CN112658446A - Laser-induced plasma micro-machining device and method - Google Patents
Laser-induced plasma micro-machining device and method Download PDFInfo
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- CN112658446A CN112658446A CN202011451342.7A CN202011451342A CN112658446A CN 112658446 A CN112658446 A CN 112658446A CN 202011451342 A CN202011451342 A CN 202011451342A CN 112658446 A CN112658446 A CN 112658446A
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000005459 micromachining Methods 0.000 title claims abstract description 18
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- 239000007788 liquid Substances 0.000 claims abstract description 34
- 238000007493 shaping process Methods 0.000 claims abstract description 19
- 230000008569 process Effects 0.000 claims abstract description 17
- 238000003754 machining Methods 0.000 claims description 17
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- 239000008367 deionised water Substances 0.000 claims description 4
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Abstract
The invention belongs to the technical field of micro-machining, and discloses a laser-induced plasma micro-machining device and a method, wherein the device comprises: the processing head module comprises a processing head main body forming a processing inner cavity, a transparent window positioned at the top of the processing head main body and an inner cavity channel positioned on one side of the processing inner cavity; a laser module for emitting a laser beam focused in a processing inner cavity of the processing head body through the transparent window; the liquid working medium enters the processing inner cavity of the processing head main body through the inner cavity channel and flows out through the processing head main body outlet to act on the surface of a workpiece below the processing head main body; the magnetic field shaping module is arranged on the inner wall of the outlet of the processing head main body and is used for forming a magnetic field in the rotating process of the processing head main body; by the high-speed introduction of the liquid working medium, the processing area can be cooled in time, and the processing area is flushed and processed products are removed.
Description
Technical Field
The invention belongs to the technical field of micro-machining, and particularly relates to a laser-induced plasma micro-machining device and method.
Background
The surface texture is a surface treatment process relating to the surface performance and the interface effect of materials, a series of micro-structures such as micro-pits, micro-grooves and the like are prepared on a functional surface, the surface texture has potential application values in the aspects of advanced sealing, lubrication improvement, friction improvement, material mechanical property improvement, hydrophobic property improvement and the like, and has important application prospects in the fields of aerospace, new energy, deep sea detection, high-end equipment and the like.
The micro-texture processing method comprises electric spark processing, electrolytic processing, chemical processing, plasma etching, ultrafast laser processing and the like. The ultrafast laser processing has the advantages of high processing efficiency, high processing precision, good material applicability and the like, but the ultrafast laser processing still has the defects of more processing process control parameters, high laser cost and the like. The problems of low laser energy absorption rate, large energy loss and the like exist when the ultrashort pulse laser is used for processing the micro texture on the surface of the transparent material.
Laser induced plasma micromachining is a process proposed by the us northwest university k.pallav and k.f.ehmann to remove workpiece material using plasma-material interactions. LIP-MM removes materials by using the high temperature (more than 5600K) of laser-induced plasma in liquid and the shock wave pressure effect, can be applied to processing various materials such as stainless steel, titanium alloy, transparent glass, ceramics and the like, and successfully realizes the processing of microgrooves with the width of about 30 mu m and the depth of 5-50 mu m. The LIP-MM generally immerses the workpiece in a liquid working medium such as static deionized water, salt solution and the like, and mainly throws out processing products such as molten materials, bubbles and the like in a processing area by the pressure of plasma, and the cooling and scouring effects of the liquid working medium are weak. In addition, the existing LIP-MM process has weak plasma confinement capability, is difficult to control the shape and distribution of the plasma, and needs to improve the controllability and consistency of the processing precision.
Disclosure of Invention
In view of the above, it is an object of the present invention to provide a laser-induced plasma micro-machining apparatus and method.
In order to achieve the purpose, the invention provides the following technical scheme: a laser-induced plasma micro-machining device comprises a machining head module, a laser module, a liquid working medium and a magnetic field shaping module; wherein:
the processing head module comprises a processing head main body forming a processing inner cavity, a transparent window positioned at the top of the processing head main body and an inner cavity channel positioned on one side of the processing inner cavity;
a laser module for emitting a laser beam focused in a processing inner cavity of the processing head body through the transparent window;
the liquid working medium enters the processing inner cavity of the processing head main body through the inner cavity channel and flows out through the processing head main body outlet to act on the surface of a workpiece below the processing head main body;
and the magnetic field shaping module is arranged on the inner wall of the outlet of the processing head main body and is used for forming a magnetic field in the rotating process of the processing head main body.
Preferably, the number of the magnetic field shaping modules is two, the two magnetic field shaping modules are respectively arranged on the inner walls of the two sides of the outlet of the machining head main body, and the magnetic field shaping modules can adopt permanent magnets, electromagnets or round coils.
Preferably, the head body rotates at a speed greater than 1000rpm during rotation.
Preferably, the processing head body outlet end face and the workpiece surface are provided with a first gap, and the first gap is less than 0.5 mm.
Preferably, the depth of a processing inner cavity of the processing head main body is less than 5 mm; the transparent window is formed by transparent high-temperature-resistant glass covering the top of the processing head main body, and the thickness of the transparent window is 1-3 mm.
Preferably, the laser module is one of a solid laser, a gas laser and a semiconductor laser, and the wavelength of the laser beam emitted by the laser module is 532nm or 1064 nm.
Preferably, the energy density of the focal point of the laser beam is more than 10GW/cm2And a second gap is formed between the focal point of the laser beam and the surface of the workpiece, wherein the second gap is-100 μm.
Preferably, the liquid working medium comprises deionized water, electrolyte, kerosene and electric spark machining working liquid, and the pressure of the liquid working medium is 0.1-2MPa when the liquid working medium passes through the inner cavity channel.
Preferably, the processing head module further comprises: the multi-degree-of-freedom mounting platform is provided with the machining head main body; when the processing head main body is processed, the processing track of the processing head main body is adjusted through the multi-degree-of-freedom feeding of the multi-degree-of-freedom mounting platform, and the feeding speed of the multi-degree-of-freedom mounting platform is 100-500 mu m/s.
In order to achieve the above purpose, the invention also provides the following technical scheme: a laser-induced plasma micromachining method comprising:
the laser beam is focused in the inner cavity of the processing head;
the liquid working medium in the inner cavity of the processing head generates optical breakdown at the focal position of the laser beam to generate plasma;
the processing head generates a magnetic field in the rotating processing process, and the magnetic field shapes the plasma;
and the shaped plasma acts on the surface of the workpiece below the processing head through the outlet of the processing head to process the surface of the workpiece.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, based on the arrangement of the liquid working medium, the high-speed liquid medium is introduced into the processing region while the laser-induced plasma micro-processing is carried out, the high-speed liquid jet flow can timely cool the processing region, the recast layer and the heat affected zone of the processing region are reduced, and the processing region can be timely flushed and processed products can be removed.
(2) According to the invention, based on the setting of the magnetic field shaping module and the rotating processing of the processing head, a high-speed rotating magnetic field is formed at the bottom outlet of the processing head, and particularly based on the force effect of the magnetic field on the plasma, the high-speed rotating magnetic field has certain shaping constraint and guiding effects on the plasma, so that the plasma is constrained within a certain controllable range and accurately acts on a processing area of a workpiece, and the locality, the accuracy controllability and the consistency of the laser-induced plasma micro-processing device during processing are effectively improved.
(3) According to the invention, the multi-degree-of-freedom feeding processing can be carried out by the processing head based on the multi-degree-of-freedom mounting platform, so that the precision of laser-induced plasma micro-processing is effectively improved.
Drawings
FIG. 1 is a schematic structural diagram of a laser-induced plasma micromachining apparatus according to the present invention;
in the figure: 1-a processing head main body, 2-a processing inner cavity, 3-a transparent window, 4-an inner cavity channel, 5-a laser module, 6-a liquid working medium and 7-a magnetic field shaping module.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Specifically, please refer to fig. 1, which is a schematic structural diagram of a laser-induced plasma micromachining apparatus provided by the present invention, and it can be seen that the laser-induced plasma micromachining apparatus provided by the present invention includes a tool head module, a laser module 5, a liquid working medium 6, and a magnetic field shaping module 7; wherein:
the processing head module comprises a processing head main body 1 forming a processing inner cavity 2, a transparent window 3 positioned at the top of the processing head main body 1 and an inner cavity channel 4 positioned at one side of the processing inner cavity 2; specifically, the depth of a processing inner cavity 2 of a processing head main body 1 is less than 5mm, so that the pressure propagation direction of plasma shock waves during processing is ensured to mainly act on a workpiece processing area; the transparent window 3 is formed by transparent high-temperature-resistant glass covering the top of the processing head main body 1, and the thickness of the transparent window 3 is 1-3 mm; in addition, a first clearance d1 is provided between the outlet end surface of the head body 1 and the workpiece surface, and the first clearance d1 is less than 0.5 mm.
A laser module 5 for emitting a laser beam focused in the inner cavity of the machining head body 1 through the transparent window 3; specifically, the laser module 5 is one of a solid laser, a gas laser, or a semiconductor laser, and the wavelength of the laser beam emitted by the laser module 5 is 532nm or 1064nm, for example, a picosecond laser, a femtosecond laser, or a nanosecond laser may be selected; the energy density of the focal point of the laser beam is more than 10GW/cm2And a second gap is formed between the focal point of the laser beam and the surface of the workpiece, wherein the second gap is-100 and 100 mu m.
The liquid working medium 6 enters the inner cavity of the processing head main body 1 through the inner cavity channel 4 and flows out through the outlet of the processing head main body 1 to act on the surface of a workpiece below the processing head main body 1; specifically, the liquid working medium 6 comprises deionized water, electrolyte, kerosene and electric spark machining working liquid, and when the liquid working medium 6 passes through the inner cavity channel 4, the pressure is 0.1-2 MPa. In addition, the control of the liquid breakdown induced plasma can be realized by adjusting the output power of the laser, the repetition frequency, the type of the liquid working medium and the like.
The magnetic field shaping module 7 is arranged on the inner wall of the outlet of the processing head main body 1 and is used for forming a magnetic field in the rotation process of the processing head main body 1; specifically, two magnetic field shaping modules 7 are respectively arranged on the inner walls of two sides of the outlet of the processing head main body 1, and the magnetic field shaping modules 7 can adopt permanent magnets, electromagnets or round coils; and the rotation speed of the processing head main body 1 is more than 1000rpm in the rotation process. When the magnetic element is a circular coil, the magnetic field generating device is a Helmholtz coil.
Based on the laser-induced plasma micro-machining device disclosed above, the invention also provides a laser-induced plasma micro-machining method, which specifically comprises the following steps:
s1, focusing a laser beam in an inner cavity of a machining head;
s2, the liquid working medium 6 in the inner cavity of the processing head generates optical breakdown at the focal position of the laser beam to generate plasma;
s3, the processing head generates a magnetic field in the rotating processing process, and the magnetic field shapes the plasma;
and S4, the shaped plasma acts on the surface of the workpiece below the processing head through the outlet of the processing head, and the surface of the workpiece is processed.
In summary, the principle of the specific processing by the laser-induced plasma micro-processing device provided by the present invention is as follows:
during processing, the processing head main body 1 rotates at a high speed, the laser module 5 emits laser beams, and the laser beams are focused in the processing inner cavity 2 through the transparent window 3; the liquid working medium 6 enters the processing inner cavity 2 through the inner cavity channel 4 under a certain pressure (0.1-2MPa), flows out through the outlet of the processing head main body 1 and acts on the surface of a workpiece below the processing head main body 1;
specifically, when the energy density of the laser beam generated at the laser focal point is greater than a threshold value (the threshold value is preferably 10 GW/cm)2) During the process, the liquid working medium 6 is subjected to optical breakdown at the laser focus, and then high-temperature and high-pressure plasma is generated. When the plasma acts on the surface of a workpiece, the workpiece material is efficiently removed under the combined action of high-temperature ablation of the plasma and shock waves of the plasma; meanwhile, the liquid working medium 6 flows out at a high speed through an outlet at the bottom of the machining head main body 1 and acts on the surface of the workpiece, so that the machining area is cooled in time, a recast layer and a heat affected zone of the machining area are reduced, and a machining product in the machining area can be flushed and discharged in time; as can be seen in particular from fig. 1, the liquid working medium 6 and the processed product are discharged through the first gap d 1.
Meanwhile, the rotation of the processing head main body 1 enables the magnetic field shaping module 7 to form a high-speed rotating magnetic field in the processing process; based on the force effect of the magnetic field on the plasma, the high-speed rotating magnetic field has certain shaping constraint and guiding effects on the plasma, so that the plasma is constrained within a certain controllable range and accurately acts on a processing area of a workpiece, and the locality, accuracy controllability and consistency of the laser-induced plasma micro-processing device during processing are effectively improved.
In summary, the device and the corresponding processing principle provided by the invention can also be applied to surface strengthening treatment of materials, such as surface strengthening treatment of aeroengine blades, precision bearings and the like. Specifically, the plasma-induced shock wave can be used for applying a certain compressive stress on the surface of the material to be treated, so that the corrosion resistance, the friction performance and the like of the strengthened treated surface are improved.
In addition, the laser processing unit further includes a multiple degree of freedom mounting platform (not shown in the figure), and the processing head body 1 is mounted on the multiple degree of freedom mounting platform.
When the processing head main body 1 is processed, the processing track of the processing head main body 1 is adjusted through the multi-degree-of-freedom feeding of the multi-degree-of-freedom mounting platform, and the feeding speed of the multi-degree-of-freedom mounting platform is 100-. Specifically, the feed adjustment of the multi-degree-of-freedom mounting platform is controlled and adjusted by adopting a digital control technology, so that the device provided by the invention can be accurately controlled to process micro-structures such as micro-grooves, micro-pits and micro three-dimensional structures.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A laser-induced plasma micro-machining device is characterized by comprising a machining head module, a laser module, a liquid working medium and a magnetic field shaping module; wherein,
the processing head module comprises a processing head main body forming a processing inner cavity, a transparent window positioned at the top of the processing head main body and an inner cavity channel positioned on one side of the processing inner cavity;
a laser module for emitting a laser beam focused in a processing inner cavity of the processing head body through the transparent window;
the liquid working medium enters the processing inner cavity of the processing head main body through the inner cavity channel and flows out through the processing head main body outlet to act on the surface of a workpiece below the processing head main body;
and the magnetic field shaping module is arranged on the inner wall of the outlet of the processing head main body and is used for forming a magnetic field in the rotating process of the processing head main body.
2. The laser-induced plasma microfabrication device according to claim 1, wherein: the two magnetic field shaping modules are respectively arranged on the inner walls of the two sides of the outlet of the machining head main body, and the magnetic field shaping modules can adopt permanent magnets, electromagnets or round coils.
3. A laser-induced plasma microfabrication device according to claim 1 or 2, characterized in that: and the rotation speed of the processing head main body is more than 1000rpm in the rotation process.
4. The laser-induced plasma microfabrication device according to claim 1, wherein: the processing head main part export terminal surface with the work piece surface is provided with first clearance, just first clearance is less than 0.5 mm.
5. The laser-induced plasma microfabrication device according to claim 1, wherein: the depth of a processing inner cavity of the processing head main body is less than 5 mm; the transparent window is formed by transparent high-temperature-resistant glass covering the top of the processing head main body, and the thickness of the transparent window is 1-3 mm.
6. The laser-induced plasma microfabrication device according to claim 1, wherein: the laser module is one of a solid laser, a gas laser or a semiconductor laser, and the wavelength of a laser beam emitted by the laser module is 532nm or 1064 nm.
7. The laser-induced plasma microfabrication device according to claim 1 or 5, wherein: the energy density of the focal point of the laser beam is more than 10GW/cm2And is anda second gap is formed between the focal point of the laser beam and the surface of the workpiece, and the second gap is-100 μm.
8. The laser-induced plasma microfabrication device according to claim 1, wherein: the liquid working medium comprises deionized water, electrolyte, kerosene and electric spark machining working liquid, and the pressure intensity is 0.1-2MPa when the liquid working medium passes through the inner cavity channel.
9. The laser-induced plasma micro-machining apparatus according to claim 1, wherein the machining head module further includes: the multi-degree-of-freedom mounting platform is provided with the machining head main body;
when the processing head main body is processed, the processing track of the processing head main body is adjusted through the multi-degree-of-freedom feeding of the multi-degree-of-freedom mounting platform, and the feeding speed of the multi-degree-of-freedom mounting platform is 100-500 mu m/s.
10. A laser-induced plasma micromachining method comprising:
the laser beam is focused in the inner cavity of the processing head;
the liquid working medium in the inner cavity of the processing head generates optical breakdown at the focal position of the laser beam to generate plasma;
the processing head generates a magnetic field in the rotating processing process, and the magnetic field shapes the plasma;
and the shaped plasma acts on the surface of the workpiece below the processing head through the outlet of the processing head to process the surface of the workpiece.
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| CN114054961A (en) * | 2021-11-19 | 2022-02-18 | 苏州大学 | Micro-nano texture cutter with large depth-diameter ratio, machining device and machining method thereof |
| CN114311356A (en) * | 2021-12-31 | 2022-04-12 | 华侨大学 | Kinetic energy assisted laser-induced plasma processing device and method |
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| CN114054961A (en) * | 2021-11-19 | 2022-02-18 | 苏州大学 | Micro-nano texture cutter with large depth-diameter ratio, machining device and machining method thereof |
| CN113977109A (en) * | 2021-12-15 | 2022-01-28 | 中国航发动力股份有限公司 | Machining method for finger tip sealing piece of aero-engine |
| CN113977109B (en) * | 2021-12-15 | 2023-11-03 | 中国航发动力股份有限公司 | Processing method of aeroengine fingertip sealing plate |
| CN114311356A (en) * | 2021-12-31 | 2022-04-12 | 华侨大学 | Kinetic energy assisted laser-induced plasma processing device and method |
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