JP7433179B2 - 制御方法及び基板搬送システム - Google Patents

制御方法及び基板搬送システム Download PDF

Info

Publication number
JP7433179B2
JP7433179B2 JP2020156679A JP2020156679A JP7433179B2 JP 7433179 B2 JP7433179 B2 JP 7433179B2 JP 2020156679 A JP2020156679 A JP 2020156679A JP 2020156679 A JP2020156679 A JP 2020156679A JP 7433179 B2 JP7433179 B2 JP 7433179B2
Authority
JP
Japan
Prior art keywords
substrate
transport mechanism
sensor
center position
outer edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020156679A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022050210A5 (enExample
JP2022050210A (ja
Inventor
健弘 新藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2020156679A priority Critical patent/JP7433179B2/ja
Priority to CN202111042397.7A priority patent/CN114203605B/zh
Priority to KR1020210118787A priority patent/KR102638031B1/ko
Priority to US17/474,644 priority patent/US12224193B2/en
Publication of JP2022050210A publication Critical patent/JP2022050210A/ja
Publication of JP2022050210A5 publication Critical patent/JP2022050210A5/ja
Application granted granted Critical
Publication of JP7433179B2 publication Critical patent/JP7433179B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Human Computer Interaction (AREA)
JP2020156679A 2020-09-17 2020-09-17 制御方法及び基板搬送システム Active JP7433179B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020156679A JP7433179B2 (ja) 2020-09-17 2020-09-17 制御方法及び基板搬送システム
CN202111042397.7A CN114203605B (zh) 2020-09-17 2021-09-07 控制方法和基片输送系统
KR1020210118787A KR102638031B1 (ko) 2020-09-17 2021-09-07 제어 방법 및 기판 반송 시스템
US17/474,644 US12224193B2 (en) 2020-09-17 2021-09-14 Control method and substrate transfer system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020156679A JP7433179B2 (ja) 2020-09-17 2020-09-17 制御方法及び基板搬送システム

Publications (3)

Publication Number Publication Date
JP2022050210A JP2022050210A (ja) 2022-03-30
JP2022050210A5 JP2022050210A5 (enExample) 2023-04-18
JP7433179B2 true JP7433179B2 (ja) 2024-02-19

Family

ID=80627078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020156679A Active JP7433179B2 (ja) 2020-09-17 2020-09-17 制御方法及び基板搬送システム

Country Status (4)

Country Link
US (1) US12224193B2 (enExample)
JP (1) JP7433179B2 (enExample)
KR (1) KR102638031B1 (enExample)
CN (1) CN114203605B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024048046A (ja) * 2022-09-27 2024-04-08 東京エレクトロン株式会社 基板搬送システム及び画像補正方法
JP2024057943A (ja) * 2022-10-13 2024-04-25 東京エレクトロン株式会社 基板搬送システムの制御方法
JP2025087427A (ja) 2023-11-29 2025-06-10 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置及びそれを備えた基板処理装置
JP7766665B2 (ja) 2023-11-29 2025-11-10 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、基板処理装置および教示方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243479A (ja) 2002-02-19 2003-08-29 Tokyo Electron Ltd 搬送手段の停止位置調整機構

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3276477B2 (ja) * 1993-09-03 2002-04-22 キヤノン株式会社 基板処理装置
JPH10340944A (ja) * 1997-06-06 1998-12-22 Nikon Corp ウェハ位置決め装置
JP2006351884A (ja) * 2005-06-16 2006-12-28 Tokyo Electron Ltd 基板搬送機構及び処理システム
JP2009500869A (ja) * 2005-07-11 2009-01-08 ブルックス オートメーション インコーポレイテッド オンザフライ（ｏｎｔｈｅｆｌｙ）ワークピースセンタリングを備えた装置
JP5036290B2 (ja) * 2006-12-12 2012-09-26 東京エレクトロン株式会社 基板処理装置および基板搬送方法、ならびにコンピュータプログラム
JP4697192B2 (ja) 2007-06-12 2011-06-08 東京エレクトロン株式会社 位置ずれ検出装置及びこれを用いた処理システム
US8185242B2 (en) * 2008-05-07 2012-05-22 Lam Research Corporation Dynamic alignment of wafers using compensation values obtained through a series of wafer movements
US9196518B1 (en) * 2013-03-15 2015-11-24 Persimmon Technologies, Corp. Adaptive placement system and method
KR102308221B1 (ko) * 2013-06-05 2021-10-01 퍼시몬 테크놀로지스 코포레이션 로봇 및 적응형 배치 시스템 및 방법
JP2015005682A (ja) * 2013-06-24 2015-01-08 シンフォニアテクノロジー株式会社 搬送ロボット、円盤状搬送対象物の搬送方法
JP6199199B2 (ja) * 2014-02-20 2017-09-20 東京エレクトロン株式会社 基板処理装置、位置ずれ補正方法及び記憶媒体
JP6339909B2 (ja) * 2014-09-17 2018-06-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
WO2016081459A1 (en) * 2014-11-18 2016-05-26 Persimmon Technologies, Corp. Robot adaptive placement system with end-effector position estimation
KR102587203B1 (ko) * 2015-07-13 2023-10-10 브룩스 오토메이션 인코퍼레이티드 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치
JP6650836B2 (ja) * 2016-06-13 2020-02-19 東京エレクトロン株式会社 基板搬送装置および基板搬送方法
US10580682B2 (en) * 2017-02-15 2020-03-03 Persimmon Technologies, Corp. Material-handling robot with multiple end-effectors
JP6915395B2 (ja) * 2017-06-16 2021-08-04 セイコーエプソン株式会社 制御装置、ロボットシステム、テーブル作成方法およびロボット制御方法
JP7008573B2 (ja) * 2018-05-16 2022-01-25 東京エレクトロン株式会社 搬送方法および搬送装置
KR102411116B1 (ko) * 2018-12-10 2022-06-20 주식회사 원익아이피에스 기판처리시스템, 기판처리시스템의 기판이송방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243479A (ja) 2002-02-19 2003-08-29 Tokyo Electron Ltd 搬送手段の停止位置調整機構

Also Published As

Publication number Publication date
KR102638031B1 (ko) 2024-02-16
KR20220037353A (ko) 2022-03-24
CN114203605A (zh) 2022-03-18
US20220084862A1 (en) 2022-03-17
JP2022050210A (ja) 2022-03-30
US12224193B2 (en) 2025-02-11
CN114203605B (zh) 2025-09-19

Similar Documents

Publication Publication Date Title
JP7433179B2 (ja) 制御方法及び基板搬送システム
US11545381B2 (en) Substrate transporting method and substrate processing system
JP4402811B2 (ja) 被処理体の搬送システムおよび被処理体の位置ずれ量の検出方法
JP2006351884A (ja) 基板搬送機構及び処理システム
US20100145513A1 (en) Method for monitoring the position of a semiconductor processing robot
WO1999045579A1 (en) On the fly center-finding during substrate handling in a processing system
JP5284486B2 (ja) 基板中心位置の特定方法
JP6574715B2 (ja) 基板搬送方法及び基板処理システム
US12211719B2 (en) Method of controlling substrate transfer system and the substrate transfer system
US20240424666A1 (en) Method for Teaching Transfer Robot and Substrate Processing System
US12198955B2 (en) Substrate transfer method and substrate transfer system
US20240228190A1 (en) Transfer device and expansion amount calculation method
JP2025012200A (ja) 搬送装置およびティーチング方法
WO2021106717A1 (ja) 基板処理システムの制御方法及び基板処理システム
KR20240101653A (ko) 로봇 및 로봇의 제어 방법
JP2005079442A (ja) 基板搬送装置、基板の搬送方法及びプログラム
JPH1070174A (ja) ウェハの位置決め装置及び方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230410

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230410

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20231208

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240109

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240206

R150 Certificate of patent or registration of utility model

Ref document number: 7433179

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150