CN113864743A - Photo-thermal integrated radiator - Google Patents

Photo-thermal integrated radiator Download PDF

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Publication number
CN113864743A
CN113864743A CN202111230350.3A CN202111230350A CN113864743A CN 113864743 A CN113864743 A CN 113864743A CN 202111230350 A CN202111230350 A CN 202111230350A CN 113864743 A CN113864743 A CN 113864743A
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CN
China
Prior art keywords
light source
source substrate
heat
groove
cover plate
Prior art date
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Pending
Application number
CN202111230350.3A
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Chinese (zh)
Inventor
董宜放
于樱迎
胡学功
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Engineering Thermophysics of CAS
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Institute of Engineering Thermophysics of CAS
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Publication date
Application filed by Institute of Engineering Thermophysics of CAS filed Critical Institute of Engineering Thermophysics of CAS
Priority to CN202111230350.3A priority Critical patent/CN113864743A/en
Publication of CN113864743A publication Critical patent/CN113864743A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The present disclosure provides a light and heat integration radiator, include: the light source bearing part comprises a light source substrate, the light source substrate is used for emitting light, and the light source bearing part can lead out heat generated by the light source substrate; the heat dissipation part comprises a connecting hole, the connecting hole is a through hole, the light source bearing part covers one end of the connecting hole, and the heat dissipation part is used for dissipating the transferred heat; the condensation cover plate is used for covering the other end of the connecting hole to form a vacuum cavity, and the vacuum cavity is filled with a phase change working medium; the phase change working medium can receive heat generated by the light source substrate and transmit the heat to the heat dissipation part.

Description

Photo-thermal integrated radiator
Technical Field
The utility model relates to a heat dissipation cooling technology field especially relates to a light and heat integration radiator.
Background
The conventional high-power lamp has high energy consumption, low lighting effect and short service life, and the high-power-density LED lamp is urgently needed to replace the conventional lighting product. However, 70% -80% of input power of the LED light source is converted into heat at present, and the junction temperature of the LED chip is increased due to the accumulation of high heat productivity, so that the problems of light emitting spectral line drift, light efficiency reduction, service life shortening and the like are caused. Heat dissipation is therefore a key bottleneck limiting the development of high power, high power density LED devices. At present, the heat dissipation capability of common section heat dissipation and heat pipe technologies in the market is very limited, and efficient and reliable heat management of a high-power-density LED is difficult to realize.
The micro-nano groove group phase change radiator is characterized in that an open micro-channel array structure is constructed on the evaporation surface of the micro-nano groove group phase change radiator, and the formation of an extended meniscus evaporation thin liquid film is promoted in the three-phase contact line area in a channel. Under the condition of high heat load, composite phase change heat exchange of thin liquid film evaporation and nucleation boiling in a thick liquid film area can occur in the micro-groove channel, so the micro-groove group composite phase change heat exchange technology is taken as an efficient passive micro-scale phase change heat exchange technology, can realize super strong heat exchange under the conditions of low thermal resistance, small temperature difference and high heat flow density, is an efficient and high-performance passive micro-scale phase change heat exchange technology suitable for the ultrahigh heat flow density, and is applied to the field of high-power LED lamp radiators in a large scale at present.
However, in the design of the conventional LED lamp radiator, the space between the heat-taking surface of the micro-groove group radiator and the LED light source substrate can only be filled with interface materials such as heat-conducting silicone grease and heat-conducting silicone, and the large interface thermal resistance severely limits the heat-taking capability of the micro-groove group radiator, so that the surface temperature of the light source is relatively high, and the light efficiency and the service life of the LED light source are seriously affected.
Disclosure of Invention
Technical problem to be solved
Based on the above problem, this disclosure provides a light and heat integration radiator to alleviate the technical problem such as radiating efficiency hangs down among the prior art.
(II) technical scheme
The utility model provides a light and heat integration radiator includes:
the light source bearing part comprises a light source substrate, the light source substrate is used for emitting light, and the light source bearing part can lead out heat generated by the light source substrate;
the heat dissipation part comprises a connecting hole, the connecting hole is a through hole, the light source bearing part covers one end of the connecting hole, and the heat dissipation part is used for dissipating the transferred heat;
the condensation cover plate is used for covering the other end of the connecting hole to form a vacuum cavity, and the vacuum cavity is filled with a phase change working medium;
the phase change working medium can receive heat generated by the light source substrate and transmit the heat to the heat dissipation part.
In an embodiment of the present disclosure, the light source bearing part further includes:
the opening evaporation cover plate is used for bearing the light source substrate and provided with an opening, and a sealing rubber ring groove is formed in the periphery of the opening evaporation cover plate;
the sealing rubber ring is arranged in the sealing rubber ring groove, and the light source substrate is connected with the sealing rubber ring in a propping manner;
and the light source gland is fixedly connected to the opening evaporation cover plate and is used for compressing the light source substrate to form the seal of the light source substrate on the side of the vacuum cavity body.
In the embodiment of the disclosure, the vacuum cavity side of the opening evaporation cover plate is a microgroove strengthened surface, the microgroove strengthened surface is provided with a groove, and the groove can increase the contact area with the phase change working medium.
In the embodiment of the present disclosure, the groove is one of a rectangular groove, a sawtooth groove and a trapezoidal groove.
In an embodiment of the present disclosure, the dimensions of the groove are: the groove width is 20-5000 μm, the groove depth is 20-5000 μm, and the groove pitch is 20-5000 μm.
In an embodiment of the present disclosure, the light source cover includes:
a through hole for passing light emitted from the light source substrate;
and the outlet groove is used for providing a power supply line for supplying power to the light source substrate.
In an embodiment of the present disclosure, the heat dissipating part further includes:
and the radiating fins are uniformly arranged on the radiating part outside the vacuum cavity and are used for increasing the radiating area of the radiating part.
In an embodiment of the present disclosure, the heat dissipation fin includes:
the thick fins are uniformly arranged on the heat dissipation part and provided with connecting holes, and the photo-thermal integrated radiator can be linked with the outside through the connecting holes;
and the fine fins are uniformly arranged on the heat dissipation part and are uniformly arranged between every two coarse fins.
In the embodiment of the disclosure, the condensation cover plate is provided with a sealing port, and the phase change working medium can be charged into the vacuum cavity through the sealing port.
In the embodiment of the disclosure, the phase change working medium is one or a combination of distilled water, electronic fluorinated liquid, deionized water, ethanol, methanol and liquid metal.
(III) advantageous effects
According to the technical scheme, the photo-thermal integrated radiator disclosed by the invention at least has one or one part of the following beneficial effects:
(1) the thermal resistance of the interface between the light source substrate and the evaporation cover plate is eliminated structurally; and
(2) the opening evaporation cover plate of the radiator is matched with the vacuum cavity of the radiator, so that the heat dissipation capacity of high power and high power density is realized.
Drawings
Fig. 1 is a schematic view of an overall structure of a photo-thermal integrated heat sink according to an embodiment of the disclosure.
Fig. 2 is a schematic cross-sectional view of the overall structure of the photothermal integrated heat sink according to the embodiment of the disclosure.
Fig. 3 is a schematic view of an outer surface of a light source gland of the photothermal integrated heat sink according to the embodiment of the disclosure.
Fig. 4 is a schematic view of the inner surface of the light source gland of the photothermal integrated heat sink according to the embodiment of the disclosure.
Fig. 5 is a schematic view of an outer surface of a light source substrate of the integrated photo-thermal heat sink according to the embodiment of the disclosure.
Fig. 6 is a schematic view of an inner surface of a light source substrate of the integrated photothermal heat sink according to the embodiment of the disclosure.
Fig. 7 is a schematic view of a sealing rubber ring of the photothermal integrated heat sink according to the embodiment of the disclosure.
Fig. 8 is a schematic view of the outer surface of the evaporation cover plate of the photothermal integrated heat sink according to the embodiment of the disclosure.
Fig. 9 is a schematic view of the inner surface of the evaporation cover plate of the photothermal integrated heat sink according to the embodiment of the disclosure.
Fig. 10 is a schematic view of an outer surface of a condensing cover plate of the photothermal integrated heat sink according to the embodiment of the disclosure.
Fig. 11 is a schematic cross-sectional view of a rectangular groove on the strengthened surface of the micro-groove of the photothermal integrated heat sink according to the embodiment of the disclosure.
Fig. 12 is a schematic cross-sectional view of a zigzag groove on the strengthened surface of the micro-groove of the photothermal integrated heat sink according to the embodiment of the disclosure.
Fig. 13 is a schematic cross-sectional view of a dovetail groove on the strengthened surface of the micro-groove of the photothermal integrated heat sink according to the embodiment of the disclosure.
[ description of main reference numerals in the drawings ] of the embodiments of the present disclosure
10 light source gland
20 light source substrate
30-opening evaporation cover plate
40 vacuum chamber
50 condensation cover plate
60 radiating fin
70 sealing rubber ring
11 coarse fin
12 thin fin
13 outlet groove
14 through hole
15 phase change working medium
16 sealing port
17 sealing rubber ring groove
111 micro-groove reinforced surface structure
112 light source external surface
113 light source cover inner surface
114 outer surface of light source substrate
115 light source substrate inner surface
116 open evaporative cover plate outer surface
Inner surface of 117 opening evaporation cover plate
Detailed Description
The utility model provides a light and heat integration radiator compares with traditional light source radiator, and radiator opening evaporation apron cooperates with radiator vacuum cavity. The opening evaporation cover plate is provided with the through opening by taking the circle center as the center, so that the heat dissipation capability of high power and high power density is further realized, and the requirements of the heat radiator on small volume, light weight, material saving, cost saving, energy saving and consumption reduction are met. Can overcome the main defects of the prior light source radiator.
For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
In an embodiment of the present disclosure, there is provided a photo-thermal integrated heat sink, as shown in fig. 1 to 2, a manufacturing method includes: the light source bearing part comprises a light source substrate 20, the light source substrate 20 is used for emitting light, and the light source bearing part can lead out heat generated by the light source substrate 20. The heat dissipation part comprises a connecting hole, the connecting hole is a through hole, the light source bearing part covers one end of the connecting hole, and the heat dissipation part is used for dissipating the transferred heat. And the condensation cover plate 50 is used for covering the other end of the connecting hole to form a vacuum cavity 40, and the phase change working medium 15 is filled in the vacuum cavity 40. The phase change working medium 15 can receive heat generated by the light source substrate and transfer the heat to the heat dissipation part.
In the embodiment of the present disclosure, as shown in fig. 3 to 9, the light source bearing part further includes: the opening evaporation cover plate 30 is used for bearing the light source substrate, the opening evaporation cover plate 30 is provided with an opening, and the sealing gasket groove 17 is formed around the opening of the opening evaporation cover plate 30. And the sealing rubber ring 70 is arranged in the sealing rubber ring groove 17, and the light source substrate is connected with the sealing rubber ring 70 in an abutting mode. And the light source gland 10 is fixedly connected to the opening evaporation cover plate 30, and the light source gland 10 is used for compressing the light source substrate to form the seal of the vacuum cavity side of the light source substrate.
In the disclosed embodiment, as shown in fig. 8-9, an open evaporation cover plate is mated with the vacuum chamber. The opening evaporation cover plate is provided with a through opening by taking the circle center as the center, and the opening can be square, rectangular, circular or other irregular shapes.
In the embodiment of the present disclosure, the vacuum chamber side of the opening evaporation cover plate, i.e. the inner surface 117 of the opening evaporation cover plate, is a micro-groove strengthened surface, and the micro-groove strengthened surface has a groove, and the groove can increase the contact area with the phase change working medium.
In the embodiment of the present disclosure, the groove is one of a rectangular groove, a sawtooth-shaped groove, and a trapezoidal groove.
In the disclosed embodiments, the groove dimensions are: the groove width is 20-5000 μm, the groove depth is 20-5000 μm, and the groove pitch is 20-5000 μm.
The photo-thermal integrated radiator provided by the embodiment of the disclosure creatively provides that a reinforced surface structure is directly processed on the inner surface of the light source substrate, and the heat-taking surface of the light source substrate and the heat-taking surface of the radiator are designed into an integrated device, so that the interface thermal resistance between the light source substrate and the radiator is structurally eliminated, the heat-taking capacity is greatly improved, and the heat-radiating performance of the radiator is improved.
In the embodiment of the present disclosure, as shown in fig. 3 to 4, the light source cover 10 includes: and a through hole 14 for passing light emitted from the light source substrate. And an outlet groove 13 for providing a power supply line for supplying power to the light source substrate.
In an embodiment of the present disclosure, as shown in fig. 1, the heat dissipation portion further includes: and the plurality of radiating fins 60 are uniformly arranged on the radiating part outside the vacuum cavity, and the radiating fins 60 are used for increasing the radiating area of the radiating part.
In the embodiment of the present disclosure, as shown in fig. 1, the heat dissipation fin includes: a plurality of thick fins 11 evenly set up on the heat dissipation portion, and thick fin 11 is provided with the connecting hole, can link light and heat integration radiator and outside through the connecting hole. And the thin fins 12 are uniformly arranged on the heat dissipation part and are uniformly arranged between every two thick fins 11.
In the embodiment of the present disclosure, as shown in fig. 10, the condensation cover plate 50 is provided with a sealing port through which the phase change working medium can be charged into the vacuum chamber.
In the embodiment of the disclosure, the phase-change working medium is packaged in the vacuum cavity, and under a certain vacuum degree and liquid filling rate, the cycle process of heat absorption (liquid-vapor) and heat release (vapor-liquid) can be completed in the cavity. The vacuum cavity is externally provided with the thick fins and the thin fins which are uniformly distributed, and the high rib efficiency and the natural convection coefficient are realized through reasonable spatial layout according to the heat transfer science and the aerodynamics. The central area of the inner surface of the evaporation cover plate of the opening of the radiator is penetrated, and the rest part of the evaporation cover plate is provided with a strengthened surface structure, so that the number of vaporization cores is increased, the separation radius of the vapor bubbles is reduced, and the separation frequency of the vapor bubbles is increased by improving the dynamic behavior of the vapor bubbles, thereby further strengthening boiling heat transfer and improving the heat extraction capability. The inner surface of the light source substrate is provided with a reinforced surface structure, and the light source substrate and the opening evaporation cover plate of the radiator are designed into an integrated device, so that the interface thermal resistance between the light source substrate and the radiator is structurally eliminated. The opening evaporation cover plate and the light source substrate are assembled and sealed through the light source gland, the sealing rubber ring and the screw. The outer surface of the radiator condensation cover plate is provided with an encapsulation structure. So far, through the space structure design to radiator vacuum cavity, opening evaporation apron and condensation apron and the outside fin of vacuum cavity, obtained and be applicable to the high heat flux density and get hot light integration radiator, the omnidirectional has promoted the holistic ability of getting hot, heat conduction, heat-sinking of radiator.
In the embodiment of the present disclosure, the outside of the vacuum chamber is uniformly distributed with thick fins and thin fins. The 4 thick fins are respectively centrosymmetric, the periphery of the radiator is divided into 4 areas in equal proportion, the thin fins are uniformly distributed in the four areas, the number of the thin fins in each area is N, N is more than or equal to 4, the thick fins and the thin fins are provided with chamfers, and R is more than or equal to 1.
In an embodiment of the present disclosure, the phase change working medium includes: at least one of distilled water, electronic fluorinated liquid, deionized water, ethanol, methanol, liquid metal or refrigerant.
In the embodiment of the disclosure, the evaporation cover plate of the opening of the heat sink and the inner surface of the light source substrate are provided with reinforced surface structures for improving the dynamic behavior of bubbles, increasing the number of gasification cores and further strengthening boiling heat transfer.
In the embodiment of the present disclosure, the opening evaporation cover plate and the light source substrate are sealed by assembling the light source gland, the sealing rubber ring and the screw.
In an embodiment of the present disclosure, the strengthened surface comprises: at least one of a micro-nano structure surface, a wetting characteristic surface, a hydrophilic/hydrophobic structure surface, a coating surface and an electrochemical deposition surface.
In the embodiment of the present disclosure, the heat sink vacuum cavity, the open evaporation cover plate, the condensation cover plate, the light source substrate, the light source gland, the coarse fins and the fine fins are made of at least one of metal, alloy, plastic and plastic metal.
Specifically, as shown in fig. 1 to 10, the working principle of the photo-thermal integrated heat sink provided by the present disclosure is as follows: the open evaporating cover plate 30 is sealed with the light source substrate 20 by the light source gland 10, the sealing rubber ring 70 and the screw assembly. The circle center of the opening evaporation cover plate 30 is provided with an area of 1-1000 cm2Wherein the shape of the through-opening 14 can be square, rectangular, circular or other irregular shapes. The inner surface 115 of the light source substrate and the inner surface 117 of the opening evaporation cover plate are provided with reinforced surface structures, so that the dynamic behavior of bubbles is improved while the heat exchange area is increased, and the purpose of heat transfer reinforcement is achieved. When the vacuum cavity 40 has a phase-change working medium 15 with a certain liquid filling rate, the phase-change working medium 15 is in direct contact with the inner surface 115 of the light source substrate and the inner surface 117 of the opening evaporation cover plate, and boiling heat exchange can be realized at the inner surface 115 of the light source substrate, so that a heat taking path in a traditional light source radiator, in which heat needs to be conducted from the light source substrate to the evaporation surface of the radiator through an interface material, is eliminated, namely interface thermal resistance between a light source and the radiator is eliminated, and the total thermal resistance of the whole radiator system is reduced. The phase change working medium 15 is condensed on the inner wall surface of the vacuum cavity 40 and the condensation cover plate 50, heat is transported to the radiator fins, and the heat is transported to the external environment through natural convection. The present disclosure adopts a photo-thermal integrated radiator, andcompared with the traditional light source radiator, the light source radiator can be obtained by directly processing reinforced surface structures such as micro-nano scale groove groups and the like on the light source substrate and designing the reinforced surface structures and the opening evaporation cover plate as an integrated device, and the interface thermal resistance between the light source substrate and the evaporation cover plate can be eliminated structurally.
In the present embodiment, as shown in fig. 6, when the inner surface 115 of the light source substrate is the micro-groove strengthened surface structure 111, the phase-change working medium 15 enters the interior of the micro-groove under the driving of the capillary force of the micro-groove, and forms a meniscus shape in the micro-groove, and stable intra-groove nucleation boiling can be achieved in the heat sink vacuum cavity 40 under a certain liquid filling rate and vacuum degree.
The open micro-channel 11 comprises N strips, wherein N is more than or equal to 10, and the arrangement density is more than 2 strips/cm. The dimensions of the micro-groove strengthened surface structure 111 are: the groove width is 20-5000 μm, the groove depth is 20-5000 μm, and the groove pitch is 20-5000 μm.
In the present embodiment, as shown in fig. 11 to 13, the cross section of the micro-groove strengthening surface structure 111 is rectangular, zigzag, or trapezoidal.
In this embodiment, the phase change working medium 15 comprises: at least one of distilled water, electronic fluorinated liquid, deionized water, ethanol, methanol, liquid metal or refrigerant.
In this embodiment, the strengthened surface comprises: at least one of a micro-nano structure surface, a wetting characteristic surface, a hydrophilic/hydrophobic structure surface, a coating surface and an electrochemical deposition surface.
In this embodiment, the radiator vacuum cavity, the open evaporation cover plate, the condensation cover plate, the light source substrate, the light source gland, the thick fins and the thin fins are made of at least one of metal, alloy, plastic and plastic metal.
So far, the embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. It is to be noted that, in the attached drawings or in the description, the implementation modes not shown or described are all the modes known by the ordinary skilled person in the field of technology, and are not described in detail. Further, the above definitions of the various elements and methods are not limited to the various specific structures, shapes or arrangements of parts mentioned in the examples, which may be easily modified or substituted by those of ordinary skill in the art.
From the above description, those skilled in the art should clearly recognize that the photothermal integrated heat sink of the present disclosure.
In conclusion, the present disclosure provides a photo-thermal integrated radiator, which comprises a radiator vacuum cavity, an opening evaporation cover plate, a condensation cover plate, a light source substrate, a light source gland, a thick fin and a thin fin. The photo-thermal integrated radiator is internally provided with a closed cavity, and can realize stable in-pool boiling under certain vacuum degree and liquid filling rate. The method and the device have the advantages that the strengthened surface structure is directly processed on the light source substrate, and the heat-taking surface of the light source substrate and the heat-taking surface of the radiator are designed into an integrated device, so that the interface thermal resistance between the light source substrate and the radiator can be eliminated structurally, the total thermal resistance between the light source substrate and the condensing cover plate of the radiator is reduced, and the small size, the light weight, the material saving, the cost saving, the energy saving and the consumption reduction of the high-power-density radiator are further realized.
It should also be noted that directional terms, such as "upper", "lower", "front", "rear", "left", "right", and the like, used in the embodiments are only directions referring to the drawings, and are not intended to limit the scope of the present disclosure. Throughout the drawings, like elements are represented by like or similar reference numerals. Conventional structures or constructions will be omitted when they may obscure the understanding of the present disclosure.
And the shapes and sizes of the respective components in the drawings do not reflect actual sizes and proportions, but merely illustrate the contents of the embodiments of the present disclosure. Furthermore, in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.
Unless otherwise indicated, the numerical parameters set forth in the specification and attached claims are approximations that can vary depending upon the desired properties sought to be obtained by the present disclosure. In particular, all numbers expressing quantities of ingredients, reaction conditions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term "about". Generally, the expression is meant to encompass variations of ± 10% in some embodiments, 5% in some embodiments, 1% in some embodiments, 0.5% in some embodiments by the specified amount.
Furthermore, the word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.
The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify a corresponding element does not by itself connote any ordinal number of the element or any ordering of one element from another or the order of manufacture, and the use of the ordinal numbers is only used to distinguish one element having a certain name from another element having a same name.
In addition, unless steps are specifically described or must occur in sequence, the order of the steps is not limited to that listed above and may be changed or rearranged as desired by the desired design. The embodiments described above may be mixed and matched with each other or with other embodiments based on design and reliability considerations, i.e., technical features in different embodiments may be freely combined to form further embodiments.
Those skilled in the art will appreciate that the modules in the device in an embodiment may be adaptively changed and disposed in one or more devices different from the embodiment. The modules or units or components of the embodiments may be combined into one module or unit or component, and furthermore they may be divided into a plurality of sub-modules or sub-units or sub-components. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where at least some of such features and/or processes or elements are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Also in the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware.
Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the disclosure, various features of the disclosure are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various disclosed aspects. However, the disclosed method should not be interpreted as reflecting an intention that: that is, the claimed disclosure requires more features than are expressly recited in each claim. Rather, as the following claims reflect, disclosed aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this disclosure.
The above-mentioned embodiments are intended to illustrate the objects, aspects and advantages of the present disclosure in further detail, and it should be understood that the above-mentioned embodiments are only illustrative of the present disclosure and are not intended to limit the present disclosure, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present disclosure should be included in the scope of the present disclosure.

Claims (10)

1. An integrated photo-thermal heat sink comprising:
the light source bearing part comprises a light source substrate, the light source substrate is used for emitting light, and the light source bearing part can lead out heat generated by the light source substrate;
the heat dissipation part comprises a connecting hole, the connecting hole is a through hole, the light source bearing part covers one end of the connecting hole, and the heat dissipation part is used for dissipating the transferred heat;
the condensation cover plate is used for covering the other end of the connecting hole to form a vacuum cavity, and the vacuum cavity is filled with a phase change working medium;
the phase change working medium can receive heat generated by the light source substrate and transmit the heat to the heat dissipation part.
2. The photothermal integrated heat sink of claim 1, wherein the light source carrying portion further comprises:
the opening evaporation cover plate is used for bearing the light source substrate and provided with an opening, and a sealing rubber ring groove is formed in the periphery of the opening evaporation cover plate;
the sealing rubber ring is arranged in the sealing rubber ring groove, and the light source substrate is connected with the sealing rubber ring in a propping manner;
and the light source gland is fixedly connected to the opening evaporation cover plate and is used for compressing the light source substrate to form the seal of the light source substrate on the side of the vacuum cavity body.
3. The photothermal integrated heat sink according to claim 2, wherein the vacuum chamber side of the open evaporation cover plate is a micro-groove strengthened surface having a groove capable of increasing the contact area with the phase change working medium.
4. The integrated photothermal heat sink of claim 3 wherein the recess is one of a rectangular slot, a saw tooth slot, and a trapezoidal slot.
5. The photothermal integrated heat sink of claim 3, wherein the groove dimensions are: the groove width is 20-5000 μm, the groove depth is 20-5000 μm, and the groove pitch is 20-5000 μm.
6. The photothermal integrated heat sink of claim 2, wherein the light source gland comprises:
a through hole for passing light emitted from the light source substrate;
and the outlet groove is used for providing a power supply line for supplying power to the light source substrate.
7. The photo-thermal integrated heat sink of claim 1, wherein the heat sink portion further comprises:
and the radiating fins are uniformly arranged on the radiating part outside the vacuum cavity and are used for increasing the radiating area of the radiating part.
8. The photo-thermal integrated heat sink of claim 7, wherein the heat sink fins comprise:
the thick fins are uniformly arranged on the heat dissipation part and provided with connecting holes, and the photo-thermal integrated radiator can be linked with the outside through the connecting holes;
and the fine fins are uniformly arranged on the heat dissipation part and are uniformly arranged between every two coarse fins.
9. The photo-thermal integrated radiator of claim 1, wherein the condensation cover plate is provided with a sealing port through which the phase change working medium can be charged into the vacuum chamber.
10. The photothermal integrated heat sink of claim 1, wherein the phase change working medium is one or a combination of distilled water, an electron fluorinated liquid, deionized water, ethanol, methanol, and a liquid metal.
CN202111230350.3A 2021-10-21 2021-10-21 Photo-thermal integrated radiator Pending CN113864743A (en)

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CN202349965U (en) * 2011-12-15 2012-07-25 重庆大学 High-power integrated light emitting diode (LED) composite finned heat pipe radiator
CN103068210A (en) * 2012-12-27 2013-04-24 中国科学院深圳先进技术研究院 Novel motor controller heat dissipation system
CN206831267U (en) * 2017-05-11 2018-01-02 华南理工大学 Integrated high-power LED bay light based on phase-change heat transfer technology
CN207247152U (en) * 2017-09-21 2018-04-17 贵州永红换热冷却技术有限公司 A kind of LED lamp heat sink
CN109882810A (en) * 2017-12-06 2019-06-14 中国科学院工程热物理研究所 The heat sink arrangement of full angle LED projection lamp
CN111895519A (en) * 2020-07-20 2020-11-06 青岛海尔空调电子有限公司 Radiator and air condensing units

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201549488U (en) * 2009-09-30 2010-08-11 广东德豪润达电气股份有限公司 Metal substrate, radiating component and semiconductor device provided with radiating component
CN202349965U (en) * 2011-12-15 2012-07-25 重庆大学 High-power integrated light emitting diode (LED) composite finned heat pipe radiator
CN103068210A (en) * 2012-12-27 2013-04-24 中国科学院深圳先进技术研究院 Novel motor controller heat dissipation system
CN206831267U (en) * 2017-05-11 2018-01-02 华南理工大学 Integrated high-power LED bay light based on phase-change heat transfer technology
CN207247152U (en) * 2017-09-21 2018-04-17 贵州永红换热冷却技术有限公司 A kind of LED lamp heat sink
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