CN113937093A - 硅基彩色iled显示器 - Google Patents

硅基彩色iled显示器 Download PDF

Info

Publication number
CN113937093A
CN113937093A CN202111315743.4A CN202111315743A CN113937093A CN 113937093 A CN113937093 A CN 113937093A CN 202111315743 A CN202111315743 A CN 202111315743A CN 113937093 A CN113937093 A CN 113937093A
Authority
CN
China
Prior art keywords
iled
display
iled array
chips
array chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111315743.4A
Other languages
English (en)
Chinese (zh)
Inventor
威廉姆·亨利
帕德里克·休斯
约瑟夫·奥基夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meta Platforms Technologies LLC
Original Assignee
Facebook Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Facebook Technologies LLC filed Critical Facebook Technologies LLC
Publication of CN113937093A publication Critical patent/CN113937093A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/2003—Display of colours
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Control Of El Displays (AREA)
  • Manufacturing & Machinery (AREA)
CN202111315743.4A 2014-07-31 2015-07-31 硅基彩色iled显示器 Pending CN113937093A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1413578.4A GB201413578D0 (en) 2014-07-31 2014-07-31 A colour iled display on silicon
GB1413578.4 2014-07-31
CN201580052942.7A CN107078132B (zh) 2014-07-31 2015-07-31 硅基彩色iled显示器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580052942.7A Division CN107078132B (zh) 2014-07-31 2015-07-31 硅基彩色iled显示器

Publications (1)

Publication Number Publication Date
CN113937093A true CN113937093A (zh) 2022-01-14

Family

ID=51587531

Family Applications (3)

Application Number Title Priority Date Filing Date
CN202111314127.7A Pending CN113937092A (zh) 2014-07-31 2015-07-31 硅基彩色iled显示器
CN202111315743.4A Pending CN113937093A (zh) 2014-07-31 2015-07-31 硅基彩色iled显示器
CN201580052942.7A Active CN107078132B (zh) 2014-07-31 2015-07-31 硅基彩色iled显示器

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202111314127.7A Pending CN113937092A (zh) 2014-07-31 2015-07-31 硅基彩色iled显示器

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201580052942.7A Active CN107078132B (zh) 2014-07-31 2015-07-31 硅基彩色iled显示器

Country Status (7)

Country Link
US (4) US10515580B2 (enExample)
EP (2) EP3826055A1 (enExample)
JP (4) JP6741649B2 (enExample)
KR (4) KR20220164074A (enExample)
CN (3) CN113937092A (enExample)
GB (1) GB201413578D0 (enExample)
WO (1) WO2016016460A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113937092A (zh) * 2014-07-31 2022-01-14 脸谱科技有限责任公司 硅基彩色iled显示器

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201413604D0 (en) 2014-07-31 2014-09-17 Infiniled Ltd A colour inorganic LED display for display devices with a high number of pixel
GB201418772D0 (en) * 2014-10-22 2014-12-03 Infiniled Ltd Display
GB2586423B (en) * 2014-10-22 2021-09-01 Facebook Tech Llc Display
GB201418810D0 (en) 2014-10-22 2014-12-03 Infiniled Ltd Display
US10079264B2 (en) * 2015-12-21 2018-09-18 Hong Kong Beida Jade Bird Display Limited Semiconductor devices with integrated thin-film transistor circuitry
DE102016108776A1 (de) 2016-05-12 2017-11-16 Osram Opto Semiconductors Gmbh Optische Anordnung und Anzeigegerät
DE102016113168A1 (de) * 2016-07-18 2018-01-18 Osram Opto Semiconductors Gmbh Modul für eine videowand
US10606121B2 (en) * 2016-09-12 2020-03-31 Seoul Semiconductor Co., Ltd. Display apparatus
CN109983392B (zh) 2016-12-09 2021-02-23 应用材料公司 准直led光场显示器
US10438859B2 (en) 2016-12-19 2019-10-08 X-Celeprint Limited Transfer printed device repair
CN106898601A (zh) * 2017-02-15 2017-06-27 佛山市国星光电股份有限公司 三角形组合的led线路板、三角形led器件及显示屏
US10396137B2 (en) * 2017-03-10 2019-08-27 X-Celeprint Limited Testing transfer-print micro-devices on wafer
US10770440B2 (en) * 2017-03-15 2020-09-08 Globalfoundries Inc. Micro-LED display assembly
WO2018169968A1 (en) 2017-03-16 2018-09-20 Invensas Corporation Direct-bonded led arrays and applications
CN106816502B (zh) * 2017-04-12 2019-04-02 京东方科技集团股份有限公司 一种led芯片、led发光基板、显示装置及彩色显示控制方法
US10490599B2 (en) 2017-07-13 2019-11-26 Applied Materials, Inc. Collimated, directional micro-LED light field display
US10712579B1 (en) * 2017-09-20 2020-07-14 Facebook Technologies, Llc Vortex linearization of micro-LED polarization
TWI781241B (zh) * 2017-11-08 2022-10-21 美商康寧公司 用於組裝顯示區域的裝置及方法
US10836200B2 (en) 2017-11-13 2020-11-17 X Display Company Technology Limited Rigid micro-modules with ILED and light conductor
US11527519B2 (en) 2017-11-27 2022-12-13 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US12100696B2 (en) 2017-11-27 2024-09-24 Seoul Viosys Co., Ltd. Light emitting diode for display and display apparatus having the same
US10892296B2 (en) 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting device having commonly connected LED sub-units
US11282981B2 (en) 2017-11-27 2022-03-22 Seoul Viosys Co., Ltd. Passivation covered light emitting unit stack
US10892297B2 (en) 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting diode (LED) stack for a display
US10748881B2 (en) 2017-12-05 2020-08-18 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US10886327B2 (en) 2017-12-14 2021-01-05 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US11552057B2 (en) 2017-12-20 2023-01-10 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US11522006B2 (en) 2017-12-21 2022-12-06 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US11552061B2 (en) 2017-12-22 2023-01-10 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US11114499B2 (en) * 2018-01-02 2021-09-07 Seoul Viosys Co., Ltd. Display device having light emitting stacked structure
US10784240B2 (en) 2018-01-03 2020-09-22 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US11169326B2 (en) 2018-02-26 2021-11-09 Invensas Bonding Technologies, Inc. Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
KR20200127023A (ko) 2018-03-01 2020-11-09 에이치이에스 아이피 홀딩스, 엘엘씨 다중 피사계 심도 촬영이 가능한 근안 디스플레이 방법
US11256004B2 (en) 2018-03-20 2022-02-22 Invensas Bonding Technologies, Inc. Direct-bonded lamination for improved image clarity in optical devices
US11100844B2 (en) * 2018-04-25 2021-08-24 Raxium, Inc. Architecture for light emitting elements in a light field display
WO2019230229A1 (ja) 2018-05-31 2019-12-05 株式会社ジャパンディスプレイ 表示装置及びアレイ基板
JP6985983B2 (ja) 2018-05-31 2021-12-22 株式会社ジャパンディスプレイ 表示装置
DE112019002238B4 (de) 2018-05-31 2024-08-08 Japan Display Inc. Anzeigevorrichtung
WO2019230250A1 (ja) 2018-05-31 2019-12-05 株式会社ジャパンディスプレイ 表示装置及びアレイ基板
DE112019002234B4 (de) 2018-05-31 2024-09-12 Japan Display Inc. Anzeigevorrichtung
JP7132779B2 (ja) 2018-07-18 2022-09-07 株式会社ジャパンディスプレイ 表示装置及びアレイ基板
WO2020021978A1 (ja) 2018-07-27 2020-01-30 株式会社ジャパンディスプレイ 検出装置付き表示機器
RU201978U1 (ru) * 2018-08-03 2021-01-25 Акционерное общество "Завод полупроводниковых приборов" Корпус микросборки
DE102018129209B4 (de) 2018-11-20 2022-04-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Multi-pixel-anzeigevorrichtung
JP7264669B2 (ja) 2019-03-01 2023-04-25 株式会社ジャパンディスプレイ 表示装置
JP7360246B2 (ja) 2019-03-14 2023-10-12 株式会社ジャパンディスプレイ 表示装置
JP7320970B2 (ja) 2019-03-28 2023-08-04 株式会社ジャパンディスプレイ 表示装置
JP7281940B2 (ja) 2019-03-28 2023-05-26 株式会社ジャパンディスプレイ 検出装置付き表示機器
JP7264694B2 (ja) 2019-03-29 2023-04-25 株式会社ジャパンディスプレイ 表示装置
JP2020166191A (ja) 2019-03-29 2020-10-08 株式会社ジャパンディスプレイ 表示装置
JP7313925B2 (ja) * 2019-06-25 2023-07-25 株式会社ジャパンディスプレイ 表示装置
JP2021026187A (ja) 2019-08-08 2021-02-22 株式会社ジャパンディスプレイ 表示装置
JP7360272B2 (ja) 2019-08-19 2023-10-12 株式会社ジャパンディスプレイ 表示装置
JP2021043373A (ja) 2019-09-12 2021-03-18 株式会社ジャパンディスプレイ 表示装置
JP7300949B2 (ja) 2019-09-24 2023-06-30 株式会社ジャパンディスプレイ 表示装置の補修方法
JP2021051150A (ja) 2019-09-24 2021-04-01 株式会社ジャパンディスプレイ 表示装置の補修方法及び表示装置
JP2021056380A (ja) 2019-09-30 2021-04-08 株式会社ジャパンディスプレイ 表示装置
JP2021056454A (ja) 2019-10-01 2021-04-08 株式会社ジャパンディスプレイ 表示装置
JP7326137B2 (ja) 2019-12-03 2023-08-15 株式会社ジャパンディスプレイ 表示装置
FR3104815B1 (fr) * 2019-12-17 2023-08-25 Thales Sa Dispositif d'affichage couleur comportant une mosaique de paves de micro-diodes electroluminescentes
US11762200B2 (en) * 2019-12-17 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded optical devices
US11355480B1 (en) * 2020-01-27 2022-06-07 Facebook Technologies, Llc Micropixellation for alignment-free assembly
EP4097710A1 (en) * 2020-01-28 2022-12-07 OLEDWorks LLC Oled display with protection circuit
US12051685B2 (en) * 2020-02-06 2024-07-30 Lumileds, LLC Light-emitting device with metal inlay and bottom contacts
JP2021153114A (ja) 2020-03-24 2021-09-30 株式会社ジャパンディスプレイ 配線基板及び表示装置
CN115398517B (zh) * 2020-04-13 2025-08-26 苹果公司 显示器后方的发射器
CN115461803A (zh) 2020-05-01 2022-12-09 索尼半导体解决方案公司 显示装置和表面安装器件
JP2022025375A (ja) 2020-07-29 2022-02-10 株式会社ジャパンディスプレイ 表示装置
KR102249675B1 (ko) * 2020-08-25 2021-05-10 포스텍네트웍스(주) 영상 저장 fpga를 활용하며 발광 소자 단위로 보정가능한 led 전광판 제어시스템
JP2022041743A (ja) 2020-09-01 2022-03-11 株式会社ジャパンディスプレイ 発光装置及び発光装置の駆動方法
US12027648B2 (en) * 2020-09-29 2024-07-02 BOE MLED Technology Co., Ltd. Light-emitting diode chip, display substrate and manufacturing method thereof
CN114361148A (zh) * 2020-09-30 2022-04-15 Tcl科技集团股份有限公司 像素结构、灯板、显示装置及像素结构的驱动方法
DE102020130211A1 (de) * 2020-11-16 2022-05-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterbauteils
DE102021101657B4 (de) 2021-01-26 2024-12-12 Infineon Technologies Ag Verfahren zur Herstellung eines hybriden Bauelements
CN113205760B (zh) * 2021-04-29 2023-12-01 无锡唐古半导体有限公司 硅基微显示器及其驱动电路
US20230017865A1 (en) * 2021-07-15 2023-01-19 GM Global Technology Operations LLC Full color microled display controlled by number of red green and blue leds
US12336357B2 (en) 2021-11-24 2025-06-17 Meta Platforms Technologies, Llc Alignment-free micro-display architecture
TWI778883B (zh) * 2021-12-03 2022-09-21 友達光電股份有限公司 元件陣列基板
CN115172539A (zh) * 2022-06-23 2022-10-11 深圳市兆驰光元科技有限公司 Cob显示面板的制备方法及修复方法
CN115171543B (zh) * 2022-06-27 2023-10-31 湖北长江新型显示产业创新中心有限公司 显示面板及拼接显示装置
KR20250084922A (ko) * 2022-09-29 2025-06-11 삼성전자주식회사 인접한 픽셀들에 위치된 부분들을 갖는 led 다이를 포함하는 발광 장치 및 이의 제조 방법
WO2024211607A1 (en) * 2023-04-05 2024-10-10 Tectus Corporation Ultra-dense micro-led array with partially overlapping microlenses
KR102831649B1 (ko) * 2023-08-28 2025-07-07 한국로봇융합연구원 수중 보행 로봇용 자석발 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101449382A (zh) * 2006-04-12 2009-06-03 剑桥显示技术有限公司 光电显示器及其制造方法
CN102473704A (zh) * 2009-07-20 2012-05-23 欧司朗光电半导体有限公司 用于制造发光机构的方法和发光机构
CN103178192A (zh) * 2013-03-11 2013-06-26 深圳市奥拓电子股份有限公司 一种高清晰度led显示屏及其超小点间距贴片式led复合灯
US20140159043A1 (en) * 2012-12-10 2014-06-12 LuxVue Technology Corporation Active matrix display panel with ground tie lines
CN107078132A (zh) * 2014-07-31 2017-08-18 欧库勒斯虚拟现实有限责任公司 硅基彩色iled显示器

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7091986B2 (en) * 1997-09-13 2006-08-15 Gia Chuong Phan Dynamic pixel resolution, brightness and contrast for displays using spatial elements
JP3906653B2 (ja) * 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
JP2003084690A (ja) 2001-09-12 2003-03-19 Matsushita Electric Ind Co Ltd Ｌｅｄ表示装置
EP2326143B1 (en) 2003-01-24 2013-04-24 Semiconductor Energy Laboratory Co., Ltd. Electronic book
US6962835B2 (en) 2003-02-07 2005-11-08 Ziptronix, Inc. Method for room temperature metal direct bonding
WO2004097947A2 (en) 2003-05-02 2004-11-11 University College Cork-National University Of Ireland, Cork Light emitting diodes and the manufacture thereof
US7408566B2 (en) 2003-10-22 2008-08-05 Oki Data Corporation Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device
CN2741133Y (zh) 2004-09-07 2005-11-16 张艳君 可共享像素的led点阵显示模块
JP2007027157A (ja) * 2005-07-12 2007-02-01 Akita Denshi Systems:Kk 発光ダイオード装置及びその製造方法並びに照明装置
JP2007180163A (ja) 2005-12-27 2007-07-12 Samsung Electronics Co Ltd 発光デバイスモジュール
JP2008218733A (ja) 2007-03-05 2008-09-18 Mikku:Kk カラー表示用ｌｅｄパネル
CN103022282B (zh) * 2008-07-07 2016-02-03 格罗有限公司 纳米结构led
JP2010024557A (ja) 2008-07-16 2010-02-04 Mitsubishi Rayon Co Ltd 仮撚加工糸及びその製造方法並びにその織編物
EP2218571A1 (en) * 2009-01-30 2010-08-18 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Illumination system for use in a stereolithography apparatus
JP4951018B2 (ja) * 2009-03-30 2012-06-13 株式会社東芝 半導体装置の製造方法
US8865489B2 (en) 2009-05-12 2014-10-21 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
US8557616B2 (en) 2009-12-09 2013-10-15 Nano And Advanced Materials Institute Limited Method for manufacturing a monolithic LED micro-display on an active matrix panel using flip-chip technology and display apparatus having the monolithic LED micro-display
US20130278631A1 (en) * 2010-02-28 2013-10-24 Osterhout Group, Inc. 3d positioning of augmented reality information
US8835903B2 (en) 2010-07-29 2014-09-16 National Tsing Hua University Light-emitting diode display and method of producing the same
DE102011016308A1 (de) 2011-04-07 2012-10-11 Osram Opto Semiconductors Gmbh Anzeigevorrichtung
JP5966412B2 (ja) 2011-04-08 2016-08-10 ソニー株式会社 画素チップ、表示パネル、照明パネル、表示装置および照明装置
CN102903804B (zh) * 2011-07-25 2015-12-16 财团法人工业技术研究院 发光元件的转移方法以及发光元件阵列
US9620478B2 (en) * 2011-11-18 2017-04-11 Apple Inc. Method of fabricating a micro device transfer head
US9368546B2 (en) * 2012-02-15 2016-06-14 Microsoft Technology Licensing, Llc Imaging structure with embedded light sources
US20140056003A1 (en) * 2012-08-20 2014-02-27 John Frattalone Modular video and lighting displays
GB201215632D0 (en) 2012-09-03 2012-10-17 Infiniled Ltd Optical device
US9153171B2 (en) 2012-12-17 2015-10-06 LuxVue Technology Corporation Smart pixel lighting and display microcontroller

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101449382A (zh) * 2006-04-12 2009-06-03 剑桥显示技术有限公司 光电显示器及其制造方法
CN102473704A (zh) * 2009-07-20 2012-05-23 欧司朗光电半导体有限公司 用于制造发光机构的方法和发光机构
US20140159043A1 (en) * 2012-12-10 2014-06-12 LuxVue Technology Corporation Active matrix display panel with ground tie lines
CN103178192A (zh) * 2013-03-11 2013-06-26 深圳市奥拓电子股份有限公司 一种高清晰度led显示屏及其超小点间距贴片式led复合灯
CN107078132A (zh) * 2014-07-31 2017-08-18 欧库勒斯虚拟现实有限责任公司 硅基彩色iled显示器
CN113937092A (zh) * 2014-07-31 2022-01-14 脸谱科技有限责任公司 硅基彩色iled显示器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113937092A (zh) * 2014-07-31 2022-01-14 脸谱科技有限责任公司 硅基彩色iled显示器

Also Published As

Publication number Publication date
CN107078132B (zh) 2021-11-05
CN113937092A (zh) 2022-01-14
KR102473326B1 (ko) 2022-12-05
EP3175482A1 (en) 2017-06-07
WO2016016460A1 (en) 2016-02-04
JP2021005087A (ja) 2021-01-14
US10984705B2 (en) 2021-04-20
US20200126477A1 (en) 2020-04-23
KR20220164075A (ko) 2022-12-12
US11244605B2 (en) 2022-02-08
GB201413578D0 (en) 2014-09-17
US10515580B2 (en) 2019-12-24
KR20170037975A (ko) 2017-04-05
CN107078132A (zh) 2017-08-18
JP7248828B2 (ja) 2023-03-29
KR20220164076A (ko) 2022-12-12
JP2022058485A (ja) 2022-04-12
JP6741649B2 (ja) 2020-08-19
EP3175482B1 (en) 2021-05-19
JP7004777B2 (ja) 2022-01-21
JP2017529557A (ja) 2017-10-05
EP3826055A1 (en) 2021-05-26
US20210217356A1 (en) 2021-07-15
JP7473702B2 (ja) 2024-04-23
JP2023088953A (ja) 2023-06-27
KR20220164074A (ko) 2022-12-12
US11468830B2 (en) 2022-10-11
US20220148495A1 (en) 2022-05-12
US20170213502A1 (en) 2017-07-27

Similar Documents

Publication Publication Date Title
JP7248828B2 (ja) シリコン上のカラーｉｌｅｄディスプレイ
JP7170809B2 (ja) 発光装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: California, USA

Applicant after: Yuan Platform Technology Co.,Ltd.

Address before: California, USA

Applicant before: Facebook Technologies, LLC

CB02 Change of applicant information