CN114513928A - 电子装置 - Google Patents

电子装置 Download PDF

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CN114513928A
CN114513928A CN202110856980.5A CN202110856980A CN114513928A CN 114513928 A CN114513928 A CN 114513928A CN 202110856980 A CN202110856980 A CN 202110856980A CN 114513928 A CN114513928 A CN 114513928A
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heat
electronic device
package
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circuit board
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张立勋
欧冠吟
陈韦仁
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HTC Corp
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Abstract

本发明提供一种电子装置，包括一电路板、一叠层封装结构、一导热盖以及一导热流体。电路板具有相对的一第一表面与一第二表面。叠层封装结构配置于第一表面。叠层封装结构具有至少一发热组件。导热盖配置于第二表面且热接触电路板。导热盖与第二表面构成一封闭空间。导热流体填充于封闭空间内。

Description

电子装置
技术领域
本发明涉及一种电子装置，且特别是涉及一种具有散热手段的电子装置。
背景技术
叠层封装体(package on package,POP)技术因为体积小且效能佳而逐渐成为普遍被采用的技术。然而，当中央处理器等高功率的芯片采用了叠层封装体技术时，中央处理器的上方会配置内存芯片。当中央处理器处于高运算状态时，中央处理器会产生大量的热，而位于中央处理器上方的内存芯片会影响中央处理器的散热效率，进而导致中央处理器的效能降低甚至损坏。
发明内容
本发明是针对一种电子装置，可改善叠层封装结构的散热效率不佳的问题。
根据本发明的实施例，电子装置包括电路板、叠层封装结构、导热盖以及导热流体。电路板具有相对的第一表面与第二表面。叠层封装结构配置于第一表面。叠层封装结构具有至少发热组件。导热盖配置于第二表面且热接触电路板。导热盖与第二表面构成封闭空间。导热流体填充于封闭空间内。
基于上述，本发明的电子装置在电路板的背面设置了以导热盖与导热流体构成的散热手段，可改善叠层封装结构的散热效率。
附图说明
图1是本发明一实施例的电子装置的剖面示意图；
图2是本发明另一实施例的电子装置的剖面示意图；
图3是本发明再一实施例的电子装置的剖面示意图。
具体实施方式
图1是本发明一实施例的电子装置的剖面示意图。请参照图1，本实施例的电子装置100包括一电路板110、一叠层封装结构(package on package structure,POPstructure)120、一导热盖130以及一导热流体140。电路板110具有相对的一第一表面112与一第二表面114。叠层封装结构120配置于第一表面112。叠层封装结构120具有至少一发热组件122。导热盖130配置于第二表面114且热接触电路板110。导热盖130与第二表面114构成一封闭空间S10。导热流体140填充于封闭空间S10内。
在本实施例的电子装置100中，由电路板110、导热盖130以及一导热流体140构成散热手段，类似由两个导热板与其内部的导热流体所构成的均温板(Vapor chamber)。相较于另外配置均温板，本实施例的电子装置100的整体厚度较小。此外，导热盖130与导热流体140的配合也具有很好的散热效果。
在本实施例中，发热组件122是中央处理器，但也可以是图像处理芯片或其他高功率的芯片。此外，叠层封装结构120还可具有一芯片124配置于发热组件122上。在本实施例中，芯片124可以是内存芯片或是其他种类的芯片。在本实施例中，芯片124的数量可以是一个或是多个，多个芯片124可以采用并排或是堆栈的方式配置于发热组件122上。本实施例的电子装置100可还包括多个电子组件150，配置于第二表面114且位于封闭空间S10内。在本实施例中，这些电子组件150可以是芯片或是被动(无源)组件，其中被动组件可以是电阻、电容或是电感。换言之，传统的散热片(Heat sink)或是均温板会被这些电子组件150所影响而无法使用。然而，导热流体140填充于这些电子组件150之间。因此，并不会因为设置了导热盖130而大幅影响电路板110的第二表面114可用于设置电子组件150的面积的大小。填充于这些电子组件150之间的导热流体140也仍然可以快速地将热量散开以避免局部高温带来的破坏。在本实施例中，导热流体140具有高热传导系数以及电绝缘特性。导热流体140并不限于水，也可以是其他具有高热传导系数的流体，只要易于确实填充封闭空间S10即可，例如散热膏、相变化材料也可作为导热流体140。
更详细而言，由于芯片124配置于发热组件122上，因此发热组件122所产生的热不容易经过芯片124传至外界环境。本实施例将导热盖130配置于发热组件122下方并填充导热流体140，因此发热组件122所产生的热比较容易经由电路板110的内部线路传到至导热盖130及导热流体140。此外，电子组件150也有助于散热并增加与导热流体140的接触面积。当发热组件122瞬间提高功率或是指令周期时，发热组件122将会瞬间产生更多的热能，也就是热冲击(Thermal impact)。本实施例的导热流体140以及导热盖130能够快速吸收热能，以降低热冲击的影响。换言之，当发热组件122瞬间提高功率或是指令周期时，局部的温度不会上升太高，并降低对于叠层封装结构120的使用寿命的影响。
在本实施例中，导热盖130位于封闭空间S10内且与第二表面114相对的一内表面132是非平面。当这些电子组件150的高度不一致时，可设置让内表面132与这些电子组件150之间保持一定的距离。因此，导热盖130与这些电子组件150之间的热阻值能够减少，有助于提高散热效率。更详细而言，导热盖130与这些电子组件150之间的距离会影响热阻值，距离越近，热阻值越低，散热效率越好。然而，过近的距离会提升电子组件与导热盖130接触而产生短路的机率。因此，内表面132与这些电子组件150之间距离是越短越好，但是不要造成短路。
在本实施例中，导热盖130具有一入口134与一出口136，入口134用以供导热流体140填入封闭空间S10，出口136用以供空气与过量的导热流体140流出。在组装时，例如是先将导热盖130接合在电路板110的第二表面114。然后，将导热流体140从入口134填入封闭空间S10。在此过程中，封闭空间S10内的空气可以从出口136排出。当导热流体140也从出口136流出时，可判断封闭空间S10应该已经被导热流体140填满。此时，就可以将入口134与一出口136封闭，以将导热流体140封闭于封闭空间S10内。在另一实施例中，也可将大量的流动性较差的导热流体140先配置在第二表面114上，然后直接以导热盖130覆盖导热流体140并与电路板110接合，即可将导热流体140封闭于封闭空间S10内。
在本实施例中，电路板110具有一接地图案116，暴露于第二表面114，导热盖130热接触接地图案116。本实施例的接地图案116的材料例如包括铜。由于叠层封装结构120本来就会与电路板110内的接地线路相连，因此叠层封装结构120所产生的热也可由接地线路与接地图案116传递至导热盖130，进而提升散热效率。此外，电路板110内也可以设置多层的接地层，以提高散热效率。
在本实施例中，电子装置100还包括一导热软垫160，配置于导热盖130与第二表面114之间，以使导热盖130热接触电路板110。在导热盖130与第二表面114之间因为平整度不佳的关系而无法密合时，导热软垫160可避免导热盖130与第二表面114之间存在间隙而产生较大的热阻。同样地，导热软垫160也可以配置于电路板110所裸露的接地图案116以及导热盖130之间，以提高散热效率。
在本实施例中，叠层封装结构120在第二表面114的正投影完全被导热盖130在第二表面114的正投影覆盖。也就是，从垂直于第二表面114的方向观看，叠层封装结构120完全位于导热盖130的范围内。由于这样的设置方式可以获得最短的热传路径，所以散热效率也会优选。但是，在其他实施例中，若有其他设计考虑，也可能叠层封装结构120在第二表面114的正投影与导热盖130在第二表面114的正投影仅至少部分重叠，但本发明不限于此。
此外，本实施例的电子装置100可包括一热管170、一散热鳍片172与一风扇174，但本发明不限于此。热管170热接触导热盖130，散热鳍片172热接触热管170，而风扇174对散热鳍片172进行散热。换言之，本实施例也可以采用热管170、散热鳍片172以及风扇174的各种组合并热接触导热盖130以提高散热效率。
图2是本发明另一实施例的电子装置的剖面示意图。请参照图2，本实施例的电子装置200与图1的电子装置100大致相同，差异在于电子装置200还包括一散热垫176与支架180。叠层封装结构120与支架180通过散热垫176而热接触。同样地，本实施例也可以采用热管170、散热鳍片172以及风扇174的各种组合并热接触导热盖130以提高散热效率。支架180可能是电子装置200内用于作为主要的支撑结构的组件，也可以是电子装置200的外壳或其他导热性佳的组件。
图3是本发明再一实施例的电子装置的剖面示意图。请参照图3，本实施例的电子装置300与图1的电子装置100大致相同，差异在于电子装置300还包括一散热垫176、一散热器178、另一热管170与另一散热鳍片172。散热器178通过散热垫176而热接触叠层封装结构120，另一热管170热接触散热器178，另一散热鳍片172热接触另一热管170，而风扇174对两个散热鳍片172进行散热。同样地，本实施例也可以采用热管170、散热鳍片172、风扇174、散热垫176以及散热器178的各种组合并热接触导热盖130以提高散热效率。
综上所述，在本发明的电子装置中，电路板的背面设置了以导热盖与导热流体构成的散热手段，可从叠层封装结构的另一侧对发热组件122进行散热，有效改善叠层封装结构的散热效率。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (10)

1.一种电子装置，其特征在于，包括：
电路板，具有相对的第一表面与第二表面；
叠层封装结构，配置于该第一表面，其中该叠层封装结构具有至少发热组件；
导热盖，配置于该第二表面且热接触该电路板，其中该导热盖与该第二表面构成封闭空间；以及
导热流体，填充于该封闭空间内。
2.根据权利要求1所述的电子装置，其特征在于，还包括多个电子组件，配置于该第二表面且位于该封闭空间内，该导热流体填充于该些电子组件之间。
3.根据权利要求2所述的电子装置，其特征在于，该导热盖位于该封闭空间内且与该第二表面相对的内表面是非平面，该些电子组件的高度不一致，且该内表面与该些电子组件之间的保持一定距离。
4.根据权利要求1所述的电子装置，其特征在于，该导热盖具有入口与出口，该入口用以供该导热流体填入该封闭空间，该出口用以供空气与过量的该导热流体流出。
5.根据权利要求1所述的电子装置，其特征在于，该电路板具有接地图案，暴露于该第二表面，该导热盖热接触该接地图案。
6.根据权利要求5所述的电子装置，其特征在于，该接地图案的材料包括铜。
7.根据权利要求1所述的电子装置，其特征在于，还包括导热软垫，配置于该导热盖与该第二表面之间，以使该导热盖热接触该电路板。
8.根据权利要求1所述的电子装置，其特征在于，该叠层封装结构在该第二表面的正投影与该导热盖在该第二表面的正投影至少部分重叠。
9.根据权利要求1所述的电子装置，其特征在于，该叠层封装结构在该第二表面的正投影完全被该导热盖在该第二表面的正投影覆盖。
10.根据权利要求1所述的电子装置，其特征在于，该叠层封装结构还具有芯片，配置于该发热组件上。
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