CN114222641A - 处理系统 - Google Patents

处理系统 Download PDF

Info

Publication number
CN114222641A
CN114222641A CN202080057800.0A CN202080057800A CN114222641A CN 114222641 A CN114222641 A CN 114222641A CN 202080057800 A CN202080057800 A CN 202080057800A CN 114222641 A CN114222641 A CN 114222641A
Authority
CN
China
Prior art keywords
processing
light
workpiece
optical system
measurement light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080057800.0A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤真路
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to CN202410978845.1A priority Critical patent/CN118893302A/zh
Publication of CN114222641A publication Critical patent/CN114222641A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane in at least three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0426—Fixtures for other work
    • B23K37/0435—Clamps
    • B23K37/0443—Jigs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Manipulator (AREA)
CN202080057800.0A 2019-08-30 2020-08-27 处理系统 Pending CN114222641A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202410978845.1A CN118893302A (zh) 2019-08-30 2020-08-27 处理系统及处理方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2019/034089 WO2021038821A1 (ja) 2019-08-30 2019-08-30 処理システム及びロボットシステム
JPPCT/JP2019/034089 2019-08-30
PCT/JP2020/032294 WO2021039881A1 (ja) 2019-08-30 2020-08-27 処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202410978845.1A Division CN118893302A (zh) 2019-08-30 2020-08-27 处理系统及处理方法

Publications (1)

Publication Number Publication Date
CN114222641A true CN114222641A (zh) 2022-03-22

Family

ID=74683981

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202080057800.0A Pending CN114222641A (zh) 2019-08-30 2020-08-27 处理系统
CN202410978845.1A Pending CN118893302A (zh) 2019-08-30 2020-08-27 处理系统及处理方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202410978845.1A Pending CN118893302A (zh) 2019-08-30 2020-08-27 处理系统及处理方法

Country Status (6)

Country Link
US (2) US20220331898A1 (https=)
EP (1) EP4023386A4 (https=)
JP (5) JP7464055B2 (https=)
CN (2) CN114222641A (https=)
TW (1) TW202109136A (https=)
WO (2) WO2021038821A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114814867A (zh) * 2022-03-30 2022-07-29 浙江大学 一种基于调频连续波光梳光源的激光三维扫描系统及方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102254339B1 (ko) * 2021-02-03 2021-05-21 주식회사 21세기 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법
DE102022116927A1 (de) 2022-07-07 2024-01-18 Trumpf Laser Gmbh Laserbearbeitungsmaschine mit frequenzkammbasiertem Abstandssensor sowie zugehöriges Verfahren mit frequenzkammbasierter Abstandsmessung
WO2025069407A1 (ja) * 2023-09-29 2025-04-03 日産自動車株式会社 ライントレース方法及びライントレースシステム
CN121889740A (zh) * 2023-09-29 2026-04-17 日产自动车株式会社 线路追踪方法及线路追踪系统
WO2026030395A1 (en) * 2024-08-01 2026-02-05 Nikon Corporation Systems and method for large-scale optical manufacturing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03264177A (ja) * 1990-03-12 1991-11-25 Fuji Electric Co Ltd レーザ刻印装置
JP2007290931A (ja) * 2006-04-27 2007-11-08 Seiko Epson Corp スクライブ装置
CN101076763A (zh) * 2004-12-10 2007-11-21 株式会社安川电机 机器人系统
JP2010082663A (ja) * 2008-09-30 2010-04-15 Sunx Ltd レーザ加工機

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2226970B (en) 1989-01-11 1992-10-21 British Aerospace Methods of manufacture and surface treatment using laser radiation
DE10207535B4 (de) * 2002-02-22 2006-07-06 Carl Zeiss Vorrichtung zum Bearbeiten und Vermessen eines Objekts sowie Verfahren hierzu
JP2005169397A (ja) 2003-12-05 2005-06-30 Seiko Epson Corp レーザ照射装置、液滴吐出装置、レーザ照射方法、液滴吐出方法及び位置制御装置
JP4988168B2 (ja) * 2005-04-08 2012-08-01 三菱電機株式会社 レーザ加工装置
JP5013699B2 (ja) 2005-10-21 2012-08-29 株式会社キーエンス ３次元加工データ設定装置、３次元加工データ設定方法、３次元加工データ設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工装置
JP2008212941A (ja) 2007-02-28 2008-09-18 Sumitomo Heavy Ind Ltd レーザ加工装置及びレーザ加工装置の制御方法
JP2009025245A (ja) * 2007-07-23 2009-02-05 Optical Comb Inc 光干渉観測装置
JP2011196785A (ja) * 2010-03-18 2011-10-06 Disco Corp チャックテーブルに保持された被加工物の計測装置およびレーザー加工機
TW201315554A (zh) * 2011-09-15 2013-04-16 松下電器產業股份有限公司 雷射加工裝置及雷射加工方法
EP2772922B1 (en) * 2011-10-25 2017-10-11 Eisuke Minehara Laser decontamination device
EP2930461A4 (en) 2012-12-06 2015-12-02 3Dragons Llc THREE-DIMENSIONAL FORM-MEASUREMENT DEVICE, METHOD FOR DETECTING A HOLOGRAM IMAGE, AND METHOD FOR MEASURING A THREE-DIMENSIONAL FORM
PL2972479T3 (pl) * 2013-03-13 2021-04-19 Ipg Photonics (Canada) Inc. Sposoby i układy do charakteryzacji właściwości obróbki laserem poprzez pomiar dynamiki kapilary z zastosowaniem interferometrii
DE102013008269C5 (de) * 2013-05-15 2019-01-24 Precitec Optronik Gmbh Bearbeitungskopf für eine Laserbearbeitungsvorrichtung
JP6148075B2 (ja) * 2013-05-31 2017-06-14 株式会社ディスコ レーザー加工装置
DE102013015656B4 (de) * 2013-09-23 2016-02-18 Precitec Optronik Gmbh Verfahren zum Messen der Eindringtiefe eines Laserstrahls in ein Werkstück, Verfahren zum Bearbeiten eines Werkstücks sowie Laserbearbeitungsvorrichtung
JP6244017B2 (ja) 2014-04-23 2017-12-06 国立研究開発法人科学技術振興機構 ブレード複合型開放流路装置およびその接合体
WO2015199054A1 (ja) 2014-06-27 2015-12-30 株式会社キーエンス 多波長光電測定装置、共焦点測定装置、干渉測定装置及びカラー測定装置
JP6836048B2 (ja) * 2014-08-27 2021-02-24 国立大学法人電気通信大学 距離測定装置
DE102016001661B3 (de) * 2016-02-12 2017-04-13 Lessmüller Lasertechnik GmbH Messvorrichtung und Verfahren zum Ermitteln einer relativen Neigung eines Werkstücks mittels optischer Kohärenztomographie bei einer Bearbeitung
JP6363660B2 (ja) * 2016-07-13 2018-07-25 ファナック株式会社 レーザ加工装置及びレーザ加工システム
JP6906837B2 (ja) * 2017-02-13 2021-07-21 株式会社ディスコ レーザー加工装置
JP2018153842A (ja) 2017-03-17 2018-10-04 トヨタ自動車株式会社 計測装置およびレーザ溶接装置
WO2019082311A1 (ja) * 2017-10-25 2019-05-02 株式会社ニコン 加工装置、及び、移動体の製造方法
JP7120253B2 (ja) * 2017-12-12 2022-08-17 株式会社ニコン 処理装置及び処理方法、加工方法、並びに、造形装置及び造形方法
JP7115973B2 (ja) * 2018-12-28 2022-08-09 株式会社キーエンス レーザ加工装置
WO2021024480A1 (ja) * 2019-08-08 2021-02-11 株式会社ニコン 加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03264177A (ja) * 1990-03-12 1991-11-25 Fuji Electric Co Ltd レーザ刻印装置
CN101076763A (zh) * 2004-12-10 2007-11-21 株式会社安川电机 机器人系统
JP2007290931A (ja) * 2006-04-27 2007-11-08 Seiko Epson Corp スクライブ装置
JP2010082663A (ja) * 2008-09-30 2010-04-15 Sunx Ltd レーザ加工機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114814867A (zh) * 2022-03-30 2022-07-29 浙江大学 一种基于调频连续波光梳光源的激光三维扫描系统及方法

Also Published As

Publication number Publication date
JP2024160350A (ja) 2024-11-13
JP7540441B2 (ja) 2024-08-27
JP7464055B2 (ja) 2024-04-09
WO2021038821A1 (ja) 2021-03-04
EP4023386A1 (en) 2022-07-06
WO2021039881A1 (ja) 2021-03-04
CN118893302A (zh) 2024-11-05
US20220331898A1 (en) 2022-10-20
JP7772048B2 (ja) 2025-11-18
JPWO2021038821A1 (https=) 2021-03-04
JP2024026496A (ja) 2024-02-28
JPWO2021039881A1 (https=) 2021-03-04
JP2026015389A (ja) 2026-01-29
EP4023386A4 (en) 2023-10-04
US20260091447A1 (en) 2026-04-02
TW202109136A (zh) 2021-03-01

Similar Documents

Publication Publication Date Title
CN114222641A (zh) 处理系统
JP7666576B2 (ja) 加工装置
JP7601100B2 (ja) 加工システム
JPH06300542A (ja) ２次元レーザパターンによる形状特徴抽出装置および２次元レーザパターン発生装置
JP7639851B2 (ja) 加工システム、加工方法、ロボットシステム、接続装置及びエンドエフェクタ装置
WO2023073833A1 (ja) データ生成方法、クラウドシステム、加工装置、コンピュータプログラム及び記録媒体
WO2023199473A1 (ja) 加工システム及び計測システム
WO2025203554A1 (ja) 加工システム、制御方法及びコンピュータプログラム

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination