KR20220094151A - Substrate processing apparatus, cleaning unit, and cleaning method for multiple valve - Google Patents

Abstract

The present invention is to effectively clean multiple valves. A substrate processing device comprises: a tank for supplying a chemical liquid; multiple valves capable of selectively supplying a plurality of types of processing liquids; and a processing liquid nozzle for processing a substrate by using the processing liquids supplied from the multiple valves. The substrate processing device can switch between a substrate processing mode for processing the substrate and a cleaning mode for cleaning at least the multiple valves. In the cleaning mode, the chemical liquid is supplied from the tank to the multiple valves in a cleaning path which is a path that passes through the tank and the multiple valves without passing through the processing liquid nozzle.

Description

SUBSTRATE PROCESSING APPARATUS, CLEANING UNIT, AND CLEANING METHOD FOR MULTIPLE VALVE

Techniques disclosed herein relate to substrate processing techniques. The substrate to be processed includes, for example, a semiconductor wafer, a glass substrate for a liquid crystal display device, a substrate for flat panel display (FPD) such as an organic EL (electroluminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a magneto-optical device and a substrate for a disk, a glass substrate for a photomask, a ceramic substrate, a substrate for a field emission display (ie, FED), or a substrate for a solar cell.

In a substrate processing apparatus, in order to use a plurality of types of processing liquids in processing a substrate, multiple valves, which are valve units capable of selectively supplying one of a plurality of types of processing liquids, may be provided (for example, Patent Documents) see 1).

Japanese Patent Laid-Open No. 2019-012791

The multi-valve as described above has a structure in which the processing liquid is respectively supplied from a plurality of pipes connected to the upstream side, and since it is a point where the pipe connection is concentrated, contaminants are easily collected. On the other hand, since the structure is complicated, there is a problem that cleaning tends to be insufficient.

The technique disclosed in this specification has been made in view of the problems described above, and is a technique for effectively cleaning multiple valves.

A substrate processing apparatus according to a first aspect of the technology disclosed herein includes a tank for supplying a chemical solution, a plurality of types of processing liquids for processing a substrate, and at least one of the plurality of types of processing liquids. a substrate processing mode for processing the substrate, comprising: multiple valves selectively supplyable; and a processing liquid nozzle for processing the substrate using the processing liquid supplied from the multiple valves; and at least cleaning the multiple valves In the substrate processing mode, the substrate is processed by the processing liquid supplied to the processing liquid nozzle, and in the cleaning mode, the tank and the tank are not passed through the processing liquid nozzle. In a cleaning path that is a path through multiple valves, the chemical is supplied from the tank to the multiple valves.

In the substrate processing apparatus according to the second aspect of the technology disclosed in the present specification, the chemical liquid is one of a plurality of types of the processing liquid in relation to the substrate processing apparatus according to the first aspect.

A substrate processing apparatus of a third aspect of the technology disclosed herein, with respect to the substrate processing apparatus of the first or second aspect, is located at a position downstream of the tank, in the cleaning path, and upstream of the multiple valves. In the above, it further includes a plurality of supply pipes to which the chemical solution is supplied, and at least one connection pipe connected across the plurality of supply pipes.

The substrate processing apparatus which is a 4th aspect of the technology disclosed in this specification, with respect to the substrate processing apparatus which is a 3rd aspect, the said connection pipe is accommodated in the housing which accommodates the said multiple valves.

The substrate processing apparatus which is a fifth aspect of the technology disclosed herein, with respect to the substrate processing apparatus which is the third or fourth aspect, the connecting pipe is accommodated in a housing that accommodates the tank and the multiple valves.

The substrate processing apparatus according to a sixth aspect of the technology disclosed herein relates to the substrate processing apparatus according to any one of the third to fifth aspects, wherein the multiple valves include a plurality of the plurality of supply pipes for opening and closing each of the plurality of supply pipes. A selection valve is provided, and in the cleaning mode, at least one of the plurality of supply pipes is opened and closed by the corresponding selection valve.

In the substrate processing apparatus according to a seventh aspect of the technology disclosed herein, the chemical liquid circulates in the cleaning path in the cleaning mode with respect to the substrate processing apparatus according to any one of the first to sixth aspects.

A substrate processing apparatus according to an eighth aspect of the technology disclosed herein further includes a rinse liquid supply source for supplying a rinse liquid, and a suction unit for sucking the inside of the multi-valve with respect to the substrate processing apparatus according to the seventh aspect and in the cleaning mode, after circulation of the chemical solution in the cleaning path, the rinse solution is supplied to the multiple valves, and the inside of the multiple valves is sucked by the suction unit.

A substrate processing apparatus according to a ninth aspect of the technology disclosed herein is, in relation to the substrate processing apparatus according to the eighth aspect, in the cleaning mode, circulation of the chemical in the cleaning path and the rinse after circulation of the chemical The supply of the liquid and the suction in the multi-valve after the supply of the rinse liquid are repeated a plurality of times.

In the substrate processing apparatus according to the tenth aspect of the technology disclosed herein, in the cleaning mode, the supply pressure of the chemical fluctuates with respect to the substrate processing apparatus according to any one of the first to seventh aspects.

A cleaning unit, which is an eleventh aspect of the technology disclosed herein, includes a tank for supplying a chemical solution, and a cleaning pipe for forming a cleaning path that is a path for cleaning at least multiple valves, wherein the multiple valves include: A type of treatment liquid is supplied, and at least one of a plurality of types of the treatment liquid may be selectively supplied, the cleaning path passing through the tank, and the multiple valves being, in the cleaning path, the tank It is cleaned by the chemical solution supplied from, and the cleaning pipe is detachable from the multi-valve.

A cleaning unit as a twelfth aspect of the technology disclosed herein, with respect to the cleaning unit according to the eleventh aspect, at a position in the cleaning path, downstream of the tank, and upstream of the multiple valves, wherein the chemical liquid is It further includes a plurality of supply pipes to be supplied, and at least one connecting pipe connected over the plurality of supply pipes.

A cleaning unit as a thirteenth aspect of the technology disclosed herein, with respect to the cleaning unit as a twelfth aspect, wherein the multi-valve includes a plurality of selection valves for opening and closing each of the plurality of the supply pipes, the plurality of the At least one of the supply pipes is opened and closed by the corresponding selection valve.

In the cleaning unit according to a fourteenth aspect of the technology disclosed herein, the chemical liquid circulates in the cleaning path with respect to the cleaning unit according to any one of the eleventh to thirteenth aspects.

A cleaning unit according to a fifteenth aspect of the technology disclosed herein, with respect to the cleaning unit according to any one of the eleventh to fourteenth aspects, includes: A suction unit is further provided, and after circulation of the chemical solution in the cleaning path, the rinse solution is supplied to the multiple valves, and the inside of the multiple valves is sucked by the suction unit.

A cleaning unit according to a sixteenth aspect of the technology disclosed herein, with respect to the cleaning unit according to the fifteenth aspect, circulates the chemical solution in the cleaning path, supplies the rinse solution after circulation of the chemical solution, and Suction in the multi-valve after supply of the rinse liquid is repeated a plurality of times.

In the multi-valve cleaning method, which is a seventeenth aspect of the technology disclosed herein, a plurality of types of treatment liquids for treating a substrate are supplied, and at least one of the plurality of types of treatment liquids is selectively supplied to the substrate A multi-valve cleaning method for cleaning multiple valves connected to a processing apparatus, the substrate processing apparatus comprising: a tank for supplying a chemical solution; and a processing liquid for processing the substrate using the processing liquid supplied from the multiple valves a nozzle, wherein the substrate processing apparatus is switchable between a substrate processing mode for processing the substrate and a cleaning mode for cleaning at least the multiple valves, in the substrate processing mode, the processing liquid supplied to the nozzle The substrate is treated by the treatment liquid, and in the cleaning mode, the chemical liquid is supplied from the tank to the multi-valve in a cleaning path that is a path through the tank and the multiple valves without passing through the treatment liquid nozzle and cleaning the multiple valves in the cleaning mode.

According to at least the first, eleventh, and seventeenth aspects of the techniques disclosed in the present specification, multiple valves can be effectively cleaned by supplying the chemical liquid to the cleaning path not through the treatment liquid nozzle.

In addition, the objective, characteristic, situation, and advantage concerning the technology disclosed in this specification will become clearer further by the detailed description and accompanying drawings shown below.

1 is a plan view schematically illustrating an example of a configuration of a substrate processing apparatus according to an embodiment.
FIG. 2 is a diagram showing an example of the configuration of the control unit illustrated in FIG. 1 .
FIG. 3 is a diagram illustrating an example of a structure connected to each processing unit via a pipe among the configurations of the substrate processing apparatus according to the embodiment.
4 is a diagram illustrating an example of a configuration of a processing unit.
FIG. 5 is a diagram illustrating a modified example of a structure connected to each processing unit via a pipe among the configurations of the substrate processing apparatus according to the embodiment.
6 is a diagram illustrating another modified example of a structure connected to each processing unit via a pipe among the configurations of the substrate processing apparatus according to the embodiment.
Fig. 7 is a diagram showing an example of the configuration of a cabinet configured to accommodate multiple valves removed in the cleaning mode.
8 is a diagram illustrating an example of the configuration of a cleaning unit configured to accommodate multiple valves.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment is described, referring an accompanying drawing. In the following embodiment, although detailed characteristics etc. are also shown for description of a technique, they are an illustration, and in order that embodiment may implement, all of them are not necessarily essential characteristics.

In addition, drawings are schematically shown, and for the convenience of description, the abbreviation|omission of a structure, or a simplification of a structure is made in drawing suitably. In addition, the mutual relationship of the magnitude|size and position of the structure etc. which are respectively shown in different drawings is not necessarily described exactly, and can be changed suitably. Moreover, also in drawings, such as a top view rather than a cross-sectional view, in order to make it easy to understand the content of embodiment, hatching may be provided.

In addition, in the description shown below, the same code|symbol is attached|subjected to the same component, and is shown, and it is assumed that it is the same also about those names and functions. Therefore, in order to avoid duplication, detailed description of them may be abbreviate|omitted.

In addition, in the description described in this specification, when a certain component is described as "including", "includes" or "having", unless otherwise specified, the existence of other components is excluded. not expression.

In addition, in the description described in this specification, even if an ordinal number such as "first" or "second" is used in some cases, these terms are used for convenience in order to facilitate understanding of the contents of the embodiment. , is not limited to the order that can occur by these ordinal numbers.

In addition, in the description described in this specification, "upper", "lower", "left", "right", "side", "lower", "table" or "ri", etc. Even if terms meaning a specific position or direction are used in some cases, these terms are used for convenience in order to facilitate understanding of the contents of the embodiment, and do not relate to the position or direction when actually implemented. .

In addition, in the description described in this specification, "... top of” or “… of the lower surface”, etc., in addition to the upper surface itself or the lower surface of the target component, a state in which other components are formed on the upper surface or lower surface of the target component. That is, for example, if it is described as "B installed on the upper surface of A", it does not prevent the intervening of a separate component "bottle" between A and B.

<Embodiment>

Hereinafter, a substrate processing apparatus and a cleaning unit according to the present embodiment will be described.

<About the structure of the substrate processing apparatus>

1 is a plan view schematically showing an example of the configuration of a substrate processing apparatus 1 according to the present embodiment. The substrate processing apparatus 1 includes a load port 601 , an indexer robot 602 , a center robot 603 , a control unit 90 , and at least one processing unit 600 (in FIG. 1 , four processing unit).

The processing unit 600 is a single-wafer type apparatus that can be used for substrate processing, and specifically, is an apparatus that performs a processing for removing organic matter adhering to the substrate W. The organic material adhering to the substrate W is, for example, a used resist film. The resist film is used, for example, as an implantation mask for an ion implantation process.

In addition, the processing unit 600 may have a chamber 180 . In this case, by controlling the atmosphere in the chamber 180 by the controller 90 , the processing unit 600 can process the substrate in a desired atmosphere.

The control unit 90 can control the operation of each configuration in the substrate processing apparatus 1 . The carrier C is a container which accommodates the board|substrate W. Moreover, the load port 601 is a container holding|maintenance mechanism which holds the some carrier C. As shown in FIG. The indexer robot 602 can transport the substrate W between the load port 601 and the substrate mounting unit 604 . The center robot 603 can transport the substrate W between the substrate placing unit 604 and the processing unit 600 .

With the above configuration, the indexer robot 602 , the substrate placing unit 604 , and the center robot 603 serve as a transport mechanism for transporting the substrate W between the respective processing units 600 and the load port 601 . function

The unprocessed substrate W is taken out from the carrier C by the indexer robot 602 . And the unprocessed board|substrate W is transferred to the center robot 603 via the board|substrate mounting part 604. As shown in FIG.

The center robot 603 carries the unprocessed substrate W into the processing unit 600 . Then, the processing unit 600 performs processing on the substrate W.

The substrate W that has been processed in the processing unit 600 is taken out from the processing unit 600 by the center robot 603 . Then, the processed substrate W is transferred to the indexer robot 602 via the substrate placing unit 604 after passing through another processing unit 600 as needed. The indexer robot 602 carries the processed board|substrate W into the carrier C. As shown in FIG. As mentioned above, the process with respect to the board|substrate W is performed.

FIG. 2 : is a figure which shows the example of the structure of the control part 90 in which the example was shown in FIG. The control part 90 may be comprised by the general computer which has an electric circuit. Specifically, the control unit 90 includes a central processing unit (CPU) 91 , a read only memory (ie, ROM) 92 , a random access memory , that is, a RAM) 93 , a recording device 94 , an input unit 96 , a display unit 97 and a communication unit 98 , and a bus line 95 connecting them to each other.

The ROM 92 stores a basic program. The RAM 93 is used as a work area when the CPU 91 performs a predetermined process. The recording device 94 is constituted by a nonvolatile recording device such as a flash memory or a hard disk device. The input part 96 is comprised by various switches, a touch panel, etc., and receives input setting instructions, such as a process recipe, from a user. The display unit 97 is constituted of, for example, a liquid crystal display device and a lamp, and displays various types of information under the control of the CPU 91 . The communication unit 98 has a data communication function via a local area network (LAN) or the like.

In the recording apparatus 94 , a plurality of modes for controlling each configuration in the substrate processing apparatus 1 of FIG. 1 are set in advance. When the CPU 91 executes the processing program 94P, one of the plurality of modes is selected, and each configuration is controlled in the mode. Note that the processing program 94P may be recorded on an external recording medium. When this recording medium is used, the processing program 94P can be installed in the control unit 90 . Note that some or all of the functions executed by the control unit 90 do not necessarily have to be realized by software, but may be realized by hardware such as a dedicated logic circuit.

FIG. 3 is a diagram illustrating an example of a structure connected to each processing unit 600 via piping among the configurations of the substrate processing apparatus 1 according to the present embodiment.

As an example is shown in FIG. 3 , the substrate processing apparatus 1 includes a cabinet 30 , a cabinet 40 , a cabinet 50 , a fluid box 60 , a fluid box 70 , and processing A unit 600A and a processing unit 600B are provided. In addition, the number of cabinets is not limited to the number shown in FIG. In addition, one fluid box should just be provided with respect to one processing unit. In addition, the processing unit 600A and the processing unit 600B are equivalent to the processing unit 600 shown in FIG.

The cabinet 30 includes a chemical liquid tank 32 , a valve 34 , a pump 36 , and a filter 38 . In the chemical liquid tank 32 , a chemical solution (eg, H ₂ O ₂ , NH ₄ OH, O ₃ or an organic solvent such as IPA) used for processing the substrate W is used for cleaning multiple valves to be described later A chemical liquid to be used or a chemical liquid to be used in combination with them is stored. The valve 34 , the pump 36 , and the filter 38 are installed in a supply pipe 39 , which is a pipe connected to the chemical liquid tank 32 , respectively.

The chemical liquid stored in the chemical liquid tank 32 is similarly operated under the control of the control unit 90 while the valve 34 whose opening/closing is adjusted by the control of the control unit 90 is open. It flows through the inside of the supply pipe 39 while passing through the filter 38, and flows into the downstream fluid box 60, further processing unit 600A, etc.

The cabinet 40 includes a chemical liquid tank 42 , a valve 44 , a pump 46 , and a filter 48 . The chemical liquid tank 42 stores a chemical liquid used for processing the substrate W, a chemical liquid used for cleaning multiple valves to be described later, or a chemical liquid used in combination therewith. The valve 44 , the pump 46 , and the filter 48 are installed in a supply pipe 49 , which is a pipe connected to the chemical liquid tank 42 , respectively.

The chemical liquid stored in the chemical liquid tank 42 is similarly operated under the control of the control unit 90 while the valve 44 whose opening/closing is adjusted by the control of the control unit 90 is open. It flows through the inside of the supply pipe 49 while passing through the filter 48, and flows into the downstream fluid box 60, the processing unit 600A, etc.

The cabinet 50 includes a chemical liquid tank 52 , a valve 54 , a pump 56 , and a filter 58 . The chemical liquid tank 52 stores a chemical liquid used for processing the substrate W, a chemical liquid used for cleaning multiple valves to be described later, or a chemical liquid used in combination therewith. The valve 54 , the pump 56 , and the filter 58 are installed in a supply pipe 59 , which is a pipe connected to the chemical liquid tank 52 , respectively.

The chemical liquid stored in the chemical liquid tank 52 is similarly operated under the control of the control unit 90 while the valve 54 whose opening and closing is adjusted by the control of the control unit 90 is open. It flows through the inside of the supply pipe 59 while passing through the filter 58, and flows into the downstream fluid box 60 and processing unit 600A, etc.

In addition, the pure water as a rinse liquid supplied from the pure water supply source also flows through the supply pipe 100 connected to the pure water supply source, and flows to the downstream fluid box 60 , the processing unit 600A, and the like.

The supply pipe 39 is also connected to a fluid box other than the fluid box 60 (for example, the fluid box 70 or another fluid box not shown), and the chemical liquid in the chemical liquid tank 32 is connected to each fluid box. to flow

The supply pipe 49 is also connected to a fluid box other than the fluid box 60 (for example, the fluid box 70 or another fluid box not shown), and the chemical solution in the chemical solution tank 32 is connected to each fluid box. to flow

The supply pipe 59 is also connected to a fluid box other than the fluid box 60 (for example, the fluid box 70 or another fluid box not shown), and the chemical liquid in the chemical liquid tank 32 is connected to each fluid box. to flow

The supply pipe 100 is also connected to a fluid box other than the fluid box 60 (for example, the fluid box 70 or another fluid box not shown) to flow pure water as a rinse liquid to each fluid box. .

The fluid box 60 includes a supply valve 62A, a supply valve 62B, a supply valve 62C, and a supply valve 62D, a connection pipe 64E, a connection pipe 64F, and a connection pipe 64G. ), a connecting valve 66E, a connecting valve 66F, a connecting valve 66G, a multiple valve 68, an opening valve 65, a supply valve 67, and a drain valve 69 to provide

The supply valve 62A, the supply valve 62B, the supply valve 62C, and the supply valve 62D are respectively connected from an upstream side of piping (for example, the supply piping 39, the supply piping 49, It is a valve installed in the supply pipe (59) and the supply pipe (100).

The connecting pipe 64E is a pipe extending downstream of the supply valve 62A and the supply valve 62B between the pipe in which the supply valve 62A is provided and the pipe in which the supply valve 62B is installed.

The connecting pipe 64F is a pipe extending downstream of the supply valve 62B and the supply valve 62C between the pipe in which the supply valve 62B is provided and the pipe in which the supply valve 62C is installed.

The connecting pipe 64G is a pipe extending downstream of the supply valve 62C and the supply valve 62D between the pipe in which the supply valve 62C is provided and the pipe in which the supply valve 62D is installed.

The connection valve 66E is a valve provided in the connection pipe 64E. The connection valve 66F is a valve provided in the connection pipe 64F. The connection valve 66G is a valve provided in the connection pipe 64G.

The multiple valve 68 is connected to a plurality of pipes corresponding to each of the supply valve 62A, the supply valve 62B, the supply valve 62C, and the supply valve 62D, and is at least one of the plurality of pipes. It is a valve that can be selected to flow to the downstream supply pipe 61 .

The opening valve 65 is a valve provided in a branching pipe downstream of the connection valve in any one pipe in which the supply valve is provided and upstream of the multiple valve 68 . The opening valve 65 is a valve for introducing air or an inert gas (eg, nitrogen) into the pipe, or sucking the inside of the pipe (ie, exhausting the inside of the pipe).

The supply valve 67 is a valve provided in the supply pipe 61 downstream of the multiple valve 68 . In a state where the supply valve 67 is opened under the control of the controller 90 , the processing liquid supplied from the multiple valve 68 is supplied to the processing unit 600A.

The drain valve 69 is a valve provided in a branching pipe downstream of the multiple valve 68 in the supply pipe 61 and upstream of the supply valve 67 . The drain valve 69 is a valve for discharging the processing liquid in the pipe.

Here, the processing liquid is not limited to the chemical liquid stored in the chemical liquid tank 32 , the chemical liquid tank 42 , and the chemical liquid tank 52 , and for example, a rinse liquid such as pure water (DIW), or these Mixtures are also included.

The fluid box 70 includes a supply valve 72A, a supply valve 72B, a supply valve 72C, and a supply valve 72D, a connection pipe 74E, a connection pipe 74F, and a connection pipe 74G. ), a connecting valve 76E, a connecting valve 76F, a connecting valve 76G, a multiple valve 78, an opening valve 75, a supply valve 77, and a drain valve 79 to provide

The supply valve 72A, the supply valve 72B, the supply valve 72C, and the supply valve 72D are valves provided in each piping connected from an upstream.

The connecting pipe 74E is a pipe extending downstream of the supply valve 72A and the supply valve 72B between the pipe in which the supply valve 72A is provided and the pipe in which the supply valve 72B is installed.

The connecting pipe 74F is a pipe extending downstream of the supply valve 72B and the supply valve 72C between the pipe in which the supply valve 72B is provided and the pipe in which the supply valve 72C is installed.

The connecting pipe 74G is a pipe extending downstream of the supply valve 72C and the supply valve 72D between the pipe in which the supply valve 72C is provided and the pipe in which the supply valve 72D is installed.

The connection valve 76E is a valve provided in the connection pipe 74E. The connection valve 76F is a valve provided in the connection pipe 74F. The connection valve 76G is a valve provided in the connection pipe 74G.

The multiple valve 78 is connected to a plurality of pipes corresponding to each of the supply valve 72A, the supply valve 72B, the supply valve 72C, and the supply valve 72D, and is at least one of the plurality of pipes. It is a valve that can be selected to flow to the downstream supply pipe 71 .

The opening valve 75 is a valve provided in a branching pipe downstream of the connection valve in any one pipe in which the supply valve is provided, and upstream of the multiple valve 78 . The opening valve 75 is a valve for introducing air or an inert gas (for example, nitrogen) into the pipe, or sucking the inside of the pipe.

The supply valve 77 is a valve provided in the supply pipe 71 downstream of the multiple valve 78 . In a state where the supply valve 77 is opened under the control of the control unit 90 , the processing liquid supplied from the multiple valves 78 is supplied to the processing unit 600B.

The drain valve 79 is a valve provided in a branching pipe downstream of the multiple valve 78 in the supply pipe 71 and upstream of the supply valve 77 . The drain valve 79 is a valve for discharging the processing liquid in the pipe.

The multi-valve 68 has a connecting portion ( 68A) and the selector valve 68B, the selector valve 68C, the selector valve 68D, and the selector valve 68E provided in each of a plurality of pipes on the upstream side of the connecting portion 68A, and the connecting portion 68A A selection valve 68F provided in the supply pipe 61 connected to the connecting portion 68A is provided on the downstream side of the .

At least one of the selector valve 68B, the selector valve 68C, the selector valve 68D, and the selector valve 68E in the multiple valve 68, and with the selector valve 68F open, upstream The processing liquid supplied from the side is supplied to the processing unit 600A through the multiple valve 68 .

The multiple valve 78 includes a connection portion 78A connected across a plurality of pipes connected from the upstream side, a selection valve 78B provided in each of the plurality of pipes on the upstream side of the connection portion 78A, and a selection valve 78C, a selection valve 78D, and a selection valve 78E, and a selection valve 78F provided on the supply pipe 71 connected to the connection part 78A on the downstream side of the connection part 78A. .

At least one of the selector valve 78B, the selector valve 78C, the selector valve 78D, and the selector valve 78E in the multiple valve 78, and the selector valve 78F is upstream in the open state The processing liquid supplied from the side is supplied to the processing unit 600B through the multi-valve 78 . Here, when multiple valves 68 are arranged such that a plurality of select valves (ie, select valve 68B, select valve 68C, select valve 68D, and select valve 68E) are arranged in a row along the vertical direction. , it is preferable that the pure water (DIW) from the pure water supply source is supplied to the selection valve 68E.

The control unit 90 supplies the processing liquid to the fluid box by controlling the opening and closing of the valve in each cabinet and the output of the pump. Then, the control unit 90 controls the opening and closing of each valve in the fluid box and the opening and closing of each valve installed in the multiple valve 68 , thereby controlling the flow rate of each processing liquid supplied to the multiple valve 68 . to supply the processing liquid to the corresponding processing unit 600 .

<About processing unit>

4 is a diagram illustrating an example of the configuration of the processing unit 600 . As an example is shown in FIG. 4 , the processing unit 600 rotates the substrate W around the vertical rotation axis Z1 passing through the central portion of the substrate W while maintaining the one substrate W in a substantially horizontal posture. ), a spin chuck 10 for rotating the substrate W, a processing liquid nozzle 20 for discharging the processing liquid to the substrate W, a nozzle arm 22 having the processing liquid nozzle 20 mounted at an end thereof, and the substrate ( A cylindrical processing cup 12 is provided which surrounds the spin chuck 10 around the rotation axis Z1 of W).

When plural types of processing liquids are assumed, a plurality of processing liquid nozzles 20 may be provided to correspond to each processing liquid. The processing liquid nozzle 20 discharges the processing liquid to the upper surface of the substrate W.

The spin chuck 10 includes a disk-shaped spin base 10A for vacuum-sucking the lower surface of the substrate W in a substantially horizontal position, a rotating shaft 10C extending downward from the center of the spin base 10A, and a rotating shaft. A spin motor 10D is provided for rotating the substrate W adsorbed on the spin base 10A by rotating the 10C. Also, instead of the spin chuck 10, a clamping chuck including a plurality of chuck pins protruding upward from the outer periphery of the upper surface of the spin base and clamping the periphery of the substrate W by the chuck pins may be used. .

The nozzle arm 22 includes an arm portion 22A, a shaft 22B, and an actuator 22C. The actuator 22C adjusts the angle around the axis of the shaft body 22B. One end of the arm portion 22A is fixed to the shaft body 22B, and the other end of the arm portion 22A is disposed away from the shaft of the shaft body 22B. In addition, the processing liquid nozzle 20 is attached to the other end of the arm part 22A. By doing so, the processing liquid nozzle 20 is configured to be swingable in the radial direction of the substrate W. As shown in FIG. In addition, the movement direction of the processing liquid nozzle 20 due to the oscillation may have a component in the radial direction of the substrate W, and does not need to be strictly parallel to the radial direction of the substrate W. Here, the nozzle arm 22 may be vertically movable by a motor (not shown) or the like. In this case, the distance between the processing liquid nozzle 20 attached to the end of the nozzle arm 22 and the upper surface of the substrate W can be adjusted by raising and lowering the nozzle arm 22 .

The control unit 90 discharges the processing liquid from the processing liquid nozzle 20 to the upper surface of the substrate W while controlling the rotation speed of the spin motor 10D. In addition, the control unit 90 controls the driving of the actuator 22C to cause the processing liquid nozzle 20 to swing on the upper surface of the substrate W .

<About operation of substrate processing apparatus>

Next, the operation of the substrate processing apparatus 1 according to the present embodiment will be described with reference to FIGS. 1 to 4 .

The indexer robot 602 transfers the substrate W from the carrier C in the load port 601 to the substrate mounting unit 604 . The center robot 603 transfers the substrate W from the substrate placing unit 604 to one processing unit 600 . The processing unit 600 processes the substrate W. The center robot 603 transfers the substrate W from the processing unit 600 to the substrate placing unit 604 . The indexer robot 602 transfers the substrate W from the substrate mounting unit 604 to the carrier C in the load port 601 .

The above processing of the substrate W is performed in a state in which the substrate processing apparatus 1 is set to the substrate processing mode. In the substrate processing mode, first, under the control of the control unit 90 , at least one of the cabinet 30 , the cabinet 40 , the cabinet 50 , and a supply source of a processing liquid (including pure water) not shown in the figure is supplied to the substrate. A treatment liquid used for the treatment of (W) is supplied.

Next, the fluid box (herein, the fluid box 60 ) corresponding to the processing unit 600 (herein, referred to as the processing unit 600A) that processes the substrate W under the control of the control unit 90 . ), at least one of the valves (that is, at least one of the supply valve 62A, the supply valve 62B, the supply valve 62C, and the supply valve 62D) provided in at least one pipe through which the supplied processing liquid flows. one) is opened, and the treatment liquid is supplied to the multi-valve 68 .

At this time, the connection valve 66E provided in the connection pipe 64E, the connection valve 66F provided in the connection pipe 64F, the connection valve 66G provided in the connection pipe 64G, and the release valve 65 are each closed. However, the opening valve 65 introduces air or an inert gas into the pipe as necessary.

Next, under the control of the control unit 90, the opening and closing of at least one of the selection valve 68B, the selection valve 68C, the selection valve 68D, the selection valve 68E, and the selection valve 68F is adjusted; Through the connection portion 68A, the processing liquid is supplied downstream of the multi-valve 68 .

Next, under the control of the controller 90 , the supply valve 67 is opened, and the processing liquid is supplied to the corresponding processing unit 600A. However, since the drain valve 69 adjusts the processing liquid used for processing the substrate W, the drain valve 69 discharges the processing liquid in the pipe as necessary.

On the other hand, the substrate processing apparatus 1 can be switched to a cleaning mode, which is a mode for cleaning a piping structure including multiple valves 68 . The said switching is mainly performed by opening and closing of the valve in a piping structure, as shown below.

In the cleaning mode, first, under the control of the control unit 90 , at least one of the cabinet 30 , the cabinet 40 , the cabinet 50 , and a supply source of a treatment liquid (including pure water) not shown in the figure, the multi-valve A processing liquid used for cleaning the piping structure including (68) is supplied.

Next, under the control of the control unit 90 , in the fluid box to be cleaned (herein, referred to as the fluid box 60 ), a valve ( That is, at least one of the supply valve 62A, the supply valve 62B, the supply valve 62C, and the supply valve 62D) is opened, and the processing liquid is supplied to the multiple valves 68 .

At this time, the connection valve 66E provided in the connection pipe 64E, the connection valve 66F provided in the connection pipe 64F, and the connection valve 66G provided in the connection pipe 64G are opened, respectively. Accordingly, the processing liquid supplied to the fluid box 60 can be simultaneously supplied to the selection valve 68B, the selection valve 68C, the selection valve 68D, and the selection valve 68E of the multi-valve 68 .

Further, by closing at least one of the connection valve 66E, the connection valve 66F, and the connection pipe 64G, the selection valve 68B, the selection valve 68C, the selection valve 68D of the multi-valve 68 and It is also possible to clean only a part of the selection valve 68E.

Moreover, under the control of the control part 90, the opening and closing of at least one of the selection valve 68B, the selection valve 68C, the selection valve 68D, the selection valve 68E, and the selection valve 68F is adjusted, and the connection part Via 68A, the treatment liquid is supplied downstream of the multi-valve 68 .

Here, in at least one of the selection valve 68B, the selection valve 68C, the selection valve 68D, and the selection valve 68E located on the upstream side of the connection part 68A, (for example, at an interval of 2 seconds) If a rapid change in the flow velocity occurs due to repeated opening/closing operation, a water hammer that vibrates the pipe may occur due to the pressure fluctuation in the pipe. Moreover, the cavitation which foams may generate|occur|produce by the pressure fluctuation|variation in a pipe|tube.

This phenomenon can give a physical impact to the object to be cleaned in the cleaning mode, and can enhance the cleaning effect.

Further, under the control of the control unit 90 , the supply valve 67 is closed and the drain valve 69 is opened, and the processing liquid used for cleaning the multi-valve 68 is discharged.

In addition, the processing liquid that has flowed into the drain valve 69 may be circulated to a chemical liquid tank in which the same type of processing liquid is stored, or to a supply source (not shown). In this case, the amount of the processing liquid used in the cleaning mode can be reduced.

In addition, cleaning in the cleaning mode as described above is first performed using a chemical solution, and cleaning is performed by changing the processing liquid to be used to pure water (DIW), and finally, using the open valve 65, a multi-valve ( 68), you may use a method of sucking the inside of the pipe including. In addition, the cycle of supplying a rinse liquid (pure water) after supplying a chemical|medical solution, and also sucking the inside of a pipe may be repeated several times.

According to this method, the cleaning effect can be enhanced by washing away the substance to be cleaned remaining in the pipe with the chemical and pure water, and also sucking the chemical and pure water that may contain the substance to be cleaned. In addition, according to the experiments of the inventors, when suction is performed after washing with a chemical solution and pure water, compared to a case where washing with a chemical solution and pure water is performed for a long time (for example, 24 hours) without suction, the chemical solution and pure water It can be seen that the cleaning effect is higher when the cleaning using is performed for a short time (eg, 2 to 6 hours) and suction is performed after cleaning each time.

As described above, the substrate processing apparatus 1 can clean the piping structure including the multiple valves 68 in the cleaning mode. Accordingly, it is possible to remove the material to be cleaned remaining in the pipe and perform the substrate processing while maintaining a state with few impurities in the processing liquid in the substrate processing mode.

Here, a path through which the processing liquid formed in the washing mode is supplied is referred to as a washing path. In the above case, the cleaning path leads from one of the chemical liquid tanks to the multiple valves in the fluid box through the supply pipe, and the drain valve 69 (or the drain valve 79) located downstream of the multiple valves is It corresponds to the path leading to the installed piping. By closing the supply valve 67 , a cleaning path from the chemical liquid tank to the multiple valves is formed as a path not including the treatment liquid nozzle 20 .

In addition, in the cleaning mode, the chemical liquid tank for storing the processing liquid used for cleaning the piping structure is compatible with the chemical liquid tank for storing the processing liquid used for substrate processing. Therefore, there is no need to separately provide a chemical liquid tank for storing the treatment liquid used for cleaning the piping structure. In addition, if a plurality of chemical liquid tanks are provided, cleaning can be performed by using the plurality of chemical liquids separately depending on the substance to be cleaned.

It is also possible to simultaneously clean multiple valves 68 in a plurality of fluid boxes. Thereby, it becomes possible to shorten a washing|cleaning time. In addition, by supplying different chemical liquids to the fluid box, it is possible to efficiently compare the effects of the chemical liquids on the object to be cleaned, and the like.

In addition, if limited to only some fluid boxes, since substrate processing can be performed in the substrate processing mode in other fluid boxes, the substrate processing apparatus 1 as a whole can be cleaned without interrupting substrate processing.

Moreover, the supply pressure of the chemical|medical solution in a washing|cleaning mode may be varied according to the output adjustment of the pump in a cabinet, opening/closing adjustment of a valve, opening/closing adjustment of a selection valve, etc. in a cabinet.

In addition, in the cleaning mode, the processing liquid nozzle 20 may be moved by driving the actuator 22C so that the processing liquid nozzle 20 is retracted from above the substrate W, but the processing liquid nozzle 20 is It may remain located above the board|substrate W. In the cleaning mode, since the supply valve 67 is closed, the processing liquid used in the cleaning mode does not reach the processing unit 600 . Accordingly, even when the processing liquid nozzle 20 remains positioned above the substrate W, the substrate W is not contaminated by the processing liquid.

<About the modified example of the structure of a substrate processing apparatus>

FIG. 5 is a diagram illustrating a modified example of a structure connected to each processing unit 600 via a pipe among the configurations of the substrate processing apparatus 1A according to the present embodiment.

In FIG. 5, unlike the case in FIG. 3, in the fluid box 160, the supply valve other than the supply valve 62D, the connection pipe, and the connection valve are not provided. Similarly, in the fluid box 170, a supply valve other than the supply valve 72D and a connection valve are not provided. In addition, the supply valve 62D and the supply valve 72D may be provided in the upstream of the corresponding fluid box.

Instead, corresponding piping and valves are provided downstream of each cabinet and upstream of the fluid box.

That is, in the supply pipe 39 downstream of the cabinet and upstream of the fluid box, a supply valve 162A is provided, and in the supply pipe 49 downstream of the cabinet and upstream of the fluid box, supply A valve 162B is provided, and in the supply pipe 59 downstream of the cabinet and upstream of the fluid box, a supply valve 162C is provided.

Moreover, the connection pipe 164E is provided downstream of the supply valve 162A and the supply valve 162B. WHEREIN: The piping in which the supply valve 162A is provided, and the piping in which the supply valve 162B is provided, and it is provided.

Moreover, the connection pipe 164F is provided downstream of the supply valve 162B and the supply valve 162C. WHEREIN: The piping in which the supply valve 162B is provided, and the piping in which the supply valve 162C is provided, and it is provided.

In addition, the connecting pipe 164G is provided downstream of the supply valve 162C over the pipe and the supply pipe 100 in which the supply valve 162C is provided.

Moreover, the connection valve 166E is provided in the connection pipe 164E. Moreover, the connection valve 166F is provided in the connection pipe 164F. A connection valve 166G is provided in the connection pipe 164G.

In such a configuration, processing is performed while switching between the substrate processing mode and the cleaning mode as in the case of FIG. 3 .

Specifically, in the substrate processing mode, under the control of the control unit 90 , a valve ( That is, the supply valve 162A) is opened, and the processing liquid is supplied to the fluid box 160 .

At this time, the connection valve 166E, the connection valve 166F, and the connection valve 166G are closed, respectively.

Next, under the control of the controller 90 , the supply valve 67 is opened, and the processing liquid is supplied to the corresponding processing unit 600A.

On the other hand, in the cleaning mode, the cabinet (herein, referred to as the cabinet 30 ) for storing the processing liquid used for cleaning the piping structure including the multiple valves 68 is supported under the control of the control unit 90 . A valve (ie, the supply valve 162A) is opened, and the processing liquid is supplied to the fluid box 160 .

At this time, the connection valve 166E, the connection valve 166F, and the connection valve 166G are open, respectively. Accordingly, the processing liquid supplied to the fluid box 160 can be simultaneously supplied to the selection valve 68B, the selection valve 68C, the selection valve 68D, and the selection valve 68E of the multiple valves 68 .

Next, under the control of the controller 90 , the supply valve 67 is closed and the drain valve 69 is opened, and the processing liquid used for cleaning the multi-valve 68 is discharged.

As described above, the substrate processing apparatus 1A can clean the piping structure including the multiple valves 68 in the cleaning mode.

Moreover, in addition to the effect exhibited by the substrate processing apparatus shown in Fig. 3, by providing the connection pipe and the connection valve on the upstream side of each fluid box, compared to the case where these structures are provided in each fluid box, The configuration can be simplified.

FIG. 6 is a diagram illustrating another modified example of a structure connected to each processing unit 600 via a pipe among the configurations of the substrate processing apparatus 1B according to the present embodiment. In addition, in FIG. 6, part illustration is abbreviate|omitted about the structure similar to the structure shown in FIG.

In FIG. 6, unlike the case in FIG. 3, any one supply valve (ie, supply valve 62A, supply valve 62B, supply valve 62C) and supply valve 62D in the fluid box 260. )), a supply pipe 239 for supplying a chemical solution used for cleaning the pipe structure is connected downstream of the pipe in which the pipe is installed. Similarly, any one of the supply valves in the fluid box 270 (that is, any one of the supply valve 72A, the supply valve 72B, the supply valve 72C, and the supply valve 72D) of the piping is installed. Downstream, a supply pipe 239 for supplying a chemical solution used for cleaning the pipe structure is connected. In addition, the supply piping 239 may be piping connected at the position upstream from each fluid box.

Then, the supply pipe 239 is connected to the cleaning cabinet 230 on the upstream side. The cleaning cabinet 230 includes a chemical liquid tank 232 , a valve 234 , a pump 236 , and a filter 238 . The chemical liquid tank 232 stores a chemical liquid used for cleaning a piping structure including multiple valves. The valve 234 , the pump 236 , and the filter 238 are installed in a supply pipe 239 , which is a pipe connected to the chemical liquid tank 232 , respectively.

The chemical liquid stored in the chemical liquid tank 232 is similarly operated under the control of the control unit 90 while the valve 234 whose opening/closing is adjusted by the control of the control unit 90 is open. It flows through the supply pipe 239 while passing through the filter 238 and flows into the downstream fluid box 260 . Further, by opening the supply valve 240 in the fluid box 260 (or the supply valve 241 in the fluid box 270), the multi-valve 68 (or the multi-valve 78) drug is supplied.

Further, the fluid box 260 is provided with a circulation pipe 264 , which is a pipe further branching from the pipe in which the drain valve 69 is installed. A circulation valve 262 is installed in the circulation pipe 264, and by controlling the opening and closing operations of the drain valve 69 and the circulation valve 262 under the control of the control unit 90, the chemical liquid used for cleaning is drained. You can choose to cycle through.

Similarly, the fluid box 270 is provided with a circulation pipe 274 , which is a pipe further branching from the pipe in which the drain valve 79 is installed. A circulation valve 272 is installed in the circulation pipe 274, and by controlling the opening and closing operations of the drain valve 79 and the circulation valve 272 under the control of the control unit 90, the chemical liquid used for cleaning is drained. You can choose to cycle through.

As described above, the substrate processing apparatus 1B can clean the piping structure including the multiple valves 68 in the cleaning mode.

Further, in addition to the effect exhibited by the substrate processing apparatus shown in FIG. 3 , a chemical liquid used for cleaning is provided by providing a dedicated chemical liquid tank 232 for storing a chemical liquid for cleaning the piping structure including multiple valves. The type and concentration of , etc. do not depend on the substrate processing. Accordingly, the degree of freedom of the supplied chemical is increased.

Here, in the above cleaning mode, the multiple valves to be cleaned may be removed from the inside of the fluid box and cleaned at a separate location.

7 is a diagram showing an example of the configuration of the cabinet 330 configured to accommodate the multiple valves 68 removed in the cleaning mode.

As an example is shown in FIG. 7 , the cabinet 330 includes a chemical liquid tank 332 , a valve 331 , a valve 333 , a valve 334 , a valve 335 , and a pump 336 . and an open valve 337 , a filter 338 , a supply pipe 339 , a circulation pipe 402 , a supply pipe 404 , a supply pipe 406 , a supply pipe 408 , and A supply pipe 410 , a supply pipe 414 , and a connection pipe 412 are provided.

The chemical liquid tank 332 stores the chemical liquid used for processing the substrate W, the chemical liquid used for cleaning the multi-valve 68 , or pure water used for cleaning the multi-valve 68 . The chemical liquid is supplied from the chemical liquid supply source when the valve 331 is opened, and the pure water is supplied from the pure water supply source when the valve 333 is opened.

The valve 335 , the opening valve 337 , the pump 336 , and the filter 338 are respectively installed in the supply pipe 414 connected to the multiple valve 68 from the chemical liquid tank 332 . In addition, the valve 334 is provided in the circulation pipe 402 branching from the supply pipe 414 upstream of the valve 335 . The circulation pipe 402 circulates the chemical liquid flowing through the supply pipe 414 to the chemical liquid tank 332 .

A supply pipe 404 , a supply pipe 406 , a supply pipe 408 , and a supply pipe 410 branching from the supply pipe 414 are connected to the upstream side of the mounted multiple valve 68 , and the supply pipe 410 is connected A connecting pipe 412 is provided over the pipe 404 , the supply pipe 406 , the supply pipe 408 , and the supply pipe 410 .

In addition, a pipe 340 for draining or circulating the processing liquid used for cleaning the multiple valve 68 is connected to the downstream side of the mounted multiple valve 68 .

In the substrate processing mode, in a state in which the valve 335 is closed and the valve 334 is opened, the chemical liquid used for processing the substrate W is supplied from the chemical liquid tank 332 to the supply pipe 414 and the circulation pipe. Through 402 and a supply pipe 339, it is supplied to the downstream fluid box. At this time, the multiple valve 68 is mounted in the downstream fluid box.

On the other hand, in the cleaning mode, in a state in which the valve 334 is closed and the valve 335 is opened, the chemical liquid used for cleaning the multiple valve 68 is supplied from the chemical liquid tank 332 to the supply pipe 414, It is supplied to the multi-valve 68 through the connecting pipe 412 , the supply pipe 404 , the supply pipe 406 , the supply pipe 408 , and the supply pipe 410 . Thereafter, the chemical liquid is drained or recovered from the pipe 340 connected downstream of the multi-valve 68 .

In addition, in the cleaning mode, in a state in which the valve 334 is closed and the valve 335 is opened, the pure water used for cleaning the multiple valve 68 is supplied from the chemical liquid tank 332 to the supply pipe 414, It may be supplied to the multi-valve 68 through the connecting pipe 412 , the supply pipe 404 , the supply pipe 406 , the supply pipe 408 , and the supply pipe 410 . After that, the inside of the pipe including the multiple valves 68 may be sucked using the opening valve 337 .

As described above, in the cabinet 330 in the cleaning mode, the piping structure including the multi-valve 68 can be cleaned.

Further, in addition to the effect exhibited by the substrate processing apparatus shown in FIG. 3 , by removing the multiple valve 68 and arranging it in the vicinity of the chemical liquid tank 332 , the configuration of the substrate processing apparatus is useful and piping for cleaning The structure is short and simple, and the time for cleaning can be shortened.

Here, a cleaning unit, which is a dedicated unit for cleaning the multiple valves, may be provided separately from the substrate processing apparatus.

FIG. 8 is a diagram illustrating an example of the configuration of a cleaning unit 80 , configured to accommodate multiple valves 68 .

As an example is shown in FIG. 8 , the cleaning unit 80 includes a chemical liquid tank 82 , a valve 81 , a valve 83 , a valve 84 , a valve 85 , and a pump 86 . ), an opening valve 87 , a filter 88 , an opening valve 89 , a supply pipe 502 , a circulation pipe 514 , a supply pipe 506 , and a supply pipe 508 , and , a supply pipe 510 , a supply pipe 512 , a connection pipe 504 , and a drain pipe 516 .

In the chemical liquid tank 82 , the chemical liquid used for cleaning the multi-valve 68 is stored. The chemical liquid is supplied to the multi-valve 68 by opening the valve 81 . Further, pure water is supplied from the pure water supply source to the multiple valves 68 by opening the valve 83 .

The opening valve 87 , the pump 86 , and the filter 88 are respectively installed in the supply pipe 502 that supplies the chemical liquid or pure water to the mounted multiple valve 68 . Here, the opening valve 87 is used for suction in the piping.

A supply pipe 506 , a supply pipe 508 , a supply pipe 510 , and a supply pipe 512 each branching from the supply pipe 502 are connected to the upstream side of the mounted multi-valve 68 , and further, the supply pipe 512 is connected. A connecting pipe 504 is provided over the pipe 506 , the supply pipe 508 , the supply pipe 510 , and the supply pipe 512 .

Also, downstream of the mounted multi-valve 68 , a valve 85 is provided in the drain pipe 516 for draining the processing liquid used for cleaning the multi-valve 68 , and the multi-valve 68 is cleaned. A valve 84 is installed in the circulation pipe 514 for circulating the chemical solution used in the chemical solution tank 82 . Here, the opening valve 89 is used for suction in the pipe downstream of the multi-valve 68 .

In the cleaning unit 80 , a cleaning path for cleaning the mounted multiple valve 68 is formed by a cleaning pipe. Here, in the example of FIG. 8 , the washing pipe is downstream from the chemical liquid tank 82 , the supply pipe 502 , the supply pipe 506 , the supply pipe 508 , the supply pipe 510 , and the supply pipe ( 512 , and piping extending from the chemical liquid tank 82 upstream to the circulation pipe 514 and the drain pipe 516 . The cleaning pipe is configured to be detachable with respect to the multiple valves (68).

Also, downstream of the mounted multi-valve 68 , a valve 85 is provided in the drain pipe 516 for draining the processing liquid used for cleaning the multi-valve 68 , and the multi-valve 68 is cleaned. A valve 84 is installed in the circulation pipe 514 for circulating the chemical solution used in the chemical solution tank 82 . Here, the opening valve 89 is used for suction in the pipe downstream of the multi-valve 68 .

When the cleaning unit 80 is used to clean the multiple valves 68 , the chemical liquid and, if necessary, pure water is supplied to the multiple valves 68 from the chemical liquid tank 82 . Then, when the chemical liquid used for cleaning is circulated to the chemical liquid tank 82 , the valve 84 is opened and the valve 85 is closed. On the other hand, when draining the chemical or pure water used for washing, the valve 84 is closed and the valve 85 is opened.

In particular, after washing with a chemical solution and after washing with pure water is performed, suction in the pipe is performed by the opening valve 87 and the opening valve 89 on both the upstream side and the downstream side of the multi-valve 68 . The cleaning effect can be enhanced by sucking the chemical and pure water that may contain the substance to be cleaned. Moreover, the washing|cleaning effect can be improved by repeating the said cycle several times.

As described above, the piping structure including the multi-valve 68 can be cleaned by using the cleaning unit 80 .

Further, in addition to the effect exhibited by the substrate processing apparatus shown in Fig. 3, since the multi-valve 68 is removed and the cleaning is performed in the cleaning unit 80 provided for cleaning the multi-valve 68, cleaning The type and concentration of the chemical to be used does not depend on the substrate treatment. Accordingly, the degree of freedom of the supplied chemical is increased.

<About the effect produced by the embodiment described above>

Next, an example of the effect produced by the embodiment described above is shown. In addition, in the following description, although the said effect is described based on the specific structure in which the example was shown in the embodiment described above, within the range in which the same effect arises, it may be substituted by the other specific structure shown in this specification. That is, in the following, for convenience, only one of the corresponding specific configurations may be representatively described, but the representatively described specific configuration may be substituted with another corresponding specific configuration.

According to the embodiment described above, the substrate processing apparatus includes a tank for supplying a chemical solution, a multiple valve 68 (or multiple valve 78 ), and a processing solution nozzle 20 . Here, the tank corresponds to, for example, at least one of the chemical liquid tank 32 , the chemical liquid tank 42 , the chemical liquid tank 52 , the chemical liquid tank 232 , the chemical liquid tank 332 , and the like. The multiple valve 68 is supplied with a plurality of types of processing liquids for processing the substrate W. In addition, the multiple valve 68 selectively supplies at least one of a plurality of types of processing liquids. The processing liquid nozzle 20 processes the substrate W using the processing liquid supplied from the multi-valve 68 . Here, the substrate processing apparatus is switchable between a substrate processing mode for processing the substrate W and a cleaning mode for cleaning at least the multiple valves 68 . In the substrate processing mode, the substrate W is processed by the processing liquid supplied to the processing liquid nozzle 20 . In the cleaning mode, the chemical liquid is supplied from the chemical liquid tank 32 to the multi-valve 68 in the cleaning path that is a path through the chemical liquid tank 32 and the multi-valve 68 without passing through the treatment liquid nozzle 20 . .

According to this configuration, the multi-valve 68 can be effectively cleaned by supplying the chemical to the cleaning path that does not pass through the treatment liquid nozzle 20 . In addition, since the processing liquid nozzle 20 is not included in the cleaning path, the chemical liquid is not discharged from the processing liquid nozzle 20 in the cleaning mode, and the substrate W is not contaminated with the chemical liquid. none.

In addition, the same effect can be produced even if it is a case where another structure in which the example was shown in this specification is added suitably to the said structure, that is, other structure in this specification which was not mentioned as said structure is added suitably as said structure.

Moreover, according to the embodiment described above, the chemical liquid is one of a plurality of types of treatment liquids. According to this configuration, the chemical liquid supplied from the chemical liquid tank used for processing the substrate W can be diverted for cleaning the multi-valve 68 , so a separate chemical liquid tank is prepared for cleaning the multi-valve 68 . no need to do

Further, according to the embodiment described above, the substrate processing apparatus includes a plurality of supply pipes to which the chemical solution is supplied at positions downstream of the chemical solution tank 32 and upstream of the multiple valve 68 in the cleaning path; , at least one connecting pipe connected across the plurality of supply pipes. Here, the supply piping includes, for example, the supply piping 39 , the supply piping 49 , the supply piping 59 , the supply piping 100 , the supply piping 404 , the supply piping 406 , and the supply piping 408 . ), the supply pipe 410 and the like. In addition, the connection piping is, for example, the connection piping 64E, the connection piping 64F, the connection piping 64G, the connection piping 74E, the connection piping 74F, the connection piping 74G, and the connection piping 164E. ), the connecting pipe 164F, the connecting pipe 164G, the connecting pipe 412, and the like. According to this configuration, the chemical solution can be simultaneously supplied to the plurality of supply pipes connected to the multiple valves 68 through the connecting pipes. Accordingly, it is possible to simultaneously clean a plurality of supply pipes connected to the multiple valves 68, thereby shortening the cleaning time.

Moreover, according to the embodiment described above, the connection pipe is accommodated in a housing (for example, the fluid box 60 , the fluid box 70 , the cabinet 330 , etc.) accommodating the multiple valves 68 . According to this configuration, it is possible to perform processing by switching the substrate processing mode and the cleaning mode for each fluid box 60 . Therefore, as for the substrate processing apparatus 1 as a whole, the interruption time of a substrate processing can be shortened.

Moreover, according to the embodiment described above, the connection pipe 412 is accommodated in the cabinet 330 accommodating the chemical liquid tank 332 and the multiple valve 68 . According to this configuration, the multiple valve 68 , the chemical liquid tank 332 , and the connection pipe 412 are accommodated in the cabinet 330 , so that the configuration of the substrate processing apparatus is useful and the piping structure for cleaning is shortened and simplified. , the time for cleaning can be shortened.

Moreover, according to the embodiment described above, the multiple valve 68 is provided with the some selection valve which opens and closes each of the some supply piping. Here, the selection valve is, for example, the selection valve 68B, the selection valve 68C, the selection valve 68D, the selection valve 68E, the selection valve 68F, the selection valve 78B, and the selection valve 78C. ), the selection valve 78D, the selection valve 78E, the selection valve 78F, and the like.

In the cleaning mode, at least one of the plurality of supply pipes is opened and closed by a corresponding selection valve. According to this configuration, when a sudden change in the flow velocity occurs due to the opening/closing operation of the selection valve, a water hammer that vibrates the pipe may occur due to the pressure fluctuation in the pipe. Moreover, the cavitation which foams may generate|occur|produce by the pressure fluctuation|variation in a pipe|tube. By these phenomena, a physical impact can be given to the object to be cleaned, and the cleaning effect can be enhanced.

Moreover, according to the embodiment described above, in the cleaning mode, the chemical liquid circulates in the cleaning path. According to this structure, the amount of the chemical|medical solution used for washing|cleaning can be reduced.

Further, according to the embodiment described above, the substrate processing apparatus includes a rinse liquid supply source (eg, a pure water supply source) for supplying the rinse liquid, and a suction unit that sucks the inside of the multi-valve 68 . Here, the suction part corresponds to at least one of the opening valve 65, the opening valve 75, the opening valve 337, and the like, for example. In the cleaning mode, the rinse liquid is supplied to the multi-valve 68 after circulation of the chemical in the cleaning path, and the inside of the multi-valve 68 is sucked by the open valve 65 . According to this configuration, the cleaning effect can be enhanced by washing away the substance to be cleaned remaining in the pipe with the chemical and pure water, and sucking the chemical and pure water that may contain the substance to be cleaned.

Further, according to the embodiment described above, in the cleaning mode, the circulation of the chemical in the cleaning path, the supply of the rinse liquid after the circulation of the chemical, and the suction in the multi-valve 68 after the supply of the rinse liquid are repeated a plurality of times. do. According to this configuration, the cleaning effect can be increased by repeating the cycle of washing out the substance to be cleaned remaining in the pipe with the chemical and pure water, and also sucking the chemical and pure water that may contain the substance to be cleaned. have.

Moreover, according to the embodiment described above, in the cleaning mode, the supply pressure of the chemical solution fluctuates. According to such a configuration, when a sudden change in the flow velocity occurs, a water hammer that vibrates the pipe may occur due to the pressure fluctuation in the pipe. Moreover, the cavitation which foams may generate|occur|produce by the pressure fluctuation|variation in a pipe|tube. By such a phenomenon, a physical impact can be given to the object to be cleaned, and the cleaning effect can be enhanced.

According to the embodiment described above, the cleaning unit includes a tank for supplying a chemical solution and a cleaning pipe. Here, the tank corresponds to the chemical liquid tank 82 or the like, for example. The cleaning piping forms a cleaning path, which is a path for cleaning at least the multiple valves 68 . The cleaning path interposes the chemical liquid tank 82 . The multi-valve 68 is cleaned by the chemical liquid supplied from the chemical liquid tank 82 in the cleaning path. In addition, the cleaning pipe is detachable with respect to the multiple valve (68).

According to this configuration, it is possible to effectively clean the multiple valves 68 by supplying the chemical solution to the cleaning path. In addition, since the multi-valve 68 is removed and cleaning is performed in the cleaning unit 80 provided for cleaning the multi-valve 68, the type and concentration of the chemical solution used for cleaning does not depend on the substrate treatment. Accordingly, the degree of freedom of the supplied chemical is increased.

In addition, unless there is a special limitation, the order in which each process is performed can be changed.

In addition, the same effect can be produced even if it is a case where another structure in which the example was shown in this specification is added suitably to the said structure, that is, other structure in this specification which was not mentioned as said structure is added suitably as said structure.

Further, according to the embodiment described above, the cleaning unit includes a plurality of supply pipes 506 to which the chemical liquid is supplied at a position downstream of the chemical liquid tank 82 and upstream of the multiple valve 68 in the cleaning path. ) (or a supply pipe 508 , a supply pipe 510 , and a supply pipe 512 ), and at least one connecting pipe 504 connected over a plurality of supply pipes. According to this configuration, the chemical solution can be simultaneously supplied to the plurality of supply pipes connected to the multiple valves 68 through the connecting pipes. Accordingly, it is possible to simultaneously clean a plurality of supply pipes connected to the multiple valves 68, thereby shortening the cleaning time.

Moreover, according to the embodiment described above, the multiple valve 68 is provided with the some selection valve which opens and closes each of the some supply piping. And at least one of the plurality of supply pipes is opened and closed by the corresponding selection valve. According to this configuration, when a sudden change in the flow velocity occurs due to the opening/closing operation of the selection valve, a water hammer that vibrates the pipe may occur due to the pressure fluctuation in the pipe. Moreover, the cavitation which foams may generate|occur|produce by the pressure fluctuation|variation in a pipe|tube. By these phenomena, a physical impact can be given to the object to be cleaned, and the cleaning effect can be enhanced.

Moreover, according to the embodiment described above, the chemical liquid circulates in the washing path. According to this structure, the amount of the chemical|medical solution used for washing|cleaning can be reduced.

Further, according to the embodiment described above, the cleaning unit includes a rinse liquid supply source (eg, a pure water supply source) for supplying the rinse liquid, and a suction unit that sucks the inside of the multi-valve 68 . Here, the suction part corresponds to at least one of the opening valve 87 and the opening valve 89, for example. After circulation of the chemical liquid in the cleaning path, the rinse liquid is supplied to the multi-valve 68 , and the inside of the multi-valve 68 is sucked by the open valve 87 . According to this configuration, the cleaning effect can be enhanced by washing away the substance to be cleaned remaining in the pipe with the chemical and pure water, and sucking the chemical and pure water that may contain the substance to be cleaned.

In addition, according to the embodiment described above, circulation of the chemical solution in the cleaning path, supply of the rinse solution after circulation of the chemical solution, and suction in the multi-valve 68 after supply of the rinse solution are repeated a plurality of times. According to this configuration, the cleaning effect can be increased by repeating the cycle of washing out the substance to be cleaned remaining in the pipe with the chemical and pure water, and also sucking the chemical and pure water that may contain the substance to be cleaned. have.

<About the modified example of the embodiment described above>

In the embodiments described above, the dimensions, shapes, relative arrangement relationships, implementation conditions, etc. of each component are also described in some cases, but these are examples in all aspects and are not intended to be limiting.

Accordingly, countless modifications and equivalents for which examples are not shown are contemplated within the scope of the technology disclosed in this specification. For example, a case in which at least one component is deformed, added, or omitted is included.

In addition, in the embodiment described above, when a material name etc. are described without particular designation, unless there is a contradiction, other additives are included in the material, for example, an alloy, etc. are included.

1, 1A, 1B: substrate processing apparatus
10: spin chuck
10A: spin base
10C: axis of rotation
10D: Spin Motor
12: processing cup
20: treatment liquid nozzle
22: nozzle arm
22A: arm
22B: axis
22C: Actuator
30, 40, 50, 330: cabinet
32, 42, 52, 82, 232, 332: chemical tank
34, 44, 54, 81, 83, 84, 85, 234, 331, 333, 334, 335: valve
36, 46, 56, 86, 236, 336: pump
38, 48, 58, 88, 238, 338: filter
39, 49, 59, 61, 71, 100, 239, 339, 404, 406, 408, 410, 414, 502, 506, 508, 510, 512: supply piping
60, 70, 160, 170, 260, 270: fluid box
62A, 62B, 62C, 62D, 67, 72A, 72B, 72C, 72D, 77, 162A, 162B, 162C, 240, 241: supply valve
64E, 64F, 64G, 74E, 74F, 74G, 164E, 164F, 164G, 412, 504: Connection piping
65, 75, 87, 89, 337: open valve
66E, 66F, 66G, 76E, 76F, 76G, 166E, 166F, 166G: Connection valve
68, 78: multiple valves
68A, 78A: connection
68B, 68C, 68D, 68E, 68F, 78B, 78C, 78D, 78E, 78F: Selector valve
69, 79: drain valve
80: cleaning unit
90: control unit
91: CPU
92: ROM
93: RAM
94: recording device
94P: processing program
95: bus line
96: input unit
97: display unit
98: communication department
180: chamber
230: cleaning cabinet
262, 272: circulation valve
264, 274, 402, 514: circulation piping
340: plumbing
516: drain pipe
600, 600A, 600B: processing unit
601: road port
602: indexer robot
603: center robot
604: substrate mounting unit

Claims (17)

a tank for supplying the chemical;
Multiple valves to which a plurality of types of processing liquids for processing the substrate are supplied, and to selectively supply at least one of the plurality of types of processing liquids;
and a processing liquid nozzle for processing the substrate using the processing liquid supplied from the multiple valves;
switchable between a substrate processing mode for processing the substrate and a cleaning mode for cleaning at least the multiple valves,
In the substrate processing mode, the substrate is processed by the processing liquid supplied to the processing liquid nozzle,
In the cleaning mode, in a cleaning path that is a path through the tank and the multiple valves without passing through the treatment liquid nozzle, the chemical solution is supplied from the tank to the multiple valves,
substrate processing equipment. The method according to claim 1,
The substrate processing apparatus, wherein the chemical liquid is one of a plurality of types of the processing liquid. The method according to claim 1 or 2,
at a location downstream of the tank and upstream of the multiple valves in the cleaning path,
a plurality of supply pipes to which the chemical solution is supplied;
The substrate processing apparatus further comprising at least one connecting pipe connected across the plurality of supply pipes. 4. The method according to claim 3,
The connection pipe is accommodated in a housing accommodating the multiple valves. 4. The method according to claim 3,
The connection pipe is accommodated in a housing accommodating the tank and the multiple valves. 4. The method according to claim 3,
The multi-valve includes a plurality of selection valves for opening and closing each of the plurality of supply pipes,
In the cleaning mode, at least one of the plurality of supply pipes is opened and closed by the corresponding selection valve. The method according to claim 1 or 2,
In the cleaning mode, the chemical liquid circulates in the cleaning path. 8. The method of claim 7,
a rinsing solution supply source for supplying the rinsing solution;
Further comprising a suction unit for sucking the inside of the multi-valve,
In the cleaning mode, the rinse liquid is supplied to the multiple valves after circulation of the chemical solution in the cleaning path, and the inside of the multiple valves is sucked by the suction unit. 9. The method of claim 8,
In the cleaning mode, circulation of the chemical solution in the cleaning path, supply of the rinse solution after circulation of the chemical solution, and suction in the multi-valve after supply of the rinse solution are repeated a plurality of times, the substrate processing apparatus . The method according to claim 1 or 2,
In the cleaning mode, the supply pressure of the chemical solution fluctuates. a tank for supplying the chemical;
a cleaning pipe for forming a cleaning path that is a path for cleaning at least multiple valves;
The multi-valve may supply a plurality of types of treatment liquid, and selectively supply at least one of the plurality of types of treatment liquid,
The cleaning path is through the tank,
The multi-valve is cleaned by the chemical solution supplied from the tank in the cleaning path,
The cleaning pipe is detachable for the multi-valve,
cleaning unit. 12. The method of claim 11,
at a location downstream of the tank and upstream of the multiple valves in the cleaning path,
a plurality of supply pipes to which the chemical solution is supplied;
The cleaning unit further comprising at least one connecting pipe connected across the plurality of supply pipes. 13. The method of claim 12,
The multi-valve includes a plurality of selection valves for opening and closing each of the plurality of supply pipes,
at least one of the plurality of supply pipes is opened and closed by the corresponding selection valve. 14. The method according to any one of claims 11 to 13,
a cleaning unit in which the chemical liquid circulates in the cleaning path. 14. The method according to any one of claims 11 to 13,
a rinsing solution supply source for supplying the rinsing solution;
Further comprising a suction unit for sucking the inside of the multi-valve,
The cleaning unit, wherein the rinse liquid is supplied to the multi-valve after circulation of the chemical solution in the cleaning path, and the inside of the multi-valve is sucked by the suction unit. 16. The method of claim 15,
The cleaning unit, wherein circulation of the chemical liquid in the cleaning path, supply of the rinse liquid after circulation of the chemical liquid, and suction in the multi-valve after supply of the rinse liquid are repeated a plurality of times. A multi-valve cleaning method for cleaning multiple valves connected to a substrate processing apparatus in a state in which a plurality of types of processing liquids for processing a substrate are supplied, and at least one of the plurality of types of processing liquids can be selectively supplied, the method comprising:
The substrate processing apparatus,
a tank for supplying the chemical;
and a processing liquid nozzle for processing the substrate using the processing liquid supplied from the multiple valves;
The substrate processing apparatus is switchable between a substrate processing mode for processing the substrate and a cleaning mode for cleaning at least the multi-valve,
In the substrate processing mode, the substrate is processed by the processing liquid supplied to the processing liquid nozzle,
In the cleaning mode, in a cleaning path that is a path through the tank and the multiple valves without passing through the treatment liquid nozzle, the chemical is supplied from the tank to the multiple valves;
in the cleaning mode, cleaning the multiple valves;
Multiple valve cleaning methods.

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