CN114207039A - 固化性树脂组合物 - Google Patents

固化性树脂组合物 Download PDF

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Publication number
CN114207039A
CN114207039A CN202080054723.3A CN202080054723A CN114207039A CN 114207039 A CN114207039 A CN 114207039A CN 202080054723 A CN202080054723 A CN 202080054723A CN 114207039 A CN114207039 A CN 114207039A
Authority
CN
China
Prior art keywords
resin composition
curable resin
component
composition according
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080054723.3A
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English (en)
Chinese (zh)
Inventor
太田启介
平山康平
山田慎介
小川亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of CN114207039A publication Critical patent/CN114207039A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202080054723.3A 2019-09-09 2020-09-02 固化性树脂组合物 Pending CN114207039A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019163992 2019-09-09
JP2019-163992 2019-09-09
PCT/JP2020/033291 WO2021049390A1 (ja) 2019-09-09 2020-09-02 硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
CN114207039A true CN114207039A (zh) 2022-03-18

Family

ID=74866954

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080054723.3A Pending CN114207039A (zh) 2019-09-09 2020-09-02 固化性树脂组合物

Country Status (6)

Country Link
US (1) US20220289973A1 (https=)
EP (1) EP4029896A4 (https=)
JP (1) JPWO2021049390A1 (https=)
CN (1) CN114207039A (https=)
TW (1) TWI840605B (https=)
WO (1) WO2021049390A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118055978A (zh) * 2021-10-18 2024-05-17 株式会社艾迪科 固化性树脂组合物、固化物及粘接剂

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1237186A (zh) * 1997-07-24 1999-12-01 洛克泰特公司 用作充填密封材料的热固性树脂组合物
JP2002363379A (ja) * 2001-05-31 2002-12-18 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2003040980A (ja) * 2001-07-31 2003-02-13 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2008260849A (ja) * 2007-04-12 2008-10-30 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂組成物付き金属箔及びプリント配線板
JP2014152302A (ja) * 2013-02-13 2014-08-25 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物、半導体装置の製造方法及び半導体装置
JP2018009048A (ja) * 2016-07-11 2018-01-18 株式会社Adeka 一液型シアン酸エステル−エポキシ複合樹脂組成物
JP2018188580A (ja) * 2017-05-10 2018-11-29 信越化学工業株式会社 熱伝導性エポキシ樹脂封止用組成物
JP2019077804A (ja) * 2017-10-25 2019-05-23 株式会社Adeka 一液型樹脂組成物、その硬化物およびそれを用いた接着剤

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60250026A (ja) 1984-05-28 1985-12-10 Mitsubishi Rayon Co Ltd エポキシ樹脂組成物
JPS62136861A (ja) * 1985-12-10 1987-06-19 Nitto Electric Ind Co Ltd 樹脂封止半導体装置
JP3230800B2 (ja) * 1997-03-06 2001-11-19 日本化薬株式会社 黒色感放射線性樹脂組成物、黒色硬化膜及びブラックマトリックス
JP2001302767A (ja) 2000-04-25 2001-10-31 Matsushita Electric Works Ltd 半導体封止用液状エポキシ樹脂組成物、半導体装置およびその製造方法
JP3367947B2 (ja) * 2001-05-31 2003-01-20 大成化工株式会社 エポキシ樹脂系ブラック酸化チタンマスターバッチ及びその製造方法
JP2005054045A (ja) * 2003-08-04 2005-03-03 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP4470887B2 (ja) * 2003-12-11 2010-06-02 日立化成工業株式会社 封止用エポキシ樹脂成形材料および電子部品装置
JP4483655B2 (ja) * 2005-03-30 2010-06-16 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP5431849B2 (ja) 2009-09-25 2014-03-05 株式会社Ａｄｅｋａ 無溶剤一液型シアン酸エステル−エポキシ複合樹脂組成物
JP5603610B2 (ja) 2010-02-12 2014-10-08 株式会社Ａｄｅｋａ 無溶剤一液型シアン酸エステル−エポキシ複合樹脂組成物
JP2015007729A (ja) 2013-06-26 2015-01-15 株式会社Adeka 光硬化性黒色組成物
CN105462531B (zh) * 2015-12-07 2019-04-05 深圳先进技术研究院 底部填充胶及其制备方法和倒装芯片

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1237186A (zh) * 1997-07-24 1999-12-01 洛克泰特公司 用作充填密封材料的热固性树脂组合物
JP2002363379A (ja) * 2001-05-31 2002-12-18 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2003040980A (ja) * 2001-07-31 2003-02-13 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2008260849A (ja) * 2007-04-12 2008-10-30 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂組成物付き金属箔及びプリント配線板
JP2014152302A (ja) * 2013-02-13 2014-08-25 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物、半導体装置の製造方法及び半導体装置
JP2018009048A (ja) * 2016-07-11 2018-01-18 株式会社Adeka 一液型シアン酸エステル−エポキシ複合樹脂組成物
JP2018188580A (ja) * 2017-05-10 2018-11-29 信越化学工業株式会社 熱伝導性エポキシ樹脂封止用組成物
JP2019077804A (ja) * 2017-10-25 2019-05-23 株式会社Adeka 一液型樹脂組成物、その硬化物およびそれを用いた接着剤

Also Published As

Publication number Publication date
EP4029896A4 (en) 2023-07-05
US20220289973A1 (en) 2022-09-15
WO2021049390A1 (ja) 2021-03-18
JPWO2021049390A1 (https=) 2021-03-18
TWI840605B (zh) 2024-05-01
TW202116909A (zh) 2021-05-01
EP4029896A1 (en) 2022-07-20

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