CN114346338A - Electrochemical machining method and device based on flexible PI film conductive characteristic laser localized regulation - Google Patents
Electrochemical machining method and device based on flexible PI film conductive characteristic laser localized regulation Download PDFInfo
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- CN114346338A CN114346338A CN202210069890.6A CN202210069890A CN114346338A CN 114346338 A CN114346338 A CN 114346338A CN 202210069890 A CN202210069890 A CN 202210069890A CN 114346338 A CN114346338 A CN 114346338A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H11/00—Auxiliary apparatus or details, not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
Abstract
The invention discloses an electrochemical machining method and device based on flexible PI film conductive characteristic laser localization regulation, and relates to the technical field of special machining, wherein a graphene area is generated on a PI film in a localized mode through laser irradiation, and the PI film with the graphene area is attached to a cathode metal plate; arranging a material to be processed above the cathode metal plate; the material to be processed and the cathode metal plate are respectively connected with the anode and the cathode of the direct-current pulse power supply, electrolyte is jetted into a gap between the material to be processed and the cathode metal plate, so that electrochemical processing is realized, and material reduction of the material to be processed only occurs in a region, corresponding to graphene, on the lower surface. The invention can realize the directional shielding and passing of an electric field, thereby realizing the electrolytic material reduction in a designated area of an anode workpiece, and simultaneously realizing the electrolytic machining on a non-planar structure while realizing different machining result requirements by utilizing the flexible characteristic of the PI film.
Description
Technical Field
The invention relates to the field of special processing, in particular to an electrochemical machining method and device based on flexible PI film conductive characteristic laser localized regulation and control, and a machining method and device for micro structures such as array micro pits, micro textures and the like.
Background
As a novel nano material, the graphene has excellent electrical, optical, thermal and mechanical properties, and has great potential value in the fields of flexible wearable devices, micro supercapacitors, biosensors and the like. By utilizing the laser thermal effect, the graphene can be prepared on the PI film in a localized manner, and the principle is briefly described as follows: laser energy absorption causes rapid local temperature rise, and high temperature destroys C-O, C ═ O and N-C; then, the carbon atoms are rearranged to form a graphene structure, and the rest atoms are recombined and released in a gas form; SP3Conversion of carbon atoms to SP under laser irradiation2The lattice, without the need for a catalyst, accomplishes graphitization of the carbon precursor.
The laser processing technology uses laser beams as main cutters, realizes the removal processing of workpiece materials through the photothermal effect or photochemical effect of light and materials, has the advantages of high energy density, high resolution, high processing efficiency and the like, but has thermal damages of a recast layer, an oxide layer, a heat affected zone and the like on the processing surface. Electrolytic machining is a non-contact machining method, the machined surface has no residual stress, no recasting layer and microcracks, and the method is widely applied to machining of difficult-to-machine materials, but stray corrosion can be brought by divergence of an electric field, so that the electrolytic machining locality is poor.
Chinese patent publication No. CN1919514A discloses a method for coaxially processing a jet liquid beam and laser. According to the method, on the basis of laser processing, a high-speed jet liquid beam coaxial with a laser beam is introduced to remove materials through electrolysis, and a recast layer, microcracks and residual stress are eliminated. The method takes the metal material as a processing object and does not relate to the relevant properties of other types of materials. Due to the influences of factors such as jet diameter, jet quality and the like, the energy of the laser beam can be weakened during coaxial conduction, so that the further accurate machining of the size is difficult.
As described above, although there are methods for preparing a graphene region on a PI mold and methods for laser processing a workpiece in the related art, the requirements for a complicated processing object and a fine processing result have not been satisfied.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides an electrochemical machining method and device based on flexible PI film conductive characteristic laser localized regulation, wherein a PI film with a graphene area is attached to a cathode plate, so that the directional shielding and passing of an electric field can be realized, and the electrolytic material reduction in a designated area of an anode workpiece can be realized.
The present invention achieves the above-described object by the following technical means.
An electrolytic processing method based on flexible PI film conductive characteristic laser localized control is characterized in that a PI film with a graphene area is attached to a cathode metal plate; arranging a material to be processed above the cathode metal plate; the material to be processed and the cathode metal plate are respectively connected with the anode and the cathode of the direct-current pulse power supply, electrolyte is jetted into a gap between the material to be processed and the cathode metal plate, so that electrochemical processing is realized, and material reduction of the material to be processed only occurs in a region, corresponding to graphene, on the lower surface.
In the scheme, the graphene region can be induced and generated in the insulating PI film through laser localized irradiation.
In the scheme, the size and the conductivity of the graphene region can be regulated and controlled by controlling related laser parameters, the patterned and differentiated graphene region can be obtained by combining a laser scanning strategy, and the patterned and differentiated graphene region is transferred to a material to be processed through electrolytic processing.
In the scheme, the hydrophilicity and hydrophobicity of the surface of the PI film are adjusted through laser irradiation, so that the directional flow of the electrolyte is controlled.
In the scheme, the boss structure can be firstly deposited in the graphene area through electrochemical reaction, and then the graphene PI film with the boss structure is attached to the cathode metal plate.
In the above scheme, the lower surface of the material to be processed is a plane, a curved surface or an arc surface.
An electrolytic machining device based on flexible PI film conductive characteristic laser localized regulation comprises a low-voltage stable jet system and an electrolytic machining system; the low-pressure stable jet system introduces electrolyte into a gap between a material to be processed and the cathode metal plate through a needle in a low-pressure jet mode to form an electrolyte layer; the electrochemical machining system is used for electrochemical machining of a specific area between a material to be machined and a cathode metal plate.
In the scheme, the material to be processed and the cathode metal plate are arranged on the special fixture, and the up-and-down position adjustment of the cathode metal plate can be realized through the fine adjustment screw on the special fixture; the special fixture is arranged on the supporting base; the angle of the supporting base is adjustable.
In the scheme, the low-pressure stable jet system comprises an XYZ three-direction fine adjustment platform and a needle head; one end of the needle head is arranged on the XYZ three-way fine adjustment platform, and the position and the angle of the needle head can be adjusted through the XYZ three-way fine adjustment platform.
In the scheme, the electrolytic machining system comprises a direct current pulse power supply and a current probe; the current probe monitors the current in real time and feeds back the current on an oscilloscope; the direct current pulse power supply provides an external power supply for the electrochemical reaction.
Has the advantages that:
(1) according to the invention, the PI film subjected to laser irradiation pretreatment is adhered to the metal plate to serve as a cathode for electrolytic machining, the characteristic that the PI film is originally non-conductive and graphene generated in an irradiation treatment area has good conductivity is utilized, and the regulated and controlled PI film serves as a cathode auxiliary adhesion layer, so that the localized shielding and passing of an electric field can be precisely and efficiently realized, and the electrolytic material reduction in a specified area of an anode workpiece is realized.
(2) The PI film with the graphene area is obtained by a laser-induced graphene technology, the graphene presents a porous honeycomb structure, and the structure and patterning of the graphene layer can be controlled by controlling parameters such as laser irradiation scanning speed and path; meanwhile, the PI film with the graphene area is pretreated by the electrodeposition technology, so that a convex structure can be deposited in the graphene area, and the depth-diameter ratio of a subsequent electrochemical machining structure is improved.
(3) The method ensures that the hydrophilicity and hydrophobicity of the surface of the PI film have adjustability by controlling parameters such as laser irradiation, thereby promoting the autonomous directional flow of the electrolyte, inhibiting the concentration polarization in the tiny processing gap and having great significance for improving the electrolytic processing quality.
(4) The flexibility of the PI film is fully utilized, the surface electrochemical machining requirements of workpieces in almost any shapes such as planes, curved surfaces, arc surfaces and the like can be met, only the metal supporting structure in the corresponding shape needs to be prepared, the PI film after laser regulation and control modification is attached to the metal supporting structure, then the surface of the workpiece is subjected to localized electrochemical machining, and the machining of the anode workpiece surface microtexture in the corresponding shape is realized.
(5) The method is simple and easy to implement, can control the size and depth of the area and process the surface structure with complex appearance, and realizes the localized processing of the three-dimensional structure and the transfer printing of the material surface pattern structure from the cathode to the anode. Meanwhile, the defects of easy generation of thermal damage, residual stress and recast layer are overcome, and the quality of the processed surface is improved.
Drawings
Fig. 1 is a schematic diagram of a graphene area prepared by laser etching a PI film surface according to an embodiment of the present invention;
FIG. 2 is a schematic view of the PI film obtained in FIG. 1 as a cathode auxiliary layer for performing electrochemical machining of a designated area;
FIG. 3 is a schematic diagram of the low pressure stable fluidic system referred to in FIG. 2;
FIG. 4 is a schematic diagram of the hydrophilic and hydrophobic properties of the upper surface of the PI film.
Reference numerals:
1-laser source, 2-mechanical grating, 3-beam expander, 4-reflector, 5-clamp, 6-PI film, 7-vibrating mirror, 8-lens, 9-low-voltage stable jet system, 10-metal needle, 11-material to be processed, 12-cathode metal plate, 13-current probe, 14-oscilloscope, 15-computer, 16-direct current pulse power supply, 17-control card, 18-special clamp, 19-electrolytic bath, 20-fine adjustment screw, 21-support base, 22-locking screw, 23-workbench, 24-adjustable support pin, 25-liquid discharge hole, 26-hose and 27-recovery cylinder.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The principle of the invention is as follows: preparing porous graphene on the PI film by using laser, and carrying out three-dimensional network modeling on the graphene. Irradiating with pulsed laser to irradiate SP3Photothermal conversion of carbon atoms into SP2The carbon atoms form a graphene structure, then the treated PI film is pasted on a metal plate to serve as a cathode to be connected with the negative electrode of a direct current pulse power supply, the positive electrode of the direct current pulse power supply is connected with an anode material, the anode material and the metal plate with the PI film pasted on the cathode are placed in parallel, and a certain gap is formed between the anode material and the metal plate; electrolyte is introduced into a gap between an anode material and a cathode metal plate attached with a PI film in a low-pressure jet mode through a needle to form an electrolyte layer, a circuit between the anode and the cathode is conducted, the cathode metal plate attached with the processed PI film can realize the directional shielding and passing of an electric field, laser beam irradiation is opposite to a graphene area on the cathode metal plate attached with the PI film, and the graphene area corresponding to a material to be processed on the anode is dissolved.
The PI film 6 is induced by laser irradiation to generate graphene, a specific conductive area, such as a black area in a figure 1, is formed, and the directional shielding and passing of an electric field can be realized; the cathode metal plate 12 pasted with the PI film after laser regulation and control treatment is used as a cathode and is connected with the negative electrode of a direct current pulse power supply 16, the positive electrode of the direct current pulse power supply 16 is connected with a material 11 to be processed, the material 11 to be processed and the cathode metal plate 12 pasted with the PI film with the graphene area on the cathode are placed in parallel, and a uniform gap is formed between the material 11 to be processed and the cathode metal plate 12; the needle 10 introduces electrolyte into a gap between a material to be processed 11 and a cathode metal plate 12 with a graphene area PI film attached to a cathode in a low-pressure jet mode to form an electrolyte layer, so that a circuit between the anode and the cathode is conducted; the laser beam emitted by the laser source 1 is irradiated on the material 11 to be processed, a local high-temperature area is formed inside, and the electrochemical dissolution rate is accelerated. The region where the material to be processed 11 dissolves corresponds to the region of graphene on the PI film 6.
In the invention, the PI mold with the graphene region is equivalent to a mold, and through electrochemical reaction, the lower surface of the material 11 to be processed forms a groove or a dimple which is attached to the graphite region.
By controlling parameters such as laser irradiation time, intensity and frequency, the hydrophilic and hydrophobic characteristics are regulated and controlled on the upper surface of the PI film 6, so that the electrolyte can flow in an autonomous and directional manner, concentration polarization in a tiny processing gap is inhibited, and the electrolytic processing quality is improved.
The laser scanning path is controlled, the PI film 6 is pretreated, a patterned conductive graphene area is irradiated, and the localized processing of a three-dimensional structure and the transfer printing of a surface pattern from a cathode to an anode are realized through electrolytic processing;
in order to realize deep hole processing, an electrodeposition step can be added on the PI film subjected to laser processing, so that a convex structure is electrodeposited in a conductive graphene area, and then corresponding electrolysis operation is carried out, so that the depth of an electrolytic processing micro pit can be further improved; by simultaneously controlling parameters such as laser irradiation, scanning speed and the like of different point positions, micro-pit electrolysis in a differentiated area can be realized.
The electrolyte in the needle 10 is a low-concentration acidic solution with the mass fraction of 5% -10%, and a neutral saline solution with the mass fraction of 10% -20% can also be used according to needs.
With reference to fig. 1, the device for preparing graphene by irradiating the surface of the PI film with laser comprises a laser source 1, a mechanical grating 2, a beam expander 3, a reflector 4, a galvanometer 7 and a lens 8; the laser beam emitted by the laser source 1 passes through the mechanical grating 2 and the beam expander 3, is reflected by the reflector 4, passes through the vibrating mirror 7 and the lens 8 and is irradiated on the PI film 6, and the generation of the laser beam and the movement of the vibrating mirror 7 are controlled by the computer 15. The laser adopted by the laser source 1 can be millisecond-nanosecond pulse width horizontal infrared pulse laser or picosecond ultraviolet pulse laser, and fixed regulation and control of the conductivity of the PI film are realized.
With reference to fig. 2, an electrochemical machining device based on laser localized regulation and control of the conductive characteristics of a flexible PI film comprises a low-voltage stable jet system 9 and an electrochemical machining system; the stable low-pressure jet system 9 is used for providing electrolyte flow beams formed after entering the metal needle 10, an electrolyte layer is formed between a material 11 to be processed and a cathode metal plate 12 with a PI film attached to a cathode of the cathode, a circuit between the cathode and an anode is conducted, hydrogen separated out in the electrolysis process is easy to accumulate on the cathode metal plate 12, and the hydrogen can be effectively removed by means of low-pressure jet.
The material 11 to be processed and the cathode metal plate 12 are placed on a special clamp 18, and the up-and-down position adjustment of the cathode metal plate 12 can be realized through a fine adjustment screw 20 on the special clamp 18; the special clamp 18 is arranged on the supporting base 21 and is locked by a locking screw 22; the supporting base 21 is placed in the electrolyte tank 19, the inclination angle of the special clamp 18 is changed by adjusting the supporting nail 24, the electrolyte sequentially passes through the liquid discharge hole 25, and the hose 26 returns to the recovery cylinder 27 to realize the recovery and utilization of the electrolyte, so that the environment pollution is avoided; the electrolyte tank 19 is placed on a table 23 and the movement of the position is achieved under the control of the computer 15 and the control card 17.
Referring to fig. 3, the low-pressure stable jet system includes a servo motor 34 driving a ball screw 32 to rotate through a coupling 35, and two ends of the ball screw 32 pass through a first support seat 34 and a second support 37; the rotation of the ball screw 32 is converted into the linear movement of the piston rod 30 by the slider 31 matching with the ball screw 32, thereby pushing the electrolyte in the electrolyte 28 to be output at a constant speed. The electrolyte flows into the metal needle 10 through the first one-way 44 and the hose 43 to form a low-pressure stable jet flow. The angle of the electrolyte can be adjusted by an angle adjuster 41, the XYZ three-way fine adjustment platform 40 can change the position of jet impact, and the first check valve 27 and the second check valve 37 can be matched with the ball screw 32 to move forward and backward to realize the output and the suction of the electrolyte. When the servo motor 34 drives the piston rod 30 to move forward through the ball screw 32, the first one-way valve 44 is opened, the second one-way valve 37 is closed, and the electrolyte enters the hose 33 under the pushing of the piston 29; when the servo motor 34 drives the piston rod 30 to move in the reverse direction via the ball screw 32, the first check valve 44 is closed, the second check valve 37 is opened, and the electrolyte in the electrolyte storage tank 38 is sucked into the electrolyte tank 28 via the filter 37.
With reference to fig. 4, the black area is a processed graphene area, the square area is an unprocessed PI film, the electrolyte flows from left to right, the hydrophobicity of the material changes from strong to weak from left to right, and the hydrophilicity changes from weak to strong, so that the directional flow of the electrolyte is realized; in the embodiment, the hydrophilic and hydrophobic characteristics are regulated and controlled on the upper surface of the PI membrane 6 by controlling parameters such as laser irradiation time, intensity, frequency and the like: thin graphene regional layers are processed near the induced graphene region through the same mechanism, and directional distribution from weakening of hydrophobicity to increasing of hydrophilicity is formed, so that autonomous directional flow of electrolyte is promoted, concentration polarization in tiny processing gaps is inhibited, and electrolytic processing quality is improved.
Example 1:
a laser electrochemical processing method based on flexible PI film conductive characteristic laser localized control is characterized in that a graphene region with excellent three-dimensional conductive performance is formed on a PI film subjected to laser control processing, directional shielding and passing of a space electric field are achieved, on the basis, a low-pressure stable jet system 9 is utilized to introduce low-pressure electrolyte beams on the surface of a material, localized electrochemical dissolution processing is achieved in a specific graphene region, and an obtained surface structure is free of thermal damage, residual stress and a recasting layer. The used electrolytic environment is an acidic solution with the mass fraction of 5-10%, and a neutral saline solution with the mass fraction of 10-20% can be selected.
In order to realize deep hole processing, an electrodeposition step can be added on the PI film subjected to laser processing, so that a raised structure is electrodeposited in a conductive graphene area, and then corresponding electrolysis operation is carried out, so that the depth of an electrolytic processing micro pit can be further improved; and the micro-pit electrolysis in the differential area can be realized by simultaneously controlling parameters such as laser irradiation, scanning speed and the like of different point positions.
An electrolytic machining device based on flexible PI film conductive characteristic laser localized regulation comprises a low-voltage stable jet system 9 and an electrolytic machining system; the low-pressure stable jet system 9 generates constant-speed electrolyte to form stable low-pressure jet after passing through a metal needle 10, and the stable low-pressure jet is jetted into a gap between a material 11 to be processed and a cathode metal plate 10 attached with a PI film 6 subjected to laser regulation and control treatment to form a thin electrolyte layer. The electrolyte tank 19, the liquid discharge hole 25, the hose 26 and the recovery cylinder 27 are also included in the embodiment, so that the electrolyte can be recovered and utilized.
The electrolytic machining system comprises a direct current pulse power supply 16, the negative electrode of the direct current pulse power supply 16 is connected with a metal plate 12 of which the negative electrode is pasted with a PI film subjected to laser regulation and control treatment, the positive electrode of the direct current pulse power supply 16 is connected with a material 11 to be machined, and the negative electrode metal plate 12 of which the negative electrode is pasted with the PI film subjected to laser regulation and control treatment can realize the directional shielding and passing of an electric field, so that when the PI film 6 is treated by laser, the electrolysis of a differential area microstructure and the copying and machining of an anode surface structure can be realized by controlling the three-dimensional structure and patterning of a graphene layer.
In the invention, the PI film is polyimide, and the phenomenon of laser induced graphene also exists in polyetherimide.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.
Claims (10)
1. An electrolytic machining method based on flexible PI film conductive characteristic laser localized control is characterized in that a PI film with a graphene area is attached to a cathode metal plate (12); arranging a material (11) to be processed above a cathode metal plate (12); the material (11) to be processed and the cathode metal plate (12) are respectively connected with the positive electrode and the negative electrode of the direct current pulse power supply (16), electrolyte is injected into a gap between the material (11) to be processed and the cathode metal plate (12) so as to realize electrochemical processing, and material reduction of the material (11) to be processed only occurs in a graphene area corresponding to the lower surface.
2. The electrochemical machining method based on the laser localized regulation and control of the conductive property of the flexible PI film as claimed in claim 1, wherein a graphene region can be induced and generated in the insulating PI film through laser localized irradiation.
3. The flexible PI film conductive property laser localized regulation and control based electrochemical machining method as claimed in claim 2, wherein the size and conductivity of the graphene region can be regulated and controlled by controlling laser related parameters, a laser scanning strategy is combined to obtain a patterned and differentiated graphene region, and the patterned and differentiated graphene region is transferred to a material (11) to be machined through electrochemical machining.
4. The electrochemical machining method based on the laser localized regulation and control of the conductive property of the flexible PI film as claimed in claim 1, wherein the hydrophilicity and hydrophobicity of the surface of the PI film are regulated through laser irradiation, so that the directional flow of electrolyte is controlled.
5. The electrochemical machining method based on the laser localized regulation and control of the conductive characteristics of the flexible PI film as claimed in claim 1, wherein a boss structure is deposited in a graphene area through electrochemical deposition, and then the graphene PI film with the boss structure is attached to a cathode metal plate (12).
6. The flexible PI film conductive property laser localized control-based electrolytic machining method as claimed in claim 1, wherein the shape of the lower surface of the material to be machined (11) is a plane, a curved surface or an arc surface.
7. An electrolytic machining device based on flexible PI film conductive characteristic laser localized regulation is characterized by comprising a low-voltage stable jet system (9) and an electrolytic machining system; the low-pressure stable jet system (9) introduces electrolyte into a gap between a material to be processed (11) and a cathode metal plate (12) through a needle (10) in a low-pressure jet form to form an electrolyte layer; the electrochemical machining system is used for electrochemical machining of a specific area between a material (11) to be machined and a cathode metal plate (12).
8. The electrolytic processing device based on the laser localized control of the conductive characteristics of the flexible PI film as claimed in claim 7, wherein the material (11) to be processed and the cathode metal plate (12) are mounted on a special fixture (18), and the up-and-down position adjustment of the cathode metal plate (12) can be realized through a fine adjustment screw (19) on the special fixture (18); the special clamp (18) is arranged on the supporting base (21); the angle of the supporting base (21) is adjustable.
9. The electrolytic processing device based on the laser localized regulation and control of the conductive property of the flexible PI film as claimed in claim 7, wherein the low-pressure stable jet system (9) comprises an XYZ three-way fine adjustment platform (40) and a needle (10); one end of the needle head (10) is arranged on the XYZ three-way fine adjustment platform (40), and the position and the angle of the needle head (10) can be adjusted through the XYZ three-way fine adjustment platform (40).
10. The flexible PI film conductive property laser localized control-based electrochemical machining device as claimed in claim 7, wherein the electrochemical machining system comprises a direct current pulse power supply (16) and a current probe (13); the current probe (13) monitors the current in real time and feeds back the current on the oscilloscope (14); the direct current pulse power supply (16) provides an external power supply for the electrochemical reaction.
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| CN202210069890.6A CN114346338A (en) | 2022-01-21 | 2022-01-21 | Electrochemical machining method and device based on flexible PI film conductive characteristic laser localized regulation |
| PCT/CN2022/077956 WO2023137827A1 (en) | 2022-01-21 | 2022-02-25 | Electrolytic machining method and apparatus based on flexible pi film conductive characteristic laser localized regulation |
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