CN113981533B - 一维单晶锗基石墨烯等离激元纳米结构的制备方法 - Google Patents
一维单晶锗基石墨烯等离激元纳米结构的制备方法 Download PDFInfo
- Publication number
- CN113981533B CN113981533B CN202111269115.7A CN202111269115A CN113981533B CN 113981533 B CN113981533 B CN 113981533B CN 202111269115 A CN202111269115 A CN 202111269115A CN 113981533 B CN113981533 B CN 113981533B
- Authority
- CN
- China
- Prior art keywords
- germanium
- source
- graphene
- temperature
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/08—Germanium
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
本发明提供了一种一维单晶锗基石墨烯等离激元纳米结构的制备方法,步骤如下:(1)在衬底上利用磁控溅射的方法溅射金纳米薄膜;(2)在步骤(1)得到的衬底上采用化学气相沉积生长掺杂锗单晶纳米线;(3)在步骤(2)得到的掺杂锗单晶纳米线表面采用化学气相沉积直接生长高质量石墨烯,获得一维锗基石墨烯表面等离激元纳米结构。本发明通过化学气相沉积法在锗单晶纳米线表面直接生长石墨烯,避免了传统的石墨烯薄膜转移过程,最大程度上减小了转移过程对石墨烯载流子迁移率的影响,增强了锗与石墨烯之间中红外表面等离激元的耦合。本发明所提供的材料具有强烈且可调的表面等离激元效应,有望在分子指纹检测、中红外传感、光子芯片等领域广泛应用。
Description
技术领域
本发明涉及极化激元纳米结构制备领域,具体涉及一种一维单晶锗基石墨烯等离激元纳米结构的制备方法。
背景技术
随着现代信息技术的飞速发展,人们对于器件微型化、高度集成化和光数据处理的要求越来越高,在纳米级尺度增强电子、光子与物质相互作用,实现光学传输与操控成为普遍关注的热点。表面等离激元能够突破传统光学衍射极限,具有很强的局域电磁场增强特点,使其在高灵敏度生物检测、传感和新型光源等领域有着广阔的应用前景。
然而,目前对于等离激元的研究大多都是基于金、银等贵金属,光学响应通常处于可见光和近红外波段,对于中红外波段的表面等离激元探究则较少。同时,对于金属而言,一旦固定金属的材料、形状和大小,其等离激元波长很难调控。对于半导体材料,通过调整掺杂程度或者施加电场便可实现等离激元波长可调。石墨烯作为一种二维半金属材料,具有超高的载流子迁移率和较宽的响应波段,在中红外和太赫兹波段可激发高度局域的表面等离激元,且损耗较低。目前制备的石墨烯基等离激元纳米结构大都依靠转移之后的石墨烯与其他贵金属材料进行复合,在这一过程中引入的样品污染会直接影响石墨烯载流子的迁移率,进而影响其等离激元寿命。同时,由于与入射光动量和能量的失配,石墨烯等离激元的光响应往往较弱,成为亟需解决的挑战。掺杂锗纳米结构是一种新兴的半导体等离激元材料,具有与石墨烯类似可调的中红外等离激元效应,且中红外光损耗较低。将锗等离激元纳米结构用于增强石墨烯的等离激元效应将是实现石墨烯等离激元耦合、光与物质强相互作用的重要手段,该方面的研究目前鲜有报道。
目前已公开的锗基石墨烯制备方法有化学气相沉积法、外延生长法和氧化还原法等。其中化学气相沉积和外延生长方法都可以获得高质量的石墨烯薄膜,但二者大都在锗单晶薄膜上进行生长,与硅基器件技术不兼容;通过氧化还原法制备的粉体石墨烯虽然对于基底的要求较低,但石墨烯的质量较差。专利CN110875470A中公开了一种无定形锗基纳米线-石墨烯纳米复合锂离子电池负极材料及制备方法,该方法采用还原氧化石墨烯与无定形锗线进行超声分散再抽滤真空干燥得到样品,整个实验周期较长且复杂,容易引入其他污染物,且对于还原氧化石墨烯无论是结晶度还是洁净度都无法与化学气相沉积制备的高质量石墨烯相比拟,因此也无法用于对样品质量要求较高的表面等离激元效应研究。
有鉴于此,特提出本发明。
发明内容
