CN114207792A - 电子组件的组装 - Google Patents

电子组件的组装 Download PDF

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Publication number
CN114207792A
CN114207792A CN202080054516.8A CN202080054516A CN114207792A CN 114207792 A CN114207792 A CN 114207792A CN 202080054516 A CN202080054516 A CN 202080054516A CN 114207792 A CN114207792 A CN 114207792A
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China
Prior art keywords
chip
substrate
molding
product carrier
functional element
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CN202080054516.8A
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English (en)
Inventor
M.海曼
B.米勒
C.纳赫蒂加尔-谢伦伯格
J.斯特罗吉斯
K.维尔克
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Siemens AG
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Siemens AG
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Publication of CN114207792A publication Critical patent/CN114207792A/zh
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Abstract

本发明涉及一种用于电子组件(10)的组装的方法，该电子组件具有至少一个芯片(40)和带有传导面(152)的基板(150)。为了在组装芯片时简化芯片的电气接触建议下列步骤:布置模制件(21、…、24)、接合材料(30)和至少一个芯片(40)，使得‑芯片(40)与模制件(21、…、24)中的至少一个和接合材料(30)中的至少一个电气接触，并且‑由模制件(21、…、24)和/或芯片(40)以及接合材料(30)构成多个功能元件(61、62、63)，其设计用于支撑基板(150)并且用于传导面(152)的电气接触。本发明还涉及一种电子组件(10)。

Description

电子组件的组装
本发明涉及一种用于组装电子组件的方法以及电子组件。这种方法尤其在制造功率电子组件时是有利的，例如在制造所谓的“功率模块”或其组成部分时是有利的。
电子组件在此包括带有传导面或者说主控层的基板和至少一个芯片。芯片是未封装的半导体并且在此也称作“裸晶片”或“裸芯片”。芯片与其他部件的电接头、进一步的传导的结构的电气接触或与壳体的电接头电气接触在现有技术中通常通过引线键合(英语“wire bonding”)进行。备选地，已知无引线键合技术(例如引线框、薄膜、球键合)。
本发明所要解决的技术问题是，提供一种用于组装电子组件的方法，该方法在芯片组装时简化了芯片的电气接触。
该技术问题在此通过一种用于组装电子组件的方法解决，其中，组件具有至少一个芯片和带有传导面的基板。为了组装这样地布置平面的模制件、接合材料和至少一个芯片，使得:
-芯片与平面的模制件的至少一个和接合材料之一电气接触，
-由模制件和/或芯片以及接合材料形成功能元件，功能元件设计用于支撑基板和传导面的电气接触。有利的是，形成多个功能元件，因为多个功能元件可以更好地支撑基板。如果接触多个芯片，则提供相应地更多功能元件来接触芯片并且支撑作用进一步得到改善。
平面的模制件是可廉价制造的由导电材料制成的平面零件。平面的模制件在此无需弯曲工艺制成，例如可以由板材冲压而成，并且可以以可变的形状和厚度，例如作为散装产品或作为带件被卷起地输送到可自动装备的产品载体。通常，模制件是长方体或板状的。但模制件也可以是盘形的或具有其他扁平的几何形状。模制件的高度补偿可以在通常的接合过程中(例如通过钎焊或烧结)通过层叠为此所需的材料而实现。模制件在此优选是铜模制件。模制件的尺寸设计可以取决于有待传导的最大电流。模制件的厚度通常在300μm到2mm之间并且可以具有其他可变尺寸。
可以使用可印刷的或可分装的糊状物形式的钎焊材料和/或烧结材料作为接合材料，或分别作为钎焊或烧结模制件。平面模制件可以在此通过自动贴装机布置在产品载体上。
功能元件在组装过程中形成机械稳定的单元并且设计用于在组装过程中支撑基板。可行的是，在基板定位在功能元件上之前，对功能元件进行接合过程(例如热接合)。因此，为了进一步组装的目的，功能元件可以形成一个或多个机械稳定的单元，这提高了功能元件的进一步的可处理性。同样可行的是，功能元件与基板接合在一起。
功能元件形成支撑结构，该支撑结构设计为，使得基板可以为了进一步组装组件定位在该支撑结构上。支撑结构可以在此设计为，使得它完全支撑基板。因此，功能元件在一个元件中结合了两种功能，即支撑和接触。由此，本发明提供了仅在一个过程中实现用于制造产品的所有连接平面的潜能。此外，通过可变的平面模制件可以以电气和热优化的方式构建所述功能元件。这优选堆叠地实施。本发明简化了芯片的接触并且在此能够在组件的构建中实现进一步的自由度。
若基板定位在功能元件上并且已经经历过接合过程，则功能元件与基板或其传导面建立永久的电气和机械连接。因此功能元件与基板机械地连接，因此支撑作用已实现其目的并且电气接触的功能现在很重要。
进一步的实施形式包括提供产品载体的步骤，其中，模制件、芯片和/或接合材料布置在产品载体上。产品载体可以在此具有一个或多个凹空，其中，模制件、芯片和/或接合材料则布置成，使得功能元件的至少一部分在凹空中形成。模制件可以在此直接地，即不用其他中间元件，布置在产品载体上。产品载体在此主要用于输送组件和其功能元件通过生产过程。凹空也可以在此设计成，使得它们为尚未接合的功能元件提供支撑作用。
产品载体不保留在制成的组件上。可行的是，产品载体已经预先装备有在所选模制件上的第一层。产品载体可以在此设计成托盘状或在此也可以设计为传送带系统或其他类型的，例如(半)自主的输送系统的一部分。产品载体的这种使用有利地增加了本方法的可操作性。换言之，提供了一种智能产品载体方案，基于该方案使该接合对象全自动化、增材构造，例如通过智能涂层和接合实现。会有利的是，产品载体设计为所述功能元件基本上形成一个平面。若不使用平坦的基板，则其他形状也可考虑并且是合理的。
在另一个实施形式中，所述功能元件相互间隔地形成。所述功能元件相互间隔地布置，即布置成，使得它们可以在定位于其上的基板的多个点处发挥支撑作用。由此，可以实现负载相对于基板的均匀分布。所述功能元件可以布置成，使得它们可以在组装过程中完全支撑基板。此外所述功能元件也布置成，使得可以实现功能元件和基板的电气接触。
在进一步的实施形式中，产品载体具有一个或多个凹空，其具有彼此不同的尺寸。这可以包括例如凹空的不同深度，例如以便补偿高度差。此外，产品载体可以具有与确定的模制件适配的凹空。凹空的深度对应于布置在此处的模制件的厚度和/或对应于必要的高度补偿。凹空的深度通常最大为2mm，但如果要加工特别厚的零件，则凹空的深度可以更大。
进一步的实施形式包括布置一个或多个辅助元件。辅助元件可以布置在产品载体上和/或布置在模制件下方。辅助元件在此不会永久保留在电子组件中，而是在辅助元件已达到其目的时，例如已为敏感的部件临时提供机械支撑作用或保护功能时又被去除。这样，辅助元件可以保留在产品载体上并且可以补偿比产品载体更大的高度差并且在此有助于增加灵活性。作为备选或补充，辅助元件可以在此后在过程中才移除。辅助元件本身在此又可以具有凹空或已预先配备有一些构件。
另一个实施形式包括将基板定位在功能元件上，使得传导面与功能元件电气接触。换言之，通过传导面与功能元件的电气接触，使先前还在基板的传导面与功能元件之间划分的电气组件的传导结构完整。随着将基板定位在功能元件上，组件的传导结构变完整并且可以将它们接合。基板可以在此具有结构化的传导面并且可以已经具有其他的电子构件。此处获得的很大优点是，所述功能元件可以以非常复杂的方式并且独立于基板构造并且基板可以在之后才施加到功能元件上。这实现了电子组件设计的较高的自由度。
在另一实施形式中，使用于接触芯片的模制件的至少一个设计为连接框架(英文:引线框架)。该实施形式是特别有利的，因为这样实现了将引线框架的连接整合到组装过程中的制造过程，以便提供更大的设计灵活性并可能节省单独的组装/过程步骤。也可考虑(例如在预成型的变型中)与标准化的引线框架结构的组合，其中，通过后续处理(例如激光切割以去除支撑结构或未使用的布线层)进行产品特定的适配。
由于功率循环稳定性和电气性能(导电和导热能力、低电感等)，引线框架技术为芯片布线提供了很大的优势。到目前为止，该技术由于最初的耗费(用于冲压、成型和模制等的工具)，对于小批量生产在经济上并不可行。耗费随着引线框架的复杂性和精度要求(不同的电位、可变的引线框架横截面等)而增加。
会有利的是，连接框架和模制件布置为，使得由连接框架、模制件和接合材料形成一个在组装的框架中可处理或操作的单元。可处理或操作在此意味着，该单元具有至少一个足够的机械内聚力，以便在进一步的过程步骤中不再分解成单部件。为此，例如可以执行由多个功能元件形成一个单元的接合步骤。例如可以(通过烧结或钎焊)将接合材料的各部分接合。
另一个实施形式包括布置电绝缘元件，使得为基板形成电绝缘的支撑部位。这提供了优点，即，不同电位的模制件可以通过在合适的支撑部位上的电绝缘模制件进行绝缘并且机械稳定化。通过使用局部的布线载体也可以在以不同方式成形的可变厚度的模制件之间建立导电连接。因此，可以减少所述功能元件的负荷，并且设计灵活性进一步增大。电绝缘元件优选在其功能上作为电绝缘体保留在组件上。
另一个实施形式包括接合，使得接合材料进入与模制件、芯片和/或传导面的连接。接合可以在此将模制件和芯片均与接合材料连接。在此，可以考虑钎焊和烧结方法。本发明的方法在此特别有利的是，现在可以在唯一的过程步骤中同时对于所有的功能元件和基板执行接合方法。但如果有必要，也可以考虑，如果需要例如特别鲁棒性的或配备高电流承载能力的功能元件，则执行由多部分组成的接合方法，其中组合多个接合方法。例如首先是为芯片产生耐高温烧结连接的烧结方法，然后是连接基板的钎焊方法。
在另一个实施形式中，布置至少一个其他的电气构件。这优选作为布置模制件、芯片和接合材料的补充而发生并且可以在相同的过程步骤中执行。在此，可以布置无源的和/或有源的构件。如果其他部件与模制件一起被加工，则已证明是特别有利的。芯片可以例如是电流测量分流器(strom mess shunt)，其测量紧邻芯片的电流。因此，除了建立导电连接和结构外，功能元件已经可以紧邻芯片创建。
在进一步的实施形式中，逐层地布置平面的模制件和/或接合材料。已经证明逐层地布置模制件和接合材料是有利的，因为这样在所述布置的各个层中已经可以进行例如质量控制并且如果在一层中有错误或缺陷，可以毫不费力地采取措施。
本发明还通过一种电子组件解决，该电子组件具有至少一个芯片、带有传导面的基板和多个相互间隔地布置的功能元件。芯片与模制件中的至少一个和接合材料中的至少一个电气接触。所述功能元件至少部分地由模制件和/或芯片以及接合材料构成，其中，功能元件设计用于尤其在生产期间支撑基板，并且设计用于传导面的电气接触。
PCB在此优选具有有源的构件，其形成所谓的“控制单元”并且它提供控制逻辑以便控制芯片。
下面参考附图中所示的实施例更详细地描述和阐述本发明。附图中：
图1示出具有布置在其上的支撑结构的产品载体，
图2示出支撑结构的分解图，
图3示出产品载体的另一个实施形式，
图4示出与基板共同作用的支撑结构，
图5示出电子组件和
图6示出可能的进一步的生产步骤。
图1示出产品载体200，在产品载体中布置了根据本发明的功能元件61、62、63。所述功能元件61、62、63在此形成支撑结构60。所述功能元件61、62、63还形成支撑结构60的接触面600，该接触面在这种情况下设计为一个平面并且用于在后续过程步骤中支撑此处未示出的基板150。产品载体200具有两个凹空220和221，其中，在凹空220中布置支撑元件61并且在凹空221中布置功能元件62和63，该功能元件62和63基于一个共同的基座。支撑元件61在此具有模制件21、22和接合材料30。支撑元件62在此具有模制件23和一部分的模制件24以及接合材料30。芯片40例如半导体开关，如IGBT-裸芯片通过接合材料30布置在模制件24上，使得芯片40形成支撑元件63。同时，芯片-顶侧和芯片-底侧通过共同的基座、模制件24被带到一个共同的平面(接触面600的平面)上。因此，可以大大简化芯片的接触。
应当注意的是，模制件21、…、24直接地布置在产品载体200上并且不被施加在基板上。这种类型的布置实现了在应当与基板连接的接触结构的构建中更大的灵活性并且明显更大的自由度。
图2示出功能元件61、62、63或支撑结构60的分解图，如从图1中已知的。支撑元件61在此由插入凹空220中的铜模制件22、接合材料30、其他的铜模制件21以及最终的其他接合材料30堆叠地布置。模制件21在此是非常扁平的铜模制件，与之相比，在凹空221中布置有明显更厚的并且更宽的铜模制件24。不同的厚度在此通过凹空220、221不同的深度补偿。铜模制件24用作两个因此通过铜模制件24电气连接的其他功能元件62、63的基座。模制件的尺寸在此可以根据热和功率标准来选择。接合材料30也可以适配于其模制件。因此，可以想到在此为其使用特殊的接合材料30，而为铜模制件21、…、24使用其他的接合材料30。
图3示出产品载体200的另一个实施例，其中，该产品载体不具有凹空，而借助辅助元件228进行在如由图1和图2已知的功能元件61，62和63之间的高度补偿。辅助元件228可以已经具有并且直接提供第一模制件或预制的功能元件，换句话说，辅助元件228已经与模制件一起提供，然后与其他的模制件21、…、24例如用自动贴装机共同地布置在产品载体200上。但同样可以想到，辅助元件228设计为产品载体200的一部分。如前面的图1和图2所示，接触面600保持平坦。
图4示出支撑结构60如何与基板150共同作用。基板150具有在这种情况下已结构化的传导面152。在基板150的顶侧设有黏合装置153，其用于将冷却体155与冷却体-接合材料130连接到基板150上。基板150或传导面152具有传导面152的接触面650。传导面152的接触面650在此设计为，使得它可以放置在支撑结构60的接触平面600上。换句话说，所述功能元件61、62、63与传导面152关联地这样设计或布置为，使得它们可以实现其支撑作用和芯片40的电气接触。在这一点上应该提到，支撑作用适用于生产过程。如果已经进行了接合过程，例如钎焊和/或烧结，则该支撑作用在很大程度上不再需要并且所述功能元件61、62、63主要用于它们的电气接触尤其芯片40的第二功能。
图5示出了在图4中组装的制成的电子组件10。组件10在此从产品载体200移除并且翻转以进一步处理。在该附图中示出的定向在此相应于通常装备电子组件的定向。按本发明的方法在此允许更多的自由度，方式是所述功能元件61、62、63可以相对基板150独立地布置并因此例如在温度和/或电力方面最佳地构造。例如，图5中所示的组件10可以用下列步骤并且按照下列顺序构造：
-提供产品载体200，其中，模制件21、…、24、芯片40和/或接合材料30这样地布置在产品载体200上，使得
-芯片40与平面的模制件21、…、24的至少一个和接合材料30的至少一个电气接触，
-功能元件61、62、63由平面的模制件21、…、24和/或芯片40以及接合材料30形成，其用于支撑基板150并且电气接触传导面152，
-接合，使得接合材料30进入与模制件21、…、24、芯片40和/或传导面152的连接并且最后
-转动组件10，用于进一步处理。
图6示出了图5的电气组件10的可能的进一步的生产步骤。基板150的结构化的传导面152具有用于带有引脚的框架12的触点112。当带有引脚的框架12与电气组件10连接，就可以浇注浇注材料14，以保护电子组件10和布置在其上的构件。控制电子设备PCB在这种情况下实施为PCB，然后可以被接触并且例如用于控制通过按本发明的方法制造的功率电子设备。
总之，本发明涉及一种用于电子组件10的组装的方法，该电子组件具有至少一个芯片40和带有传导面的基板150。为了在组装芯片时简化芯片的电气接触，建议下列步骤:
布置平面的模制件21、…、24、接合材料30和至少一个芯片40，使得-芯片40与平面的模制件21、…、24中的至少一个和接合材料30中的至少一个电气接触，和
-功能元件61、62、63由平面的模制件21、…、24和/或芯片40以及接合材料30形成，其设计用于支撑基板150并且电气接触传导面152。本发明还涉及一种电子组件10。
附图标记清单
10 电子组件
12 带有引脚的框架
14 浇注材料
PCB 控制电子设备
21、22、23、24 平面的模制件
26 绝缘模制件
30 接合材料
40 芯片
60 支撑结构
61、62、63 功能元件
150 基板
152 传导面
200 产品载体
220、221 凹空
228 辅助元件
600 接触面
650 传导面的接触面

Claims (10)

1.一种用于组装(10)电子组件的方法，该电子组件具有至少一个芯片(40)和带有传导面(152)的基板(150)，包括步骤:
提供产品载体(200)，该产品载体具有一个或多个凹空(220、221)，其具有彼此不同的尺寸，
将平面的模制件(21、…、24)、接合材料(30)和至少一个芯片(40)布置在产品载体(200)上，使得
-所述芯片(40)与平面的模制件(21、…、24)中的至少一个和所述接合材料(30)中的至少一个电气接触，并且
-由平面的模制件(21、…、24)和/或芯片(40)以及接合材料(30)形成功能元件(61、62、63)，所述功能元件设计用于支撑基板(150)和用于传导面(152)的电气接触。
2.根据权利要求1所述的方法，其中，所述功能元件(61、62、63)相互间隔地形成。
3.根据前述权利要求之一所述的方法，包括步骤:尤其在产品载体(200)上提供一个或多个辅助元件(228)。
4.根据前述权利要求之一所述的方法，包括步骤:将所述基板(150)定位在所述功能元件(61、62、63)上，使得所述传导面(152)与所述功能元件(61、62、63)电气接触。
5.根据前述权利要求之一所述的方法，其中，用于接触所述芯片(40)的模制件(21、…、24)的至少一个设计为连接框架。
6.根据前述权利要求之一所述的方法，包括步骤:布置电绝缘元件，使得形成用于基板(150)的电绝缘的支撑部位。
7.根据前述权利要求之一所述的方法，还包括步骤:进行接合，使得接合材料(30)进入与所述模制件(21、…、24)、芯片(40)和/或传导面(152)的连接。
8.根据前述权利要求之一所述的方法，其中，布置至少一个电气构件。
9.根据前述权利要求之一所述的方法，其中，逐层地布置平面的模制件(21、…、24)和/或所述接合材料(24)。
10.一种电子组件(10)，其具有至少一个芯片(40)、带有传导面(152)的基板(150)和功能元件(61、62、63)，
其中，所述芯片(40)与模制件(21、…、24)中的至少一个和接合材料(30)中的至少一个电气接触，其中，所述功能元件(61、62、63)由模制件(21、…、24)和/或芯片(40)以及接合材料(30)构成，并且设计用于支撑基板(150)和用于传导面(152)的电气接触。
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