CN114346338B - Electrochemical machining method and device based on flexible PI film conductive characteristic laser localized regulation and control - Google Patents
Electrochemical machining method and device based on flexible PI film conductive characteristic laser localized regulation and control Download PDFInfo
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- CN114346338B CN114346338B CN202210069890.6A CN202210069890A CN114346338B CN 114346338 B CN114346338 B CN 114346338B CN 202210069890 A CN202210069890 A CN 202210069890A CN 114346338 B CN114346338 B CN 114346338B
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- 238000003754 machining Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 17
- 230000033228 biological regulation Effects 0.000 title claims abstract description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 49
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 47
- 239000003792 electrolyte Substances 0.000 claims abstract description 41
- 238000012545 processing Methods 0.000 claims abstract description 33
- 230000009467 reduction Effects 0.000 claims abstract description 6
- 230000001276 controlling effect Effects 0.000 claims description 9
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 5
- 238000003487 electrochemical reaction Methods 0.000 claims description 4
- 238000004070 electrodeposition Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 claims 1
- 238000005868 electrolysis reaction Methods 0.000 abstract description 9
- 230000005684 electric field Effects 0.000 abstract description 8
- 238000011282 treatment Methods 0.000 description 6
- 238000011084 recovery Methods 0.000 description 5
- 239000010405 anode material Substances 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 230000003685 thermal hair damage Effects 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000013532 laser treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000010023 transfer printing Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000007833 carbon precursor Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000005087 graphitization Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H11/00—Auxiliary apparatus or details, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
The invention discloses an electrolytic machining method and device based on flexible PI film conductive characteristic laser localized regulation and control, and relates to the technical field of special machining, wherein a graphene region is localized on a PI film through laser irradiation, and the PI film with the graphene region is attached to a cathode metal plate; disposing a material to be processed above the cathode metal plate; the material to be processed and the cathode metal plate are respectively connected with the anode and the cathode of the direct current pulse power supply, and electrolyte is injected into a gap between the material to be processed and the cathode metal plate, so that electrochemical processing is realized, and material reduction of the material to be processed only occurs in a graphene region corresponding to the lower surface. The invention can realize the directional shielding and passing of the electric field, thereby realizing the electrolysis material reduction in a designated area of the anode workpiece, and simultaneously realizing the electrolysis processing on a non-planar structure while realizing the requirements of different processing results by utilizing the flexible characteristic of the PI film.
Description
Technical Field
The invention relates to the field of special processing, in particular to an electrolytic processing method and device based on flexible PI film conductive characteristic laser localized regulation and control, and the electrolytic processing method and device are used for processing micro-structures such as array micro pits and micro textures.
Background
Graphene is used as a novel nano material, has excellent electrical, optical, thermal and mechanical properties, and has great potential value in the fields of flexible wearable devices, micro super capacitors, biosensors and the like. Graphene can be prepared locally on a PI film by utilizing the laser thermal effect, and the principle is briefly described as follows: laser energy absorption causes rapid local temperature rise, high temperature damage C-O, C =o and N-C; subsequently, the carbon atoms are rearranged to form a graphene structure, and the rest atoms are recombined and released in the form of gas; the SP 3 carbon atoms are converted into SP 2 lattice under laser irradiation, and graphitization of the carbon precursor can be completed without a catalyst.
The laser processing technology uses laser beams as main cutters, realizes the removal processing of workpiece materials through the photo-thermal effect or photochemical effect of light and materials, has the advantages of high energy density, high resolution, high processing efficiency and the like, but has the thermal damage of recast layers, oxide layers, heat affected zones and the like on the processing surface. The electrolytic machining is a non-contact machining method, the machining surface is free of residual stress, a recast layer and microcracks, the electrolytic machining method is widely applied to machining of difficult-to-machine materials, stray corrosion is caused by electric field divergence, so that the electrolytic machining is poor in localization, in addition, cathode tools with different shapes are required for different structures, and in various small-batch flexible electrolytic machining, the preparation of the cathode tools becomes a key limiting efficiency improvement.
Chinese patent publication No. CN1919514a discloses a coaxial composite processing method of jet liquid beam and laser. The method introduces high-speed jet liquid beam coaxial with the laser beam to electrolyze and remove materials on the basis of laser processing, and eliminates recast layers, microcracks and residual stress. The method takes a metal material as a processing object, and related properties of other types of materials are not related. Due to the influences of factors such as jet diameter and jet quality, the energy of the laser beam can be weakened during coaxial conduction, so that the further accurate machining of the dimension is difficult.
In summary, although there are a method of preparing a graphene region on a PI die and a method of laser processing a workpiece in the related art, it is not yet possible to satisfy the requirements of a complicated processing object and a fine processing result.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides an electrolytic machining method and device based on flexible PI film conductive characteristic laser localized regulation, which can realize directional shielding and passing of an electric field by attaching a PI film with a graphene area on a cathode plate, thereby realizing electrolysis material reduction in a designated area of an anode workpiece.
The present invention achieves the above technical object by the following means.
An electrochemical machining method based on flexible PI film conductive characteristic laser localized regulation and control is characterized in that a PI film with a graphene area is attached to a cathode metal plate; disposing a material to be processed above the cathode metal plate; the material to be processed and the cathode metal plate are respectively connected with the anode and the cathode of the direct current pulse power supply, and electrolyte is injected into a gap between the material to be processed and the cathode metal plate, so that electrochemical processing is realized, and material reduction of the material to be processed only occurs in a graphene region corresponding to the lower surface.
In the scheme, the graphene region can be induced in the insulating PI film through laser localized irradiation.
In the scheme, the size and the conductivity of the graphene region can be regulated and controlled by controlling the related parameters of the laser, and the patterned and differential graphene region can be obtained by combining a laser scanning strategy and transferred to a material to be processed through electrolytic processing.
In the scheme, the surface hydrophilicity and hydrophobicity of the PI film are adjusted through laser irradiation, so that the directional flow of the electrolyte is controlled.
In the scheme, the boss structure can be deposited in the graphene region through electrochemical reaction, and then the graphene PI film with the boss structure is attached to the cathode metal plate.
In the above scheme, the shape of the lower surface of the material to be processed is a plane, a curved surface or an arc surface.
An electrochemical machining device based on flexible PI film conductive characteristic laser localized regulation and control comprises a low-pressure stable jet system and an electrochemical machining system; the low-pressure stable jet system introduces electrolyte into a gap between a material to be processed and a cathode metal plate in a low-pressure jet mode through a needle to form an electrolyte layer; the electrochemical machining system is used for electrochemical machining of a specific area between the material to be machined and the cathode metal plate.
In the scheme, the material to be processed and the cathode metal plate are arranged on the special fixture, and the up-down position adjustment of the cathode metal plate can be realized through the fine adjustment screw on the special fixture; the special clamp is arranged on the supporting base; the angle of the supporting base is adjustable.
In the scheme, the low-pressure stable jet system comprises an XYZ three-way fine adjustment platform and a needle; one end of the needle head is arranged on the XYZ three-way fine adjustment platform, and the position and the angle of the needle head can be adjusted through the XYZ three-way fine adjustment platform.
In the scheme, the electrolytic machining system comprises a direct current pulse power supply and a current probe; the current probe monitors the current in real time and gives feedback to the oscilloscope; the direct current pulse power supply provides an external power supply for electrochemical reaction.
Advantageous effects
(1) According to the invention, the PI film subjected to laser irradiation pretreatment is adhered to the metal plate to serve as a cathode for electrolytic machining, and the regulated PI film is used as an auxiliary cathode adhesion layer by utilizing the characteristic that the PI film is originally non-conductive and graphene generated in an irradiation treatment area has good conductivity, so that localized shielding and passing of an electric field can be precisely and efficiently realized, and electrolytic material reduction can be realized in a designated area of an anode workpiece.
(2) The PI film with the graphene area is obtained by a laser induced graphene technology, the graphene presents a porous honeycomb structure, and the structure and patterning of the graphene layer can be controlled by controlling parameters such as laser irradiation scanning speed, path and the like; meanwhile, the PI film with the graphene region is pretreated by utilizing the electrodeposition technology, so that a convex structure can be deposited in the graphene region, and the depth-to-diameter ratio of the subsequent electrolytic machining structure can be improved.
(3) According to the invention, parameters such as laser irradiation and the like are controlled to enable the hydrophilicity and hydrophobicity of the surface of the PI film to be adjustable, so that the autonomous directional flow of the electrolyte is promoted, the concentration polarization in a micro processing gap is inhibited, and the method has important significance for improving the electrolytic processing quality.
(4) The flexibility of the PI film is fully utilized, the electrolytic machining requirements of almost any shape of workpiece surfaces such as planes, curved surfaces and arc surfaces can be met, only a metal supporting structure with a corresponding shape is needed to be prepared, the PI film after laser regulation and modification is attached to the metal supporting structure, localized electrolytic machining is further carried out on the workpiece surfaces, and the processing of the micro-texture of the anode workpiece surfaces with corresponding shapes is realized.
(5) The method is simple and easy to implement, can complete the processing of the surface structure with controllable area size and depth and complex morphology, and realizes the localized processing of the three-dimensional structure and the transfer printing of the material surface pattern structure from the cathode to the anode. Meanwhile, the defects of easy thermal damage, residual stress and recasting of the layer are overcome, and the quality of the processed surface is improved.
Drawings
Fig. 1 is a schematic diagram of a graphene region prepared by laser etching of a PI film surface according to an embodiment of the present invention;
FIG. 2 is a schematic view of the PI film of FIG. 1 as a cathode auxiliary patch for electrolytic machining of a designated area;
FIG. 3 is a schematic diagram of the low pressure stabilizing jet system of FIG. 2;
FIG. 4 is a schematic diagram of the hydrophilic-hydrophobic character of the upper surface of the PI film.
Reference numerals:
1-laser source, 2-mechanical grating, 3-beam expander, 4-reflector, 5-fixture, 6-PI film, 7-vibrating mirror, 8-lens, 9-low pressure stable jet system, 10-metal needle, 11-material to be processed, 12-cathode metal plate, 13-current probe, 14-oscilloscope, 15-computer, 16-DC pulse power supply, 17-control card, 18-special fixture, 19-electrolyte tank, 20-fine tuning screw, 21-supporting base, 22-locking screw, 23-workbench, 24-adjustable supporting nail, 25-liquid discharging hole, 26-hose, 27-recovery cylinder.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The principle of the invention is as follows: and preparing porous graphene on the PI film by using laser, and carrying out three-dimensional network modeling on the graphene. Photo-thermally converting SP 3 carbon atoms into SP 2 carbon atoms by pulse laser irradiation to form a graphene structure, adhering a processed PI film on a metal plate to serve as a cathode to be connected with the cathode of a direct current pulse power supply, connecting the anode of the direct current pulse power supply with an anode material, and placing the anode material and the metal plate with the PI film adhered on the cathode in parallel with a certain gap; electrolyte is introduced into a gap between an anode material and a cathode metal plate attached with a PI film in a low-pressure jet flow mode through a needle head to form an electrolyte layer, a circuit between the anode and the cathode is conducted, the cathode metal plate attached with the processed PI film can realize directional shielding and passing of an electric field, laser beam irradiation is opposite to a graphene area on the cathode metal plate attached with the PI film, and dissolution is carried out in a corresponding area of the anode material to be processed.
The PI film 6 is subjected to laser irradiation to induce graphene to form a specific conductive area, such as a black area in the graph 1, so that the directional shielding and passing of an electric field can be realized; the cathode metal plate 12 attached with the PI film after laser regulation treatment is used as a cathode to be connected with the cathode of the direct current pulse power supply 16, the anode of the direct current pulse power supply 16 is connected with the material 11 to be processed, the material 11 to be processed is placed in parallel with the cathode metal plate 12 attached with the PI film with the graphene area on the cathode, and a uniform gap exists between the cathode metal plate and the cathode metal plate; the needle 10 introduces electrolyte into a gap between a material 11 to be processed and a cathode metal plate 12, the cathode of which is stuck with a PI film with a graphene area, in a low-pressure jet flow mode to form an electrolyte layer, so that a circuit between the anode and the cathode is conducted; the laser beam emitted by the laser source 1 irradiates on the material 11 to be processed, a local high-temperature area is formed inside, and the electrochemical dissolution rate is accelerated. The area where the material to be processed 11 dissolves corresponds to the area of graphene on the PI film 6.
In the invention, the PI die with the graphene area corresponds to a die, and through electrochemical reaction, a groove or a micro pit and other structures which are in shared fit with the graphite area can be formed on the lower surface of the material 11 to be processed.
Through controlling parameters such as laser irradiation time, intensity, frequency and the like, the hydrophilic-hydrophobic characteristic is regulated and controlled on the upper surface of the PI film 6, so that the autonomous directional flow of electrolyte is promoted, concentration polarization in a micro machining gap is inhibited, and the electrolytic machining quality is improved.
Preprocessing the PI film 6 by controlling a laser scanning path, irradiating a patterned conductive graphene region, and realizing localized processing of a three-dimensional structure and transfer printing of a surface pattern from a cathode to an anode by electrolytic processing;
In order to realize deep hole processing, an electrodeposition step can be added on the PI film subjected to laser treatment, so that a convex structure is electrodeposited on a conductive graphene area, and then corresponding electrolysis operation is carried out, so that the depth of an electrolytic processing micro pit can be further increased; the micro-pit electrolysis in the differential area can be realized by simultaneously controlling parameters such as laser irradiation, scanning speed and the like of different points.
The electrolyte in the needle head 10 is low-concentration acid solution with the mass fraction of 5% -10%, or neutral saline solution with the mass fraction of 10% -20% can be used according to the requirement.
Referring to fig. 1, a device for preparing graphene by irradiating a PI film surface with laser comprises a laser source 1, a mechanical grating 2, a beam expander 3, a reflector 4, a galvanometer 7 and a lens 8; the laser beam emitted by the laser source 1 is reflected by the reflecting mirror 4 through the mechanical grating 2 and the beam expander 3 and is irradiated on the PI film 6 through the vibrating mirror 7 and the lens 8, and the generation of the laser beam and the movement of the vibrating mirror 7 are controlled by the computer 15. The laser adopted by the laser source 1 can be millisecond-nanosecond pulse width horizontal infrared pulse laser or picosecond ultraviolet pulse laser, so that the conductivity of the PI film is regulated and controlled.
Referring to fig. 2, an electrochemical machining device based on flexible PI film conductive property laser localized control comprises a low-pressure stable jet system 9 and an electrochemical machining system; the stable low-pressure jet system 9 is used for providing electrolyte flow beams formed after entering the metal needle 10, the electrolyte flow beams form electrolyte layers between a material 11 to be processed and a cathode metal plate 12 with a PI film attached to a cathode, a circuit between the cathode and the anode is conducted, and hydrogen separated in the electrolysis process is easy to accumulate on the cathode metal plate 12, so that the hydrogen can be effectively removed by means of low-pressure jet.
The material 11 to be processed and the cathode metal plate 12 are placed on a special fixture 18, and the up-down position adjustment of the cathode metal plate 12 can be realized through a fine adjustment screw 20 on the special fixture 18; the special fixture 18 is arranged on the supporting base 21, and the special fixture and the supporting base are locked by the locking screw 22; the supporting base 21 is placed in the electrolyte tank 19, the inclination angle of the special clamp 18 is changed through the adjustable supporting nails 24, the electrolyte sequentially passes through the liquid discharge holes 25, and the hose 26 returns to the recovery cylinder 27 to realize the recovery and the utilization of the electrolyte, so that the environment is prevented from being polluted; the electrolyte tank 19 is placed on a table 23 and the movement of the position is effected under the control of the computer 15 and the control card 17.
Referring to fig. 3, the low-pressure stable jet system comprises a servo motor 34 driving a rolling screw 32 to rotate through a coupling 35, wherein two ends of the rolling screw 32 are connected with a second support seat 36 through a first support seat 33; the rotation of the ball screw 32 is converted into linear movement of the piston rod 30 by the slider 31 mated with the ball screw 32, thereby pushing the electrolyte in the electrolyte 28 to be output at a constant speed. The electrolyte flows into the metal needle 10 through the first check valve 44 and the hose 43 to form a low-pressure stable jet. The angle of the device can be adjusted by the angle adjuster 41, the XYZ three-way fine adjustment platform 40 can change the jet impact position, and the first check valve 44 and the second check valve 37 can cooperate with the forward and reverse movement of the ball screw 32 to realize electrolyte output and suction. When the servo motor 34 drives the piston rod 30 to move forward through the ball screw 32, the first one-way valve 44 is opened, the second one-way valve 37 is closed, and electrolyte enters the hose 43 under the pushing of the piston 29; when the servo motor 34 drives the piston rod 30 to reversely move through the ball screw 32, the first check valve 44 is closed, the second check valve 37 is opened, and the electrolyte in the electrolyte storage groove 38 is sucked into the electrolyte tank 28 through the filter 39.
Referring to fig. 4, the black area is a processed graphene area, the square area is an unprocessed PI film, the flow direction of the electrolyte is from left to right, the hydrophobicity on the material is from strong to weak, and the hydrophilicity is from weak to strong, so that the directional flow of the electrolyte is realized; the hydrophilic and hydrophobic characteristics of the upper surface of the PI film 6 are regulated and controlled by controlling parameters such as laser irradiation time, intensity, frequency and the like: and processing a thin graphene region layer nearby the induced graphene region by the same mechanism to form directional distribution from reduced hydrophobicity to enhanced hydrophilicity, so that autonomous directional flow of electrolyte is promoted, concentration polarization in a micro processing gap is inhibited, and electrolytic processing quality is improved.
Examples
A laser electrochemical machining method based on flexible PI film conductive characteristic laser localized regulation and control is characterized in that a three-dimensional graphene region with excellent conductive performance is formed on a PI film subjected to laser regulation and control treatment, so that the directional shielding and passing of a space electric field are realized, on the basis, a low-pressure stable jet system 9 is utilized to introduce a low-pressure electrolyte beam on the surface of a material, localized electrochemical dissolution machining is realized at a specific graphene region, and the obtained surface structure has no thermal damage, no residual stress and no recasting layer. The electrolytic environment is an acidic solution, the mass fraction is 5% -10%, or a neutral saline solution can be selected, and the mass fraction is 10% -20%.
In order to realize deep hole processing, an electrodeposition step can be added on the PI film subjected to laser treatment, so that a convex structure is electrodeposited on a conductive graphene area, and then corresponding electrolysis operation is carried out, so that the depth of an electrolytic processing micro pit can be further increased; the micro-pit electrolysis in the differential area can also be realized by simultaneously controlling parameters such as laser irradiation, scanning speed and the like of different points.
An electrolytic machining device based on flexible PI film conductive characteristic laser localized regulation and control comprises a low-pressure stable jet system 9 and an electrolytic machining system; the low-pressure stable jet system 9 generates constant-speed electrolyte, and the constant-speed electrolyte forms stable low-pressure jet after passing through the metal needle 10, and the stable low-pressure jet is jetted into a gap between a material 11 to be processed and a cathode metal plate 12 attached with the PI film 6 subjected to laser regulation treatment, and forms a thin electrolyte layer. The example also includes an electrolyte tank 19, a drain hole 25, a hose 26 and a recovery cylinder 27 to facilitate electrolyte recovery.