针对现有技术中存在的问题,本发明提出了一种一维单晶锗基石墨烯等离激元纳米结构的制备方法,通过化学气相沉积法在掺杂锗单晶纳米线表面直接生长石墨烯,构建等离激元纳米复合结构。本发明采用化学气相沉积的方法,在一维掺杂锗单晶纳米线表面直接生长高质量石墨烯,实现一维等离激元纳米结构的可控制备。与以往方法相比,本发明整个实验过程耗时短,制备方法简单,可重复性高,同时实现了锗纳米线/石墨烯复合结构的尺寸和掺杂的调控,为推动高灵敏度、低成本等离激元传感材料的制备及其分子指纹检测等方面应用开辟了新思路。
为解决上述技术问题,本发明采用以下技术方案:
一种一维单晶锗基石墨烯等离激元纳米结构的制备方法,步骤如下:
(1)在衬底上利用射频磁控溅射方法,在真空环境下溅射金纳米薄膜,通过调整溅射功率、温度和时间实现对金膜厚度的控制;
所述衬底清洗方式:先用丙酮超声清洗15min,再使用异丙醇超声清洗15min,然后乙醇冲洗后用氮气枪吹干;
(2)在步骤(1)得到的衬底上采用化学气相沉积的方法生长掺杂锗单晶纳米线;掺杂锗单晶纳米线直径取决于步骤1)所溅射的金薄膜的厚度;
(3)在步骤(2)所得到掺杂锗单晶纳米线表面采用化学气相沉积的方法生长高结晶度石墨烯壳层。
进一步,步骤(1)中衬底为Si/SiO2(100) (含300nm SiO2)、蓝宝石衬底(0001)、Si(111)衬底或云母衬底中的任意一种;所得金纳米薄膜的厚度为5~30nm;步骤(2)所得纳米线直径为50~1000 nm,长度为30~100μm。步骤(3)所生长的一维石墨烯包覆单晶锗纳米结构具有光滑的表面形貌,石墨烯结晶质量较高,显示出强且尖锐的拉曼特征峰。
进一步,步骤(1)中磁控溅射方法为射频磁控溅射方法,在真空环境下,溅射功率为25W-50W,溅射时间为5s-40s,衬底温度为25℃-400℃,
进一步,步骤(2)中采用管式炉,将步骤(1)所得衬底放置于管式炉中央,引入锗源,在保护气存在的条件下对管式炉进行升温,当衬底所在温区升至400℃以上,锗源通过载气输运到达衬底表面实现锗单晶纳米线的生长。步骤(2)结束后,在保护气存在的条件下将管式炉升至石墨烯生长温度,然后通入一定量的碳源和载气,实现锗纳米线/石墨烯复合纳米结构的制备。
进一步,所述锗源为气态锗源、液态锗源或固态锗源中的任一种,保护气体为Ar,气体流量为1-100sccm,升温时间为20-60min,温度为300℃~1000℃,保温时间为5-60min。
进一步,所述引入锗源的温度为300℃~1000℃,具体根据所用锗源进行适当调整,不同锗源会导致不同的挥发温度,使用气态源和液态源时温度较低。
进一步,所述气态锗源为GeH4,锗源为气态锗源时,管式炉升温至300℃-600℃;液态锗源(有机锗的化合物)为四乙基锗或二苯基锗,锗源为液态锗源时,管式炉升温至300℃-600℃。
进一步,固态锗源为锗粉(99.999%),尺寸:-100目,当锗源为锗粉时,同时在锗粉中混入石墨粉(99.95%),石墨粉尺寸≥325目,锗粉用量为300mg-1g,石墨粉用量为100mg-333mg;锗粉和石墨粉的质量比为3:1,管式炉锗源所在温区升温至900℃-1000℃,衬底所在温区升温至400℃~650℃。
进一步,步骤(3)中以H2为载气,载气流量为10-100sccm,通入碳源,碳源气体流量为1-50sccm,采用化学气相沉积的方法生长石墨烯。
进一步,所述碳源为CH4,C2H2和C2H4中的任一种,优选CH4,化学气相沉积温度为850℃-870℃,升温时间为50min,保温时间为0.5h-2h。
进一步,步骤(2)中通入锗源时,还可以同时引入N型掺杂源,以实现掺杂锗单晶纳米线的生长。
进一步,所述N型掺杂源可为磷源或锑源,磷源包括赤磷和黑磷等,锑源包括三氯化锑、三氧化二锑。所述固态掺杂磷源赤磷粉末纯度为99%,尺寸60-100目;黑磷晶体粉末纯度99.998%,掺杂源用量为1mg-20mg。所述固态掺杂锑源三氯化锑粉末纯度99%,三氧化二锑粉末纯度99.9%,N型掺杂源用量为1mg-20mg,优选的,固体锗源与N型掺杂源的质量比为100:1~1000:1。
进一步,所述步骤(3)的压力环境为常压。
所述方法还包括:第一步掺杂锗单晶纳米线生长过程中将管式炉升温到生长温度所用时间为1h;升温过程结束后为保温阶段,保温阶段结束停止通入Ar,通入H2。第二步石墨烯生长过程中将管式炉升温到850℃-870℃,所用时间为50min,升温结束后进入保温阶段,通入CH4进行反应,保温阶段结束停止通入CH4,自然降温到常温后取出样品。
本发明的有益效果是:本发明通过化学气相沉积法在掺杂锗单晶纳米线表面直接生长石墨烯,避免了传统的石墨烯薄膜转移过程,最大程度上减小了样品缺陷、污染物对载流子迁移率的影响,确保了较长的等离激元寿命。整个化学气相沉积过程无需取出样品,直接调整通入的气体及温控程序就可实现复合结构的制备,能够有效避免锗单晶纳米线的氧化,维持较强的等离激元效应。同时通过对掺杂的调控,可以得到不同波长光响应的等离激元纳米结构。由拉曼光谱、扫描电子显微镜以及透射电子显微镜等分析手段确定样品是高结晶质量的锗纳米线/石墨烯复合等离激元纳米结构。
锗作为一种可调的中红外等离激元材料,能够与石墨烯结合在中红外波段实现较强的等离激元耦合增强。同时通过调控锗单晶纳米线与石墨烯的生长和掺杂条件,可以在较宽光谱范围内调控石墨烯等离激元,从而探究其在气体传感、生物分子探测等方面的应用。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为实施例3掺杂锗单晶纳米线典型扫描电子显微镜图片。
图2为实施例3生长过石墨烯的掺杂锗单晶纳米线典型扫描电子显微镜图片。
图3为实施例3掺杂锗单晶纳米线典型透射电子显微镜图片。
图4为实施例3生长过石墨烯的掺杂锗单晶纳米线典型透射电子显微镜图片。
图5为实施例2生长过石墨烯的锗单晶纳米线拉曼光谱图。
图6为实施例1锗单晶纳米线XRD图谱。
图7为实施例3掺杂锗单晶纳米线在不同波长激发下的近场光学图像。
图8为实施例3生长过石墨烯的掺杂锗单晶纳米线在不同波长激发下的近场光学图像。
具体实施方式
下面将结合本发明实施例,对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1
一维单晶锗基石墨烯等离激元纳米结构的制备方法,具体如下:
步骤1:将硅片切成需要的大小,放入烧杯中用丙酮溶液超声15分钟,然后放在异丙醇溶液中超声15min,最后乙醇冲洗后用氮气枪吹干备用;
步骤2:分别将金靶材和清洗过的硅片装入磁控溅射仪器,打开分子泵开关,通入工作气体20sccm Ar,待溅射室真空度达到7 ×10-4pa,选用磁控溅射射频模式,设置溅射功率为25W,衬底温度设置为室温,将溅射时间设置为10s,溅射结束后取出样品,衬底表面上覆有一层纳米级的金薄膜;
步骤3:称取300mg锗粉,100mg石墨粉,将二者混和后放入刚玉舟中,选用步骤2得到的有金薄膜镀层的硅片放入石英舟,然后将两舟分别放置管式炉的两个温区;设置管式炉升温程序,锗粉所在温区温度设为950℃,衬底所在温区温度设为650℃,升温程序开始前先用Ar气对系统进行洗气,洗气结束后通入20sccm Ar,开启升温程序,1h后两温区分别升至950℃、600℃,保温30min后第一阶段反应停止;
步骤4:系统第一步程序结束后停止通入Ar气,通入50sccm H2,然后开启第二步升温程序,50min将系统升至850℃,通入30sccm CH4保温2h,反应结束后停止CH4的供给,系统开始自然降温,衬底表面覆盖锗纳米线/石墨烯复合结构即一维单晶锗基石墨烯等离激元纳米结构。
实施例2
一维单晶锗基石墨烯等离激元纳米结构的制备方法,具体如下:
步骤1:将硅片切成需要的大小,放入烧杯中用丙酮溶液超声15分钟,然后放在异丙醇溶液中超声15min,最后乙醇冲洗后用氮气枪吹干备用;
步骤2:分别将金靶材和清洗过的硅片装入磁控溅射仪器,打开泵开关,通入工作气体20sccm Ar,待溅射室真空度达到7×10-4pa,选用磁控溅射射频模式,设置溅射功率为25W,衬底温度设置为400℃,将溅射时间设置为20s,溅射结束后取出样品,衬底表面上覆有一层纳米级的金薄膜;
步骤3:称取300mg锗粉,100mg石墨粉,1mg红磷粉末,将三者混和后放入刚玉舟中,选用步骤2得到的有金薄膜镀层的硅片放入石英舟,然后将两舟分别放置管式炉的两个温区,设置管式炉升温程序,锗粉所在温区温度设为950℃,衬底所在温区温度设为650℃,升温程序开始前先用Ar气对系统进行洗气,洗气结束后通入20sccm Ar,开启升温程序,1h后两温区分别升至950℃、600℃,保温30min后第一阶段反应停止;
步骤4:系统第一步程序结束后停止通入Ar气,通入50sccm H2,然后开启第二步升温程序,50min将系统升至870℃,通入50sccm CH4保温2h,反应结束后停止CH4的供给,系统开始自然降温,衬底表面覆盖锗纳米线/石墨烯复合结构即一维单晶锗基石墨烯等离激元纳米结构。
实施例3
一维单晶锗基石墨烯等离激元纳米结构的制备方法,具体如下:
步骤1:将硅片切成需要的大小,放入烧杯中用丙酮溶液超声15分钟,然后放在异丙醇溶液中超声15min,最后乙醇冲洗后用氮气枪吹干备用;
步骤2:分别将金靶材和清洗过的硅片装入磁控溅射仪器,打开泵开关,通入工作气体20sccm Ar,待溅射室真空度达到7×10-4pa,选用磁控溅射射频模式,设置溅射功率为25W,衬底温度设置为400℃,将溅射时间设置为10s,溅射结束后取出样品,衬底表面上覆有一层纳米级的金薄膜;
步骤3:称取500mg锗粉,166.6mg石墨粉,2.2mg红磷粉末,将三者混和后放入刚玉舟中,选用步骤2得到的有金薄膜镀层的硅片放入石英舟,然后将两舟分别放置管式炉的两个温区,设置管式炉升温程序,锗粉所在温区温度设为950℃,衬底所在温区温度设为650℃,升温程序开始前先用Ar气对系统进行洗气,洗气结束后通入20sccm Ar,开启升温程序,1h后两温区分别升至950℃、600℃,保温30min后第一阶段反应停止;
步骤4:系统第一步程序结束后停止通入Ar气,通入50sccm H2,然后开启第二步升温程序,50min将系统升至860℃,通入40sccm CH4保温2h,反应结束后停止CH4的供给,系统开始自然降温,衬底表面覆盖锗纳米线/石墨烯复合结构即一维单晶锗基石墨烯等离激元纳米结构。
实施例4
一维单晶锗基石墨烯等离激元纳米结构的制备方法,具体如下:
步骤1:将硅片切成需要的大小,放入烧杯中用丙酮溶液超声15分钟,然后放在异丙醇溶液中超声15min,最后乙醇冲洗后用氮气枪吹干备用;
步骤2:分别将金靶材和清洗过的硅片装入磁控溅射仪器,打开泵开关,通入工作气体20sccm Ar,待溅射室真空度达到7×10-4pa,选用磁控溅射射频模式,设置溅射功率为25W,衬底温度设置为室温,将溅射时间设置为5s,溅射结束后取出样品,衬底表面上覆有一层纳米级的金薄膜;
步骤3:称取3mg红磷粉末放入刚玉舟中,选用步骤2得到的有金薄膜镀层的硅片放入石英舟,然后将两舟放入管式炉中,设置管式炉升温程序,将管式炉温度设为500℃,升温程序开始前先用Ar气对系统进行洗气,洗气结束后通入19sccm Ar和1sccm GeH4,开启升温程序,1h后管式炉温区升至500℃,保温30min后第一阶段反应停止;
步骤4:系统第一步程序结束后停止通入Ar气和GeH4,通入50sccm H2,然后开启第二步升温程序,50min将系统升至860℃,通入50sccm CH4保温2h,反应结束后停止CH4的供给,系统开始自然降温,衬底表面覆盖锗纳米线/石墨烯复合结构即一维单晶锗基石墨烯等离激元纳米结构。
实施例5
一维单晶锗基石墨烯等离激元纳米结构的制备方法,具体如下:
步骤1:将硅片切成需要的大小,放入烧杯中用丙酮溶液超声15分钟,然后放在异丙醇溶液中超声15min,最后乙醇冲洗后用氮气枪吹干备用;
步骤2:分别将金靶材和清洗过的硅片装入磁控溅射仪器,打开泵开关,通入工作气体20sccm Ar,待溅射室真空度达到7×10-4pa,选用磁控溅射射频模式,设置溅射功率为25W,衬底温度设置为室温,将溅射时间设置为20s,溅射结束后取出样品,衬底表面上覆有一层纳米级的金薄膜;
步骤3:称取4mg红磷粉末放入刚玉舟中,选用步骤2得到的有金薄膜镀层的硅片放入石英舟,然后将两舟放入管式炉中,设置管式炉升温程序,将管式炉温度设为500℃,升温程序开始前先用Ar气对系统进行洗气,洗气结束后通入18sccm Ar和2sccm GeH4,开启升温程序,1h后管式炉温区升至500℃,保温30min后第一阶段反应停止;
步骤4:系统第一步程序结束后停止通入Ar气和GeH4,通入50sccm H2,然后开启第二步升温程序,50min将系统升至870℃,通入50sccm CH4保温2h,反应结束后停止CH4的供给,系统开始自然降温。衬底表面覆盖锗纳米线/石墨烯复合结构即一维单晶锗基石墨烯等离激元纳米结构。
通过拉曼数据、扫描电子显微镜数据等表征,证明所得材料为锗纳米线/石墨烯复合结构,且复合纳米结构具有较好的形貌维持,石墨烯的质量较好。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (5)
1.一种一维单晶锗基石墨烯等离激元纳米结构的制备方法,其特征在于,步骤如下:
(1)在衬底上利用磁控溅射的方法溅射金纳米薄膜;
(2)在步骤(1)得到的衬底上采用化学气相沉积的方法生长掺杂锗单晶纳米线;
(3)在步骤(2)所得到掺杂锗单晶纳米线表面采用化学气相沉积的方法直接生长高结晶度石墨烯壳层;
所述步骤(1)中衬底为Si/SiO2(100)、蓝宝石衬底(0001)、Si(111)衬底、云母衬底中的任意一种,金纳米薄膜的厚度为5~30nm;步骤(2)中掺杂锗单晶纳米线的直径为50~1000nm,长度为30~100μm;
