CN114381052A - 一种无硅导热垫片及其制备方法 - Google Patents
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 26
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 26
- 239000003921 oil Substances 0.000 claims abstract description 24
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 19
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 19
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 15
- 239000010703 silicon Substances 0.000 claims abstract description 15
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 14
- 238000005096 rolling process Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 11
- -1 ethylene-propylene-styrene Chemical class 0.000 claims description 9
- 238000005303 weighing Methods 0.000 claims description 9
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- 238000004821 distillation Methods 0.000 claims description 8
- 229920001897 terpolymer Polymers 0.000 claims description 8
- 239000011787 zinc oxide Substances 0.000 claims description 8
- 239000005062 Polybutadiene Substances 0.000 claims description 7
- 229920002367 Polyisobutene Polymers 0.000 claims description 7
- 229920002857 polybutadiene Polymers 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 229920013639 polyalphaolefin Polymers 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 abstract description 12
- 229920005989 resin Polymers 0.000 abstract description 12
- 239000011159 matrix material Substances 0.000 abstract description 11
- 230000035699 permeability Effects 0.000 abstract description 5
- 239000004014 plasticizer Substances 0.000 abstract description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
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Abstract
本发明公开了一种无硅导热垫片及其制备方法,包括如下质量百分含量的组分:热塑性弹性体3~15%;碳氢油0.5~5%;导热粉体80~97%;助剂0.1~2%。本发明以热塑性弹性体为基体树脂,并选用碳氢油作为增塑剂,通过碳氢油增加基体树脂与粉体物料之间的相容性,并调节垫片的硬度,使所制备的无硅导热垫片具有渗油率低,挥发率低,硬度小,压缩应力和残余应力低的优点,能保护敏感器件不受损伤,能够应用于对硅敏感器件领域。
Description
技术领域
本发明涉及热界面材料技术领域,特别是涉及一种可用于芯片封装、便携电子、5G通信、新能源汽车等有散热需求领域的无硅导热垫片及其制备方法。
背景技术
芯片、5G通信基站、新能源汽车电芯等都是高发热部件,热量能否快速导出决定了设备的工作性能和可靠性。由于元件的表面粗糙,造成热源和散热器件之间的界面是有限的点接触,散热面积极小,而空气又是热的不良导体,因此需要热界面材料来增加接触面积,形成更多良好的导热通路,以提高散热效率。
导热垫片是热界面材料中使用较广泛的一个材料类型,目前市面上绝大多数的导热垫片均为有机硅基材。在有机硅基材导热垫片中,由于小分子硅氧烷D3~D10的存在,始终是个困扰终端客户的问题。D3~D10是非反应型的环状硅氧烷混合物,有一定的挥发性。不论硅胶是否硫化,其都会从本体材料中持续迁移。有机硅基材导热垫片应用到电子产品后,其中的小分子硅氧烷可能会扩散到电子元器件表面,导致器件的触点导电失效。除此之外,有机硅主链在发生断裂降解后会生成二氧化硅,其对电子元器件也会造成电气失效和磨损。
目前,业界已经开发出的非有机硅基材的导热垫片,大多是丙烯酸树脂体系,如中国专利CN 111394068 A、CN 105860395 B和CN 105860395 B公开的无硅导热垫片。但这种丙烯酸树脂体系的导热垫片不适用于压力敏感的元器件,会造成敏感器件损伤。
发明内容
本发明通过提供一种无硅导热垫片及其制备方法,解决了现有技术中非有机硅基材的导热垫片不适用于敏感器件的问题。
为解决上述技术问题,本发明提供了一种无硅导热垫片,包括如下质量百分含量的组分:
热塑性弹性体3~15%;
碳氢油0.5~5%;
导热粉体80~97%;
助剂0.1~2%。
在本发明一个较佳实施例中,所述热塑性弹性体包括丁二烯-苯乙烯共聚物、乙烯-苯乙烯共聚物、丁二烯-苯乙烯-乙烯三元共聚物、聚异丁烯、聚丁二烯、氢化聚丁二烯或乙烯-丙烯-苯乙烯三元共聚物中的至少一种。
在本发明一个较佳实施例中,所述碳氢油包括液态聚阿尔法烯烃、液态聚酯、液态聚醚或液态聚异丁烯中的至少一种。
在本发明一个较佳实施例中,所述导热粉体包括氧化铝、氧化锌、氮化铝或氮化硼中的至少一种。
在本发明一个较佳实施例中,所述助剂包括抗氧剂和色粉。
为解决上述技术问题,本发明还提供了一种无硅导热垫片的制备方法,包括如下步骤:
(1)将热塑性弹性体、碳氢油和助剂按配方量称好并投入搅拌器中,在搅拌状态下,加热使热塑性弹性体熔化,减压蒸馏脱去小分子物质;
(2)称取配方量的导热粉体加入步骤(1)中减压蒸馏后的混合物料中,并搅拌混合均匀;
(3)将步骤(2)中得到的混合物在压延机上加热压延成所需厚度的片材,冷却后得到所述无硅导热垫片。
在本发明一个较佳实施例中,所述步骤(1)中,所述加热的温度为150~180℃。
在本发明一个较佳实施例中,所述步骤(3)中,所述压延的温度为120~160℃。
本发明的有益效果是:本发明一种无硅导热垫片及其制备方法,以热塑性弹性体为基体树脂,并选用碳氢油作为增塑剂,通过碳氢油增加基体树脂与粉体物料之间的相容性,并调节垫片的硬度,使所制备的无硅导热垫片具有渗油率低,挥发率低,硬度小,压缩应力和残余应力低的优点,不损伤敏感器件,能够应用于对硅敏感器件领域。
具体实施方式
下面对本发明的较佳实施例进行详细阐述,以使本发明的优点和特征能更易于被本领域技术人员理解,从而对本发明的保护范围做出更为清楚明确的界定。
本发明实施例包括:
本发明以热塑性弹性体为基体树脂,并选用碳氢油作为增塑剂,以增加基体树脂与粉体物料之间的相容性,并调节垫片的硬度,使所制备的无硅导热垫片既不存在小分子物质迁移的问题,也不损伤敏感器件,进一步提高了无硅导热垫片的性能,并拓宽其应用范围。
本发明公开了一种无硅导热垫片,包括如下质量百分含量的组分:
热塑性弹性体3~15%,所述热塑性弹性体包括丁二烯-苯乙烯共聚物、乙烯-苯乙烯共聚物、丁二烯-苯乙烯-乙烯三元共聚物、聚异丁烯、聚丁二烯、氢化聚丁二烯或乙烯-丙烯-苯乙烯三元共聚物中的至少一种。选用热塑性弹性体作为树脂基体,一方面不存在有机硅小分子,适用于对硅敏感的电子器件的应用场景;另一方面,以热塑性弹性体为基体制备的导热垫片硬度低,压缩应力和残余应力比较低,在保证界面良好接触的前提下,能有效减小对精密电子元器件的冲击。
碳氢油0.5~5%,所述碳氢油用作增塑剂,能够调节导热垫片的硬度,还能够提高树脂基体与粉体物料,如导热粉体、色粉等之间的相容性,从而提高导热垫片的整体性能。
具体地,所述碳氢油包括液态聚阿尔法烯烃、液态聚酯、液态聚醚或液态聚异丁烯中的至少一种。
导热粉体80~97%,所述导热粉体包括氧化铝、氧化锌、氮化铝或氮化硼中的至少一种,能够有效提高导热垫片的导热系数。
助剂0.1~2%,所述助剂包括抗氧剂和色粉,所述抗氧剂和色粉的质量比为1:1到2:1。
上述无硅导热垫片的制备方法为:
(1)将热塑性弹性体、碳氢油和助剂按配方量称好并投入搅拌器中,在搅拌状态下,加热至150~180℃,使热塑性弹性体熔化,抽真空,减压蒸馏脱去混合物中的小分子物质;
通过减压蒸馏去除热塑性弹性体和碳氢油中残存的低分子量物质和沸点比较低的物质,能够减少后期垫片的热失重,降低其挥发性及渗油率,从而增加垫片的热稳定性,提高长期使用的可靠性;
(2)称取配方量的导热粉体加入步骤(1)中减压蒸馏后的混合物料中,并搅拌混合均匀;
(3)将步骤(2)中得到的混合物在压延机上在120~160℃压延成所需厚度的片材,冷却后得到所述无硅导热垫片。
实施例1
按照物料总量为100kg计算,称取乙烯-丙烯-苯乙烯三元共聚物3.3kg、液态聚阿尔法烯烃1.5kg、抗氧剂10100.1kg和色粉(如炭黑)0.1kg投入加热温度为150~180℃的双行星搅拌锅中搅拌混合均匀,并在搅拌状态下,抽真空,减压蒸馏脱去小分子物质;然后加入氧化铝85kg、氧化锌10kg,并搅拌混合均匀;
将上述混合物在压延机上在140℃下压延成2mm厚度的片材,冷却后得到所述无硅导热垫片。
实施例2
按照物料总量为100kg计算,称取乙烯-丙烯-苯乙烯三元共聚物3.3kg、液态聚异丁烯1.5kg、抗氧剂10100.1kg和色粉(如炭黑)0.1kg投入加热温度为150~180℃的双行星搅拌锅中搅拌混合均匀,并在搅拌状态下,抽真空,减压蒸馏脱去小分子物质;然后加入氧化铝85kg、氧化锌10kg,并搅拌混合均匀;
将上述混合物在压延机上在140℃下压延成2mm厚度的片材,冷却后得到所述无硅导热垫片。
实施例3
按照物料总量为100kg计算,称取氢化聚丁二烯3.3kg、聚阿尔法烯烃1.5kg、抗氧剂10100.1kg和色粉(如炭黑)0.1kg投入加热温度为150~180℃的双行星搅拌锅中搅拌混合均匀,并在搅拌状态下,抽真空,减压蒸馏脱去小分子物质;然后加入氧化铝85kg、氧化锌10kg,并搅拌混合均匀;
将上述混合物在压延机上在140℃下压延成2mm厚度的片材,冷却后得到所述无硅导热垫片。
对比例1
2mm厚度的有机硅导热垫片,其配方构成为:按质量百分含量计算,有机硅树脂4.9%、色粉0.1%、氧化铝85%、氧化锌10%。
对比例2
2mm厚度的丙烯酸树脂体系无硅导热垫片,其配方构成为:丙烯酸树脂4.4%、固化剂异氰酸酯0.4%、抗氧剂10100.1%、色粉0.1%、氧化铝85%、氧化锌10%。
对上述实施例1-3及对比例1-2的导热垫片进行如下性能测试:
导热系数:参照ASTM D5470标准测试;
硬度(邵OO):参照ASTM D2240标准测试;
小分子硅氧烷含量:在气相色谱-质谱联用仪GC-MS上测试;
挥发率:参照ASTM E595标准测试;
压缩至70%变形量并维持5分钟后,测试70%压缩应力和70%残余应力。测试结果如下表所示:
结果 | 实施例1 | 实施例2 | 实施例3 | 对比例1 | 对比例2 |
导热系数(W/m-K) | 8.0 | 8.0 | 8.0 | 8.0 | 8.0 |
硬度(邵OO) | 40 | 40 | 30 | 40 | 60 |
小分子硅氧烷含量(%) | 0 | 0 | 0 | 0.02 | 0 |
挥发率(%) | 0.05 | 0.05 | 0.08 | 0.15 | 0.14 |
70%压缩应力(psi) | 40 | 45 | 25 | 95 | 120 |
70%残余应力(psi) | 8 | 10 | 5 | 17 | 25 |
从上表可知:本发明实施例1-3制备的热塑性弹性体体系无硅垫片,一方面不含有机硅,没有小分子硅氧烷,且挥发率较低,可适用于对硅敏感的电子应用领域;另一方面,在导热系数相同的前提下,本发明制备的热塑性弹性体体系无硅垫片的硬度、压缩应力和残余应力均明显低于丙烯酸体系无硅垫片,能够更好地保护精密元器件不受损伤。
本发明一种无硅导热垫片及其制备方法,具有如下优点:
(1)采用热塑性弹性体作为基体树脂,同时引入与树脂和导热粉体相容性极好的碳氢油,实现双重硬度调节,有效降低导热垫片的硬度,并降低压缩应力和残余应力,能够用于对硅敏感的器件,同时能保护精密元器件不受损伤。
(2)通过热塑性弹性体作为基体树脂,所制备的导热垫片无有机硅小分子析出,渗油率极低;
(3)通过将熔融后的热塑性弹性体与碳氢油、助剂的混合物进行减压蒸馏出去小分子物质和沸点比较低的物质,能够进一步降低隔热垫片的挥发性及渗油率,从而增加垫片的热稳定性,提高长期使用的可靠性。
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。
Claims (8)
1.一种无硅导热垫片,其特征在于,包括如下质量百分含量的组分:
热塑性弹性体3~15%;
碳氢油0.5~5%;
导热粉体80~97%;
助剂0.1~2%。
2.根据权利要求1所述的一种无硅导热垫片,其特征在于,所述热塑性弹性体包括丁烯-苯乙烯共聚物、乙烯-苯乙烯共聚物、丁烯-苯乙烯-乙烯三元共聚物、聚异丁烯、聚丁二烯、氢化聚丁二烯或乙烯-丙烯-苯乙烯三元共聚物中的至少一种。
3.根据权利要求1所述的一种无硅导热垫片,其特征在于,所述碳氢油包括液态聚阿尔法烯烃、液态聚酯、液态聚醚或液态聚异丁烯中的至少一种。
4.根据权利要求1所述的一种无硅导热垫片,其特征在于,所述导热粉体包括氧化铝、氧化锌、氮化铝或氮化硼中的至少一种。
5.根据权利要求1所述的一种无硅导热垫片,其特征在于,所述助剂包括抗氧剂和色粉。
6.一种如权利要求1所述的无硅导热垫片的制备方法,其特征在于,包括如下步骤:
(1)将热塑性弹性体、碳氢油和助剂按配方量称好并投入搅拌器中,在搅拌状态下,加热使热塑性弹性体熔化,减压蒸馏脱去混合物中的小分子物质;
(2)称取配方量的导热粉体加入步骤(1)中减压蒸馏后的混合物料中,并搅拌混合均匀;
(3)将步骤(2)中得到的混合物在压延机上加热压延成所需厚度的片材,冷却后得到所述无硅导热垫片。
7.根据权利要求6所述的一种无硅导热垫片的制备方法,其特征在于,所述步骤(1)中,所述加热的温度为150~180℃。
8.根据权利要求6所述的一种无硅导热垫片的制备方法,其特征在于,所述步骤(3)中,所述压延的温度为120~160℃。
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