CN114163961A - 一种聚氨酯改性环氧树脂胶黏材料及其制备方法和应用 - Google Patents
一种聚氨酯改性环氧树脂胶黏材料及其制备方法和应用 Download PDFInfo
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- CN114163961A CN114163961A CN202210018997.8A CN202210018997A CN114163961A CN 114163961 A CN114163961 A CN 114163961A CN 202210018997 A CN202210018997 A CN 202210018997A CN 114163961 A CN114163961 A CN 114163961A
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- epoxy resin
- adhesive material
- resin adhesive
- modified epoxy
- polyurethane
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
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Priority Applications (1)
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CN202210018997.8A CN114163961B (zh) | 2022-01-10 | 2022-01-10 | 一种聚氨酯改性环氧树脂胶黏材料及其制备方法和应用 |
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CN202210018997.8A CN114163961B (zh) | 2022-01-10 | 2022-01-10 | 一种聚氨酯改性环氧树脂胶黏材料及其制备方法和应用 |
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CN114163961A true CN114163961A (zh) | 2022-03-11 |
CN114163961B CN114163961B (zh) | 2022-09-20 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62141083A (ja) * | 1985-12-13 | 1987-06-24 | Sony Chem Kk | フイルム状熱硬化型接着剤 |
CN101298548A (zh) * | 2008-06-13 | 2008-11-05 | 江苏科技大学 | 一种环氧改性聚氨酯耐超低温胶粘剂 |
CN102069615A (zh) * | 2010-11-11 | 2011-05-25 | 广东生益科技股份有限公司 | 覆铜板的制作方法 |
CN105492534A (zh) * | 2013-09-26 | 2016-04-13 | 东洋纺株式会社 | 聚氨酯树脂组合物及使用其的粘接剂组合物、层叠体、印刷线路板 |
CN108359221A (zh) * | 2018-03-16 | 2018-08-03 | 苏州生益科技有限公司 | 一种树脂组合物及应用其制备的低流胶半固化片 |
CN108410133A (zh) * | 2018-03-16 | 2018-08-17 | 苏州生益科技有限公司 | 树脂组合物及应用其制备的低流胶半固化片 |
CN111500239A (zh) * | 2020-06-08 | 2020-08-07 | 东莞市新懿电子材料技术有限公司 | 一种高导热的单组分底部填充胶粘剂及其制备方法 |
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2022
- 2022-01-10 CN CN202210018997.8A patent/CN114163961B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62141083A (ja) * | 1985-12-13 | 1987-06-24 | Sony Chem Kk | フイルム状熱硬化型接着剤 |
CN101298548A (zh) * | 2008-06-13 | 2008-11-05 | 江苏科技大学 | 一种环氧改性聚氨酯耐超低温胶粘剂 |
CN102069615A (zh) * | 2010-11-11 | 2011-05-25 | 广东生益科技股份有限公司 | 覆铜板的制作方法 |
CN105492534A (zh) * | 2013-09-26 | 2016-04-13 | 东洋纺株式会社 | 聚氨酯树脂组合物及使用其的粘接剂组合物、层叠体、印刷线路板 |
CN108359221A (zh) * | 2018-03-16 | 2018-08-03 | 苏州生益科技有限公司 | 一种树脂组合物及应用其制备的低流胶半固化片 |
CN108410133A (zh) * | 2018-03-16 | 2018-08-17 | 苏州生益科技有限公司 | 树脂组合物及应用其制备的低流胶半固化片 |
CN111500239A (zh) * | 2020-06-08 | 2020-08-07 | 东莞市新懿电子材料技术有限公司 | 一种高导热的单组分底部填充胶粘剂及其制备方法 |
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Inventor after: Chen Shoubing Inventor after: Liu Jianfeng Inventor after: Wang Jin Inventor after: Ju Hao Inventor after: Zhang Yaoming Inventor after: Zhang Changsheng Inventor after: Yang Zenghui Inventor after: Wang Tingmei Inventor after: Wang Qihua Inventor after: Jiang Yihui Inventor before: Chen Shoubing Inventor before: Liu Jianfeng Inventor before: Wang Jin Inventor before: Ju Hao Inventor before: Zhang Yaoming Inventor before: Zhang Changsheng Inventor before: Yang Zenghui Inventor before: Wang Tingmei Inventor before: Wang Qihua Inventor before: Jiang Yihui |