CN114096612A - 用于电气部件的光辐射可固化的环氧树脂 - Google Patents
用于电气部件的光辐射可固化的环氧树脂 Download PDFInfo
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- epoxy resin
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 73
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 70
- 239000000203 mixture Substances 0.000 claims abstract description 66
- 238000009472 formulation Methods 0.000 claims abstract description 63
- 230000005855 radiation Effects 0.000 claims abstract description 11
- 238000010146 3D printing Methods 0.000 claims abstract description 9
- 230000015556 catabolic process Effects 0.000 claims abstract description 6
- 230000009477 glass transition Effects 0.000 claims abstract description 4
- -1 diaryliodonium cation Chemical class 0.000 claims description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 12
- 150000002921 oxetanes Chemical class 0.000 claims description 8
- 238000003848 UV Light-Curing Methods 0.000 claims description 7
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000012955 diaryliodonium Substances 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 239000012952 cationic photoinitiator Substances 0.000 claims description 5
- 239000003085 diluting agent Substances 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 4
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 4
- 125000005409 triarylsulfonium group Chemical group 0.000 claims description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 238000006467 substitution reaction Methods 0.000 claims description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 claims description 3
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 claims description 2
- NLQMSBJFLQPLIJ-UHFFFAOYSA-N (3-methyloxetan-3-yl)methanol Chemical compound OCC1(C)COC1 NLQMSBJFLQPLIJ-UHFFFAOYSA-N 0.000 claims description 2
- CCHJOAVOTFFIMP-UHFFFAOYSA-N 2-phenyloxetane Chemical compound O1CCC1C1=CC=CC=C1 CCHJOAVOTFFIMP-UHFFFAOYSA-N 0.000 claims description 2
- RVGLUKRYMXEQAH-UHFFFAOYSA-N 3,3-dimethyloxetane Chemical compound CC1(C)COC1 RVGLUKRYMXEQAH-UHFFFAOYSA-N 0.000 claims description 2
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 claims description 2
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 claims description 2
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 claims description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 125000005520 diaryliodonium group Chemical group 0.000 claims description 2
- 150000002009 diols Chemical class 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- QMLWSAXEQSBAAQ-UHFFFAOYSA-N oxetan-3-ol Chemical compound OC1COC1 QMLWSAXEQSBAAQ-UHFFFAOYSA-N 0.000 claims description 2