步骤(2)中采用管式炉,将步骤(1)所得衬底放置于管式炉中央,引入锗源在保护气存在的条件下对管式炉进行升温,实现锗单晶纳米线的生长;
所述锗源为气态锗源、液态锗源或固态锗源中的任一种,保护气体为Ar,气体流量为1-100sccm,升温时间为20-60min,锗源温度为300℃~1000℃,衬底温度为400~650℃,保温时间为5-60min;
步骤(2)中引入锗源时,同时引入N型掺杂源,以实现掺杂锗单晶纳米线的生长;
所述N型掺杂源为磷源或锑源,磷源包括赤磷、黑磷;锑源包括三氯化锑、三氧化二锑,其中N型掺杂源的质量为1-20mg。
2.根据权利要求1所述的一维单晶锗基石墨烯等离激元纳米结构的制备方法,其特征在于:所述步骤(1)中磁控溅射方法为射频磁控溅射方法,在真空环境下,溅射功率为25W-50W,溅射时间为5s-40s,衬底温度为25℃-400℃。
3.根据权利要求1所述的一维单晶锗基石墨烯等离激元纳米结构的制备方法,其特征在于:所述气态锗源为GeH4,锗源为气态锗源时,管式炉升温至300℃-600℃;液态锗源为四乙基锗或二苯基锗,锗源为液态锗源时,管式炉升温至300℃-600℃;固态锗源为锗粉,当锗源为锗粉时,同时在锗粉中混入石墨粉,锗粉和石墨粉的质量比为3:1,管式炉锗源所在温区升温至900℃-1000℃,衬底所在温区升温至400℃~650℃。
4.根据权利要求1所述的一维单晶锗基石墨烯等离激元纳米结构的制备方法,其特征在于:步骤(3)中以H2为载气,载气流量为10-100sccm,通入碳源气体,碳源气体流量为1-50sccm,采用化学气相沉积的方法生长石墨烯壳层。
5.根据权利要求4所述的一维单晶锗基石墨烯等离激元纳米结构的制备方法,其特征在于:所述碳源气体为CH4,C2H2和C2H4中的任一种,化学气相沉积反应温度为850℃-870℃,反应压力为常压,升温时间为50min,保温时间为0.5h-2h。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111269115.7A CN113981533B (zh) | 2021-10-29 | 2021-10-29 | 一维单晶锗基石墨烯等离激元纳米结构的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111269115.7A CN113981533B (zh) | 2021-10-29 | 2021-10-29 | 一维单晶锗基石墨烯等离激元纳米结构的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113981533A CN113981533A (zh) | 2022-01-28 |
CN113981533B true CN113981533B (zh) | 2023-01-24 |
Family
ID=79744090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111269115.7A Active CN113981533B (zh) | 2021-10-29 | 2021-10-29 | 一维单晶锗基石墨烯等离激元纳米结构的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113981533B (zh) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9773669B2 (en) * | 2014-09-11 | 2017-09-26 | Ramot At Tel-Aviv University Ltd. | Method of fabricating a nanoribbon and applications thereof |
CN105990107B (zh) * | 2015-03-06 | 2018-10-09 | 武汉理工大学 | 掺杂磷的n型锗纳米线的低温低压生长及拉曼光谱表征方法 |
CN105088179B (zh) * | 2015-08-26 | 2017-08-15 | 中国科学院上海微系统与信息技术研究所 | 一种转移石墨烯的方法 |
CN105174268A (zh) * | 2015-09-21 | 2015-12-23 | 中国科学院上海微系统与信息技术研究所 | 纳米线与石墨烯的复合材料及其制备方法 |
