CN114340846B - 切割装置及方法 - Google Patents

切割装置及方法 Download PDF

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Publication number
CN114340846B
CN114340846B CN202080061320.1A CN202080061320A CN114340846B CN 114340846 B CN114340846 B CN 114340846B CN 202080061320 A CN202080061320 A CN 202080061320A CN 114340846 B CN114340846 B CN 114340846B
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China
Prior art keywords
workpiece
jig
line
shape
cutting
Prior art date
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Active
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CN202080061320.1A
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English (en)
Chinese (zh)
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CN114340846A (zh
Inventor
武田邦义
对马健夫
深谷浩则
新井裕介
清水翼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP2020149028A external-priority patent/JP6912745B1/ja
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of CN114340846A publication Critical patent/CN114340846A/zh
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Publication of CN114340846B publication Critical patent/CN114340846B/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Automatic Control Of Machine Tools (AREA)
CN202080061320.1A 2019-09-27 2020-09-07 切割装置及方法 Active CN114340846B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2019177265 2019-09-27
JP2019-177265 2019-09-27
JP2020-090657 2020-05-25
JP2020090657 2020-05-25
JP2020-149028 2020-09-04
JP2020149028A JP6912745B1 (ja) 2019-09-27 2020-09-04 ダイシング装置及び方法
PCT/JP2020/033741 WO2021059937A1 (ja) 2019-09-27 2020-09-07 ダイシング装置及び方法

Publications (2)

Publication Number Publication Date
CN114340846A CN114340846A (zh) 2022-04-12
CN114340846B true CN114340846B (zh) 2022-11-29

Family

ID=75165677

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080061320.1A Active CN114340846B (zh) 2019-09-27 2020-09-07 切割装置及方法

Country Status (3)

Country Link
KR (1) KR102411860B1 (ja)
CN (1) CN114340846B (ja)
WO (1) WO2021059937A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253466A (ja) * 2005-03-11 2006-09-21 Disco Abrasive Syst Ltd アライメント方法
JP2009170501A (ja) * 2008-01-11 2009-07-30 Disco Abrasive Syst Ltd 切削装置
JP2011114070A (ja) * 2009-11-25 2011-06-09 Disco Abrasive Syst Ltd 加工装置
CN102531367A (zh) * 2010-12-28 2012-07-04 三星钻石工业股份有限公司 基板加工方法
JP2012256796A (ja) * 2011-06-10 2012-12-27 Disco Abrasive Syst Ltd 分割予定ライン検出方法
CN106024613A (zh) * 2015-03-25 2016-10-12 东和株式会社 切断装置以及切断方法
CN106920775A (zh) * 2015-12-24 2017-07-04 株式会社迪思科 晶片的加工方法
CN108527499A (zh) * 2017-03-06 2018-09-14 株式会社迪思科 加工装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4640715B2 (ja) * 2000-07-14 2011-03-02 株式会社ディスコ アライメント方法及びアライメント装置
JP4927338B2 (ja) * 2005-02-21 2012-05-09 住友重機械工業株式会社 ステージ装置及びガントリ型ステージ装置及びステージ装置の制御方法
JP5947010B2 (ja) 2011-09-15 2016-07-06 株式会社ディスコ 分割装置
KR101607226B1 (ko) * 2014-04-14 2016-03-29 주식회사 레이저앱스 레이저 절단 및 가공장치와 그 방법
JP6212507B2 (ja) 2015-02-05 2017-10-11 Ｔｏｗａ株式会社 切断装置及び切断方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253466A (ja) * 2005-03-11 2006-09-21 Disco Abrasive Syst Ltd アライメント方法
JP2009170501A (ja) * 2008-01-11 2009-07-30 Disco Abrasive Syst Ltd 切削装置
JP2011114070A (ja) * 2009-11-25 2011-06-09 Disco Abrasive Syst Ltd 加工装置
CN102531367A (zh) * 2010-12-28 2012-07-04 三星钻石工业股份有限公司 基板加工方法
JP2012256796A (ja) * 2011-06-10 2012-12-27 Disco Abrasive Syst Ltd 分割予定ライン検出方法
CN106024613A (zh) * 2015-03-25 2016-10-12 东和株式会社 切断装置以及切断方法
CN106920775A (zh) * 2015-12-24 2017-07-04 株式会社迪思科 晶片的加工方法
CN108527499A (zh) * 2017-03-06 2018-09-14 株式会社迪思科 加工装置

Also Published As

Publication number Publication date
KR20220002695A (ko) 2022-01-06
CN114340846A (zh) 2022-04-12
KR102411860B1 (ko) 2022-06-23
WO2021059937A1 (ja) 2021-04-01

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