- SWYHWLFHDVMLHO-UHFFFAOYSA-N oxetan-3-ylmethanol Chemical compound OCC1COC1 SWYHWLFHDVMLHO-UHFFFAOYSA-N 0.000 claims description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 claims description 2
- 229920005862 polyol Polymers 0.000 claims description 2
- 150000003077 polyols Chemical class 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 150000004684 trihydrates Chemical class 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 4
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 claims 2
- AXBZYIUMMDXBRJ-UHFFFAOYSA-N [2-(hydroxymethyl)oxetan-3-yl]methanol Chemical compound OCC1COC1CO AXBZYIUMMDXBRJ-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 15
- 125000003118 aryl group Chemical group 0.000 description 7
- 238000001723 curing Methods 0.000 description 5
- 125000002091 cationic group Chemical group 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 235000002639 sodium chloride Nutrition 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- NPRYHWFMGPYJIY-UHFFFAOYSA-N 2-cyclohexyloxirane Chemical compound C1OC1C1CCCCC1 NPRYHWFMGPYJIY-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- PSBPNWBGNOWCCU-UHFFFAOYSA-N OB(O)O.S.S.S Chemical compound OB(O)O.S.S.S PSBPNWBGNOWCCU-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- QSGREIXRTDCBHO-UHFFFAOYSA-N [3-(hydroxymethyl)oxetan-3-yl]methanol Chemical compound OCC1(CO)COC1 QSGREIXRTDCBHO-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000012949 free radical photoinitiator Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012038 nucleophile Substances 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 230000007928 solubilization Effects 0.000 description 1
- 238000005063 solubilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000003930 superacid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
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Abstract
本公开为暴露于电压差的电气部件提供一种具有改进的性质的环氧树脂制剂。这些改进的电气性质可以包括提高的玻璃化转变温度、提高的击穿强度和/或较低的损耗系数。电气部件可由环氧树脂制剂通过3D打印环氧树脂制剂并用UV辐射固化该制剂而形成。环氧树脂制剂可包括环氧树脂、光引发剂和促进剂。
Description
技术领域
本发明大体上涉及环氧树脂制剂，且特别地涉及在电气部件中具有改进的性能的环氧树脂制剂。
背景技术
近来，由环氧树脂制剂制成各种部件已变得更加常见。例如，一种越来越多使用的方法是3D打印技术，其以编程的三维形状打印环氧树脂制剂。为了允许以准确的形状及时打印部件，所打印的环氧树脂常常在它被打印时通过用紫外线辐射(UV)照射环氧树脂制剂进行固化。例如，可在环氧树脂制剂被打印时使用激光以将UV辐射施加到环氧树脂制剂来使其快速固化。
为了实施环氧树脂制剂的UV固化，环氧树脂制剂有必要包括对光辐射作出响应的光引发剂。在使用中，当光辐射被施加到光引发剂时，光引发剂引起环氧树脂的固化。已针对3D打印应用在环氧树脂制剂中使用的一种常见类型的光引发剂是各种形式的丙烯酸酯。针对部件的3D打印在环氧树脂制剂中使用丙烯酸酯的优点是，丙烯酸酯在施加UV辐射时引起环氧树脂的快速固化。还发现由环氧树脂/丙烯酸酯制剂制成的部件适合于许多应用。
然而，发明人已确定，当在经历电压差的电气部件中使用时，由环氧树脂/丙烯酸酯制剂制成的部件会具有较差的性质。因此，发明人相信，为电气部件提供具有改进的性质的改进的环氧树脂制剂将是有用的。
发明内容
描述了一种光辐射可固化的环氧树脂制剂。该环氧树脂制剂包括光引发剂、促进剂和环氧树脂。可利用3D打印将环氧树脂制剂形成为电气部件。该电气部件可具有改进的电气性质，包括玻璃化转变温度、击穿强度和损耗系数。
具体实施方式
用于光辐射固化应用中的改进的环氧树脂制剂可包括按重量计为1％-6％的光引发剂、按重量计为3％-20％的促进剂和按重量计为至少50％的环氧树脂。更优选地，光引发剂的部分按重量计为1.7％-4％或1.7％-3％。更优选地，促进剂的部分按重量计为5％-15％或5％-10％。更优选地，环氧树脂制剂的部分按重量计至少为70％或80％。环氧树脂制剂还可包括按体积计高达65％的填料，诸如二氧化硅、云母、石英、碳酸钙、滑石、硅酸铝、氧化铝、三水合氧化铝或硫酸钙。
可在3D打印工艺中使用环氧树脂制剂以形成电气部件。尽管各种电气部件是可能的，但一些示例包括套管、介电涂层、插头壳体和绝缘导管。应理解，套管是绝缘装置，其向穿过接地屏障(诸如，墙壁或外壳)的高压线路提供电气隔离。介电涂层可用于提供电气隔离并减少电气部件的爬电距离(creep distance)。插头壳体是用于电气连接器或插头的绝缘屏障。绝缘导管可用于容纳电气布线并防范机械、化学或任何其他外部损坏源。
在环氧树脂制剂固化之后，由其形成的电气部件暴露于电压差。固化后的环氧树脂的玻璃化转变温度优选地至少为120℃。固化后的环氧树脂的电气击穿强度优选地至少为25kV/mm，且更优选地至少为40kV/mm。固化后的环氧树脂的电损耗系数优选地小于1％，且更优选地小于0.2％。
光引发剂优选地为阳离子光引发剂。目前，环氧树脂和氧杂环丁烷的阴离子光聚合的可行途径很少。尽管存在许多类型的阳离子引发剂，但只有两类阳离子是工业相关的：二芳基碘鎓阳离子和三芳基锍阳离子。碘鎓盐主要在220-290nm波长范围内吸收，且锍盐主要在300-360nm波长范围内吸收。碘鎓盐具有两个芳基且锍盐具有三个芳基，以便具有UV反应性。由于生产工艺所致，锍盐的另一种常见盐在分子内含有五个芳基和两个硫原子或者四个芳基和两个硫原子。然而，这仍然被认为是“三芳基锍盐”，因为反应性阳离子键合到三个芳基官能团。为了改进在聚合物树脂中的增溶，芳基可用各种官能团取代。这些官能化可以是对称的或不对称的，不过对称更常见。4和4’芳基碳的常见官能化是：叔丁基、甲基、乙基、丙基、异丙基、辛基、二芳基硫化物(仅锍)和芳基硫化物(仅锍)。尽管存在大量的取代(这些取代只要它们吸电子便是可能的)，但工业相关的阳离子光引发剂中的大多数取代是线性脂肪族基团。每种盐的阴离子应是弱亲核试剂和强酸，诸如路易斯超强酸。常见的示例包括六氟锑酸盐(SbF6 -)；六氟磷酸盐(PF6 -)；四氟硼酸盐(BF4 -)；四五氟苯基硼酸盐(B(C6F5)4 -)；六氟砷酸盐(AsF6 -)；以及四九氟叔丁基铝酸盐(Al(C4F9)4 -)。这些阳离子/阴离子对的任何组合均可以是可行的。在实践中，最有用的阴离子是SbF6 -、B(C6F5)4 -和Al(C4F9)4 -。具有相同通用结构的化合物也可被取代。阳离子光引发剂优选地可以是二芳基碘鎓阳离子或三芳基锍阳离子，包括三芳基锍六氟锑酸盐、二芳基六氟锑酸碘鎓盐、二芳基四[五氟苯基]硼酸碘鎓盐、或高分子量四[五氟苯基]硼酸锍。更优选地，光引发剂是三芳基锍六氟锑酸盐。
丙烯酸酯(acrylated)低聚物和树脂通常用于光固化。丙烯酸酯树脂使用自由基光引发剂而不是阳离子引发剂。在一些情况下，阳离子引发剂和自由基引发剂一起被用于丙烯酸酯树脂中。改进的环氧树脂制剂可包括丙烯酸类单体、丙烯酸酯低聚物、丙烯酸酯树脂或其组合。然而，作为上限，丙烯酸酯含量按重量计不应超过5％。该数字包括混合物中任何类型的丙烯酸酯的总重量分数，不管是丙烯酸酯树脂还是丙烯酸单体的部分。丙烯酸酯树脂含量不应超过总树脂组成的20％。丙烯酸酯低聚物的组成不应超过低聚物组成的50％。最优选地，改进的环氧树脂制剂没有丙烯酸酯部分。
促进剂优选地为醇、二元醇或多元醇以作为反应性稀释剂。更优选地，促进剂是氧杂环丁烷。氧杂环丁烷是常见的反应性稀释剂(即，具有比树脂低的粘度并被结合到最终的环氧树脂材料中)。氧杂环丁烷也可以用于加速固化工艺。最优选地，氧杂环丁烷是3-乙基-3-氧杂环丁烷甲醇。也可使用其他氧杂环丁烷，它们优选地是具有氧杂环丁烷和醇基团两者的反应性稀释剂。示例包括氧杂环丁烷-3-甲醇和3-甲基-3-氧杂环丁烷甲醇。双官能的氧杂环丁烷可用于高度固化，包括双[1-乙基(3-氧杂环丁烷基)]甲基醚；1,4-双[(3-乙基-3-氧杂环丁烷基甲氧基)甲基]苯；3-乙基-3-[(2-乙基己氧基)甲基]氧杂环丁烷；二甲基氧杂环丁烷；苯基氧杂环丁烷；三甲撑氧；甲基-3-氧杂环丁烷；乙基-3-氧杂环丁烷；长链烷基取代的氧杂环丁烷(丙基、丁基、戊基、己基、庚基、辛基取代)；3-羟基氧杂环丁烷；3,3-氧杂环丁烷二甲醇；2,6-二氧杂螺环3.3庚烷。美国专利号7,235,593中提供了可使用的氧杂环丁烷的附加示例，该专利通过引用并入本文中。
环氧树脂优选地为脂环族环氧树脂。当与芳香族环氧树脂相比时，脂环族化合物更能抵抗UV降解并且快速反应。虽然存在可用的几种脂环族环氧树脂，但含有官能团环氧环己烷的环氧树脂固化得快得多并且对于3D打印是优选的。示例包括3,4-环氧环己基甲基-3',4'-环氧环己烷羧酸酯；环氧环己烷(也称为环己基环氧乙烷或环氧乙烷环己烷)，其是一种反应性稀释剂；或其组合。缩水甘油基环氧树脂官能团并不那么快固化，且因此对于高Tg的3D打印树脂并不那么有用。大多数芳香族环氧树脂也是缩水甘油基环氧树脂，并且对于用阳离子UV引发的聚合进行快速固化并不那么有用。
虽然已描述了本发明的优选实施例，但是应理解，本发明不限于此，并且可在不脱离本文中的本发明的情况下进行修改。虽然本文中所描述的每个实施例可能仅引用某些特征并且可能不具体引用关于其他实施例所描述的每个特征，但应认识到，除非另外描述，否则本文中所描述的特征是可互换的，即使没有提及特定特征。还应理解，上文所描述的优点不一定是本发明的仅有的优点，并且不一定期望将在本发明的每个实施例的情况下实现所有所描述的优点。本发明的范围由所附权利要求限定，并且在权利要求的含义内的所有装置和方法，无论是字面上的还是等效的，都旨在包含在其中。
Claims (28)
1.一种光辐射可固化的环氧树脂制剂，包括：
按重量计为1％-6％的光引发剂；
按重量计为3％-20％的促进剂；以及
按重量计为至少50％的环氧树脂。
2.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，所述光引发剂包括阳离子光引发剂。
3.根据权利要求2所述的光辐射可固化的环氧树脂制剂，其中，所述阳离子光引发剂包括二芳基碘鎓阳离子或三芳基锍阳离子。
4.根据权利要求3所述的光辐射可固化的环氧树脂制剂，其中，所述二芳基碘鎓阳离子或三芳基锍阳离子包括三芳基锍六氟锑酸盐、二芳基六氟锑酸碘鎓盐、二芳基四[五氟苯基]硼酸碘鎓盐、或高分子量四[五氟苯基]硼酸锍。
5.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，所述光引发剂包括三芳基锍六氟锑酸盐。
6.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，所述促进剂包括醇、二元醇或多元醇以作为反应性稀释剂。
7.根据权利要求6所述的光辐射可固化的环氧树脂制剂，其中，所述促进剂包括氧杂环丁烷。
8.根据权利要求7所述的光辐射可固化的环氧树脂制剂，其中，所述氧杂环丁烷包括3-乙基-3-氧杂环丁烷甲醇、氧杂环丁烷-3-甲醇、或3-甲基-3-氧杂环丁烷甲醇。
9.根据权利要求7所述的光辐射可固化的环氧树脂制剂，其中，所述氧杂环丁烷包括双[1-乙基(3-氧杂环丁烷基)]甲基醚、1,4-双[(3-乙基-3-氧杂环丁烷基甲氧基)甲基]苯、3-乙基-3-[(2-乙基己氧基)甲基]氧杂环丁烷、二甲基氧杂环丁烷、苯基氧杂环丁烷、三甲撑氧、甲基-3-氧杂环丁烷、乙基-3-氧杂环丁烷、长链烷基取代的氧杂环丁烷(丙基、丁基、戊基、己基、庚基、辛基取代)、3-羟基氧杂环丁烷、3,3-氧杂环丁烷二甲醇、或2,6-二氧杂螺环3.3庚烷。
10.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，所述环氧树脂是脂环族环氧树脂。
11.根据权利要求10所述的光辐射可固化的环氧树脂制剂，其中，所述脂环族环氧树脂包括3,4-环氧环己基甲基-3',4'-环氧环己烷羧酸酯、环氧环己烷、或其组合。
12.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其进一步包括按重量计小于5％的丙烯酸酯单体、丙烯酸酯低聚物、丙烯酸酯树脂或其组合。
13.根据权利要求12所述的光辐射可固化的环氧树脂制剂，其不具有丙烯酸酯的部分。
14.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其进一步包括按体积计高达65％的填料，所述填料包括二氧化硅、云母、石英、碳酸钙、滑石、硅酸铝、氧化铝、三水合氧化铝或硫酸钙。
15.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，所述环氧树脂制剂在UV固化之后具有至少120℃的玻璃化转变温度。
16.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，所述环氧树脂制剂在UV固化之后具有至少25kV/mm的电气击穿强度。
17.根据权利要求16所述的光辐射可固化的环氧树脂制剂，其中，所述环氧树脂制剂在UV固化之后具有至少40kV/mm的电气击穿强度。
18.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，所述环氧树脂制剂在UV固化之后具有小于1％的电损耗系数。
19.根据权利要求18所述的光辐射可固化的环氧树脂制剂，其中，所述环氧树脂制剂在UV固化之后具有小于0.2％的电损耗系数。
20.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，所述环氧树脂制剂在UV固化之后形成暴露于电压差的电气部件。
21.根据权利要求20所述的光辐射可固化的环氧树脂制剂，其中，所述电气部件包括套管、介电涂层、插头壳体或绝缘导管。
22.根据权利要求20所述的光辐射可固化的环氧树脂制剂，其中，所述电气部件通过3D打印所述环氧树脂制剂而形成。
23.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，包括按重量计为1.7％-4％的光引发剂。
24.根据权利要求23所述的光辐射可固化的环氧树脂制剂，其中，包括按重量计为1.7％-3％的光引发剂。
25.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，包括按重量计为5％-15％的促进剂。
26.根据权利要求25所述的光辐射可固化的环氧树脂制剂，其中，包括按重量计为5％-10％的促进剂。
27.根据权利要求1所述的光辐射可固化的环氧树脂制剂，其中，包括按重量计为至少70％的环氧树脂。
28.根据权利要求27所述的光辐射可固化的环氧树脂制剂，其中，包括按重量计为至少80％的环氧树脂。
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Also Published As
| Publication number | Publication date |
|---|---|
| EP4097163A1 (en) | 2022-12-07 |
| US20220251287A1 (en) | 2022-08-11 |
| WO2021151707A1 (en) | 2021-08-05 |
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