base, and clamps the peripheral portion of the substrate W by the chuck pins.
The nozzle arm 22 includes an arm portion 22A, a shaft body 22B, and an actuator 22C. The actuator 22C adjusts the angle of the shaft body 22B around the shaft. One end of the arm 22A is fixed to the shaft body 22B, and the other end of the arm 22A is disposed away from the shaft of the shaft body 22B. The treatment liquid nozzle 20 is attached to the other end of the arm 22A. Thus, the treatment liquid nozzle 20 is configured to be swingable in the radial direction of the substrate W. The moving direction of the treatment liquid nozzle 20 due to the oscillation need only have a component in the radial direction of the substrate W, and need not be strictly parallel to the radial direction of the substrate W. Here, the nozzle arm 22 may be vertically movable up and down by a motor or the like not shown. In this case, the distance between the treatment liquid nozzle 20 attached to the end of the nozzle arm 22 and the upper surface of the substrate W can be adjusted by raising and lowering the nozzle arm 22.
The controller 90 controls the rotation speed of the rotation motor 10D and causes the processing liquid to be discharged from the processing liquid nozzle 20 onto the upper surface of the substrate W. The controller 90 controls the drive of the driver 22C to swing the treatment liquid nozzle 20 on the upper surface of the substrate W.
< action with respect to substrate processing apparatus >
Next, the operation of the substrate processing apparatus 1 according to the present embodiment will be described with reference to fig. 1 to 4.
The index robot 602 conveys the substrate W from the carrier C at the load port 601 to the substrate placing section 604. The central robot 603 transfers the substrate W from the substrate mounting portion 604 to one processing unit 600. The processing unit 600 processes the substrate W. The central robot 603 transfers the substrate W from the processing unit 600 to the substrate mounting portion 604. The index robot 602 transfers the substrate W from the substrate mounting portion 604 to the carrier C at the load port 601.
The above-described processing of the substrate W is performed in a state where the substrate processing apparatus 1 is set to the substrate processing mode. In the substrate processing mode, first, a processing liquid for processing the substrate W is supplied from at least one of the casing 30, the casing 40, the casing 50, and a supply source of the processing liquid (including pure water), not shown, under the control of the controller 90.
Then, under the control of the control unit 90, in the fluid tank (here, the fluid tank 60) corresponding to the processing unit 600 (here, the processing unit 600A) that performs the processing of the substrate W, the valve (i.e., at least one of the supply valve 62A, the supply valve 62B, the supply valve 62C, and the supply valve 62D) provided in at least one pipe through which the supplied processing liquid flows is opened, and the processing liquid is supplied to the multiple valve 68.
At this time, the connection valve 66E provided in the connection pipe 64E, the connection valve 66F provided in the connection pipe 64F, the connection valve 66G provided in the connection pipe 64G, and the opening valve 65 are closed, respectively. However, the open valve 65 introduces air or an inert gas into the pipe as necessary.
Then, the control unit 90 controls at least one of the selector valves 68B, 68C, 68D, 68E, and 68F to open and close, and supplies the processing liquid to the downstream side of the multi-valve 68 through the connection portion 68A.
Then, the supply valve 67 is opened under the control of the control unit 90, and the processing liquid is supplied to the corresponding processing unit 600A. However, in order to adjust the processing liquid used for the processing of the substrate W, the drain valve 69 discharges the processing liquid in the pipe as necessary.
On the other hand, the substrate processing apparatus 1 can be switched to a cleaning mode for cleaning the piping structure including the multi-valve 68 and the like. As will be described later, this switching is mainly performed by opening and closing a valve in the piping structure.
In the cleaning mode, first, the processing liquid for cleaning the piping structure including the multi-valve 68 is supplied from at least one of the casing 30, the casing 40, the casing 50, and a supply source of the processing liquid (including deionized water), not shown, by the control of the controller 90.
Next, under the control of the control unit 90, in the fluid tank (here, the fluid tank 60) to be cleaned, the valve (i.e., at least one of the supply valve 62A, the supply valve 62B, the supply valve 62C, and the supply valve 62D) provided in at least one pipe through which the supplied processing liquid flows is opened, and the processing liquid is supplied to the multiple valve 68.
At this time, the connection valve 66E provided in the connection pipe 64E, the connection valve 66F provided in the connection pipe 64F, and the connection valve 66G provided in the connection pipe 64G are opened. Thus, the processing liquid supplied to the fluid tank 60 can be simultaneously supplied to the selector valve 68B, the selector valve 68C, the selector valve 68D, and the selector valve 68E of the multi-valve 68.
Further, by closing at least one of the connection valve 66E, the connection valve 66F, and the connection pipe 64G, only a part of the selector valves 68B, 68C, 68D, and 68E of the multi-valve 68 can be cleaned.
The control unit 90 controls at least one of the selector valves 68B, 68C, 68D, 68E, and 68F to open and close, and supplies the processing liquid to the downstream side of the multi-valve 68 through the connection portion 68A.
Here, at least one of the selector valves 68B, 68C, 68D, and 68E located on the upstream side of the connection portion 68A may be: when a rapid change in flow velocity occurs by opening and closing operations (repeated at 2-second intervals, for example), a water hammer effect is generated that vibrates the piping due to a change in pressure in the pipe. In addition, there is cavitation in which foaming occurs due to a change in pressure in the pipe.
These phenomena can physically impact the cleaning object in the cleaning mode, and the cleaning effect can be improved.
Further, the supply valve 67 is closed and the drain valve 69 is opened under the control of the control unit 90, and the processing liquid used for cleaning the multi-valve 68 is discharged.
The treatment liquid flowing to the drain valve 69 may be circulated to a chemical liquid tank or a supply source, not shown, in which the same treatment liquid is stored. In this case, the amount of the treatment liquid used in the cleaning mode can be reduced.
In addition, the following method may be used: the cleaning in the cleaning mode as described above is performed first using the chemical solution, then the used treatment solution is changed to deionized water (DIW) for cleaning, and finally the inside of the pipe including the multi-valve 68 is sucked using the opening valve 65. Further, the following cycle may be repeated a plurality of times: after the chemical liquid is supplied, a rinse liquid (deionized water) is supplied, and then the inside of the pipe is sucked.
According to such a method, the cleaning effect can be improved by flushing the substance to be cleaned remaining in the pipe with the chemical solution and the deionized water and then sucking the chemical solution and the deionized water, which may contain the substance to be cleaned. Furthermore, according to the experimental findings of the inventors: in the case where the suction is performed after the cleaning with the chemical solution and the deionized water, the cleaning with the chemical solution and the deionized water can be performed in a shorter time (for example, 2 hours to 6 hours) than in the case where the cleaning with the chemical solution and the deionized water is performed for a longer time (for example, 24 hours) without performing the suction, and the cleaning effect is higher by performing the suction after each cleaning.
As described above, the substrate processing apparatus 1 can clean the piping structure including the multi-valve 68 in the cleaning mode. Thus, the cleaning target substance remaining in the pipe can be removed, and the substrate processing can be performed while maintaining a state of less impurities in the processing liquid in the substrate processing mode.
Here, the path formed in the cleaning mode for supplying the processing liquid is referred to as a cleaning path. In the above case, the cleaning path corresponds to the following path: from any one of the chemical liquid tanks, the liquid reaches the multiple valve in the fluid tank through the supply pipe, and further reaches a pipe provided with a drain valve 69 (or a drain valve 79) located downstream of the multiple valve. By the supply valve 67 being closed, a cleaning path from the liquid medicine tank to the multiple valve is formed as a path not including the treatment liquid nozzle 20.
Further, the chemical liquid tank for storing the processing liquid for cleaning the pipe structure in the cleaning mode can be shared with the chemical liquid tank for storing the processing liquid for substrate processing. Therefore, it is not necessary to additionally provide a chemical solution tank for storing a processing solution for cleaning the piping structure. Further, if a plurality of chemical solution tanks are provided, cleaning can be performed using a plurality of chemical solutions in accordance with the substance to be cleaned.
In addition, the multi-valve 68 in a plurality of fluid tanks can be cleaned at the same time. This can shorten the cleaning time. Further, by supplying different chemical solutions to the fluid tanks, the effects of the chemical solutions on the cleaning target can be effectively compared.
Further, if only a part of the fluid tanks is limited, the substrate processing can be performed in the substrate processing mode in the other fluid tanks, and therefore, the entire substrate processing apparatus 1 can be cleaned without interrupting the substrate processing.
The supply pressure of the chemical liquid in the cleaning mode may be varied by adjusting the output of the pump in the housing, adjusting the opening and closing of the valve, adjusting the opening and closing of the selector valve, or the like.
In the cleaning mode, the treatment liquid nozzle 20 may be moved by the drive of the driver 22C so that the treatment liquid nozzle 20 is retracted from above the substrate W, but the treatment liquid nozzle 20 may be kept positioned above the substrate W. In the cleaning mode, the supply valve 67 is closed, and therefore, the processing liquid used in the cleaning mode does not reach the processing unit 600. Thus, even if the treatment liquid nozzle 20 is kept above the substrate W, the substrate W is not contaminated by the treatment liquid.
< modification of the structure of the substrate processing apparatus >
Fig. 5 is a diagram showing a modification of the structure of the substrate processing apparatus 1A according to the present embodiment, which is connected to each processing unit 600 via a pipe.
In fig. 5, unlike the case of fig. 3, no supply valve, no connection pipe, and no connection valve other than the supply valve 62D are provided in the fluid tank 160. Similarly, no supply valve and no connection valve other than the supply valve 72D are provided in the fluid tank 170. The supply valves 62D and 72D may be provided upstream of the corresponding fluid tanks.
Instead, corresponding piping and valves are provided downstream of each housing and upstream of the fluid tank.
That is, the supply valve 162A is provided in the supply pipe 39 downstream of the casing and upstream of the fluid tank, the supply valve 162B is provided in the supply pipe 49 downstream of the casing and upstream of the fluid tank, and the supply valve 162C is provided in the supply pipe 59 downstream of the casing and upstream of the fluid tank.
The connection pipe 164E is provided downstream of the supply valves 162A and 162B so as to extend between the pipe provided with the supply valve 162A and the pipe provided with the supply valve 162B.
The connection pipe 164F is provided downstream of the supply valves 162B and 162C so as to extend between the pipe provided with the supply valve 162B and the pipe provided with the supply valve 162C.
The connection pipe 164G is provided downstream of the supply valve 162C so as to extend over the pipe provided with the supply valve 162C and the supply pipe 100.
The connection valve 166E is provided in the connection pipe 164E. The connection valve 166F is provided in the connection pipe 164F. The connection valve 166G is provided in the connection pipe 164G.
In such a configuration, as in the case of fig. 3, the processing is performed while switching between the substrate processing mode and the cleaning mode.
Specifically, in the substrate processing mode, the valve (i.e., the supply valve 162A) corresponding to the casing (herein, the casing 30) storing the processing liquid for processing the substrate W is opened by the control of the control unit 90, and the processing liquid is supplied to the fluid tank 160.
At this time, the connection valves 166E, 166F, and 166G are closed, respectively.
Subsequently, the supply valve 67 is opened under the control of the control unit 90, and the processing liquid is supplied to the corresponding processing unit 600A.
On the other hand, in the cleaning mode, the valve (i.e., the supply valve 162A) corresponding to the casing (herein, the casing 30) storing the processing liquid for cleaning of the piping structure including the multi-valve 68 is opened by the control of the control unit 90, and the processing liquid is supplied to the fluid tank 160.
At this time, the connection valves 166E, 166F, and 166G are opened. Thus, the processing liquid supplied to the fluid tank 160 can be simultaneously supplied to the selector valve 68B, the selector valve 68C, the selector valve 68D, and the selector valve 68E of the multi-valve 68.
Subsequently, the supply valve 67 is closed and the drain valve 69 is opened under the control of the control unit 90, and the processing liquid for cleaning the multi-valve 68 is discharged.
As described above, the substrate processing apparatus 1A can clean the pipe structure including the multi-valve 68 in the cleaning mode.
In addition to the effects of the substrate processing apparatus shown in fig. 3, by providing the connection pipes and the connection valves on the upstream side of the respective fluid tanks, the structure can be simplified as compared with the case where these structures are provided in the respective fluid tanks.
Fig. 6 is a diagram showing another modification of the structure of the substrate processing apparatus 1B according to the present embodiment, which is connected to each processing unit 600 via a pipe. In fig. 6, a part of the same structure as that shown in fig. 3 is omitted.
In fig. 6, unlike the case of fig. 3, a supply pipe 239 that supplies a chemical solution for cleaning of the pipe structure is connected to the downstream of the pipe in the fluid tank 260, in which any one of the supply valves (i.e., any one of the supply valves 62A, 62B, 62C, and 62D) is provided. Similarly, a supply pipe 239 to which a chemical solution for cleaning the pipe structure is supplied is connected downstream of a pipe in the fluid tank 270 in which any one of the supply valves (i.e., any one of the supply valves 72A, 72B, 72C, and 72D) is provided. The supply pipe 239 may be a pipe connected to a position upstream of each fluid tank.
Further, the supply pipe 239 is connected to the cleaning case 230 on the upstream side. The cleaning case 230 includes a liquid medicine tank 232, a valve 234, a pump 236, and a filter 238. The chemical liquid tank 232 stores a chemical liquid for cleaning a piping structure including a multi-valve. The valve 234, the pump 236, and the filter 238 are provided in a supply pipe 239 serving as a pipe connected to the chemical liquid tank 232.
In a state where the valve 234 whose opening and closing are adjusted by the control of the control unit 90 is opened, the chemical liquid stored in the chemical liquid tank 232 passes through the filter 238 by the pump 236 which is operated by the control of the control unit 90, flows through the supply pipe 239, and flows to the downstream tank 260. Further, by opening the supply valve 240 in the fluid tank 260 (or the supply valve 241 in the fluid tank 270), the chemical liquid is supplied to the multi-valve 68 (or the multi-valve 78).
Further, the fluid tank 260 is provided with a circulation pipe 264, and the circulation pipe 264 is a pipe branched from the pipe provided with the drain valve 69. The circulation pipe 264 is provided with a circulation valve 262, and the opening and closing operations of the drain valve 69 and the circulation valve 262 are controlled by the control of the control unit 90, whereby it is possible to select whether to discharge or circulate the chemical used for cleaning.
Similarly, the fluid tank 270 is provided with a circulation pipe 274, and the circulation pipe 274 is a pipe branching off from the pipe provided with the drain valve 79. The circulation pipe 274 is provided with a circulation valve 272, and the opening and closing operations of the drain valve 79 and the circulation valve 272 are controlled by the control of the control unit 90, whereby it is possible to select whether the chemical used for cleaning is discharged or circulated.
As described above, the substrate processing apparatus 1B can clean the piping structure including the multi-valve 68 in the cleaning mode.
In addition to the effects of the substrate processing apparatus shown in fig. 3, by providing a dedicated chemical solution tank 232 and storing a chemical solution for cleaning a piping structure including a multi-valve, the type, concentration, and the like of the chemical solution used for cleaning are independent of the substrate processing. This improves the degree of freedom of the chemical solution to be supplied.
In the above-described cleaning mode, the multi-valve to be cleaned may be removed from the fluid tank and cleaned in another place.
Fig. 7 is a diagram showing an example of the structure of the housing 330 configured to accommodate the multi-valve 68 in the cleaning mode.
As illustrated in fig. 7, the housing 330 includes a chemical liquid tank 332, a valve 331, a valve 333, a valve 334, a valve 335, a pump 336, an opening valve 337, a filter 338, a supply pipe 339, a circulation pipe 402, a supply pipe 404, a supply pipe 406, a supply pipe 408, a supply pipe 410, a supply pipe 414, and a connection pipe 412.
The chemical solution tank 332 stores a chemical solution for processing the substrate W, a chemical solution for cleaning the multi-valve 68, or deionized water for cleaning the multi-valve 68. The chemical liquid is supplied from the chemical liquid supply source by opening the valve 331, and the pure water is supplied from the pure water supply source by opening the valve 333.
The valve 335, the opening valve 337, the pump 336, and the filter 338 are provided in the supply pipe 414 connected from the chemical liquid tank 332 to the multi-valve 68. Further, the valve 334 is provided in the circulation pipe 402 branched from the supply pipe 414 upstream of the valve 335. The circulation pipe 402 circulates the chemical solution flowing through the supply pipe 414 to the chemical solution tank 332.
A supply pipe 404, a supply pipe 406, a supply pipe 408, and a supply pipe 410 branched from a supply pipe 414 are connected to the upstream side of the mounted multi-valve 68, and a connection pipe 412 is provided across the supply pipe 404, the supply pipe 406, the supply pipe 408, and the supply pipe 410.
Further, a pipe 340 is connected to the downstream side of the mounted multiple valve 68, and the pipe 340 is used for discharging or circulating the processing liquid for cleaning the multiple valve 68.
In the substrate processing mode, in a state where the valve 335 is closed and the valve 334 is open, the chemical liquid for processing the substrate W is supplied from the chemical liquid tank 332 to the downstream tank via the supply pipe 414, the circulation pipe 402, and the supply pipe 339. At this time, the multiple valve 68 is mounted in the downstream tank.
On the other hand, in the cleaning mode, in a state where the valve 334 is closed and the valve 335 is opened, the chemical liquid for cleaning the multi-valve 68 is supplied from the chemical liquid tank 332 to the multi-valve 68 via the supply pipe 414, the connection pipe 412, the supply pipe 404, the supply pipe 406, the supply pipe 408, and the supply pipe 410. Then, the chemical liquid is discharged or collected from the pipe 340 connected to the downstream of the multi-valve 68.
Further, in the cleaning mode, while the valve 334 is closed and the valve 335 is open, deionized water for cleaning the multi-valve 68 may be supplied from the chemical liquid tank 332 to the multi-valve 68 via the supply pipe 414, the connection pipe 412, the supply pipe 404, the supply pipe 406, the supply pipe 408, and the supply pipe 410. The inside of the piping including the multi-valve 68 may be further sucked by using the opening valve 337.
As described above, the piping structure including the multi-valve 68 can be cleaned in the housing 330 in the cleaning mode.
In addition to the effects of the substrate processing apparatus shown in fig. 3, by removing the multi-way valve 68 and disposing it near the liquid chemical tank 332, the piping structure for cleaning can be made short and simple while extending the structure of the substrate processing apparatus, and the time for cleaning can be shortened.
Here, the cleaning unit, which is a dedicated unit for cleaning the multi-valve, may be provided separately from the substrate processing apparatus.
Fig. 8 is a diagram showing an example of the structure of the cleaning unit 80 configured to accommodate the multiple valve 68.
As illustrated in fig. 8, the cleaning unit 80 includes a chemical liquid tank 82, a valve 81, a valve 83, a valve 84, a valve 85, a pump 86, an opening valve 87, a filter 88, an opening valve 89, a supply pipe 502, a circulation pipe 514, a supply pipe 506, a supply pipe 508, a supply pipe 510, a supply pipe 512, a connection pipe 504, and a drain pipe 516.
The chemical liquid tank 82 stores a chemical liquid for cleaning the multi-valve 68. By opening the valve 81, the liquid chemical is supplied to the multi-valve 68. Further, pure water is supplied from the pure water supply source to the multiple valve 68 by opening the valve 83.
The opening valve 87, the pump 86, and the filter 88 are provided in a supply pipe 502 for supplying the chemical solution or deionized water to the multiple valve 68 mounted thereon. Here, the open valve 87 is used for suction in the pipe.
A supply pipe 506, a supply pipe 508, a supply pipe 510, and a supply pipe 512 branching from the supply pipe 502 are connected to the upstream side of the mounted multi-valve 68, and a connection pipe 504 is provided so as to straddle the supply pipe 506, the supply pipe 508, the supply pipe 510, and the supply pipe 512.
Further, downstream of the mounted multiple valve 68, a valve 85 is provided in a drain pipe 516 for discharging the processing liquid used for cleaning the multiple valve 68, and a valve 84 is provided in a circulation pipe 514 for circulating the chemical liquid used for cleaning the multiple valve 68 to the chemical liquid tank 82. Here, the open valve 89 is used for suction in the piping downstream of the multi-valve 68.
In the cleaning unit 80, a cleaning path for cleaning the mounted multiple valve 68 is formed by a cleaning pipe. Here, in the example of fig. 8, the cleaning pipe includes: piping from the chemical liquid tank 82 downstream to the supply piping 502, further to the supply piping 506, the supply piping 508, the supply piping 510, and the supply piping 512; and piping from the chemical liquid tank 82 to the upstream side to the circulation piping 514 and the drain piping 516. The cleaning pipe is detachable from the multi-valve 68.
Further, downstream of the mounted multiple valve 68, a valve 85 is provided in a drain pipe 516 for discharging the processing liquid used for cleaning the multiple valve 68, and a valve 84 is provided in a circulation pipe 514 for circulating the chemical liquid used for cleaning the multiple valve 68 to the chemical liquid tank 82. Here, the open valve 89 is used for suction in the piping downstream of the multi-valve 68.
When the multi-valve 68 is cleaned by the cleaning unit 80, the chemical liquid is supplied from the chemical liquid tank 82 to the multi-valve 68, and pure water is further supplied as necessary. When the chemical liquid for cleaning is circulated to the chemical liquid tank 82, the valve 84 is opened and the valve 85 is closed. On the other hand, when the chemical solution or the deionized water used for cleaning is discharged, the valve 84 is closed and the valve 85 is opened.
In particular, after the cleaning by the chemical solution, the cleaning by the deionized water is further performed, and then the inside of the pipe is sucked by the open valve 87 and the open valve 89 on both the upstream side and the downstream side of the multi-valve 68, and the chemical solution and the deionized water which may contain the substance to be cleaned are sucked, whereby the cleaning effect can be improved. Further, by repeating this cycle a plurality of times, the cleaning effect can be improved.
As described above, the piping structure including the multi-valve 68 can be cleaned using the cleaning unit 80.
In addition to the effects of the substrate processing apparatus shown in fig. 3, since the multi-valve 68 is removed and cleaning is performed in the cleaning unit 80 for cleaning provided as the multi-valve 68, the type, concentration, and the like of the chemical used for cleaning do not depend on the substrate processing. This improves the degree of freedom of the chemical solution to be supplied.
< effects produced by the above-described embodiments >
Next, an example of the effects produced by the above-described embodiments will be described. In the following description, although the effects are described based on the specific configurations exemplified in the above-described embodiments, the present invention may be replaced with other specific configurations exemplified in the present specification within a range in which the same effects are produced. That is, in the following description, only one of the related specific configurations may be representatively described for convenience, but the representatively described specific configuration may be replaced with another related specific configuration.
According to the above-described embodiment, the substrate processing apparatus includes the tank for supplying the chemical solution, the multi-valve 68 (or the multi-valve 78), and the processing solution nozzle 20. Here, the tank corresponds to at least one of the liquid medicine tank 32, the liquid medicine tank 42, the liquid medicine tank 52, the liquid medicine tank 232, the liquid medicine tank 332, and the like, for example. The multiple valve 68 is supplied with a plurality of processing liquids for processing the substrate W. In addition, the multiple valve 68 selectively supplies at least one of the plurality of processing liquids. The processing liquid nozzle 20 processes the substrate W with the processing liquid supplied from the multi-valve 68. Here, the substrate processing apparatus can switch between a substrate processing mode for processing the substrate W and a cleaning mode for cleaning at least the multi-valve 68. In the substrate processing mode, the substrate W is processed by the processing liquid supplied to the processing liquid nozzle 20. In the cleaning mode, the chemical liquid is supplied from the chemical liquid tank 32 to the multi-way valve 68 in a cleaning path that is a path passing through the chemical liquid tank 32 and the multi-way valve 68 without passing through the treatment liquid nozzle 20.
With such a configuration, the multi-valve 68 can be effectively cleaned by supplying the chemical solution to the cleaning path not via the treatment solution nozzle 20. Since the cleaning path does not include the treatment liquid nozzle 20, the chemical liquid is not discharged from the treatment liquid nozzle 20 in the cleaning mode, and the substrate W is not contaminated by the chemical liquid.
In addition, the same effects can be produced also in the case where another structure exemplified in the present specification is appropriately added to the above-described structure, that is, in the case where another structure in the present specification, which is not mentioned, is appropriately added to the above-described structure.
In addition, according to the above-described embodiment, the chemical liquid is one of a plurality of kinds of treatment liquids. With this configuration, since the chemical solution supplied from the chemical solution tank for processing the substrate W can be used for cleaning the multi-valve 68, it is not necessary to separately prepare a chemical solution tank for cleaning the multi-valve 68.
Further, according to the above-described embodiment, the substrate processing apparatus includes a plurality of supply pipes for supplying the chemical solution and at least one connection pipe connected to the plurality of supply pipes so as to straddle the plurality of supply pipes at a position downstream of the chemical solution tank 32 and upstream of the multi-valve 68 in the cleaning path. Here, the supply pipe corresponds to, for example, the supply pipe 39, the supply pipe 49, the supply pipe 59, the supply pipe 100, the supply pipe 404, the supply pipe 406, the supply pipe 408, the supply pipe 410, and the like. The connection piping corresponds to, for example, the connection piping 64E, the connection piping 64F, the connection piping 64G, the connection piping 74E, the connection piping 74F, the connection piping 74G, the connection piping 164E, the connection piping 164F, the connection piping 164G, the connection piping 412, and the like. With this configuration, the chemical solution can be simultaneously supplied to the plurality of supply pipes connected to the multi-valve 68 via the connection pipes. This allows the plurality of supply pipes connected to the multi-valve 68 to be cleaned at the same time, thereby shortening the cleaning time.
In addition, according to the above-described embodiment, the connection pipe is housed in the case (for example, the fluid tank 60, the fluid tank 70, the housing 330, and the like) that houses the multiple valve 68. With this configuration, the substrate processing mode and the cleaning mode can be switched for each fluid tank 60 to execute the processing. This can shorten the time for interrupting the substrate processing in the entire substrate processing apparatus 1.
In addition, according to the above-described embodiment, the connection pipe 412 is housed in the case 330 that houses the chemical liquid tank 332 and the multi-valve 68. With such a configuration, by housing the multiple valve 68, the chemical solution tank 332, and the connection pipe 412 in the housing 330, the pipe structure for cleaning can be made short and simple, and the time for cleaning can be shortened, while extending the configuration of the substrate processing apparatus.
In addition, according to the above-described embodiment, the multiple valve 68 includes a plurality of selector valves that open and close each of the plurality of supply pipes. Here, the selector valve corresponds to at least one of the selector valve 68B, the selector valve 68C, the selector valve 68D, the selector valve 68E, the selector valve 68F, the selector valve 78B, the selector valve 78C, the selector valve 78D, the selector valve 78E, the selector valve 78F, and the like, for example.
In the cleaning mode, at least one of the plurality of supply pipes is opened and closed by a corresponding selector valve. According to such a structure, there are cases where: when a rapid change in flow velocity occurs by the opening and closing operation of the selector valve, a water hammer effect is generated which vibrates the piping due to a change in pressure in the pipe. In addition, there is cavitation in which foaming occurs due to a change in pressure within the tube. By these phenomena, physical impact can be applied to the cleaning object, and the cleaning effect can be improved.
In addition, according to the above-described embodiment, in the cleaning mode, the chemical solution circulates through the cleaning path. With this configuration, the amount of the chemical solution used for cleaning can be reduced.
In addition, according to the above-described embodiment, the substrate processing apparatus includes a rinse liquid supply source (e.g., a deionized water supply source) for supplying a rinse liquid, and a suction unit for sucking the interior of the multi-valve 68. Here, the suction portion corresponds to at least one of the opening valve 65, the opening valve 75, the opening valve 337, and the like, for example. In the cleaning mode, after the circulation of the chemical solution in the cleaning path, the rinse solution is supplied to the multiple valve 68, and the inside of the multiple valve 68 is further sucked by the opening valve 65. According to such a configuration, the substance to be cleaned remaining in the pipe is rinsed with the chemical solution and the pure water, and the chemical solution and the pure water, which may contain the substance to be cleaned, are further sucked, whereby the cleaning effect can be improved.
In addition, according to the above-described embodiment, in the cleaning mode, the circulation of the chemical solution in the cleaning path, the supply of the rinse solution after the circulation of the chemical solution, and the suction of the interior of the multi-valve 68 after the supply of the rinse solution are repeated a plurality of times. According to such a configuration, the cleaning effect can be improved by repeating a cycle of flushing the substance to be cleaned remaining in the pipe with the chemical solution and the deionized water and further sucking the chemical solution and the deionized water, which may contain the substance to be cleaned.
In addition, according to the above-described embodiment, the supply pressure of the chemical solution changes in the cleaning mode. With such a configuration, when a rapid change in flow velocity occurs, a water hammer action that vibrates the pipe may occur due to a change in pressure in the pipe. In addition, cavitation in which foaming occurs due to a change in pressure in the pipe may occur. By these phenomena, physical impact can be applied to the cleaning object, and the cleaning effect can be improved.
According to the above-described embodiment, the cleaning unit includes the tank for supplying the chemical liquid and the cleaning pipe. Here, the tank corresponds to, for example, the liquid medicine tank 82 and the like. The cleaning pipe forms a cleaning path as a path for cleaning at least the multi-valve 68. The cleaning path is via a medicinal solution tank 82. In the cleaning path, the multiple valve 68 is cleaned by the chemical liquid supplied from the chemical liquid tank 82. The cleaning pipe is detachable from the multi-valve 68.
With such a configuration, the multi-valve 68 can be cleaned efficiently by supplying the chemical solution to the cleaning path. Further, since the multi-valve 68 is removed and cleaning is performed in the cleaning unit 80 provided for cleaning the multi-valve 68, the type, concentration, and the like of the chemical used for cleaning do not depend on the substrate processing. This improves the degree of freedom of the chemical solution to be supplied.
In addition, the order of performing the respective processes can be changed without particular limitation.
In addition, the same effects can be produced also in the case where another structure exemplified in the present specification is appropriately added to the above-described structure, that is, in the case where another structure in the present specification, which is not mentioned, is appropriately added to the above-described structure.
Further, according to the above-described embodiment, the cleaning unit includes the plurality of supply pipes 506 (or the supply pipe 508, the supply pipe 510, and the supply pipe 512) for supplying the chemical liquid and at least one connection pipe 504 connected to the plurality of supply pipes so as to straddle the supply pipes at a position downstream of the chemical liquid tank 82 and upstream of the multi-valve 68 in the cleaning path. With this configuration, the chemical solution can be simultaneously supplied to the plurality of supply pipes connected to the multi-valve 68 via the connection pipes. Accordingly, the plurality of supply pipes connected to the multi-valve 68 can be cleaned at the same time, and the cleaning time can be shortened.
In addition, according to the above-described embodiment, the multiple valve 68 includes a plurality of selector valves that open and close each of the plurality of supply pipes. At least one of the plurality of supply pipes is opened and closed by a corresponding selector valve. According to such a configuration, when a rapid flow rate change occurs due to the opening/closing operation of the selector valve, a water hammer action that vibrates the pipe may occur due to a pressure change in the pipe. In addition, cavitation in which foaming occurs due to a change in pressure in the pipe may occur. By these phenomena, physical impact can be applied to the cleaning object, and the cleaning effect can be improved.
In addition, according to the above-described embodiment, the chemical solution circulates through the cleaning path. With this configuration, the amount of the chemical solution used for cleaning can be reduced.
Further, according to the above-described embodiment, the cleaning unit includes the rinse liquid supply source (for example, the deionized water supply source) for supplying the rinse liquid, and the suction unit for sucking the interior of the multi-valve 68. Here, the suction portion corresponds to at least one of the opening valve 87, the opening valve 89, and the like, for example. After the circulation of the chemical liquid in the cleaning path, the rinse liquid is supplied to the multiple valve 68, and the inside of the multiple valve 68 is further sucked by the open valve 87. According to such a configuration, the substance to be cleaned remaining in the pipe is rinsed with the chemical solution and the pure water, and the chemical solution and the pure water, which may contain the substance to be cleaned, are further sucked, whereby the cleaning effect can be improved.
Further, according to the above-described embodiment, the circulation of the chemical solution in the cleaning path, the supply of the rinse solution after the circulation of the chemical solution, and the suction of the interior of the multi-valve 68 after the supply of the rinse solution are repeated. According to such a configuration, the cleaning effect can be improved by repeating a cycle of flushing the substance to be cleaned remaining in the pipe with the chemical solution and the deionized water and further sucking the chemical solution and the deionized water, which may contain the substance to be cleaned.
< modification of the above-described embodiment >
In the above-described embodiments, the sizes, shapes, relative arrangement relationships, conditions for implementation, and the like of the respective constituent elements are described in some cases, but they are not limited to these examples in all aspects.
Therefore, a myriad of modifications and equivalents not illustrated can be conceived within the scope of the technology disclosed in the present specification. For example, the case where at least one of the constituent elements is changed, added, or omitted is included.
In the above-described embodiments, when a material name or the like is not specifically described, an alloy or the like containing other additives in the material is included unless a contradiction occurs.

Claims (17)

1. A substrate processing apparatus is characterized by comprising:
a tank for supplying a chemical liquid;
a multiple valve to which a plurality of processing liquids for processing a substrate are supplied and which can selectively supply at least one of the plurality of processing liquids; and
a processing liquid nozzle for processing the substrate by using the processing liquid supplied from the multi-valve,
can be switched between a substrate processing mode for processing the substrate and a cleaning mode for cleaning at least the multi-valve,
in the substrate processing mode, the substrate is processed by the processing liquid supplied to the processing liquid nozzle,
in the cleaning mode, the chemical liquid is supplied from the tank to the multi-valve in a cleaning path that is a path that passes through the tank and the multi-valve without passing through the treatment liquid nozzle.
2. The substrate processing apparatus according to claim 1,
the chemical solution is one of a plurality of treatment solutions.
3. The substrate processing apparatus according to claim 1 or 2,
the cleaning path further includes, at a position downstream of the tank and upstream of the multi-valve:
a plurality of supply pipes to which the chemical liquid is supplied; and
and at least one connection pipe connected to the plurality of supply pipes so as to straddle the supply pipes.
4. The substrate processing apparatus according to claim 3,
the connection pipe is accommodated in a case accommodating the multi-valve.
5. The substrate processing apparatus according to claim 3,
the connection pipe is accommodated in a housing that accommodates the tank and the multi-valve.
6. The substrate processing apparatus according to claim 3,
the multiple valve includes a plurality of selector valves for opening and closing each of the plurality of supply pipes,
in the cleaning mode, at least one of the plurality of supply pipes is opened and closed by the corresponding selector valve.
7. The substrate processing apparatus according to claim 1 or 2,
in the cleaning mode, the chemical solution circulates through the cleaning path.
8. The substrate processing apparatus according to claim 7, further comprising:
a rinse liquid supply source for supplying a rinse liquid; and
a suction part for sucking the inside of the multiple valve,
in the cleaning mode, after the chemical solution circulates through the cleaning path, the rinse solution is supplied to the multiple valve, and the inside of the multiple valve is further sucked by the suction unit.
9. The substrate processing apparatus according to claim 8,
in the cleaning mode, the circulation of the chemical solution in the cleaning path, the supply of the rinse solution after the circulation of the chemical solution, and the suction in the multi-valve after the supply of the rinse solution are repeated a plurality of times.
10. The substrate processing apparatus according to claim 1 or 2,
in the cleaning mode, the supply pressure of the chemical agent is varied.
11. A cleaning unit is characterized by comprising:
a tank for supplying a chemical liquid; and
a cleaning pipe for forming a cleaning path which is a path for cleaning at least the multi-valve,
the multiple valve is supplied with a plurality of kinds of processing liquids and can selectively supply at least one of the plurality of kinds of processing liquids,
the cleaning path is passed through the tank,
in the cleaning path, the multiple valve is cleaned by the chemical supplied from the tank,
the cleaning pipe is detachable from the multi-valve.
12. The cleaning unit of claim 11,
the cleaning path further includes, at a position downstream of the tank and upstream of the multi-valve:
a plurality of supply pipes to which the chemical liquid is supplied; and
and at least one connection pipe connected to the plurality of supply pipes so as to straddle the supply pipes.
13. The cleaning unit of claim 12,
the multiple valve includes a plurality of selector valves for opening and closing each of the plurality of supply pipes,
at least one of the plurality of supply pipes is opened and closed by the corresponding selector valve.
14. The cleaning unit according to any one of claims 11 to 13,
the chemical solution circulates through the cleaning path.
15. The cleaning unit according to any one of claims 11 to 13, further comprising:
a rinse liquid supply source for supplying a rinse liquid; and
a suction part for sucking the inside of the multiple valve,
after the circulation of the chemical solution in the cleaning path, the rinse solution is supplied to the multiple valve, and the inside of the multiple valve is further sucked by the suction unit.
16. The cleaning unit of claim 15,
the circulation of the chemical solution in the cleaning path, the supply of the rinse solution after the circulation of the chemical solution, and the suction of the interior of the multi-valve after the supply of the rinse solution are repeated a plurality of times.
17. A multi-valve cleaning method for cleaning a multi-valve connected to a substrate processing apparatus in a state in which a plurality of processing liquids for processing a substrate are supplied and at least one of the plurality of processing liquids can be selectively supplied,
the method for cleaning the multi-valve is characterized in that,
the substrate processing apparatus includes:
a tank for supplying a chemical liquid; and
a processing liquid nozzle for processing the substrate by using the processing liquid supplied from the multi-valve,
the substrate processing apparatus is switchable between a substrate processing mode for processing the substrate and a cleaning mode for cleaning at least the multi-valve,
in the substrate processing mode, the substrate is processed by the processing liquid supplied to the processing liquid nozzle,
in the cleaning mode, the chemical liquid is supplied from the tank to the multi-valve in a cleaning path which is a path passing through the tank and the multi-valve without passing through the treatment liquid nozzle,
the cleaning mode includes a step of cleaning the multi-way valve.
CN202111586967.9A 2020-12-28 2021-12-23 Substrate processing apparatus, cleaning unit, and multi-valve cleaning method Pending CN114695188A (en)

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