CN114174423B - 树脂组合物 - Google Patents
树脂组合物 Download PDFInfo
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- CN114174423B CN114174423B CN202080055261.7A CN202080055261A CN114174423B CN 114174423 B CN114174423 B CN 114174423B CN 202080055261 A CN202080055261 A CN 202080055261A CN 114174423 B CN114174423 B CN 114174423B
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- resin composition
- underfill material
- azine
- epoxy resin
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- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
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- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
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- 239000000178 monomer Substances 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0041—Optical brightening agents, organic pigments
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3462—Six-membered rings
- C08K5/3465—Six-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019189517 | 2019-10-16 | ||
| JP2019-189517 | 2019-10-16 | ||
| PCT/JP2020/035036 WO2021075197A1 (ja) | 2019-10-16 | 2020-09-16 | 樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114174423A CN114174423A (zh) | 2022-03-11 |
| CN114174423B true CN114174423B (zh) | 2024-06-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080055261.7A Active CN114174423B (zh) | 2019-10-16 | 2020-09-16 | 树脂组合物 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2021075197A1 (ja) |
| KR (1) | KR20220084267A (ja) |
| CN (1) | CN114174423B (ja) |
| WO (1) | WO2021075197A1 (ja) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6131449A (ja) * | 1984-07-23 | 1986-02-13 | Nippon Kayaku Co Ltd | 紫外線硬化型樹脂組成物 |
| JP2003246840A (ja) * | 2002-02-25 | 2003-09-05 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物及び光半導体装置 |
| JP2009127011A (ja) * | 2007-11-27 | 2009-06-11 | Panasonic Electric Works Co Ltd | 封止用エポキシ樹脂組成物および半導体装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59185349A (ja) * | 1983-04-06 | 1984-10-20 | Orient Kagaku Kogyo Kk | 静電荷像現像用トナ− |
| JPH0764124B2 (ja) * | 1985-05-23 | 1995-07-12 | 大日本印刷株式会社 | 熱転写シ−ト |
| JP2961632B2 (ja) * | 1992-01-23 | 1999-10-12 | 富士写真フイルム株式会社 | ハロゲン化銀写真感光材料 |
| JPH0867806A (ja) * | 1994-08-30 | 1996-03-12 | Sumitomo Bakelite Co Ltd | 半導体封止用樹脂組成物 |
| JP2000273288A (ja) | 1999-03-29 | 2000-10-03 | Citizen Watch Co Ltd | 封止樹脂組成物 |
| DE102007026256A1 (de) * | 2007-06-04 | 2008-12-11 | Akemi Chemisch Technische Spezialfabrik Gmbh | Mehrfarbkomponenten-Klebersystem |
| JP2009046606A (ja) * | 2007-08-21 | 2009-03-05 | Sumitomo Bakelite Co Ltd | 熱硬化性液状封止樹脂組成物及び半導体装置 |
| WO2014188850A1 (ja) * | 2013-05-21 | 2014-11-27 | 昭和電工株式会社 | 遮光性防湿絶縁塗料、遮光性防湿絶縁塗料を用いた封止・絶縁処理方法、および遮光性防湿絶縁塗料によって封止・絶縁処理された電子部品 |
-
2020
- 2020-09-16 KR KR1020227004198A patent/KR20220084267A/ko unknown
- 2020-09-16 JP JP2021552275A patent/JPWO2021075197A1/ja active Pending
- 2020-09-16 CN CN202080055261.7A patent/CN114174423B/zh active Active
- 2020-09-16 WO PCT/JP2020/035036 patent/WO2021075197A1/ja active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6131449A (ja) * | 1984-07-23 | 1986-02-13 | Nippon Kayaku Co Ltd | 紫外線硬化型樹脂組成物 |
| JP2003246840A (ja) * | 2002-02-25 | 2003-09-05 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物及び光半導体装置 |
| JP2009127011A (ja) * | 2007-11-27 | 2009-06-11 | Panasonic Electric Works Co Ltd | 封止用エポキシ樹脂組成物および半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114174423A (zh) | 2022-03-11 |
| WO2021075197A1 (ja) | 2021-04-22 |
| JPWO2021075197A1 (ja) | 2021-04-22 |
| TW202124554A (zh) | 2021-07-01 |
| KR20220084267A (ko) | 2022-06-21 |
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