CN114203605B - 控制方法和基片输送系统 - Google Patents

控制方法和基片输送系统

Info

Publication number
CN114203605B
CN114203605B CN202111042397.7A CN202111042397A CN114203605B CN 114203605 B CN114203605 B CN 114203605B CN 202111042397 A CN202111042397 A CN 202111042397A CN 114203605 B CN114203605 B CN 114203605B
Authority
CN
China
Prior art keywords
substrate
conveying
path
sensor
outer edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111042397.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN114203605A (zh
Inventor
新藤健弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN114203605A publication Critical patent/CN114203605A/zh
Application granted granted Critical
Publication of CN114203605B publication Critical patent/CN114203605B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Human Computer Interaction (AREA)
CN202111042397.7A 2020-09-17 2021-09-07 控制方法和基片输送系统 Active CN114203605B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020156679A JP7433179B2 (ja) 2020-09-17 2020-09-17 制御方法及び基板搬送システム
JP2020-156679 2020-09-17

Publications (2)

Publication Number Publication Date
CN114203605A CN114203605A (zh) 2022-03-18
CN114203605B true CN114203605B (zh) 2025-09-19

Family

ID=80627078

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111042397.7A Active CN114203605B (zh) 2020-09-17 2021-09-07 控制方法和基片输送系统

Country Status (4)

Country Link
US (1) US12224193B2 (enExample)
JP (1) JP7433179B2 (enExample)
KR (1) KR102638031B1 (enExample)
CN (1) CN114203605B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024048046A (ja) * 2022-09-27 2024-04-08 東京エレクトロン株式会社 基板搬送システム及び画像補正方法
JP2024057943A (ja) * 2022-10-13 2024-04-25 東京エレクトロン株式会社 基板搬送システムの制御方法
JP2025087427A (ja) 2023-11-29 2025-06-10 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置及びそれを備えた基板処理装置
JP7766665B2 (ja) 2023-11-29 2025-11-10 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、基板処理装置および教示方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101202211A (zh) * 2006-12-12 2008-06-18 东京毅力科创株式会社 基板处理装置、基板搬送方法和计算机程序
JP2015005682A (ja) * 2013-06-24 2015-01-08 シンフォニアテクノロジー株式会社 搬送ロボット、円盤状搬送対象物の搬送方法
CN106716616A (zh) * 2014-09-17 2017-05-24 株式会社斯库林集团 基板处理装置以及基板处理方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3276477B2 (ja) * 1993-09-03 2002-04-22 キヤノン株式会社 基板処理装置
JPH10340944A (ja) * 1997-06-06 1998-12-22 Nikon Corp ウェハ位置決め装置
JP2003243479A (ja) 2002-02-19 2003-08-29 Tokyo Electron Ltd 搬送手段の停止位置調整機構
JP2006351884A (ja) * 2005-06-16 2006-12-28 Tokyo Electron Ltd 基板搬送機構及び処理システム
JP2009500869A (ja) * 2005-07-11 2009-01-08 ブルックス オートメーション インコーポレイテッド オンザフライ（ｏｎｔｈｅｆｌｙ）ワークピースセンタリングを備えた装置
JP4697192B2 (ja) 2007-06-12 2011-06-08 東京エレクトロン株式会社 位置ずれ検出装置及びこれを用いた処理システム
US8185242B2 (en) * 2008-05-07 2012-05-22 Lam Research Corporation Dynamic alignment of wafers using compensation values obtained through a series of wafer movements
US9196518B1 (en) * 2013-03-15 2015-11-24 Persimmon Technologies, Corp. Adaptive placement system and method
KR102308221B1 (ko) * 2013-06-05 2021-10-01 퍼시몬 테크놀로지스 코포레이션 로봇 및 적응형 배치 시스템 및 방법
JP6199199B2 (ja) * 2014-02-20 2017-09-20 東京エレクトロン株式会社 基板処理装置、位置ずれ補正方法及び記憶媒体
WO2016081459A1 (en) * 2014-11-18 2016-05-26 Persimmon Technologies, Corp. Robot adaptive placement system with end-effector position estimation
KR102587203B1 (ko) * 2015-07-13 2023-10-10 브룩스 오토메이션 인코퍼레이티드 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치
JP6650836B2 (ja) * 2016-06-13 2020-02-19 東京エレクトロン株式会社 基板搬送装置および基板搬送方法
US10580682B2 (en) * 2017-02-15 2020-03-03 Persimmon Technologies, Corp. Material-handling robot with multiple end-effectors
JP6915395B2 (ja) * 2017-06-16 2021-08-04 セイコーエプソン株式会社 制御装置、ロボットシステム、テーブル作成方法およびロボット制御方法
JP7008573B2 (ja) * 2018-05-16 2022-01-25 東京エレクトロン株式会社 搬送方法および搬送装置
KR102411116B1 (ko) * 2018-12-10 2022-06-20 주식회사 원익아이피에스 기판처리시스템, 기판처리시스템의 기판이송방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101202211A (zh) * 2006-12-12 2008-06-18 东京毅力科创株式会社 基板处理装置、基板搬送方法和计算机程序
JP2015005682A (ja) * 2013-06-24 2015-01-08 シンフォニアテクノロジー株式会社 搬送ロボット、円盤状搬送対象物の搬送方法
CN106716616A (zh) * 2014-09-17 2017-05-24 株式会社斯库林集团 基板处理装置以及基板处理方法

Also Published As

Publication number Publication date
KR102638031B1 (ko) 2024-02-16
KR20220037353A (ko) 2022-03-24
CN114203605A (zh) 2022-03-18
US20220084862A1 (en) 2022-03-17
JP2022050210A (ja) 2022-03-30
US12224193B2 (en) 2025-02-11
JP7433179B2 (ja) 2024-02-19

Similar Documents

Publication Publication Date Title
CN114203605B (zh) 控制方法和基片输送系统
CN106992137B (zh) 搬送装置和校正方法
JP4402811B2 (ja) 被処理体の搬送システムおよび被処理体の位置ずれ量の検出方法
JP6663774B2 (ja) 基板搬送方法及び基板処理システム
JP2006351884A (ja) 基板搬送機構及び処理システム
TWI397969B (zh) 具有迅速工件定中心功能的加工裝置
JP4961895B2 (ja) ウェハ搬送装置、ウェハ搬送方法及び記憶媒体
JP2004080001A (ja) 半導体ウェハの位置ずれ測定及び補正方法
JP5600703B2 (ja) 搬送装置及び搬送方法
JP2002246447A (ja) 被処理体の位置ずれ検出装置、処理システム及び位置ずれ検出方法
WO2002047871A1 (fr) Procede de transfert de substrat
CN114121740B (zh) 基板输送系统的控制方法和基板输送系统
KR102667669B1 (ko) 기판 반송 장치, 기판 처리 시스템 및 기판 처리 방법
JP5266964B2 (ja) 基板搬送システム、半導体製造装置および基板位置算出方法
JP2006351883A (ja) 基板搬送機構及び処理システム
JP7540869B2 (ja) 搬送装置のティーチング方法及び搬送システム
JPWO2010073817A1 (ja) 基板位置決め装置、基板処理装置、基板位置決めプログラム及び電子デバイスの製造方法
JP2023012940A (ja) 基板搬送方法および基板搬送システム
JP6035035B2 (ja) 基板搬送装置及び基板搬送方法
KR20050068978A (ko) 디지털 이미지를 이용한 웨이퍼 얼라인 방법
KR20210092906A (ko) 기판 이송 방법 및 기판 이송 장치
JP2001044263A (ja) 基板搬送方法及び基板搬送装置
WO2021106717A1 (ja) 基板処理システムの制御方法及び基板処理システム
TW202429612A (zh) 基板搬送機器人系統
JP2023049784A (ja) 基板処理システム及び搬送装置のティーチング方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant