CN114042675A - 一种链式晶圆清洗干燥机器人整机 - Google Patents

一种链式晶圆清洗干燥机器人整机 Download PDF

Info

Publication number
CN114042675A
CN114042675A CN202111309565.4A CN202111309565A CN114042675A CN 114042675 A CN114042675 A CN 114042675A CN 202111309565 A CN202111309565 A CN 202111309565A CN 114042675 A CN114042675 A CN 114042675A
Authority
CN
China
Prior art keywords
chain
wafer
horizontal pole
complete machine
sprocket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202111309565.4A
Other languages
English (en)
Inventor
彭虎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN202111309565.4A priority Critical patent/CN114042675A/zh
Publication of CN114042675A publication Critical patent/CN114042675A/zh
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/022Cleaning travelling work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00Accessories or details of general applicability for machines or apparatus for cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/041Cleaning travelling work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

本发明涉及晶圆清洗干燥技术领域,且公开了一种链式晶圆清洗干燥机器人整机,包括支架、横杆一及横杆二,所述横杆一和横杆二均固定安装在支架上,所述横杆二上转动连接有链轮,所述横杆一上转动设置异形链轮,所述异形链轮和链轮上传动连接有链条,所述链条上连接有夹持机构,所述夹持机构包括用于夹持晶圆的转盘及悬浮球。本发明通过夹持机构进行顺时针的转动,使晶圆旋转经过清洗槽,清洗槽内设有吹气组件,并对晶圆进行干燥,使多个晶圆一起进行清洗干燥,提高效率,同时能够轻松的将清洗干燥完成的晶圆取下及夹持,有效的增加的工作的效率同时有效的防止对晶圆产生刮除伤,使晶圆的合格率更高。

Description

一种链式晶圆清洗干燥机器人整机
技术领域
本发明涉及晶圆清洗干燥技术领域,具体为一种链式晶圆清洗干燥机器人整机。
背景技术
晶圆是指制作硅半导体电路所用的硅晶片,其原始材料是硅。高纯度的多晶硅溶解后掺入硅晶体晶种,然后慢慢拉出,形成圆柱形的单晶硅。硅晶棒在经过研磨,抛光,切片后,形成硅晶圆片,也就是晶圆。目前国内晶圆生产线以8英寸和12英寸为主。
而马兰戈尼提供一种无污染且能在短时间内干燥半导体晶圆的方法,其在干燥过程中因异丙醇不需加热且气化量极少,故不致造成危险,相对具有较佳的安全性,并可确保良好、安全的干燥效果,因此很多情况下采用马兰戈尼方式进行清洗干燥,但是该方式采用间断式的生产方式,效率低下,因此需要一种链式晶圆清洗干燥机器人整机。
发明内容
本发明的目的在于提供一种链式晶圆清洗干燥机器人整机,以解决上述背景技术中提出的问题。
为实现上述目的,本发明提供如下技术方案:一种链式晶圆清洗干燥机器人整机,包括支架、横杆一及横杆二,所述横杆一和横杆二均固定安装在支架上,所述横杆二上转动连接有链轮,所述横杆一上转动设置异形链轮,所述异形链轮和链轮上传动连接有链条,所述链条上连接有夹持机构,所述夹持机构包括用于夹持晶圆的转盘及悬浮球。
优选的,所述横杆一与横杆二相互平行设置,所述链轮设有两个,两个所述链轮为左右相互对称设置,其中一个所述链轮后设有电机,所述电机与横杆二固定连接,所述电机输出端贯穿横杆二与链轮固定连接,所述链条外设有防护壳,所述支架内部放置有清洗槽。
优选的,所述异形链轮左右两侧均设有顶杆,所述顶杆与横杆一转动连接,两根所述顶杆位于环形设置的链条内部,且两根顶杆与链条挤压设置,所述异形链轮外壁上固定连接有斜齿及矩形齿,所述斜齿为三角形设置,且斜齿的斜面上设有褶皱,所述矩形齿远离异形链轮的一侧为锥形设置,所述矩形齿和斜齿均设有两个,所述矩形齿和斜齿呈交替的圆周分布。
优选的,所述夹持机构还包括连接杆、铝薄条、连接弹簧、磁铁一、卡块、辅助弹簧、驱动杆、复位弹簧及旋转盘;
所述转盘与连接杆固定连接,所述连接杆固定安装在链条上。
优选的,所述转盘的正面开设有凹槽,所述转盘的侧壁上开设有通孔,所述通孔与凹槽连通设置,所述铝薄条设有两根,两根所述铝薄条的两端均与凹槽侧壁固定连接,所述两根所述铝薄条为对称设置,两根所述铝薄条侧壁上均开设有驱动槽,所述连接弹簧固定连接在两根铝薄条之间,所述磁铁一固定安装上端的铝薄条中间部位,所述悬浮球放置在凹槽内。
优选的,所述悬浮球内部开设有空腔,所述空腔下端内壁上粘附有磁铁二,所述悬浮球为橡胶设置。
优选的,所述凹槽的侧壁上开设有滑槽,所述卡块滑动安装在滑槽内,所辅助弹簧固定安装在凹槽内,所述转盘内部开设有辅助腔,所述旋转盘转动安装在辅助腔内,所述驱动杆两端分别与卡块下端及旋转盘铰接连接。
优选的,所述卡块靠近辅助弹簧一侧为弧形设置,所述驱动杆设有若干根,若干根所述驱动杆均为倾斜设置,所述复位弹簧固定连接在两根驱动杆之间,所述复位弹簧处于拉伸状态。
与现有技术相比,本发明的有益效果是:
(1)、本发明通过需要清理干燥的晶圆夹持在夹持机构内,并且电机工作使链轮进行转动,并且带动链条进行转动,使夹持机构进行顺时针的转动,并且使晶圆旋转经过清洗槽,清洗槽内设有吹气组件,并对晶圆进行干燥,使多个晶圆一起进行清洗干燥,提高效率。
(2)、本发明通过异形链轮上的斜齿及矩形齿会交替的卡设到链条内,使链条进行偏移,链条与斜齿褶皱的斜面进行挤压,使得发生轻微的震动,使夹持机构上的晶圆能够更好的与离子水进行接触,并且达到更好清洗的目的。
(3)、本发明通过夹持机构在夹持时,使卡块将晶圆卡设在凹槽内,便于将清洗干燥完成的晶圆取下及夹持,有效的增加的工作的效率。
(4)、本发明通过水逐渐浸满凹槽,悬浮球上浮的瞬间,使两根铝薄条相互的发生来回弹动,使凹槽内产生气泡,并且通过铝薄条上开设有的驱动槽使产生的气泡更多,气泡撞击晶圆使气泡破裂,对晶圆的清理效果更好,并且有效的防止对晶圆产生刮除伤,使晶圆的合格率更高。
(5)、本发明通过复位弹簧产生弹动,同时卡块一侧为弧形设置,因此带动晶圆间断的挤压辅助弹簧,达到使晶圆前后来回的偏移,使晶圆表面清理更加干净,同时晶圆的边缘受到水流的冲击,减少晶圆卡设部位受不到水冲的影响。
附图说明
图1为本发明整体结构示意图;
图2为本发明支架结构示意图;
图3为本发明链条及防护壳结构示意图;
图4为本发明异形链轮结构示意图;
图5为本发明夹持机构结构示意图;
图6为本发明悬浮球结构示意图;
图7为本发明转盘后视半剖结构示意图;
图8为本发明卡块截面图。
图中:1、支架;11、横杆一;12、横杆二;13、链轮;14、电机;15、防护壳;16、顶杆;2、清洗槽;3、异形链轮;31、斜齿;32、矩形齿;4、链条;5、夹持机构;51、连接杆;52、转盘;53、凹槽;54、通孔;55、铝薄条;56、驱动槽;57、连接弹簧;58、磁铁一;59、悬浮球;591、空腔;592、磁铁二;501、卡块;502、辅助弹簧;503、滑槽;504、辅助腔;505、驱动杆;506、复位弹簧;507、旋转盘。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
请参阅图1-8,本发明提供一种技术方案:一种链式晶圆清洗干燥机器人整机,包括支架1、横杆一11及横杆二12,横杆一11和横杆二12均固定安装在支架1上,横杆二12上转动连接有链轮13,横杆一11上转动设置异形链轮3,异形链轮3和链轮13上传动连接有链条4,链条4上连接有夹持机构5,夹持机构5包括用于夹持晶圆的转盘52及悬浮球59;
横杆一11与横杆二12相互平行设置,链轮13设有两个,两个链轮13为左右相互对称设置,其中一个链轮13后设有电机14,电机14与横杆二12固定连接,电机14输出端贯穿横杆二12与链轮13固定连接,链条4外设有防护壳15,支架1内部放置有清洗槽2;
异形链轮3左右两侧均设有顶杆16,顶杆16与横杆一11转动连接,两根顶杆16位于环形设置的链条4内部,且两根顶杆16与链条4挤压设置,异形链轮3外壁上固定连接有斜齿31及矩形齿32,斜齿31为三角形设置,且斜齿31的斜面上设有褶皱,矩形齿32远离异形链轮3的一侧为锥形设置,矩形齿32和斜齿31均设有两个,矩形齿32和斜齿31呈交替的圆周分布,通过异形链轮3上的斜齿31及矩形齿32会交替的卡设到链条4内,使链条4进行偏移,链条4与斜齿31褶皱的斜面进行挤压,使得发生轻微的震动,使夹持机构5上的晶圆能够更好的与离子水进行接触,并且达到更好清洗的目的;
夹持机构5还包括连接杆51、铝薄条55、连接弹簧57、磁铁一58、卡块501、辅助弹簧502、驱动杆505、复位弹簧506及旋转盘507;
转盘52与连接杆51固定连接,连接杆51固定安装在链条4上;
转盘52的正面开设有凹槽53,转盘52的侧壁上开设有通孔54,通孔54与凹槽53连通设置,铝薄条55设有两根,两根铝薄条55的两端均与凹槽53侧壁固定连接,两根铝薄条55为对称设置,两根铝薄条55侧壁上均开设有驱动槽56,连接弹簧57固定连接在两根铝薄条55之间,磁铁一58固定安装上端的铝薄条55中间部位,悬浮球59放置在凹槽53内;
悬浮球59内部开设有空腔591,空腔591下端内壁上粘附有磁铁二592,悬浮球59为橡胶设置,通过水逐渐浸满凹槽53,悬浮球59上浮的瞬间,使两根铝薄条55相互的发生来回弹动,使凹槽53内产生气泡,并且通过铝薄条55上开设有的驱动槽56使产生的气泡更多,气泡撞击晶圆使气泡破裂,对晶圆的清理效果更好,并且有效的防止对晶圆产生刮除伤,使晶圆的合格率更高;
凹槽53的侧壁上开设有滑槽503,卡块501滑动安装在滑槽503内,所辅助弹簧502固定安装在凹槽53内,转盘52内部开设有辅助腔504,旋转盘507转动安装在辅助腔504内,驱动杆505两端分别与卡块501下端及旋转盘507铰接连接;
卡块501靠近辅助弹簧502一侧为弧形设置,驱动杆505设有若干根,若干根驱动杆505均为倾斜设置,复位弹簧506固定连接在两根驱动杆505之间,复位弹簧506处于拉伸状态,通过夹持机构5在夹持时,使卡块501将晶圆卡设在凹槽53内,便于将清洗干燥完成的晶圆取下及夹持,有效的增加的工作的效率,通过复位弹簧506产生弹动,同时卡块501一侧为弧形设置,因此带动晶圆间断的挤压辅助弹簧502,达到使晶圆前后来回的偏移,使晶圆表面清理更加干净,同时晶圆的边缘受到水流的冲击,减少晶圆卡设部位受不到水冲的影响。
使用时,首先将需要清理干燥的晶圆夹持在夹持机构5内,并且电机14工作使链轮13进行转动,并且带动链条4进行转动,使夹持机构5进行顺时针的转动,并且使晶圆旋转经过清洗槽2,清洗槽2内设有吹气组件,并对晶圆进行干燥,使多个晶圆一起进行清洗干燥,提高效率;
其次异形链轮3也会随着转动,并且异形链轮3上的斜齿31及矩形齿32会交替的卡设到链条4内,并且两个斜齿31的位置具有前后的距离差,斜齿31卡设到链条4内时,会使链条4进行偏移,并且链条4与斜齿31褶皱的斜面进行挤压,使得发生轻微的震动,使夹持机构5上的晶圆能够更好的与离子水进行接触,并且达到更好清洗的目的,然后链条4卡设到矩形齿32上,使链条4恢复,然后链条4又卡设到另一个斜齿31上,使链条4再度倾斜,一直往复;
最后夹持机构5在夹持时,转动旋转盘507使驱动杆505趋于竖直状态,使卡块501缩回滑槽503内,再将晶圆放置到凹槽53内,使晶圆放置到辅助弹簧502上,不与凹槽53底部接触,并且驱动杆505在复位弹簧506的拉伸力下恢复倾斜状态,使卡块501将晶圆卡设在凹槽53内,便于将清洗干燥完成的晶圆取下及夹持,有效的增加的工作的效率,同时抓转盘52转动到离子水内时,水从通孔54内进入,并且水逐渐浸满凹槽53,使凹槽53内的悬浮球59受到浮力,并且由于磁铁一58与磁铁二592相互吸附的作用,使悬浮过程中将铝薄条55进行上拉,使铝薄条55产生形变,因此最后悬浮球59全部浸没时,悬浮力大于两个磁铁的吸附力,导致悬浮球59上浮,悬浮球59上浮的瞬间,使两根铝薄条55相互的发生来回弹动,使凹槽53内产生气泡,并且通过铝薄条55上开设有的驱动槽56使产生的气泡更多,气泡撞击晶圆使气泡破裂,对晶圆的清理效果更好,并且有效的防止对晶圆产生刮除伤,使晶圆的合格率更高;
当转盘52浸没在在清洗槽2内时链条4与异形链轮3产生的震动,带动复位弹簧506产生弹动,因此能够使卡块501在滑槽503内轻微的滑动,同时卡块501一侧为弧形设置,因此带动晶圆间断的挤压辅助弹簧502,达到使晶圆前后来回的偏移,使晶圆表面清理更加干净,同时晶圆的边缘受到水流的冲击,减少晶圆卡设部位受不到水冲的影响。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。

Claims (8)

1.一种链式晶圆清洗干燥机器人整机,包括支架(1)、横杆一(11)及横杆二(12),其特征在于:所述横杆一(11)和横杆二(12)均固定安装在支架(1)上,所述横杆二(12)上转动连接有链轮(13),所述横杆一(11)上转动设置异形链轮(3),所述异形链轮(3)和链轮(13)上传动连接有链条(4),所述链条(4)上连接有夹持机构(5),所述夹持机构(5)包括用于夹持晶圆的转盘(52)及悬浮球(59)。
2.根据权利要求1所述的一种链式晶圆清洗干燥机器人整机,其特征在于:所述横杆一(11)与横杆二(12)相互平行设置,所述链轮(13)设有两个,两个所述链轮(13)为左右相互对称设置,其中一个所述链轮(13)后设有电机(14),所述电机(14)与横杆二(12)固定连接,所述电机(14)输出端贯穿横杆二(12)与链轮(13)固定连接,所述链条(4)外设有防护壳(15),所述支架(1)内部放置有清洗槽(2)。
3.根据权利要求1所述的一种链式晶圆清洗干燥机器人整机,其特征在于:所述异形链轮(3)左右两侧均设有顶杆(16),所述顶杆(16)与横杆一(11)转动连接,两根所述顶杆(16)位于环形设置的链条(4)内部,且两根顶杆(16)与链条(4)挤压设置,所述异形链轮(3)外壁上固定连接有斜齿(31)及矩形齿(32),所述斜齿(31)为三角形设置,且斜齿(31)的斜面上设有褶皱,所述矩形齿(32)远离异形链轮(3)的一侧为锥形设置,所述矩形齿(32)和斜齿(31)均设有两个,所述矩形齿(32)和斜齿(31)呈交替的圆周分布。
4.根据权利要求1所述的一种链式晶圆清洗干燥机器人整机,其特征在于:所述夹持机构(5)还包括连接杆(51)、铝薄条(55)、连接弹簧(57)、磁铁一(58)、卡块(501)、辅助弹簧(502)、驱动杆(505)、复位弹簧(506)及旋转盘(507);
所述转盘(52)与连接杆(51)固定连接,所述连接杆(51)固定安装在链条(4)上。
5.根据权利要求4所述的一种链式晶圆清洗干燥机器人整机,其特征在于:所述转盘(52)的正面开设有凹槽(53),所述转盘(52)的侧壁上开设有通孔(54),所述通孔(54)与凹槽(53)连通设置,所述铝薄条(55)设有两根,两根所述铝薄条(55)的两端均与凹槽(53)侧壁固定连接,所述两根所述铝薄条(55)为对称设置,两根所述铝薄条(55)侧壁上均开设有驱动槽(56),所述连接弹簧(57)固定连接在两根铝薄条(55)之间,所述磁铁一(58)固定安装上端的铝薄条(55)中间部位,所述悬浮球(59)放置在凹槽(53)内。
6.根据权利要求1所述的一种链式晶圆清洗干燥机器人整机,其特征在于:所述悬浮球(59)内部开设有空腔(591),所述空腔(591)下端内壁上粘附有磁铁二(592),所述悬浮球(59)为橡胶设置。
7.根据权利要求5所述的一种链式晶圆清洗干燥机器人整机,其特征在于:所述凹槽(53)的侧壁上开设有滑槽(503),所述卡块(501)滑动安装在滑槽(503)内,所辅助弹簧(502)固定安装在凹槽(53)内,所述转盘(52)内部开设有辅助腔(504),所述旋转盘(507)转动安装在辅助腔(504)内,所述驱动杆(505)两端分别与卡块(501)下端及旋转盘(507)铰接连接。
8.根据权利要求7所述的一种链式晶圆清洗干燥机器人整机,其特征在于:所述卡块(501)靠近辅助弹簧(502)一侧为弧形设置,所述驱动杆(505)设有若干根,若干根所述驱动杆(505)均为倾斜设置,所述复位弹簧(506)固定连接在两根驱动杆(505)之间,所述复位弹簧(506)处于拉伸状态。
CN202111309565.4A 2021-11-06 2021-11-06 一种链式晶圆清洗干燥机器人整机 Withdrawn CN114042675A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111309565.4A CN114042675A (zh) 2021-11-06 2021-11-06 一种链式晶圆清洗干燥机器人整机

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111309565.4A CN114042675A (zh) 2021-11-06 2021-11-06 一种链式晶圆清洗干燥机器人整机

Publications (1)

Publication Number Publication Date
CN114042675A true CN114042675A (zh) 2022-02-15

Family

ID=80207418

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111309565.4A Withdrawn CN114042675A (zh) 2021-11-06 2021-11-06 一种链式晶圆清洗干燥机器人整机

Country Status (1)

Country Link
CN (1) CN114042675A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114589149A (zh) * 2022-03-15 2022-06-07 万志良 一种汽车刹车片生产用铁掌快速除油装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114589149A (zh) * 2022-03-15 2022-06-07 万志良 一种汽车刹车片生产用铁掌快速除油装置
CN114589149B (zh) * 2022-03-15 2024-01-12 万志良 一种汽车刹车片生产用铁掌快速除油装置

Similar Documents

Publication Publication Date Title
CN114042675A (zh) 一种链式晶圆清洗干燥机器人整机
CN210207750U (zh) 一种具有清洁功能的机械零件传动机构
CN114598255A (zh) 一种防尘除静电太阳电池装置及其防尘除静电方法
CN218108653U (zh) 一种用于单晶硅片的脱胶机
CN219112305U (zh) 自动芯片清洗机
CN209810742U (zh) 一种光伏电站清洗机器人
CN213795772U (zh) 一种便于对工件进行冷却的轴承生产用打磨装置
CN215496647U (zh) 一种用于半导体芯片清洗的一体化设备
CN111687090B (zh) 一种太阳能硅片回收再利用处理装置
CN115301626A (zh) 一种连续式芯片洗涤装置及工艺
CN209829656U (zh) 一种太阳能背板清洁装置
CN220873532U (zh) 一种晶圆花篮上下摆动机构
CN212856768U (zh) 一种发动机缸体生产清洗装置
CN207579037U (zh) 一种用于双螺旋杆挤出造粒机的过滤清洗装置
CN220172149U (zh) 一种软接触的花篮
CN210995605U (zh) 一种单晶硅片垂直清洗装置
CN215844429U (zh) 一种晶圆清洗回收机
CN211330426U (zh) 一种双氟磺酰亚胺锂晶体洗涤装置
CN210743924U (zh) 一种多晶硅铸锭硅片清洗设备
CN217984989U (zh) 一种光伏组件固定安装支架
CN220820412U (zh) 眼镜镜片超声波旋转离心力清洗器
CN217775011U (zh) 一种电路板贴片表层除尘吸附装置
CN214214411U (zh) 一种废弃塑料膜回收处理装置
CN210207748U (zh) 一种有机玻璃生产加工用擦拭设备
CN213055987U (zh) 一种高压袋高效节能吹膜机

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20220215