WO2021243659A1 - 显示组件和显示装置 - Google Patents

显示组件和显示装置 Download PDF

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Publication number
WO2021243659A1
WO2021243659A1 PCT/CN2020/094443 CN2020094443W WO2021243659A1 WO 2021243659 A1 WO2021243659 A1 WO 2021243659A1 CN 2020094443 W CN2020094443 W CN 2020094443W WO 2021243659 A1 WO2021243659 A1 WO 2021243659A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
binding
layer
integrated circuit
Prior art date
Application number
PCT/CN2020/094443
Other languages
English (en)
French (fr)
Inventor
陈启中
纪冰
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202080000897.1A priority Critical patent/CN114072867B/zh
Priority to PCT/CN2020/094443 priority patent/WO2021243659A1/zh
Priority to US17/271,466 priority patent/US11647616B2/en
Priority to GB2209532.7A priority patent/GB2606900A/en
Publication of WO2021243659A1 publication Critical patent/WO2021243659A1/zh
Priority to US18/194,042 priority patent/US11937414B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0054—Casings specially adapted for display applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Definitions

  • This application relates to the field of display technology, and in particular to a display assembly and a display device.
  • OLED display devices As a display component of electronic equipment, OLED display devices have been widely used in various electronic products, and OLED display panels are an important component of display devices.
  • a tape In order to protect the drive integrated circuit chip (Drive IC) and the main flexible circuit board (MFPC) of the OLED display module, a tape (IC Cover) is generally attached to the upper part of the MFPC and Drive IC.
  • IC Cover Tape the structure design of IC Cover Tape is relatively simple, and the protection effect of MFPC and Drive IC is poor, and the yield rate of MFPC and Drive IC cannot be effectively guaranteed.
  • the application discloses a display assembly and a display device, with the purpose of improving the protection effect of driving integrated circuit chips and flexible circuit boards, and improving the yield of display products.
  • a display assembly includes a display module, a flexible circuit board, an integrated circuit chip, and a composite tape; the integrated circuit chip and the binding part of the flexible circuit board are respectively bound and connected to the display module;
  • the composite tape is located in the binding area of the display module and is pasted on the integrated circuit chip and the flexible circuit board; the composite tape includes:
  • the conductive cloth layer includes a first part and a second part, the first part is configured to cover the binding part of the integrated circuit chip and the flexible circuit board, and the second part is configured to cover at least part of the ground of the flexible circuit board Department;
  • the insulating film layer is located on the side of the conductive cloth layer facing the integrated circuit chip and the flexible circuit board, the insulating film layer includes a third part, and the third part is located on the first part of the conductive cloth layer And cover the binding part of the integrated circuit chip and the flexible circuit board, and the insulating film layer avoids the at least part of the grounding part of the flexible circuit board.
  • the third part of the insulating film layer is configured to cover the boundary of the binding portion of the flexible circuit board and completely cover the integrated circuit chip, and is bonded to the display module.
  • the composite tape further includes:
  • the absorbing material layer is located on the side of the insulating film layer away from the conductive cloth layer, and located at the third part of the insulating film layer, and is configured to cover the integrated circuit chip.
  • the shape of the wave absorbing material layer is similar to that of the integrated circuit chip, and the wave absorbing material layer is configured to completely cover the integrated circuit chip.
  • the composite tape further includes:
  • the double-sided adhesive layer is located on the side of the wave-absorbing material layer away from the insulating film layer, and the edge of the double-sided adhesive layer extends beyond the edge of the wave-absorbing material layer and is bonded to the insulating film layer.
  • the grounding portion includes a first grounding portion close to the binding portion and a second grounding portion far from the binding portion;
  • the second part of the conductive cloth layer is configured to cover and adhere to the first ground portion.
  • the conductive cloth layer is configured to avoid the second ground portion.
  • the conductive cloth layer further includes a fourth part configured to cover the test part of the flexible circuit board;
  • the insulating film layer includes a fourth part located on the conductive cloth layer and used to cover a fifth part of the flexible circuit board.
  • the flexible circuit board is L-shaped and includes a first extension portion and a second extension portion;
  • the first extension portion includes the binding portion, a test portion, and a first grounding portion;
  • the second extension The part includes a second ground part and a component part;
  • the conductive cloth layer is configured to cover at least a part of the first extension part and avoid the second ground part and the component part of the second extension part;
  • the insulating film layer is configured to cover part of the first extension portion.
  • the binding portion includes a layer of metal wiring board, the edge area on the side opposite to the binding portion includes three layers of metal wiring boards, and the other area includes six layers.
  • Metal wiring board; the second extension includes six layers of metal wiring board.
  • the conductive cloth layer is configured such that the distance between the side edge away from the flexible circuit board binding part and the component part of the flexible circuit board is 4.7mm-4.8mm, and the left and right side edges
  • the distance from the left and right side borders of the flexible circuit board is 1.2mm-1.3mm; the left and right side borders are the borders at both ends of the extending direction of the first extension part.
  • the material of the insulating film layer is a polyester film.
  • the thickness of the insulating film layer is 0.009 mm-0.011 mm.
  • the display module includes a flexible display panel, the flexible display panel has a binding area, and the binding area can be bent to the back of the display module;
  • the binding portion of the flexible circuit board and the integrated circuit chip are respectively bound and connected to the binding area of the flexible display panel;
  • the composite tape covers a part of the binding area of the flexible display panel and is bonded to the part of the binding area.
  • the display module includes a display panel and a flexible connecting board with one end bound to the display panel, the flexible connecting board has a binding area, and the binding area can be bent to the display module The back of the group
  • the binding part of the flexible circuit board and the integrated circuit chip are respectively bound and connected to the binding area of the flexible connection board;
  • the composite tape covers a part of the binding area of the flexible connecting plate and is bonded to the part of the binding area.
