CN114521290A - 模块 - Google Patents

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CN114521290A
CN114521290A CN202080067389.5A CN202080067389A CN114521290A CN 114521290 A CN114521290 A CN 114521290A CN 202080067389 A CN202080067389 A CN 202080067389A CN 114521290 A CN114521290 A CN 114521290A
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module
wire
electrode
bonding
present
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大坪喜人
楠元彦
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

本发明涉及模块。模块(101)具备：具有第一面(1a)的基板(1)；安装于第一面(1a)的第一部件(3a)及第二部件(3b)；和被配置为横跨第一部件(3a)及第二部件(3b)双方的导线(4)。导线(4)的一端及另一端均连接于第一面(1a)，并且导线(4)接地。在从垂直于第一面(1a)的方向观察时，第一部件(3a)位于比第二部件(3b)还靠近上述一端的位置，导线(4)离第一面(1a)最远的部位(25)位于比上述另一端还靠近上述一端的位置，第二部件(3b)的上表面位于比第一部件(3a)的上表面低的位置。

Description

模块
技术领域
本发明涉及模块。
背景技术
以电磁波的屏蔽为目的进行导线接合的构造记载于美国专利US9、761、537B2(专利文献1)中。在该文献的图7和图9中，还记载了以横跨安装部件的方式进行导线接合的结构。
一般，通过第一接合和第二接合这两个阶段的工序进行导线接合。以下，假设利用导线将第一对象部位与第二对象部位之间电连接来进行说明。首先，在第一接合中，在使由工具保持的导线的前端熔融并形成为球状的状态下，进行向第一对象部位的接合。接下来，在第二接合中，引绕一端已经通过第一接合与第一对象部位接合的状态的导线，将该导线的中途的一点压在第二对象部位并使其熔融而接合，切断其后续的导线。
专利文献1：美国专利US9、761、537B2
通常，在通过第一接合接合的部位和通过第二接合接合的部位中，导线的倾斜不同。通过第一接合接合的部位能够进行导线从第一对象部位向接近垂直的方向延伸的接合，但在通过第二接合接合的部位中，第二对象部位的表面与导线所成的角度比较小。换言之，导线成为倾斜的状态。在第一对象部位、第二对象部位双方处于基板的表面的情况下，考虑到在第二接合部位处导线倾斜，在第二接合部位的附近需要用于接合导线的额外空间。
发明内容
因此，本发明的目的在于提供能够实现基于导线的隔室屏蔽，并且有效活用沿着基板的表面的空间的模块。
为了实现上述目的，基于本发明的模块具备：基板，具有第一面；第一部件及第二部件，安装于上述第一面；以及导线，被配置为横跨上述第一部件及上述第二部件双方。上述导线的一端以及另一端均连接于上述第一面，上述导线接地，在从垂直于上述第一面的方向观察时，上述第一部件位于比上述第二部件还靠近上述一端的位置，上述导线离上述第一面最远的部位位于比上述另一端还靠近上述一端的位置，上述第二部件的上表面位于比上述第一部件的上表面低的位置。
根据本发明，虽然导线的另一端容易变低，但作为高度较低的部件的第二部件3b位于比第一部件还靠近另一端的位置，因此能够高效地利用导线4的下方的空间，实现基于导线的隔室屏蔽，并且有效活用沿着基板的表面的空间。
附图说明
图1是基于本发明的实施方式1中的模块的立体图。
图2是基于本发明的实施方式1中的模块的俯视图。
图3是与图2中的III-III线相关的向视剖视图。
图4是基于本发明的实施方式1中的从模块除去屏蔽膜的上表面部分以及密封树脂的状态的俯视图。
图5是基于本发明的实施方式1中的模块中具备的导线的第一接合端的附近的放大图。
图6是基于本发明的实施方式1中的模块中具备的导线的第二接合端的附近的放大图。
图7是基于本发明的实施方式2中的从模块除去屏蔽膜的上表面部分以及密封树脂的状态的俯视图。
图8是基于本发明的实施方式3中的从模块除去屏蔽膜的上表面部分以及密封树脂的状态的俯视图。
图9是基于本发明的实施方式3中的模块的剖视图。
图10是基于本发明的实施方式4中的从模块除去屏蔽膜的上表面部分以及密封树脂的状态的俯视图。
图11是基于本发明的实施方式4中的模块的剖视图。
图12是基于本发明的实施方式4中的模块的变形例的第二部件附近的构造的说明图。
图13是基于本发明的实施方式5中的模块的剖视图。
图14是基于本发明的实施方式5中的模块的第二部件附近的局部侧视图。
图15是基于本发明的实施方式5中的模块的第二部件附近的局部立体图。
图16是基于本发明的实施方式6中的模块的剖视图。
具体实施方式
在附图中所示的尺寸比不一定忠实地表示为像现实那样，为了便于说明，有时夸张地表示尺寸比。在以下的说明中，在提及上或者下的概念时，并不意味着绝对的上或者下，有时意味着图示的姿势中的相对的上或者下。在以下的剖视图中，为了便于说明，有时同时显示处于本来不出现在同一截面内的位置关系的多个构成要素。
(实施方式1)
参照图1～图4，对基于本发明的实施方式1中的模块进行说明。图1表示本实施方式中的模块101的立体图。模块101的上表面以及侧面被屏蔽膜8覆盖。图2表示模块101的俯视图。如图2所示，模块101在内部具备第一部件3a、第二部件3b、部件3c、3d、3e。图3表示与图2中的III-III线相关的向视剖视图。
模块101具备：具有第一面1a的基板1；安装于第一面1a的第一部件3a和第二部件3b；以及被配置为横跨第一部件3a及第二部件3b双方的导线4。第一部件3a例如是IC元件。更具体而言，第一部件3a例如是LNA(低噪声放大器)。第一部件3a例如也可以是PA(功率放大器)。第二部件3b是芯片部件。具体而言，第二部件3b例如可以是片式电容器，也可以是片式电阻。另外，第二部件3b与第一部件3a一起在模块内成为一个屏蔽对象，即，例如可以是发送系统电路、接收系统电路等中的任一个。
基板1是布线基板。基板1是将多个绝缘层2层叠而成的。基板1可以是陶瓷多层基板，也可以是印刷电路板那样的树脂多层基板。基板1具有第二面1b作为与第一面1a相反侧的面。导线4的一端以及另一端均连接于第一面1a。此处所说的“一端”是第一接合端41。“另一端”是第二接合端42。即，上述一端是导线接合的起点侧，上述另一端是导线接合的终点侧。第一接合端41连接于焊盘电极18a。第二接合端42连接于焊盘电极18b。导线4接地。
形成有第一密封树脂6a，以便覆盖安装于第一面1a的所有部件。形成有屏蔽膜8，以便覆盖第一密封树脂6a的上表面、侧面以及基板1的侧面。屏蔽膜8接地。在基板1的内部配置有导体图案16。导体导通孔15与导体图案16电连接。在基板1的第二面1b设置有外部端子17。
图4表示在除去屏蔽膜8的上表面部分和密封树脂6a的状态下从正上方观察的情况。在从垂直于第一面1a的方向观察时，第一部件3a位于比第二部件3b还靠近上述一端的位置。如图3所示，导线4离第一面1a最远的部位25位于比上述另一端还靠近上述一端的位置。第二部件3b的上表面位于比第一部件3a的上表面低的位置。
在本实施方式中，通过将导线4配置为横跨第一部件3a和第二部件3b双方，从而进行相对于第一部件3a和第二部件3的隔室屏蔽。此时，导线4离第一面1a最远的部位25位于比上述另一端还靠近上述一端的位置，因此在另一端的附近，导线4容易变低。然而，在从垂直于第一面1a的方向观察时，作为高度较高的部件的第一部件3a位于比第二部件3b还靠近上述一端的位置，作为高度较低的部件的第二部件3b位于比第一部件3a还靠近另一端的位置。由此，能够高效地利用导线4的下方的空间来配置第一部件3a和第二部件3b。因此，在本实施方式中，能够实现基于导线4的隔室屏蔽，并且有效活用沿着基板1的表面的空间。
对导线4的两端各自连接于第一面1a的部位的情况进行进一步详细说明。图5表示作为上述一端的第一接合端41与第一面1a电连接的部位的放大图。第一接合端41经由焊盘电极18a连接于第一面1a。在第一接合端41形成有球状的部分。在第一接合端41中，导线4相对于第一面1a形成角度A地延伸。
图6表示作为上述另一端的第二接合端42与第一面1a连接的部位的放大图。第二接合端42经由焊盘电极18b连接于第一面1a。在第二接合端42中，导线4相对于第一面1a形成角度B地延伸。在此处，角度A大于角度B。即，在第二接合侧，与第一接合侧相比，导线成为更大地倾斜的状态。
如此处所示，优选上述一端相对于第一面1a形成第一角度A地连接，上述另一端形成小于第一角度A的第二角度B地连接于第一面1a。
如本实施方式所示，优选模块101具备：密封第一部件3a及第二部件3b的密封树脂、和形成为覆盖上述密封树脂的屏蔽膜8。在此处，第一密封树脂6a相当于“密封树脂”。
(实施方式2)
参照图7，对基于本发明的实施方式2中的模块进行说明。本实施方式中的模块102的基本结构与实施方式1中说明的模块101相同，但具备以下的结构。图7表示在本实施方式中的模块102中，在除去屏蔽膜8的上表面部分和密封树脂6a的状态下从正上方观察的情况。在实施方式1中，多个导线4与第一部件3a的边平行地配置，但在本实施方式中，多个导线4相对于第一部件3a的边倾斜地配置。即，在从垂直于第一面1a的方向观察时，导线4相对于第一部件3a的边倾斜地配置。
在本实施方式中，也能够获得实施方式1中说明的效果。而且，在本实施方式中，由于多个导线4相对于第一部件3a的边倾斜地配置，因此能够沿着第一部件3a的更多的边配置导线4的任意一端。因此，能够使隔室屏蔽更稳固。
(实施方式3)
参照图8～图9，对基于本发明的实施方式3中的模块进行说明。图8表示在本实施方式中的模块103中，在除去屏蔽膜8的上表面部分和密封树脂6a的状态下从正上方观察的情况。图9表示模块103的剖视图。本实施方式中的模块103的基本结构与实施方式1中说明的模块101相同，但具备以下的结构。
在模块103中，在第一面1a安装有第一部件3a1以及第二部件3b1。导线4被配置为一并横跨第一部件3a1和第二部件3b1。在从上方观察时的面积中，第一部件3a1比第二部件3b1小。第一部件3a1的上表面比第二部件3b1的上表面高。第二部件3b1例如是IC元件。更具体而言，第一部件3a例如是LNA(低噪声放大器)。第一部件3a例如也可以是PA(功率放大器)。
在本实施方式中，也能够获得实施方式1中说明的效果。
(实施方式4)
参照图10～图11，对基于本发明的实施方式4中的模块进行说明。图10表示在本实施方式中的模块104中，在除去屏蔽膜8的上表面部分和密封树脂6a的状态下从正上方观察的情况。图11表示模块104的剖视图。本实施方式中的模块104的基本结构与实施方式1中说明的模块101相同，但具备以下的结构。
在模块104中，导线4与第二部件3b抵接并弯曲。导线4与第二部件3b的肩部63抵接并弯曲。在此处所示的例子中，肩部63是绝缘部，不存在导线4与第二部件3b之间的短路的可能性。或者，即使肩部是导电部，但只要是接地电极，即使导线和肩部抵接也不存在短路的可能性。
在本实施方式中，也能够获得实施方式1中说明的效果。在本实施方式中，而且，由于导线4与第二部件3b抵接并弯曲，因此能够使导线4的上述另一端相对于第一面1a以更陡峭的角度连接。即，能够增大图6所示的部位的角度B。这样，能够有效活用第一面1a的有限的空间。
(变形例)
在图11中，以一般的长方体的第二部件3b为例进行示出，但也可以使用图12所示的第二部件3b2那样的部件来代替第二部件3b。第二部件3b2是长方体且在长边方向的两端形成有电极的构造的部件。第二部件3b2具备电极61a、61b以及非电极部62。非电极部62是夹在电极61a、61b的中间部分。在安装有这样的第二部件3b2的情况下，如图12所示，导线4与第二部件3b2的非电极部62的肩部63抵接。只要导线4避开电极而与这样的非电极部62的肩部63抵接，就不会产生不希望的电连接，而能够使导线4弯曲。此处所示的第二部件3b2的结构只是一个例子。
(实施方式5)
参照图13～图15，对基于本发明的实施方式5中的模块进行说明。图13表示本实施方式中的模块105的剖视图。本实施方式中的模块105的基本结构与实施方式4中说明的模块104相同，但具备以下的结构。图14和图15表示将第二部件3b的附近放大的结构。第二部件3b具备第一电极61作为用于与基板1连接的电极。
第二部件3b具有第一电极61，在第一面1a配置有与第一电极61电连接的第二电极64，第二电极64沿着第一面1a延伸，以便包括从第二部件3b相对于第一面1a的投影区域向外伸出的伸出部64e，作为上述另一端的第二接合端42连接于伸出部64e。第一电极61和第二电极64均可以是GND电极。
在本实施方式中，第二电极64包括伸出部64e，作为上述另一端的第二接合端42连接于伸出部64e，因此能够使导线4的第二接合端42的电连接更可靠。
(实施方式6)
参照图16，对基于本发明的实施方式6中的模块进行说明。图16表示本实施方式中的模块106的剖视图。本实施方式中的模块106的基本结构与实施方式1中说明的模块101相同，但具备以下的结构。
模块106成为双面安装构造。即，在模块106中，基板1具有第二面1b作为与第一面1a相反侧的面，在第二面1b至少安装有一个部件。具体而言，在模块106中，作为一个例子，在基板1的第二面1b安装有部件3f、3g。部件3f、3g被第二密封树脂6b密封。在模块104的下表面设置有外部端子24。在此处所示的例子中，柱状导体23的下表面成为外部端子24。柱状导体23配置于第二面1b。柱状导体23可以是销、通过镀覆形成的电极、金属块中的任意一个。柱状导体23贯通第二密封树脂6b。也可以在柱状导体23的下端连接有焊料凸块。此处所示的外部端子24的结构只是一个例子，并不限于此。也可以设置凸块来代替柱状导体23。
在本实施方式中，也能够获得与实施方式1中说明的内容同样的效果。在本实施方式中，由于成为双面安装构造，因此能够将更多的部件安装于基板1。
此外，也可以将上述实施方式中的多个进行适当地组合并采用。
此外，本次公开的上述实施方式在全部的点是例示，不起限制作用。本发明的范围由权利要求书表示，包括与权利要求书等同的意思以及范围内的所有变更。
附图标记说明
1…基板；1a…第一面；1b…第二面；2…绝缘层；3a、3a1…第一部件；3b、3b1、3b2…第二部件；3c、3d、3e、3f、3g…部件；4…导线；6a…第一密封树脂；6b…第二密封树脂；8…屏蔽膜；15…导体导通孔；16…导体图案；17、24…外部端子；18、18a、18b…焊盘电极；23…柱状导体；25…(最远的)部位；41…第一接合端；42…第二接合端；61…第一电极；61a、61b…(第二部件的)电极；62…(第二部件的)非电极部；63…(第二部件的)肩部；64…第二电极；64e…伸出部；101、102、103、104、105、106…模块。

Claims (8)

1.一种模块，具备：
基板，具有第一面；
第一部件及第二部件，安装于上述第一面；以及
导线，被配置为横跨上述第一部件及上述第二部件双方，
上述导线的一端以及另一端均连接于上述第一面，
上述导线接地，
在从垂直于上述第一面的方向观察时，上述第一部件位于比上述第二部件还靠近上述一端的位置，
上述导线离上述第一面最远的部位位于比上述另一端还靠近上述一端的位置，
上述第二部件的上表面位于比上述第一部件的上表面低的位置。
2.根据权利要求1所述的模块，其中，
上述一端相对于上述第一面形成第一角度地连接，上述另一端形成第二角度地连接于上述第一面，上述第二角度小于上述第一角度。
3.根据权利要求1或2所述的模块，其中，
上述一端是导线接合的起点侧。
4.根据权利要求1～3中任意一项所述的模块，其中，
上述导线与上述第二部件抵接并弯曲。
5.根据权利要求4所述的模块，其中，
上述第二部件具有第一电极，在上述第一面配置有与上述第一电极电连接的第二电极，上述第二电极沿着上述第一面延伸以便包括从上述第二部件相对于上述第一面的投影区域向外伸出的伸出部，上述另一端连接于上述伸出部。
6.根据权利要求1～5中任意一项所述的模块，其中，
在从垂直于上述第一面的方向观察时，上述导线相对于上述第一部件的边倾斜地配置。
7.根据权利要求1～6中任意一项所述的模块，其中，
具备：密封上述第一部件以及上述第二部件的密封树脂、和形成为覆盖上述密封树脂的屏蔽膜。
8.根据权利要求1～7中任意一项所述的模块，其中，
上述基板具有第二面作为与上述第一面相反侧的面，在上述第二面至少安装有一个部件。
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