The electrolytic machining system comprises a direct current pulse power supply 16, wherein the negative electrode of the direct current pulse power supply 16 is connected with a cathode metal plate 12, the cathode of which is stuck with a PI film subjected to laser regulation treatment, and the positive electrode of the direct current pulse power supply 16 is connected with a material 11 to be machined, and the cathode metal plate 12, stuck with the PI film subjected to laser regulation treatment, can realize directional shielding and passing of an electric field, so that when the PI film 6 is treated by utilizing laser, the three-dimensional structure and patterning of a graphene layer can be controlled, and the micro-structure electrolysis of a differential area and the replication machining of the surface structure of an anode can be realized.
In the invention, the PI film is polyimide, and the polyetherimide also has the phenomenon of laser induced graphene.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives, and variations may be made in the above embodiments by those skilled in the art without departing from the spirit and principles of the invention.
Claims (4)
1. An electrolytic machining method based on flexible PI film conductive characteristic laser localized regulation and control is characterized in that a PI film with a graphene area is attached to a cathode metal plate (12); -arranging the material to be processed (11) above the cathode metal plate (12); the material to be processed (11) and the cathode metal plate (12) are respectively connected with the positive electrode and the negative electrode of the direct current pulse power supply (16), and electrolyte is jetted into a gap between the material to be processed (11) and the cathode metal plate (12) so as to realize electrochemical processing, and the material reduction of the material to be processed (11) only occurs in a graphene region corresponding to the lower surface; inducing a graphene region in the insulating PI film through laser localized irradiation; the size and the conductivity of the graphene region are regulated and controlled by controlling related parameters of laser, and the patterned and differential graphene region is obtained by combining a laser scanning strategy and transferred to a material (11) to be processed through electrolytic processing; the shape of the lower surface of the material (11) to be processed is a plane, a curved surface or an arc surface; adjusting the surface hydrophilicity and hydrophobicity of the PI film by laser irradiation, thereby controlling the directional flow of the electrolyte; and (3) depositing a boss structure in a graphene region through electrochemical deposition, and attaching a graphene PI film with the boss structure to a cathode metal plate (12).
2. An electrolytic machining device for realizing the electrolytic machining method based on the flexible PI film conductive characteristic laser localized control as claimed in claim 1, which is characterized by comprising a low-pressure stable jet system (9) and an electrolytic machining system; the low-pressure stable jet system (9) comprises an XYZ three-way fine adjustment platform (40) and a needle (10); one end of the needle head (10) is arranged on an XYZ three-way fine adjustment platform (40), and the position and the angle of the needle head (10) are adjusted through the XYZ three-way fine adjustment platform (40); the low-pressure stable jet system (9) introduces electrolyte into a gap between a material (11) to be processed and a cathode metal plate (12) in a low-pressure jet mode through a needle (10) to form an electrolyte layer; the electrochemical machining system is used for electrochemical machining of a specific area between a material (11) to be machined and a cathode metal plate (12).
3. The electrolytic processing device according to claim 2, wherein the material to be processed (11) and the cathode metal plate (12) are mounted on a special fixture (18), and the up-down position adjustment of the cathode metal plate (12) is achieved by a fine adjustment screw (20) on the special fixture (18); the special clamp (18) is arranged on the supporting base (21); the angle of the supporting base (21) is adjustable.
4. An electrolytic machining device according to claim 2, characterized in that the electrolytic machining system comprises a direct current pulse power source (16) and a current probe (13); the current probe (13) monitors the current in real time and gives feedback on the oscilloscope (14); the direct current pulse power supply (16) provides an external power supply for electrochemical reaction.
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| CN202210069890.6A CN114346338B (en) | 2022-01-21 | 2022-01-21 | Electrochemical machining method and device based on flexible PI film conductive characteristic laser localized regulation and control |
| PCT/CN2022/077956 WO2023137827A1 (en) | 2022-01-21 | 2022-02-25 | Electrolytic machining method and apparatus based on flexible pi film conductive characteristic laser localized regulation |
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| CN202210069890.6A CN114346338B (en) | 2022-01-21 | 2022-01-21 | Electrochemical machining method and device based on flexible PI film conductive characteristic laser localized regulation and control |
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| WO2023137827A1 (en) | 2023-07-27 |
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