CN111883607A (zh) * | 2020-07-13 | 2020-11-03 | 上海纳米技术及应用国家工程研究中心有限公司 | 一种基于石墨烯/锗复合薄膜的高灵敏度位置探测器的构筑方法 |
-
2021
- 2021-10-29 CN CN202111269115.7A patent/CN113981533B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN113981533A (zh) | 2022-01-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Van Hieu | Comparative study of gas sensor performance of SnO2 nanowires and their hierarchical nanostructures | |
CN109881176B (zh) | 一种花瓣状的二硫化钼二维晶体材料及其制备方法和应用 | |
CN109368605B (zh) | 一种碲纳米线材料的制备方法、碲纳米线材料及装置 | |
CN110028058B (zh) | 一种氮掺石墨烯材料及其制备方法 | |
CN101972641B (zh) | 大面积氧化钛纳米管薄膜、其制备方法及应用 | |
Wang et al. | Control growth of catalyst-free high-quality ZnO nanowire arrays on transparent quartz glass substrate by chemical vapor deposition | |
CN108767028B (zh) | 基于氧化镓异质结结构的柔性日盲紫外探测器及其制备方法 | |
CN108314019B (zh) | 一种层数均匀的大面积高质量石墨烯薄膜的制备方法 | |
Meitei et al. | Microstructural and optical properties of Ag assisted β-Ga2O3 nanowires on silicon substrate | |
Prathap et al. | Anti-reflection In2O3 nanocones for silicon solar cells | |
CN112875655A (zh) | 一种非层状二维Cr2Se3纳米片的制备方法和应用 | |
CN113981533B (zh) | 一维单晶锗基石墨烯等离激元纳米结构的制备方法 | |
Ali | Origin of photoluminescence in nanocrystalline Si: H films | |
CN114864377A (zh) | 一种易转移的PbX单晶薄膜的制备方法 | |
CN110224035B (zh) | 一种异质结、其制备方法和应用 | |
Water et al. | Effect of growth temperature on photoluminescence and piezoelectric characteristics of ZnO nanowires | |
CN108893714B (zh) | 一种高密度Ag纳米柱表面增强拉曼散射衬底的制备方法 | |
CN110828589A (zh) | 一种柔性日盲紫外光电探测器及其制备方法 | |
CN110172733A (zh) | 一种高质量锡酸锌单晶薄膜及其制备方法 | |
CN115663057A (zh) | 一种基于氢氩混合等离子体温和处理的多层WSe2薄膜光电探测器及其制备方法 | |
CN116240496A (zh) | 一种基于合金纳米粒子调控局域表面等离子共振的方法 | |
CN113278949B (zh) | 一种单层硫硒化钼合金组份可调的制备方法 | |
Rahayi et al. | Synthesis and characterization of tin (IV) oxide thin films | |
CN113658852A (zh) | 硅基尺寸可控β-Ga2O3纳米线的制备方法 | |
CN109504951B (zh) | 一种生长混合相锌镁氧三元氧化物纳米线网的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |