CN114072867A - 显示组件和显示装置 - Google Patents

显示组件和显示装置 Download PDF

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Publication number
CN114072867A
CN114072867A CN202080000897.1A CN202080000897A CN114072867A CN 114072867 A CN114072867 A CN 114072867A CN 202080000897 A CN202080000897 A CN 202080000897A CN 114072867 A CN114072867 A CN 114072867A
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CN
China
Prior art keywords
flexible
layer
integrated circuit
binding
circuit board
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Granted
Application number
CN202080000897.1A
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English (en)
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CN114072867B (zh
Inventor
陈启中
纪冰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Publication of CN114072867A publication Critical patent/CN114072867A/zh
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Publication of CN114072867B publication Critical patent/CN114072867B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0054—Casings specially adapted for display applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structure Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本申请涉及显示技术领域，公开一种显示组件和显示装置，目的是改善对驱动集成电路芯片和柔性线路板的保护效果，提高产品良率。显示组件包括显示模组、柔性线路板、集成电路芯片及复合胶布；集成电路芯片和柔性线路板的绑定部与显示模组绑定连接；复合胶布位于显示模组绑定区并贴覆于集成电路芯片和柔性线路板上，包括：具有第一部分和第二部分的导电布层，第一部分覆盖集成电路芯片和柔性线路板的绑定部，第二部分覆盖柔性线路板的至少部分接地部；绝缘膜层，位于导电布层朝向集成电路芯片和柔性线路板的一侧，包括位于导电布层的第一部分并覆盖集成电路芯片和柔性线路板绑定部的第三部分，绝缘膜层避让柔性线路板的至少部分接地部。

Description

PCT国内申请，说明书已公开。

Claims (16)

  1. PCT国内申请，权利要求书已公开。
CN202080000897.1A 2020-06-04 2020-06-04 显示组件和显示装置 Active CN114072867B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/094443 WO2021243659A1 (zh) 2020-06-04 2020-06-04 显示组件和显示装置

Publications (2)

Publication Number Publication Date
CN114072867A true CN114072867A (zh) 2022-02-18
CN114072867B CN114072867B (zh) 2023-08-25

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US (2) US11647616B2 (zh)
CN (1) CN114072867B (zh)
GB (1) GB2606900A (zh)
WO (1) WO2021243659A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115206191B (zh) * 2022-07-13 2023-10-31 武汉华星光电半导体显示技术有限公司 电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101625463A (zh) * 2008-07-09 2010-01-13 奇美电子股份有限公司 复合胶带及显示装置
CN103268168A (zh) * 2013-06-07 2013-08-28 友达光电（苏州）有限公司 触控显示模块
CN210042723U (zh) * 2019-02-20 2020-02-07 苏州铂韬新材料科技有限公司 一种电磁屏蔽结构
CN210606462U (zh) * 2019-08-21 2020-05-22 敦泰电子（深圳）有限公司 一种显示模组和终端设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102271585B1 (ko) * 2014-02-10 2021-07-01 삼성디스플레이 주식회사 표시 장치
CN204884440U (zh) * 2015-08-27 2015-12-16 京东方科技集团股份有限公司 柔性显示面板和柔性显示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101625463A (zh) * 2008-07-09 2010-01-13 奇美电子股份有限公司 复合胶带及显示装置
CN103268168A (zh) * 2013-06-07 2013-08-28 友达光电（苏州）有限公司 触控显示模块
CN210042723U (zh) * 2019-02-20 2020-02-07 苏州铂韬新材料科技有限公司 一种电磁屏蔽结构
CN210606462U (zh) * 2019-08-21 2020-05-22 敦泰电子（深圳）有限公司 一种显示模组和终端设备

Also Published As

Publication number Publication date
CN114072867B (zh) 2023-08-25
GB202209532D0 (en) 2022-08-10
US11647616B2 (en) 2023-05-09
WO2021243659A1 (zh) 2021-12-09
US11937414B2 (en) 2024-03-19
US20220192065A1 (en) 2022-06-16
US20230240058A1 (en) 2023-07-27
GB2606900A (en) 2022-11-23

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