CN103178192A - 一种高清晰度led显示屏及其超小点间距贴片式led复合灯 - Google Patents
一种高清晰度led显示屏及其超小点间距贴片式led复合灯 Download PDFInfo
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- CN103178192A CN103178192A CN2013100759760A CN201310075976A CN103178192A CN 103178192 A CN103178192 A CN 103178192A CN 2013100759760 A CN2013100759760 A CN 2013100759760A CN 201310075976 A CN201310075976 A CN 201310075976A CN 103178192 A CN103178192 A CN 103178192A
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- lamp
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (10)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310075976.0A CN103178192B (zh) | 2013-03-11 | 一种高清晰度led显示屏及其超小点间距贴片式led复合灯 | |
PL13838095T PL2802020T3 (pl) | 2013-03-11 | 2013-03-26 | Wyświetlacz ekranowy LED wysokiej rozdzielczości oraz jego montowana powierzchniowo zespolona lampa LED o super-małej odległości między punktami |
EP13838095.1A EP2802020B1 (en) | 2013-03-11 | 2013-03-26 | High-definition led display screen and surface-mounted led composite lamp with super-small point distance thereof |
US14/382,346 US9494302B2 (en) | 2013-03-11 | 2013-03-26 | High-definition LED display screen and surface-mounted LED composite lamp with ultra-small point distance thereof |
PCT/CN2013/073191 WO2014139189A1 (zh) | 2013-03-11 | 2013-03-26 | 一种高清晰度led显示屏及其超小点间距贴片式led复合灯 |
JP2015561897A JP2016512344A (ja) | 2013-03-11 | 2013-03-26 | 高解像度ledディスプレイ及びその超微細ドットピッチを有する表面実装型ledコンビネーションランプ |
TW102130336A TW201435241A (zh) | 2013-03-11 | 2013-08-23 | 高清晰度led顯示器及其超小點間距貼片式led複合燈 |
JP2017002931U JP3213621U (ja) | 2013-03-11 | 2017-06-28 | 高解像度ledディスプレイ及びその超微細ドットピッチを有する表面実装型ledコンビネーションランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310075976.0A CN103178192B (zh) | 2013-03-11 | 一种高清晰度led显示屏及其超小点间距贴片式led复合灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103178192A true CN103178192A (zh) | 2013-06-26 |
CN103178192B CN103178192B (zh) | 2016-11-30 |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104218135A (zh) * | 2013-05-29 | 2014-12-17 | 惠州科锐半导体照明有限公司 | 固态发射器封装、多像素发射封装和led显示器 |
CN106299097A (zh) * | 2016-10-11 | 2017-01-04 | 黄福强 | 一种正贴正发光led、灯条及高透率显示屏 |
US9831393B2 (en) | 2010-07-30 | 2017-11-28 | Cree Hong Kong Limited | Water resistant surface mount device package |
CN107968101A (zh) * | 2017-12-26 | 2018-04-27 | 上海得倍电子技术有限公司 | 一种高清led显示屏模组结构及其制造方法 |
CN108352147A (zh) * | 2015-11-13 | 2018-07-31 | 奥斯兰姆奥普托半导体有限责任公司 | 用于视频墙的模块 |
CN109102762A (zh) * | 2018-09-25 | 2018-12-28 | 深圳市奥拓电子股份有限公司 | Led复合灯、led显示模组及led显示屏 |
CN109524528A (zh) * | 2017-09-20 | 2019-03-26 | 宏齐科技股份有限公司 | 发光二极管封装 |
CN109741685A (zh) * | 2019-02-18 | 2019-05-10 | 深圳市洲明科技股份有限公司 | 一种led显示模组及其制作方法 |
WO2019148779A1 (zh) * | 2018-02-02 | 2019-08-08 | 深圳市奥拓电子股份有限公司 | Led 灯珠及 led 显示结构 |
US10431567B2 (en) | 2010-11-03 | 2019-10-01 | Cree, Inc. | White ceramic LED package |
CN113948544A (zh) * | 2021-10-15 | 2022-01-18 | 厦门天马微电子有限公司 | 显示面板、拼接屏和显示装置 |
CN114927066A (zh) * | 2022-06-17 | 2022-08-19 | 滁州惠科光电科技有限公司 | 背光模组和显示装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6599768B1 (en) * | 2002-08-20 | 2003-07-29 | United Epitaxy Co., Ltd. | Surface mounting method for high power light emitting diode |
CN101567323A (zh) * | 2009-05-27 | 2009-10-28 | 深圳市蓝科电子有限公司 | 一种显示屏用三基色发光二极管的制造方法 |
CN101770748A (zh) * | 2010-01-12 | 2010-07-07 | 北京利亚德电子科技有限公司 | Led面板电视显示面板的扫描方法 |
CN202171911U (zh) * | 2011-03-28 | 2012-03-21 | 泉州彩亮电子有限公司 | 一种改进的led面罩 |
CN202711616U (zh) * | 2012-07-13 | 2013-01-30 | 深圳市金立翔科技有限公司 | Led显示屏面罩 |
CN102945845A (zh) * | 2012-11-13 | 2013-02-27 | 佛山市国星光电股份有限公司 | 一种显示屏用的led器件及显示模组 |
CN203150614U (zh) * | 2013-03-11 | 2013-08-21 | 深圳市奥拓电子股份有限公司 | 一种高清晰度led显示屏及其超小点间距贴片式led复合灯 |
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6599768B1 (en) * | 2002-08-20 | 2003-07-29 | United Epitaxy Co., Ltd. | Surface mounting method for high power light emitting diode |
CN101567323A (zh) * | 2009-05-27 | 2009-10-28 | 深圳市蓝科电子有限公司 | 一种显示屏用三基色发光二极管的制造方法 |
CN101770748A (zh) * | 2010-01-12 | 2010-07-07 | 北京利亚德电子科技有限公司 | Led面板电视显示面板的扫描方法 |
CN202171911U (zh) * | 2011-03-28 | 2012-03-21 | 泉州彩亮电子有限公司 | 一种改进的led面罩 |
CN202711616U (zh) * | 2012-07-13 | 2013-01-30 | 深圳市金立翔科技有限公司 | Led显示屏面罩 |
CN102945845A (zh) * | 2012-11-13 | 2013-02-27 | 佛山市国星光电股份有限公司 | 一种显示屏用的led器件及显示模组 |
CN203150614U (zh) * | 2013-03-11 | 2013-08-21 | 深圳市奥拓电子股份有限公司 | 一种高清晰度led显示屏及其超小点间距贴片式led复合灯 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9831393B2 (en) | 2010-07-30 | 2017-11-28 | Cree Hong Kong Limited | Water resistant surface mount device package |
US10431567B2 (en) | 2010-11-03 | 2019-10-01 | Cree, Inc. | White ceramic LED package |
CN104218135A (zh) * | 2013-05-29 | 2014-12-17 | 惠州科锐半导体照明有限公司 | 固态发射器封装、多像素发射封装和led显示器 |
CN108352147A (zh) * | 2015-11-13 | 2018-07-31 | 奥斯兰姆奥普托半导体有限责任公司 | 用于视频墙的模块 |
CN108352147B (zh) * | 2015-11-13 | 2021-02-26 | 奥斯兰姆奥普托半导体有限责任公司 | 用于视频墙的模块 |
CN106299097A (zh) * | 2016-10-11 | 2017-01-04 | 黄福强 | 一种正贴正发光led、灯条及高透率显示屏 |
CN106299097B (zh) * | 2016-10-11 | 2024-02-09 | 黄福强 | 一种正贴正发光led、灯条及高透率显示屏 |
CN109524528A (zh) * | 2017-09-20 | 2019-03-26 | 宏齐科技股份有限公司 | 发光二极管封装 |
CN107968101A (zh) * | 2017-12-26 | 2018-04-27 | 上海得倍电子技术有限公司 | 一种高清led显示屏模组结构及其制造方法 |
WO2019148779A1 (zh) * | 2018-02-02 | 2019-08-08 | 深圳市奥拓电子股份有限公司 | Led 灯珠及 led 显示结构 |
WO2020062765A1 (zh) * | 2018-09-25 | 2020-04-02 | 深圳市奥拓电子股份有限公司 | Led复合灯、led显示模组及led显示屏 |
CN109102762A (zh) * | 2018-09-25 | 2018-12-28 | 深圳市奥拓电子股份有限公司 | Led复合灯、led显示模组及led显示屏 |
CN109102762B (zh) * | 2018-09-25 | 2024-03-29 | 深圳市奥拓电子股份有限公司 | Led复合灯、led显示模组及led显示屏 |
CN109741685A (zh) * | 2019-02-18 | 2019-05-10 | 深圳市洲明科技股份有限公司 | 一种led显示模组及其制作方法 |
CN113948544A (zh) * | 2021-10-15 | 2022-01-18 | 厦门天马微电子有限公司 | 显示面板、拼接屏和显示装置 |
CN113948544B (zh) * | 2021-10-15 | 2023-09-12 | 厦门天马微电子有限公司 | 显示面板、拼接屏和显示装置 |
CN114927066A (zh) * | 2022-06-17 | 2022-08-19 | 滁州惠科光电科技有限公司 | 背光模组和显示装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2016512344A (ja) | 2016-04-25 |
EP2802020A4 (en) | 2015-04-15 |
US20150204525A1 (en) | 2015-07-23 |
PL2802020T3 (pl) | 2017-06-30 |
US9494302B2 (en) | 2016-11-15 |
TW201435241A (zh) | 2014-09-16 |
EP2802020A1 (en) | 2014-11-12 |
EP2802020B1 (en) | 2016-10-05 |
WO2014139189A1 (zh) | 2014-09-18 |
JP3213621U (ja) | 2017-11-24 |
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