  • a display device includes the display assembly as described in any one of the above.
  • FIG. 1 is a schematic structural diagram of a composite tape provided by an embodiment of the application
  • FIG. 2 is a schematic diagram of an exploded structure of each layer structure of the composite tape in FIG. 1;
  • FIG. 3 is a schematic structural diagram of a display assembly provided by an embodiment of this application.
  • FIG. 4 is a schematic diagram of a part of the structure of the display assembly in FIG. 3;
  • FIG. 5 is a cross-sectional structure of the display assembly in FIG. 3 along the A1-A2 direction and an enlarged schematic diagram of a partial cross-section;
  • FIG. 6 is a cross-sectional structure of the display assembly in FIG. 3 along the direction B1-B2 and an enlarged schematic view of a partial cross-section;
  • FIG. 7 is a schematic diagram of another cross-sectional structure of the display assembly in FIG. 3 along the A1-A2 direction.
  • an embodiment of the present application provides a composite tape 1 for adhering to the binding area of a display component, the display component including a display module 4, an integrated circuit chip 3 and a flexible circuit Board 4; the integrated circuit chip 3 and the binding portion 21 of the flexible circuit board 4 are respectively bound and connected to the display module 4;
  • the composite adhesive tape 1 includes:
  • the conductive cloth layer 11 includes a first portion 11a and a second portion 11b.
  • the first portion 11a is configured to cover the integrated circuit chip 3 and the binding portion 21 of the flexible circuit board 2
  • the second portion 11b is configured to cover the flexible circuit board 2
  • At least part of the grounding portion (the first grounding portion 22 in FIG. 3 and FIG. 4); specifically, the grounding portion refers to a conductive portion exposed to the outside that can be used for grounding, for example, a copper leakage portion;
  • the insulating film layer 12 is located on the side of the conductive cloth layer 11 facing the integrated circuit chip 3 and the flexible circuit board 2.
  • the insulating film layer 12 includes a first portion 11a located on the conductive cloth layer 11 and used to cover the binding portion 21 of the flexible circuit board 2.
  • the third part 12c of the integrated circuit chip 3, the insulating film layer 12 avoids at least part of the grounding portion of the flexible circuit board 4 (the first grounding portion 22 in FIG. 3 and FIG. 4), that is, the insulating film layer 12 Does not cover at least part of the above-mentioned grounding part.
  • the above-mentioned composite tape 1 has a conductive cloth layer 11 and an insulating film layer 12.
  • the insulating film layer 12 avoids at least part of the ground portion of the flexible circuit board 4 (the first ground portion 22 in FIG. 3 and FIG. 4), and the conductive cloth layer 11
  • the second part 11b can directly cover at least part of the grounding portion of the flexible circuit board 2 (the first grounding portion 22 in FIG. 3 and FIG. 4), so as to realize the electrical connection between the conductive cloth layer 11 and the flexible circuit board 2.
  • the conductive cloth layer 11 can serve as an electromagnetic shielding layer to protect the flexible circuit board 2 and the integrated circuit chip 3, and on the other hand, it can be beneficial to realize the grounding of both the flexible circuit board 2 and the composite tape 1.
  • the insulating film layer 12 is located on the side of the conductive fabric layer 11 facing the integrated circuit chip 3 and the flexible circuit board 2, and the third portion 12c of the insulating film layer 12 is configured to cover the binding portion 21 of the flexible circuit board 2 and the integrated circuit chip 3.
  • the binding part 21 of the flexible circuit board 2 and the integrated circuit chip 3 can be isolated from the conductive cloth layer 11, so as to avoid the binding of the flexible circuit board 2 or the integrated circuit chip 3 and the display module 4 due to the conductive cloth layer 11.
  • the insulating film layer 12 can isolate water vapor and prevent water vapor from invading the bonding area of the flexible circuit board 2 and the integrated circuit chip 3, thereby effectively improving the yield of the bonding connection.
  • the above-mentioned composite tape 1 can improve the protection effect of the integrated circuit chip 3 and the flexible circuit board 2, and improve the bonding yield of the integrated circuit chip 3 and the flexible circuit board 2, thereby increasing the yield of display products.
  • the conductive cloth layer 11 is a structural layer in which fibers are pre-treated and electroplated with metal plating to make them have metallic characteristics.
  • the insulating film layer 12 is a film layer with electrical insulation, good flexibility, and good waterproof performance. Specifically, it may be a polyester film material, such as Mylar.
  • the thickness of the insulating film layer 12 may be about 0.01 mm, for example, it may be 0.009 mm-0.011 mm.
  • the third portion 12c of the insulating film layer 12 is configured to cover the boundary S of the binding portion 21 of the flexible circuit board 2 and completely cover the integrated circuit chip 3, and is connected to the display module. Group 4 bonding.
  • the "boundary S of the binding portion 21 of the flexible circuit board 2" refers to the flexible circuit board 2 that overlaps the binding area 40 of the display module 4 and is consistent with the extension direction of the long edge of the binding area 40 An edge.
  • the bounding distance between the drive IC chip (Drive IC) and the main flexible circuit board 2 (MFPC) is generally about 0.55mm, which does not meet the factory glue distance ( ⁇ 0.65mm). Therefore, the boundary of the binding area of Drive IC and MFPC is generally not glued, so there is a risk of water vapor intruding into the binding area of Drive IC and MFPC, which may cause defects.
  • the boundary S of the bonding portion 21 of the flexible circuit board 2 and the boundary of the bonding area of the integrated circuit chip 3 are both covered by the insulating film layer 12 of the composite tape 1 and bonded and packaged, so that water vapor intrusion can be effectively avoided To the bonding area of the flexible circuit board 2 and the integrated circuit chip 3, thereby improving the yield of the bonding connection.
  • the composite tape 1 of the present application may further include a wave absorbing material layer 13, which is located on the side of the insulating film layer 12 away from the conductive cloth layer 11, and The third portion 12c of the insulating film layer 12 is configured to cover the integrated circuit chip 3.
  • the shape of the wave absorbing material layer 13 is similar to that of the integrated circuit chip 3, and the wave absorbing material layer 13 is configured to completely cover the integrated circuit chip 3.
  • similar shapes include the same shape and size, the same shape but different sizes, and the roughly the same outline of the shape.
  • a wave-absorbing material refers to a type of material that can absorb or greatly reduce the electromagnetic wave energy projected on its surface, thereby reducing electromagnetic wave interference.
  • the absorbing material layer in the present application may be a solid powder material layer coagulated by a colloid.
  • the solid powder may be iron oxide powder or magnetic iron nano powder.
  • the absorbing material layer 13 is located on the side of the insulating film layer 12 away from the conductive cloth layer 11 and covers the integrated circuit chip (Drive IC) 3, which can effectively reduce electromagnetic radiation and reduce the external electromagnetic radiation of Drive IC 3 and the impact of external electromagnetic radiation on Drive IC 3 interference.
  • Drive IC integrated circuit chip
  • the composite tape 1 of the present application may also include a double-sided adhesive layer 14, which is located on the side of the wave-absorbing material layer 13 away from the insulating film layer 12.
  • the edge of the surface adhesive layer 14 extends beyond the edge of the wave absorbing material layer 13 and adheres to the insulating film layer 12.
  • the composite tape 1 of the present application includes four structural layers, as shown in FIGS. 3 and 5, the first layer (the uppermost layer) is the conductive cloth layer 11, the second layer is the insulating film layer 12, and the third layer is the absorbent
  • the wave material layer 13 and the fourth layer are the double-sided adhesive layer 14.
  • the double-sided adhesive layer 14 and the wave-absorbing material layer 13 are covered on Drive IC 3.
  • the outer dimension of the double-sided adhesive layer 14 is larger than the outer dimension of the wave-absorbing material layer 13, and the double-sided adhesive layer 14 exceeds the size of the wave-absorbing material layer 13.
  • the insulating film layer 12 Part of it will be directly attached to the insulating film layer 12 to form a wrapper on the wave absorbing material layer 13 so as to prevent some powder particles (Particles) detached from the wave absorbing material layer 13 from adversely affecting the display product.
  • one side of the double-sided adhesive layer 14 is attached to the Drive IC 3, and the other side is attached to the absorbing material layer 13, so that the position of the absorbing material layer 13 relative to the Drive IC 3 can be fixed to prevent the damage caused by the absorbing material layer. 13 The position is shifted to reduce the absorbing effect of the absorbing material.
  • the grounding portion of the flexible circuit board 2 may include a first grounding portion 22 close to the binding portion 21 and a second grounding portion 23 far from the binding portion 21.
  • the second portion 11 b of the conductive cloth layer 11 is configured to cover the first ground portion 22 and adhere to the first ground portion 22.
  • the conductive cloth layer 11 is configured to avoid the second ground portion 23 of the flexible circuit board 2.
  • the conductive cloth layer 11 covers the first ground portion 22 of the flexible circuit board 2 and is electrically connected to the flexible circuit board 2 through the first ground portion 22, and the conductive cloth layer 11 exposes the second ground portion of the flexible circuit board 2.
  • the display module 4 used for binding connection is a mobile phone module
  • the second grounding portion 23 of the flexible circuit board 2 can be connected to The middle frame of the mobile phone is electrically connected to achieve grounding. Therefore, the flexible circuit board 2 can be grounded through the conductive cloth layer 11 or directly grounded, so as to better ensure the circuit yield.
  • the conductive cloth layer 11 may further include a fourth portion 11 d configured to cover the test portion of the flexible circuit board 2.
  • the insulating film layer 12 includes a fourth portion 11d of the conductive cloth layer 11 and a fifth portion 12e for covering the test portion of the flexible circuit board 2.
  • the testing department includes multiple test points 24 for automatic detection of the module production line binding process section (belonging to the module front-end process), as shown in Figures 3 and 6, during the module binding operation (belonging to After the module front-end process), the conductive cloth layer 11 and the insulating film layer 12 of the composite tape 1 cover the test part (test point 24) of the flexible circuit board 2, which can protect the test part.
  • the insulating film under the conductive cloth layer 11 The layer 12 isolates the conductive cloth layer 11 from the test point 24 to prevent the test point 24 and the conductive cloth layer 11 from being electrically conductive.
  • the flexible circuit board 2 is L-shaped and includes a first extension portion 201 and a second extension portion 202; the first extension portion 201 includes a binding portion 21 and a test portion (test point 24) And the first ground portion 22; the second extension portion 202 includes a second ground portion 23 and a component portion 25.
  • the conductive cloth layer 11 is configured to cover at least a part of the first extension 201 (for example, cover the binding part 21, the test part, and the first ground part 22) and avoid the second extension 202 of the second extension part 201.
  • the second grounding portion 23 and the component portion 25, that is, the conductive fabric layer 11 does not cover the second grounding portion 23 and the component portion 25.
  • the insulating film layer 12 is configured to cover a part of the first extension part 201 (eg, cover the binding part 21 and the test part).
  • the main body of the flexible circuit board (MFPC) 2 is the thickest and generally has 6 layers; in order to leave room for the customer's whole machine, part of the area L will be set to 3 layers Board; the binding part 21 is generally set as a 1-layer board to facilitate binding and connection with the display module 4.
  • an n-layer board (n is 6, 3, 1) means that n-layer metal traces can be provided, which can be called an'n-layer metal trace board'.
  • the binding portion 21 includes one layer of metal wiring board, and the edge area L on the side opposite to the binding portion 21 includes three layers of metal wiring board, reducing the thickness of the L area, In order to facilitate the assembly of the battery during the assembly of the whole machine, space is reserved for the assembly of the battery; the other area of the first extension 201 includes six layers of metal wiring boards.
  • the second extension 202 includes a six-layer metal wiring board.
  • the specific orientations of up, down, left, and right in FIG. 3 are taken as an example for description.
  • the conductive cloth layer 11 is configured as: the upper side edge (bound away from the flexible circuit board 2)
  • the distance between the side edge of the part 21) and the component part 25 of the flexible circuit board 2 may be approximately 4.7 mm-4.8 mm, for example, about 4.772 mm.
  • the spacing may be between 1.2 mm and 1.3 mm, for example, about 1.256 mm.
  • the left and right side borders of the flexible circuit board 2 are the borders at the two ends in the extending direction of the first extension portion 201.
  • the insulating film layer 12 has no overlap with the second portion 11b of the conductive cloth layer 11, and the boundaries of other parts can overlap with the boundary of the conductive cloth layer 11; of course, the insulating film layer 12 The other part of the boundary may not overlap with the boundary of the conductive cloth layer 11. For example, the boundary of the conductive cloth layer 11 may exceed the boundary of the insulating film layer 12.
  • an embodiment of the present application also provides a display assembly, which includes a display module 4, a flexible circuit board 2, an integrated circuit chip 3, and a composite tape as described above. 1; where:
  • the binding portion 21 of the flexible circuit board 2 and the integrated circuit chip 3 are respectively bound and connected to the display module 4;
  • the composite tape 1 is pasted on the integrated circuit chip 3 and the flexible circuit board 2.
  • the display module 4 includes a flexible display panel 41.
  • the flexible display panel 41 has a binding area 40 that can be bent to the back of the display module 4.
  • the binding portion 21 of the flexible circuit board 2 and the integrated circuit chip 3 are respectively bound and connected to the binding area 40 of the flexible display panel 41;
  • the composite tape 1 covers a part of the binding area 40 of the flexible display panel 41, and is connected to a part of the binding area 40 of the flexible display panel 41.
  • the binding areas 40 are bonded together.
  • the binding area 40 of the present application is not only the area where the flexible display panel 41 is in contact with the flexible circuit board 2 and the integrated circuit chip 3, as shown in FIG. 6, the binding area 40 refers to the flexible display panel 41 bent Fold to the entire part of the back of the display module 4.
  • the conductive cloth layer 11 and the insulating film layer 12 of the composite tape 1 both cover the boundary of the binding portion 21 of the flexible circuit board 2 and completely cover the integrated circuit chip 3, and intersect a part of the binding area 40 of the display module 4 Stacked, the insulating film layer 12 is bonded to the part of the bonding area 40.
  • the display module 4 includes a display panel 42 and a flexible connecting board 43 with one end bound to the display panel 42.
  • the flexible connecting board 43 has a binding area 40, and the binding area 40 It can be bent to the back of the display module 4.
  • the display panel 42 in this embodiment may be a rigid display panel.
  • the binding portion 21 of the flexible circuit board 2 and the integrated circuit chip 3 are respectively bound and connected to the binding area 40 of the flexible connection board 43; the composite tape 1 covers part of the binding area 40 of the flexible connection board 43, and is connected to a part of the binding area 40 of the flexible connection board 43.
  • the binding areas 40 are bonded together.
  • the binding area 40 of the flexible circuit board 2 refers to the flexible circuit board 2 bent to the back of the display module 4 The whole part.
  • the conductive cloth layer 11 and the insulating film layer 12 of the composite tape 1 both cover the boundary of the binding portion 21 of the flexible circuit board 2 and completely cover the integrated circuit chip 3, and intersect a part of the binding area 40 of the flexible connection board 43 Stacked, the insulating film layer 12 is bonded to the part of the bonding area 40.
  • the display module 4 includes a display panel (for example, the flexible display panel 41 in FIGS. 5 and 6, or the display in FIG.
  • the panel 42 may also include a glass cover 44 and a polarizer 45 on the light-emitting side of the display panel, and a heat dissipation module 46 (not shown in FIG. 7) on the back of the display panel, which will not be repeated here.
  • the present application also provides a display device, which includes any one of the above-mentioned display components.
  • the display device may be an OLED display device, which may be specifically applied to display devices such as tablet computers and mobile phones.
  • the display assembly and the display device may also include other structures, which may be determined according to actual requirements, and the embodiments of the present disclosure do not limit this.
  • the specific application and arrangement of the composite tape provided in the embodiments of the present disclosure in the display assembly and the display device reference may be made to the above description of the composite tape, which will not be repeated here.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

本申请涉及显示技术领域，公开一种显示组件和显示装置，目的是改善对驱动集成电路芯片和柔性线路板的保护效果，提高产品良率。显示组件包括显示模组、柔性线路板、集成电路芯片及复合胶布；集成电路芯片和柔性线路板的绑定部与显示模组绑定连接；复合胶布位于显示模组绑定区并贴覆于集成电路芯片和柔性线路板上，包括：具有第一部分和第二部分的导电布层，第一部分覆盖集成电路芯片和柔性线路板的绑定部，第二部分覆盖柔性线路板的至少部分接地部；绝缘膜层，位于导电布层朝向集成电路芯片和柔性线路板的一侧，包括位于导电布层的第一部分并覆盖集成电路芯片和柔性线路板绑定部的第三部分，绝缘膜层避让柔性线路板的至少部分接地部。

Description

显示组件和显示装置 技术领域
本申请涉及显示技术领域，特别涉及一种显示组件和显示装置。
背景技术
OLED显示装置作为电子设备的显示部件已经广泛的应用于各种电子产品中，而OLED显示面板则是显示装置中的一个重要部件。为了保护OLED显示模组的驱动集成电路芯片(Drive IC)和主柔性电路板(MFPC)，一般会在MFPC和Drive IC的上部贴附一个胶布(IC Cover Tape)。目前IC Cover Tape的结构设计比较简单，对MFPC和Drive IC的保护效果较差，无法有效保证MFPC和Drive IC的良率。
发明内容
本申请公开了一种显示组件和显示装置，目的是改善对驱动集成电路芯片和柔性线路板的保护效果，提高显示产品良率。
为达到上述目的，本申请提供以下技术方案：
一种显示组件，包括显示模组、柔性线路板、集成电路芯片以及复合胶布；所述集成电路芯片和所述柔性线路板的绑定部分别与所述显示模组绑定连接；
所述复合胶布位于所述显示模组的绑定区，并贴覆于所述集成电路芯片和所述柔性线路板上；所述复合胶布包括：
导电布层，包括第一部分和第二部分，所述第一部分被配置为覆盖集成电路芯片和柔性线路板的绑定部，所述第二部分被配置为覆盖所述柔性线路板的至少部分接地部；
绝缘膜层，位于所述导电布层朝向所述集成电路芯片和所述柔性线路板的一侧，所述绝缘膜层包括第三部分，所述第三部分位于所述导电布层的第 一部分并覆盖所述集成电路芯片和柔性线路板的绑定部，所述绝缘膜层避让所述柔性线路板的所述至少部分接地部。
可选的，所述绝缘膜层的第三部分被配置为覆盖所述柔性线路板的绑定部边界且完全覆盖集成电路芯片，并与所述显示模组粘合。
可选的，所述的复合胶布，还包括：
吸波材料层，位于所述绝缘膜层背离所述导电布层的一侧，且位于所述绝缘膜层的第三部分，被配置为覆盖所述集成电路芯片。
可选的，所述吸波材料层与所述集成电路芯片的形状相似，且所述吸波材料层被配置为完全覆盖所述集成电路芯片。
可选的，所述的复合胶布，还包括：
双面胶层，位于所述吸波材料层背离所述绝缘膜层的一侧，所述双面胶层的边缘超出所述吸波材料层的边沿并与所述绝缘膜层粘合。
可选的，所述接地部包括靠近所述绑定部的第一接地部和远离所述绑定部的第二接地部；
所述导电布层的第二部分被配置为覆盖所述第一接地部并与所述第一接地部粘合。
可选的，所述导电布层被配置为避让所述第二接地部。
可选的，所述导电布层还包括第四部分，所述第四部分被配置为覆盖所述柔性线路板的测试部；
所述绝缘膜层包括位于所述导电布层的第四部分且用于覆盖所述柔性线路板的测试部的第五部分。
可选的，所述柔性线路板呈L型，包括第一延伸部和第二延伸部；所述第一延伸部包括所述绑定部、测试部和第一接地部；所述第二延伸部包括第二接地部和元器件部；
所述导电布层被配置为至少覆盖部分所述第一延伸部且避让所述第二延伸部的第二接地部和元器件部；
所述绝缘膜层被配置为覆盖部分所述第一延伸部。
可选的，所述第一延伸部中，所述绑定部包括一层金属走线板，与所述绑定部相对的一侧边缘区域包括三层金属走线板，其他区域包括六层金属走线板；所述第二延伸部包括六层金属走线板。
可选的，所述导电布层被配置为：远离所述柔性线路板绑定部的一侧边沿与所述柔性线路板的元器件部之间的间距为4.7mm-4.8mm，左右侧边沿与所述柔性线路板的左右侧边界的间距为1.2mm-1.3mm；所述左右侧边界为所述第一延伸部延伸方向两端的边界。
可选的，所述绝缘膜层的材料为聚酯膜。
可选的，所述绝缘膜层的厚度为0.009mm-0.011mm。
可选的，所述显示模组包括柔性显示面板，所述柔性显示面板具有绑定区，所述绑定区可弯折至所述显示模组的背面；
所述柔性线路板的绑定部和所述集成电路芯片分别与所述柔性显示面板的绑定区绑定连接；
所述复合胶布覆盖所述柔性显示面板的部分绑定区，并与所述部分绑定区相粘合。
可选的，所述显示模组包括显示面板以及一端与所述显示面板绑定连接的柔性连接板，所述柔性连接板具有绑定区，所述绑定区可弯折至所述显示模组的背面；
所述柔性线路板的绑定部和所述集成电路芯片分别与所述柔性连接板的绑定区绑定连接；
所述复合胶布覆盖所述柔性连接板的部分绑定区，并与所述部分绑定区相粘合。
一种显示装置，包括如上述任一项所述的显示组件。
附图说明
图1为本申请一实施例提供的一种复合胶布的结构示意图；
图2为图1中的复合胶布的各层结构分解结构示意图；
图3为本申请一实施例提供的一种显示组件的结构示意图；
图4为图3中的显示组件的部分结构示意图；
图5为图3中的显示组件沿A1-A2方向的一种截面结构及部分截面的放大示意图；
图6为图3中的显示组件沿B1-B2方向的一种截面结构及部分截面的放大示意图；
图7为图3中的显示组件沿A1-A2方向的另一种截面结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
如图1至图4所示，本申请实施例提供了一种复合胶布1，用于粘附在显示组件的绑定区域，所述显示组件包括显示模组4、集成电路芯片3和柔性线路板4；所述集成电路芯片3和所述柔性线路板4的绑定部21分别与显示模组4绑定连接；所述复合胶布1包括：
导电布层11，包括第一部分11a和第二部分11b，第一部分11a被配置为覆盖集成电路芯片3和柔性线路板2的绑定部21，第二部分11b被配置为覆盖柔性线路板2的至少部分接地部(如图3和图4中的第一接地部22)；具体的，接地部是指暴露在外可以用于接地的导电部位，例如可以是漏铜部；
绝缘膜层12，位于导电布层11朝向集成电路芯片3和柔性线路板2的一侧，绝缘膜层12包括位于导电布层11的第一部分11a并用于覆盖柔性线路板2的绑定部21和集成电路芯片3的第三部分12c，所述绝缘膜层12避让上述的柔性线路板4的至少部分接地部(如图3和图4中的第一接地部22)，即绝缘膜层12不覆盖上述的至少部分接地部。
上述复合胶布1，具有导电布层11和绝缘膜层12，绝缘膜层12避让柔 性线路板4的至少部分接地部(如图3和图4中的第一接地部22)，导电布层11的第二部分11b可以直接覆盖在柔性线路板2的至少部分接地部(如图3和图4中的第一接地部22)上，从而实现导电布层11与柔性线路板2的电连接，进而，一方面，导电布层11可以作为电磁屏蔽层对柔性线路板2和集成电路芯片3起到保护作用，另一方面，可以有利于实现柔性线路板2和复合胶布1两者的接地。绝缘膜层12位于导电布层11朝向集成电路芯片3和柔性线路板2的一侧，绝缘膜层12的第三部分12c配置为覆盖柔性线路板2的绑定部21和集成电路芯片3，一方面可以将柔性线路板2的绑定部21和集成电路芯片3与导电布层11之间隔绝，避免由于导电布层11导致柔性线路板2或集成电路芯片3与显示模组4的绑定连接短路，另一方面，绝缘膜层12可以隔绝水汽，防止水汽入侵柔性线路板2和集成电路芯片3的绑定区，从而可以有效提高绑定连接的良率。
综上所述，上述复合胶布1，可以提高对集成电路芯片3和柔性线路板2的保护效果，提高集成电路芯片3和柔性线路板2的绑定良率，进而提高显示产品良率。
具体的，导电布层11是以纤维经前置处理施以电镀金属镀层使其具有金属特性的结构层。绝缘膜层12是一种电绝缘、柔性较好、防水性能较好的膜层，具体可以为聚酯膜材料，例如迈拉膜(Mylar)。
示例性的，绝缘膜层12厚度可以为0.01mm左右，例如，可以为0.009mm-0.011mm。
如图1至图4所示，一些实施例中，绝缘膜层12的第三部分12c被配置为覆盖柔性线路板2的绑定部21边界S并完全覆盖集成电路芯片3，且与显示模组4粘合。
具体的，‘柔性线路板2的绑定部21边界S’，是指柔性线路板2中与显示模组4的绑定区40交叠且与绑定区40长边边沿的延伸方向一致的一条边沿。
目前，受客户整机尺寸限制，驱动集成电路芯片(Drive IC)与主柔性 线路板2(MFPC)的绑定部边界距离一般为0.55mm左右，不满足工厂涂胶距离(≥0.65mm)，因此，在Drive IC和MFPC的绑定区边界一般未涂胶，因此容易有水汽侵入Drive IC和MFPC的绑定区域造成不良的风险。
本申请实施例中，柔性线路板2的绑定部21边界S和集成电路芯片3的绑定区边界均被复合胶布1的绝缘膜层12覆盖并粘结封装，这样，可以有效避免水汽入侵至柔性线路板2和集成电路芯片3的绑定区，从而提高绑定连接的良率。
如图1至图3所示，一些实施例中，本申请的复合胶布1还可以包括吸波材料层13，吸波材料层13位于绝缘膜层12背离导电布层11的一侧，且位于绝缘膜层12的第三部分12c，被配置为覆盖集成电路芯片3。
示例性的，吸波材料层13与集成电路芯片3的形状相似，且吸波材料层13被配置为完全覆盖集成电路芯片3。
具体的，‘形状相似’包括形状和尺寸完全相同，形状相同但尺寸不同，以及形状的轮廓大致相同等情况。
具体的，吸波材料是指能够吸收或者大幅减弱投射到它表面的电磁波能量，从而减少电磁波干扰的一类材料。示例性的，本申请中的吸波材料层，可以是采用胶体凝结的固体粉末材料层，具体的，固体粉末可以是氧化铁粉末或者磁性铁纳米粉末。
吸波材料层13位于绝缘膜层12背离导电布层11的一侧并覆盖集成电路芯片(Drive IC)3，可以有效减弱电磁辐射，减少Drive IC 3对外的电磁辐射以及外部电磁辐射对Drive IC 3的干扰。
如图1至图3所示，一些实施例中，本申请的复合胶布1还可以包括双面胶层14，双面胶层14位于吸波材料层13背离绝缘膜层12的一侧，双面胶层14的边缘超出吸波材料层13的边沿并与绝缘膜层12粘合。
即，本申请的复合胶布1包含四层结构层，如图3和图5所示，第一层(最上层)为导电布层11，第二层为绝缘膜层12，第三层为吸波材料层13，第四层为双面胶层14。其中，双面胶层14和吸波材料层13覆盖在Drive IC 3 上，双面胶层14的外形尺寸大于吸波材料层13的外形尺寸，双面胶层14超出吸波材料层13的部分会直接贴附在绝缘膜层12上，从而对吸波材料层13形成包裹，这样可以防止吸波材料层13中脱离出的一些粉末颗粒(Particle)对显示产品产生不良影响。另外，双面胶层14的一面贴附在Drive IC 3上，另一面贴附吸波材料层13，这样可以使得吸波材料层13相对于Drive IC 3的位置固定，防止因吸波材料层13位置偏移，降低吸波材料的吸波效果。
如图3和图4所示，一些实施例中，柔性线路板2的接地部可以包括靠近绑定部21的第一接地部22和远离绑定部21的第二接地部23。
示例性的，如图1至图3所示，导电布层11的第二部分11b被配置为覆盖第一接地部22并与第一接地部22粘合。
示例性的，如图1至图3所示，导电布层11被配置避让柔性线路板2的第二接地部23。
换句话说，即导电布层11覆盖柔性线路板2的第一接地部22并通过第一接地部22实现与柔性线路板2电连接，并且，导电布层11暴露柔性线路板2的第二接地部23，从而柔性线路板2可以通过第二接地部23实现接地，例如，当用于绑定连接的显示模组4为手机模组时，柔性线路板2的第二接地部23可以与手机的中框电连接，从而实现接地。从而，柔性线路板2既可以通过导电布层11实现接地，也可以直接接地，从而更好地保障电路良率。
如图1至图3所示，一些实施例中，除了覆盖柔性线路板2的绑定部21和集成电路芯片3的第一部分11a，以及覆盖柔性线路板2接地部的第二部分11b，导电布层11还可以包括第四部分11d，该第四部分11d被配置为覆盖柔性线路板2的测试部。
进一步的，绝缘膜层12包括位于导电布层11的第四部分11d且用于覆盖柔性线路板2的测试部的第五部分12e。
具体的，测试部包括多个测试点24，用于模组产线绑定工艺段自动检测(属于模组前段工艺)，如图3和图6所示，在进行模组绑定操作(属于模组前段工艺)之后，复合胶布1的导电布层11和绝缘膜层12覆盖柔性线路板2 的测试部(测试点24)，可以对测试部形成保护，在导电布层11下的绝缘膜层12将导电布层11与测试点24隔绝，防止测试点24与导电布层11接通导电。
如图4所示，一些实施例中，柔性线路板2呈L型，包括第一延伸部201和第二延伸部202；第一延伸部201包括绑定部21、测试部(测试点24)和第一接地部22；第二延伸部202包括第二接地部23和元器件部25。
具体的，如图3所示，导电布层11被配置为至少覆盖部分第一延伸部201(如覆盖绑定部21、测试部和第一接地部22)且避让第二延伸部202的第二接地部23和元器件部25，即导电布层11不覆盖第二接地部23和元器件部25。绝缘膜层12被配置为覆盖部分第一延伸部201(如覆盖绑定部21和测试部)。
具体的，如图3、图5至图7所示，柔性线路板(MFPC)2主体部位最厚，一般具有6层板；为了给客户整机留出空间，部分区域L会设置为3层板；绑定部21一般设置为1层板，以便于与显示模组4绑定连接。具体的，n层板(n为6，3，1)是指可以设置n层金属走线，可以称之为‘n层金属走线板’。
示例性的，第一延伸部201中，绑定部21包括一层金属走线板，与绑定部21相对的一侧边缘区域L包括三层金属走线板，减小L区域的厚度，以便于整机组装时方便装配电池，为电池装配预留出空间；第一延伸部201的其他区域包括六层金属走线板。第二延伸部202包括六层金属走线板。
一种具体的实施例中，以图3中的上下左右具体方位为例进行说明，如图1和图3所示，导电布层11被配置为：上侧边沿(远离柔性线路板2绑定部21的一侧边沿)与柔性线路板2的元器件部25之间的间距大概可以在4.7mm-4.8mm之间，例如4.772mm左右，左右侧边沿与柔性线路板2的左右侧边界的间距大概可以在1.2mm-1.3mm之间，例如1.256mm左右，如图3所示，柔性线路板2的左右侧边界为第一延伸部201延伸方向两端的边界。如图1和图2所示，绝缘膜层12除了与导电布层11的第二部分11b边界无交 叠外，其他部分的边界可以与导电布层11的边界重合；当然，绝缘膜层12其他部分边界也可以不与导电布层11边界重合，例如，导电布层11边界可以超出绝缘膜层12的边界。
如图3、图5至图7所示，本申请实施例还提供一种显示组件，该显示组件包括显示模组4、柔性线路板2、集成电路芯片3以及如上述任一项的复合胶布1；其中：
柔性线路板2的绑定部21和集成电路芯片3分别与显示模组4绑定连接；
复合胶布1贴覆于集成电路芯片3和柔性线路板2上。
如图5和图6所示，一些实施例中，显示模组4包括柔性显示面板41，柔性显示面板41具有绑定区40，绑定区可弯折至显示模组4的背面。
具体的，柔性线路板2的绑定部21和集成电路芯片3分别与柔性显示面板41的绑定区40绑定连接；复合胶布1覆盖柔性显示面板41的部分绑定区40，并与部分绑定区40相粘合。
具体的，本申请的绑定区40并不仅是柔性显示面板41与柔性线路板2和集成电路芯片3接触连接的区域，如图6所示，该绑定区40是指柔性显示面板41弯折至显示模组4背面的整个部分。
示例性的，复合胶布1的导电布层11和绝缘膜层12均覆盖柔性线路板2的绑定部21边界并完全覆盖集成电路芯片3、且与显示模组4的部分绑定区40相交叠，绝缘膜层12与该部分绑定区40相粘合。
如图7所示，另一些实施例中，显示模组4包括显示面板42以及一端与显示面板42绑定连接的柔性连接板43，柔性连接板43具有绑定区40，该绑定区40可弯折至显示模组4的背面。示例性的，本实施例中的显示面板42可以为刚性显示面板。
具体的，柔性线路板2的绑定部21和集成电路芯片3分别与柔性连接板43的绑定区40绑定连接；复合胶布1覆盖柔性连接板43的部分绑定区40，并与部分绑定区40相粘合。
与上述实施例中柔性显示面板的绑定区同理，如图7所示，本实施例中，柔性线路板2的绑定区40是指柔性线路板2弯折至显示模组4背面的整个部分。
示例性的，复合胶布1的导电布层11和绝缘膜层12均覆盖柔性线路板2的绑定部21边界并完全覆盖集成电路芯片3、且与柔性连接板43的部分绑定区40相交叠，绝缘膜层12与该部分绑定区40相粘合。
具体的，如图5至图7所示，本申请实施例提供的显示组件中，显示模组4除了包括显示面板(例如图5和图6中的柔性显示面板41，或者图7中的显示面板42)，还可以包括位于显示面板出光侧的玻璃盖板44和偏光片45，以及位于显示面板背面的散热模组46(图7中未示出)等结构，在此不一一赘述。
另外，本申请还提供一种显示装置，该显示装置包括上述任一项的显示组件。
具体的，该显示装置可以为OLED显示装置，具体可以应用于平板电脑、手机等显示设备。
需要说明的是，本公开的一些实施例中，显示组件和显示装置还可以包括其他的结构，这可以根据实际需求而定，本公开的实施例对此不作限制。另外，关于本公开实施例提供的复合胶布在显示组件和显示装置中的具体应用和布置，可以参考上文中关于复合胶布的描述，此处不再赘述。
尽管已描述了本申请的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本申请范围的所有变更和修改。
显然，本领域的技术人员可以对本申请实施例进行各种改动和变型而不脱离本申请实施例的精神和范围。这样，倘若本申请实施例的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (16)

  1. 一种显示组件，其中，包括显示模组、柔性线路板、集成电路芯片以及复合胶布；所述集成电路芯片和所述柔性线路板的绑定部分别与所述显示模组绑定连接；
    所述复合胶布位于所述显示模组的绑定区，并贴覆于所述集成电路芯片和所述柔性线路板上；所述复合胶布包括：
    导电布层，包括第一部分和第二部分，所述第一部分被配置为覆盖集成电路芯片和柔性线路板的绑定部，所述第二部分被配置为覆盖所述柔性线路板的至少部分接地部；
    绝缘膜层，位于所述导电布层朝向所述集成电路芯片和所述柔性线路板的一侧，所述绝缘膜层包括第三部分，所述第三部分位于所述导电布层的第一部分并覆盖所述集成电路芯片和柔性线路板的绑定部，所述绝缘膜层避让所述柔性线路板的所述至少部分接地部。
  2. 如权利要求1所述的显示组件，其中，所述绝缘膜层的第三部分被配置为覆盖所述柔性线路板的绑定部边界且完全覆盖集成电路芯片，并与所述显示模组粘合。
  3. 如权利要求2所述的显示组件，其中，所述复合胶布还包括：
    吸波材料层，位于所述绝缘膜层背离所述导电布层的一侧，且位于所述绝缘膜层的第三部分，被配置为覆盖所述集成电路芯片。
  4. 如权利要求3所述的显示组件，其中，所述吸波材料层与所述集成电路芯片的形状相似，且所述吸波材料层被配置为完全覆盖所述集成电路芯片。
  5. 如权利要求3所述的显示组件，其中，所述复合胶布还包括：
    双面胶层，位于所述吸波材料层背离所述绝缘膜层的一侧，所述双面胶层的边缘超出所述吸波材料层的边沿并与所述绝缘膜层粘合。
  6. 如权利要求1-5任一项所述的显示组件，其中，所述接地部包括靠近 所述绑定部的第一接地部和远离所述绑定部的第二接地部；
    所述导电布层的第二部分被配置为覆盖所述第一接地部并与所述第一接地部粘合。
  7. 如权利要求6所述的显示组件，其中，所述导电布层被配置为避让所述第二接地部。
  8. 如权利要求1-5任一项所述的显示组件，其中，所述导电布层还包括第四部分，所述第四部分被配置为覆盖所述柔性线路板的测试部；
    所述绝缘膜层包括位于所述导电布层的第四部分且用于覆盖所述柔性线路板的测试部的第五部分。
  9. 如权利要求1-5任一项所述的显示组件，其中，所述柔性线路板呈L型，包括第一延伸部和第二延伸部；所述第一延伸部包括所述绑定部、测试部和第一接地部；所述第二延伸部包括第二接地部和元器件部；
    所述导电布层被配置为至少覆盖部分所述第一延伸部且避让所述第二延伸部的第二接地部和元器件部；
    所述绝缘膜层被配置为覆盖部分所述第一延伸部。
  10. 如权利要求9所述的显示组件，其中，所述第一延伸部中，所述绑定部包括一层金属走线板，与所述绑定部相对的一侧边缘区域包括三层金属走线板，其他区域包括六层金属走线板；所述第二延伸部包括六层金属走线板。
  11. 如权利要求9所述的显示组件，其中，所述导电布层被配置为：远离所述柔性线路板绑定部的一侧边沿与所述柔性线路板的元器件部之间的间距为4.7mm-4.8mm，左右侧边沿与所述柔性线路板的左右侧边界的间距为1.2mm-1.3mm；所述左右侧边界为所述第一延伸部延伸方向两端的边界。
  12. 如权利要求1-5任一项所述的显示组件，其中，所述绝缘膜层的材料为聚酯膜。
  13. 如权利要求1-5任一项所述的显示组件，其中，所述绝缘膜层的厚度为0.009mm-0.011mm。
  14. 如权利要求1-5任一项所述的显示组件，其中，所述显示模组包括柔性显示面板，所述柔性显示面板具有绑定区，所述绑定区可弯折至所述显示模组的背面；
    所述柔性线路板的绑定部和所述集成电路芯片分别与所述柔性显示面板的绑定区绑定连接；
    所述复合胶布覆盖所述柔性显示面板的部分绑定区，并与所述部分绑定区相粘合。
  15. 如权利要求1-5任一项所述的显示组件，其中，所述显示模组包括显示面板以及一端与所述显示面板绑定连接的柔性连接板，所述柔性连接板具有绑定区，所述绑定区可弯折至所述显示模组的背面；
    所述柔性线路板的绑定部和所述集成电路芯片分别与所述柔性连接板的绑定区绑定连接；
    所述复合胶布覆盖所述柔性连接板的部分绑定区，并与所述部分绑定区相粘合。
  16. 一种显示装置，其中，包括如权利要求1-15任一项所述的显示组件。
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