CN114514616A - 氮化物半导体结构体、氮化物半导体器件以及用于制作该器件的方法 - Google Patents
氮化物半导体结构体、氮化物半导体器件以及用于制作该器件的方法 Download PDFInfo
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- CN114514616A CN114514616A CN202080070160.7A CN202080070160A CN114514616A CN 114514616 A CN114514616 A CN 114514616A CN 202080070160 A CN202080070160 A CN 202080070160A CN 114514616 A CN114514616 A CN 114514616A
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- Crystallography & Structural Chemistry (AREA)
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Recrystallisation Techniques (AREA)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019186371 | 2019-10-09 | ||
| JP2019-186371 | 2019-10-09 | ||
| PCT/JP2020/038155 WO2021070910A1 (ja) | 2019-10-09 | 2020-10-08 | 窒化物半導体構造体、窒化物半導体デバイス及びその製造方法 |
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| Publication Number | Publication Date |
|---|---|
| CN114514616A true CN114514616A (zh) | 2022-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202080070160.7A Pending CN114514616A (zh) | 2019-10-09 | 2020-10-08 | 氮化物半导体结构体、氮化物半导体器件以及用于制作该器件的方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12100936B2 (https=) |
| JP (1) | JP7212173B2 (https=) |
| CN (1) | CN114514616A (https=) |
| WO (1) | WO2021070910A1 (https=) |
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| JP7718026B2 (ja) * | 2021-08-30 | 2025-08-05 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
| US12463033B2 (en) | 2022-10-19 | 2025-11-04 | Kyocera Corporation | Semiconductor substrate, and manufacturing method and manufacturing apparatus of semiconductor substrate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020197841A1 (en) * | 2001-06-05 | 2002-12-26 | Seiji Nagai | Group III nitride compound semiconductor element and method for producing the same |
| US20050258451A1 (en) * | 2004-05-20 | 2005-11-24 | Saxler Adam W | Methods of fabricating nitride-based transistors having regrown ohmic contact regions and nitride-based transistors having regrown ohmic contact regions |
| JP2008507853A (ja) * | 2004-07-26 | 2008-03-13 | クリー インコーポレイテッド | 横方向成長活性領域を有する窒化物ベースのトランジスタ及びその製造方法 |
| JP2009518874A (ja) * | 2005-12-08 | 2009-05-07 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 高効率発光ダイオード(led) |
| JP2009267303A (ja) * | 2008-04-30 | 2009-11-12 | Nec Corp | 半導体レーザ及びその製造方法 |
| CN101689483A (zh) * | 2007-04-27 | 2010-03-31 | 阿祖罗半导体股份公司 | 第ⅳ族衬底表面上的氮化物半导体元件层结构 |
| US20100233870A1 (en) * | 2009-03-11 | 2010-09-16 | Hitachi Cable, Ltd. | Method of fabricating group III nitride semiconductor single crystal, and method of fabricating group III nitride semiconductor single crystal substrate |
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| EP0996173B1 (en) | 1998-10-23 | 2015-12-30 | Xerox Corporation | Semiconductor structures including polycrystalline GaN layers and method of manufacturing |
| FR2875333B1 (fr) | 2004-09-16 | 2006-12-15 | Centre Nat Rech Scient Cnrse | Realisation d'une couche de nitrure d'indium |
| JP5451280B2 (ja) * | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
| WO2013089843A2 (en) | 2011-09-02 | 2013-06-20 | The California Institute Of Technology | Photovoltaic semiconductive materials |
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| US20020197841A1 (en) * | 2001-06-05 | 2002-12-26 | Seiji Nagai | Group III nitride compound semiconductor element and method for producing the same |
| US20050258451A1 (en) * | 2004-05-20 | 2005-11-24 | Saxler Adam W | Methods of fabricating nitride-based transistors having regrown ohmic contact regions and nitride-based transistors having regrown ohmic contact regions |
| JP2008507853A (ja) * | 2004-07-26 | 2008-03-13 | クリー インコーポレイテッド | 横方向成長活性領域を有する窒化物ベースのトランジスタ及びその製造方法 |
| JP2009518874A (ja) * | 2005-12-08 | 2009-05-07 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 高効率発光ダイオード(led) |
| CN101689483A (zh) * | 2007-04-27 | 2010-03-31 | 阿祖罗半导体股份公司 | 第ⅳ族衬底表面上的氮化物半导体元件层结构 |
| JP2009267303A (ja) * | 2008-04-30 | 2009-11-12 | Nec Corp | 半導体レーザ及びその製造方法 |
| US20100233870A1 (en) * | 2009-03-11 | 2010-09-16 | Hitachi Cable, Ltd. | Method of fabricating group III nitride semiconductor single crystal, and method of fabricating group III nitride semiconductor single crystal substrate |
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| Publication number | Publication date |
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| US12100936B2 (en) | 2024-09-24 |
| JP7212173B2 (ja) | 2023-01-24 |
| WO2021070910A1 (ja) | 2021-04-15 |
| US20220367748A1 (en) | 2022-11-17 |
| JPWO2021070910A1 (https=) | 2021-04-15 |
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