KR101008343B1 - Apparatus of processing substrate and method of processing substrate using the same - Google Patents

Abstract

The substrate processing apparatus according to the present invention includes a process processing unit for processing a substrate using a fluid, a common line connected to the nozzle for discharging the fluid to the substrate side, at least two fluid supply units for providing different fluids to the process processing unit, Fluid supply lines connected to each of the fluid supplies, and a divert valve. The directional valve is connected to the fluid supply lines and the common line and selects some of the fluids provided from the fluid supply lines to transfer to the common line side. Since the nozzle is combined with the common line through which different fluids can flow, even if only one nozzle is provided in the substrate processing apparatus, the substrate can be processed using at least two different fluids, thereby simplifying the structure of the substrate processing apparatus. You can.

Description

Substrate processing apparatus and substrate processing method using same {APPARATUS OF PROCESSING SUBSTRATE AND METHOD OF PROCESSING SUBSTRATE USING THE SAME}

The present invention relates to a substrate processing apparatus and a substrate processing method using the same, and more particularly, to a substrate processing apparatus for processing a substrate using a fluid and a substrate processing method using the same.

The substrate processing apparatus loads the semiconductor substrate in a single wafer type, and then loads the substrate on the substrate support unit, rotates the substrate support unit, and simultaneously supplies the substrate treatment material to the substrate seated on the substrate support unit, thereby providing a predetermined process for the semiconductor substrate. Do this.

The substrate treating material is provided to the substrate side by a nozzle. The type of substrate treating material provided to the substrate side may vary according to a process performed on the substrate, so that a plurality of different substrate treating materials may be provided in the substrate treating apparatus.

In the case where a plurality of different substrate processing materials are provided in the substrate processing apparatus, nozzles corresponding to the number of substrate processing materials are generally provided in the substrate processing apparatus, so that the arm is combined with any one of the nozzles. The combined nozzle is moved to the substrate side. Due to the operation of the arm, a space for the operation of the arm must be secured in the substrate processing apparatus, and the operation of the fluid supply apparatus must be precisely controlled.

An object of the present invention is to provide a substrate processing apparatus having a simpler structure and a substrate processing method using the same.

In order to achieve the above object, a substrate processing apparatus according to the present invention includes a process processing unit for processing a substrate using a fluid, a nozzle for discharging the fluid to the substrate side, a common line connected to the nozzle, and different fluids to the process processing unit side. At least two fluid supply parts providing fluids, fluid supply lines connected to each of the fluid supplies, and some of fluids connected to the fluid supply lines and the common line and provided from the fluid supply lines. It includes a direction switching valve for transmitting to the common line side.

In the substrate processing method for treating a substrate by using fluids provided from fluid supply units different from each other, the substrate processing method according to the present invention to achieve the above object is as follows. A first fluid provided from any one of the fluid supply parts is provided to the substrate side through a direction change valve, a common line connected to the direction change valve, and a nozzle connected to the common line, and the substrate is formed using the first fluid. To process.

A second fluid different from the first fluid provided from one of the fluid supply parts is provided to the substrate side through the diverter valve, the common line, and the nozzle, and the substrate is connected to the substrate using the second fluid. Process.

According to the invention, even if at least two different fluids are used to process the substrate, the nozzle for discharging the fluid to the substrate side is combined with a common line through which various fluids can flow. Therefore, even if only one nozzle is provided in the substrate processing apparatus, at least two different fluids can be used to process the substrate. As a result, the structure of the substrate processing apparatus can be further simplified.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The objects, features and effects of the present invention described above will be readily understood through embodiments related to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be applied and modified in various forms. Rather, the following embodiments are provided to clarify the technical spirit disclosed by the present invention, and furthermore, to fully convey the technical spirit of the present invention to those skilled in the art having an average knowledge in the field to which the present invention belongs. Therefore, the scope of the present invention should not be construed as limited by the embodiments described below. On the other hand, the drawings presented in conjunction with the following examples are somewhat simplified or exaggerated for clarity, the same reference numerals in the drawings represent the same components.

1 is a view showing a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the substrate processing apparatus 10 may include a process processor 100, a first fluid supply part 200, a second fluid supply part 210, a cleaning liquid supply part 220, a gas supply part 230, and a nozzle 160. ), And a diverter valve (150).

The process processor 100 includes a housing 110, a spin head 120, and a driver 130. The housing 110 provides a space for cleaning the substrate W therein. The housing 110 may have a cylindrical shape with an open upper portion, and the substrate W may enter and exit the inside of the housing 110 through the upper portion of the housing 110.

The spin head 120 may have a circular plate shape for supporting the substrate W, and a plurality of chucking pins (not shown) and a plurality of chucking pins supporting the substrate W are disposed on the spun head 120. Support pins (not shown) are provided. The spin head 120 is coupled to the driving unit 130 and rotates by the power of the driving unit 130.

The first fluid supply part 200 provides a first fluid (204 of FIG. 2) used to process the substrate W to the process processor 100. In more detail, the first fluid supply unit 200 provides the first fluid to the process processor 100 through the first fluid supply line 201 and the common line 151, and the first fluid It is discharged through the nozzle 160. The first fluid supply line 201 may be provided with a first pump 202 and a first valve 203 for controlling the flow of the first fluid.

The second fluid supply unit 210 provides a second fluid (214 of FIG. 5) used to process the substrate W to the process processor 100. The second fluid may include a material different from the first fluid, and the second fluid supply part 210 may pass the second fluid through the second fluid supply line 211 and the common line 151 to the process processor. 100, and the second fluid is discharged through the nozzle 160. The second fluid supply line 202 may be provided with a second pump 212 and a second valve 213 for controlling the flow of the second fluid.

The cleaning solution supply unit 220 provides a cleaning solution for cleaning the inside of the common line 151 through the cleaning solution supply line 221. The cleaning liquid has a property of dissolving the first fluid and the second fluid. For example, the cleaning liquid may include a material such as thinner. The cleaning liquid supply line 221 may be provided with a third pump 222 and a third valve 223 for controlling the flow of the cleaning liquid.

The gas supply unit 230 provides a purge gas into the common line 151 through a gas supply line 231. The purge gas includes an inert gas that does not react with the fluid used to treat the substrate, such as nitrogen gas. In addition, the gas supply line 231 may be provided with a fourth pump 232 and a fourth valve 233 for controlling the flow of the purge gas.

On the other hand, one end 153 of the diverter valve 150 is coupled to the common line 151, the other end 152 of the diverter valve 150 is the first fluid supply line 201, 2 is coupled to the fluid supply line 211, the cleaning liquid supply line 221, and the gas supply line 231. The diverter valve 150 has a switching line 155 to selectively receive any one of a plurality of fluids provided through a plurality of lines coupled to the other end 152 to the common line ( 151) to the side. Therefore, according to the function of the divert valve 150, the other end 152 of the divert valve 150 is coupled with the lines corresponding to the number of types of fluid, the divert valve 150 One end 153 of) is combined with one common line 151.

Since the structure and function of the directional valve 150 to selectively transmit only one of the fluids provided through the plurality of lines 201, 211, 221, 231 to the common line 151 side is a general technical matter, Detailed description thereof will be omitted.

On the other hand, as described above, the first and the second fluid provided from the first fluid supply unit 200 and the second fluid supply unit 210 are different from each other. Therefore, since the common line 151 becomes a line through which the first and second fluids flow, the first and second fluids may be partially mixed in the common line 151. Therefore, when discharging the first fluid and the second fluid sequentially from the nozzle 160, before discharging the first fluid from the nozzle 160 and discharging the second fluid from the nozzle 160. It is preferable to remove the first fluid that may remain in the common line 151.

The first fluid remaining in the common line 151 is removed by using the cleaning liquid provided from the cleaning liquid supply unit 220. As described above, since the cleaning liquid includes a solvent that is generally used such as thinner, the cleaning liquid is provided to the cleaning liquid supply line 221 and the common line 151, and thus the cleaning liquid is commonly used. The first fluid remaining in the line 151 is dissolved and discharged to the outside through the nozzle 160.

In addition, after the inside of the common line 151 is cleaned using the cleaning liquid, the first fluid and the solvent remaining in the common line 151 are purged using the purge gas provided from the gas supply unit 230. It may be discharged to the outside through the nozzle 160. A more detailed description thereof will be described in more detail with reference to FIGS. 2 to 5.

2 to 6 are diagrams illustrating a method of treating a substrate using the substrate processing apparatus shown in FIG. 1. On the other hand, since the matters related to the structure and function of the directional valve 150 is generally known matter, the structure of the directional valve 150 is shown schematically in FIGS. On the other hand, even if the direction switching valve 150 does not have a structure shown in Figures 2 to 6, the direction control having a different structure capable of performing the function of the direction control valve 150 described above with reference to FIG. Valves may be used.

2 to 6 sequentially process the substrate (W in FIG. 1) using the first fluid 204 and the second fluid 214 using the substrate processing apparatus (10 of FIG. 1) illustrated in FIG. 1. Figures showing how to process.

1 and 2, when the first fluid 204 is used to process the substrate W, a switching line provided in the direction switching valve 150 in the direction switching valve 150 is provided. The first fluid supply line 201 is connected to the common line 151 by 155. As a result, the first fluid 204 provided from the first fluid supply unit 200 is provided to the substrate W through the first fluid supply line 201, the common line 151, and the nozzle 160. Can be.

1 and 3, after processing the substrate W using the first fluid 204, the first and second agents 151 and the switching line 155 accommodated in the common line 151 and the switching line 155 using the first pump 202. 1 fluid 204 is moved to the first fluid supply part 200 side. Therefore, the first fluid 204 is removed in the common line 151 and the switching line 155.

1 and 4, after removing all of the first fluid in the common line 151 and the switching line 155, the position of the switching line 155 in the directional valve 150 is changed to the The switching line 155 is connected to the cleaning liquid supply line 221 and the common line 151. After that, the cleaning liquid 224 provided from the cleaning liquid supply unit 220 is provided to the cleaning liquid supply line 221 and the common line 151 to clean the inside of the common line 151.

1 and 5, after cleaning the inside of the common line 151 using the cleaning liquid (224 of FIG. 4), the position of the switching line 155 in the direction switching valve 150 is changed to change the switching. The line 155 is connected to the gas supply line 231 and the common line 151. Subsequently, the purge gas 234 provided from the gas supply unit 230 is provided to the gas supply line 231 and the common line 151 so that the material remaining inside the common line 151 is nozzle 160. To the outside through).

1 and 6, after cleaning the inside of the common line 151 using the purge gas (234 of FIG. 5), the position of the switching line 155 in the direction switching valve 150 is changed to the above. The switching line 155 is connected to the second fluid supply line 211 and the common line 151. As a result, the second fluid 214 provided from the second fluid supply unit 210 is provided toward the substrate W through the second fluid supply line 211, the common line 151, and the nozzle 160. It can be used to process the substrate (W).

Although described with reference to the above embodiments, those skilled in the art can be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

1 is a view showing a substrate processing apparatus according to an embodiment of the present invention.

2 to 6 are diagrams illustrating a method of treating a substrate using the substrate processing apparatus shown in FIG. 1.

* Description of the symbols for the main parts of the drawings *

10-Substrate Processing Unit W-Substrate

100-Process Process 150-Directional Valve

155-Transition line 151-Public line

160-Nozzle 200-First Fluid Supply

202-First pump 210-Second fluid supply

220-Cleaning solution supply 230-Gas supply

201-First Fluid Supply Line 211-Second Fluid Supply Line

221-Cleaning Fluid Supply Line 231-Gas Supply Line

204-First Fluid 214-Second Fluid

224-Cleaning solution 234-Purge gas

Claims (9)

A process processor which processes the substrate using a fluid; A nozzle for discharging the fluid to the substrate side; A common line connected to the nozzle; At least two fluid supply parts providing different fluids to the process processor; Fluid supply lines connected to the fluid supply parts, respectively; A pump installed on each of the fluid supply lines to control the flow of fluids; And a direction switching valve connected to the fluid supply lines and the common line to select one of the fluids provided from the fluid supply lines and to transmit the fluid to the common line. The direction switching valve, And a conversion line having one end connected to the common line and the other end movable to be connected to any one of the fluid supply lines. The method of claim 1, And a cleaning solution supply unit connected to the redirection valve to provide a cleaning solution for cleaning the inside of the common line. The substrate treating apparatus of claim 2, wherein the cleaning liquid comprises a substance dissolving the fluids. The method of claim 2, And a gas supply unit connected to the direction switching valve to provide a purge gas to the common line. delete In the substrate processing method for treating a substrate by selectively using any one of the different fluids, Discharging the first fluid to the substrate by connecting a switching line to the common line and the fluid supply line such that a common line connected to the nozzle is connected to a fluid supply line provided with a first fluid; Removing the first fluid remaining in the switching line and the common line using a pump after the process of processing the substrate using the first fluid is completed; Moving the switching line connected to the fluid supply line and connecting the cleaning line with a cleaning solution supply line; Cleaning the common line through the cleaning liquid provided in the cleaning liquid supply line; Moving the conversion line connected to the cleaning solution supply line and connecting the gas supply line to which purge gas is provided; Cleaning the common line through the purge gas provided in the gas supply line; Moving the switching line connected to the gas supply line and connecting the fluid supply line to a second fluid; And discharging the second fluid provided from the fluid supply line to the substrate through a connected switching line and a nozzle. delete The method of claim 6, And purging the inside of the common line by using a purge gas provided from a gas supply unit. The method of claim 6, wherein the cleaning liquid comprises a substance for dissolving the fluids.

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