CN206918963U - A kind of heat sink - Google Patents
A kind of heat sink Download PDFInfo
- Publication number
- CN206918963U CN206918963U CN201720769821.0U CN201720769821U CN206918963U CN 206918963 U CN206918963 U CN 206918963U CN 201720769821 U CN201720769821 U CN 201720769821U CN 206918963 U CN206918963 U CN 206918963U
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- China
- Prior art keywords
- heat sink
- liquid interface
- liquid
- heat
- cover plate
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Abstract
The utility model provides a kind of heat sink, and the heat sink is that inside is the hollow-core construction with guiding gutter, and outside sets into liquid interface and goes out liquid interface;The heat sink specifically includes:Apparatus main body and cover plate, it is described enter liquid interface and go out liquid interface set on the cover board, boss cylinder is provided with described device main body, the guiding gutter is to be arranged on the annular diversion trench on the inside of cover plate, the boss cylinder matches with annular diversion trench, and both are mutually embedding to form the flow channel for liquids to interconnect afterwards.The heat that the utility model is sent by the liquid absorption thermal source in flow channel for liquids or light source, improve thermal source or light source service life and radiating efficiency;And multiple heat sink series connection can be carried out by entering liquid interface, going out liquid interface, to meet the needs of different heat radiation powers.
Description
Technical field
It the utility model is related to technical field of heat dissipation, and in particular to a kind of heat sink.
Background technology
Heat transfer is the heat transfer process that material is occurred under temperature difference effect, no matter in an interior of articles or one
Between a little objects, simply by the presence of the temperature difference, heat just will be spontaneously transmitted at low temperature with a certain or certain several ways at high temperature.
Heat transfer has three kinds of basic modes:Heat transfer (heat conduction), thermal convection current, heat radiation.By taking LED light source as an example, with conventional light source phase
Than LED outstanding feature is small volume, compact-sized, convenient embedded various light fixtures, as the carrier of light source, the radiating of light fixture
It is most important that design plays LED its advantage.If the radiating efficiency design of light fixture is higher, can not only extend LED uses the longevity
Life, can also mitigate the weight of light fixture, expand its application.Conversely, the performance of LED advantages can be then influenceed, or even as it
The bottleneck of application.
The radiating mode that we know at present generally has two kinds:The first is active radiating, that is, passes through additional fans, liquid
Methods of Forced refrigerating such as cold or heat pipe circuit, microchannel refrigeration, conductor refrigeration etc. are radiated.Second is passive
Formula radiates, and relies primarily on the free convection of air, is dispersed into heat caused by thermal source in air naturally by fin.
The radiating efficiency of active heat removal is higher compared to passive radiating in above two radiating mode, and the utility model is intended providing
A kind of heat sink suitable for liquid-cooling heat radiation.
Documents 1:A kind of heat sinks of CN104676545A, the heat sent for absorbing heater, the heating
Body is close, is close to or is embedded in the one side of the heat sink, and the another side of the heat sink is provided with multiple microprotrusions, shape
Into dimpling group, capillary slot road is provided between microprotrusion, and form capillary slot group;The dimpling group and capillary slot group leaching
Not in liquid refrigerant, capillary slot group forms capillary force, and the liquid refrigerant on capillary slot road side is drawn into micro-channel,
And the thin liquid film region of phase-change heat-exchange is formed in micro-channel;The heat sink is additionally provided with reservoir, and the reservoir is set
Put on the periphery, edge or outer rim that have microprotrusion face of the heat sink.
Documents 2:CN2499786Y provides a kind of heat sink, is made up of heat absorbing element one and heat absorbing element two, inhales
Thermal element one and heat absorbing element two are made by metal material, and heat absorbing element two is strip;Heat absorbing element one is quadrangle, heat absorption
Element two is evenly distributed on heat absorbing element one, and parallel with one side of heat absorbing element one.
The heat sink that above-mentioned documents 1 provide is radiated by the thin liquid film region in micro-channel, heat-sinking capability
It is limited.And the heat sink that documents 2 provide is absorbed heat by metal heat absorbing element, radiating, heat-sinking capability is also bad.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of heat sink for being used to radiate, and can absorb heat well
The heat that source or light source are sent, improve thermal source or light source service life and radiating efficiency.
In order to solve the above-mentioned technical problem, the utility model uses following technical scheme:
A kind of heat sink is provided,
The heat sink is that inside is the hollow-core construction with guiding gutter, and outside sets into liquid interface and goes out liquid interface;
The heat sink specifically includes:Apparatus main body and cover plate, it is described to enter liquid interface and to go out liquid interface and be arranged on cover plate
On, boss cylinder is provided with described device main body, the guiding gutter is to be arranged on the annular diversion trench on the inside of cover plate, described convex
Platform cylinder matches with annular diversion trench, and both are mutually embedding to form the flow channel for liquids to interconnect afterwards.
Further,
The boss cylinder, annular diversion trench are arranged in array.
Further,
Annular diversion trench on the inside of the cover plate can also be arranged to groove cylinder, the boss cylinder in apparatus main body
With the groove cylindrical on the inside of cover plate into the flow channel for liquids to interconnect.
Further,
The boss cylinder, groove cylinder are arranged in array.
Further,
Described device main body is provided with sealing ring with cover plate and is fixedly connected by screw between the two.
Further,
The heat sink enters liquid interface, goes out liquid interface and be connected respectively by pipeline with peripheral hardware liquid pump, liquid cooling heat radiator,
Realize the circulation and radiating of liquid.
Further,
It is the cold liquid of liquid being filled with by peripheral hardware liquid pump in the flow channel for liquids, the cold liquid of liquid can be water or superconducting fluid.
Further,
Entering liquid interface or going out for the heat sink sets temperature sensor at liquid interface, the temperature sensor is used to examine
The temperature of the cold liquid of liquid is surveyed, so as to control the rotating speed of the flow of liquid pump and fan.
During for radiating, the end face of the apparatus main body of heat sink can be arranged on light source or near heating sources, led to simultaneously
The liquid pump for crossing peripheral hardware absorbs the heat that light source or thermal source distribute to the cold liquid of liquid, the cold liquid of liquid is filled with inside heat sink, and by outer
If liquid cooling heat radiator radiating after flow back in the flow channel for liquids inside heat sink, so circulation, realize radiating.
Heat sink provided by the utility model, on the one hand, above-mentioned boss cylinder, groove cylinder, annular diversion trench
The area of dissipation in heat sink can be increased, on the other hand the cold liquid of liquid can be shunted, so that the cold liquid of liquid is more abundant
Take away heat.
During concrete application, the heat sink in the utility model can use single row or multiple rows heat sink, multiple rows of heat absorption
Device is specially to be connected using multiple above-mentioned heat sinks by entering liquid interface, going out liquid interface, to meet different radiating work(
The demand of rate.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the stereo-resolution structural representation of the heat sink of the utility model embodiment 1;
Fig. 2 is the section fractionation structural representation of the heat sink of the utility model embodiment 1;
Fig. 3 is the structural representation of the heat sink cover plate of the utility model embodiment 1;
Fig. 4 is the overall structure sectional view of the heat sink of the utility model embodiment 2;
Fig. 5 is the structural representation of the heat sink cover plate of the utility model embodiment 2;
Above-mentioned description of reference numerals:
Apparatus main body 101;Boss cylinder 1011;Cover plate 102;Annular diversion trench 1021;Groove cylinder 1021 ';It is close
Seal 103;Enter liquid interface 104;Go out liquid interface 105;Screw 106.
Embodiment
Below in conjunction with the accompanying drawings and embodiment further illustrates to utility model, but is not limited to model of the present utility model
Enclose.
Embodiment 1
As Figure 1-3, the present embodiment provides a kind of heat sink, and the heat sink is internal for guiding gutter
Hollow-core construction, outside set into liquid interface 104 and go out liquid interface 105;
The heat sink specifically includes:Apparatus main body 101 and cover plate 102, enter liquid interface 104 and go out liquid interface 105 to set
Put on cover plate 102, boss cylinder 1011 is provided with apparatus main body 101, guiding gutter is the annular for being arranged on the inner side of cover plate 102
Guiding gutter 1021, boss cylinder 1011 match with annular diversion trench 1021, and both are mutually embedding to form the liquid to interconnect afterwards
Runner.
The boss cylinder 1011, annular diversion trench 1021 are arranged in array.
Described device main body 101 and cover plate 102 are provided with sealing ring 102 and fixed by screw 106 between the two to be connected
Connect.
The heat sink enters liquid interface 104, goes out liquid interface 105 respectively by pipeline and peripheral hardware liquid pump, liquid-cooling heat radiation
Device connects, and realizes the circulation and radiating of liquid.
It is the cold liquid of liquid being filled with by peripheral hardware liquid pump in the runner, the cold liquid of liquid can be water or superconducting fluid.
Entering liquid interface 104 or going out for the heat sink sets temperature sensor, the temperature sensor at liquid interface 105
For detecting the temperature of the cold liquid of liquid, so as to control the rotating speed of the flow of liquid pump and fan.
During for radiating, the end face of the apparatus main body 101 of heat sink can be arranged on light source or near heating sources, simultaneously
For liquid pump by peripheral hardware to the cold liquid of liquid is filled with inside heat sink, the cold liquid of liquid absorbs the heat that light source or thermal source distribute, and passes through
Flowed back to after the liquid cooling heat radiator radiating of peripheral hardware in the flow channel for liquids inside heat sink, so circulation, realize radiating.
The heat sink that the present embodiment provides, on the one hand, above-mentioned boss cylinder 1011, annular diversion trench 1021 can be with
Increase the area of dissipation in heat sink, on the other hand the cold liquid of liquid can be shunted, so that the cold liquid of liquid more fully band
Walk heat.
During concrete application, the heat sink in the present embodiment can use single row or multiple rows heat sink, multiple rows of heat absorption dress
Put and specially connected using multiple above-mentioned heat sinks by entering liquid interface 104, going out liquid interface 105, to meet different dissipate
The demand of thermal power.
Embodiment 2
As illustrated in figures 4-5, the present embodiment and the difference of embodiment 1 are:
The annular diversion trench 1021 of the inner side of cover plate 102 can also be arranged to groove cylinder 1021 ', in apparatus main body 101
The groove cylinder 1021 ' of the inner side of boss cylinder 1011 and cover plate 102 form the flow channel for liquids to interconnect.
Boss cylinder 1011, groove cylinder 1021 ' are arranged in array.
The heat sink that the present embodiment provides, on the one hand, above-mentioned boss cylinder 1011, groove cylinder 1021 ' can be with
Increase the area of dissipation in heat sink, on the other hand the cold liquid of liquid can be shunted, so that the cold liquid of liquid more fully band
Walk heat.
The advantages of general principle of the present utility model, principal character and the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, the utility model can also on the premise of the spirit and scope of the utility model is not departed from
There are various changes and modifications, these changes and improvements are both fallen within claimed the scope of the utility model.The utility model will
Protection domain is asked to be defined by appended claims and its equivalent.
Claims (7)
- A kind of 1. heat sink, it is characterised in thatThe heat sink is that inside is the hollow-core construction with guiding gutter, and outside sets into liquid interface and goes out liquid interface;The heat sink specifically includes:Apparatus main body and cover plate, it is described enter liquid interface and go out liquid interface set on the cover board, institute State in apparatus main body and be provided with boss cylinder, the guiding gutter is to be arranged on the annular diversion trench on the inside of cover plate, the boss circle Cylinder matches with annular diversion trench, and both are mutually embedding to form the flow channel for liquids to interconnect afterwards.
- A kind of 2. heat sink according to claim 1, it is characterised in thatThe boss cylinder, annular diversion trench are arranged in array.
- A kind of 3. heat sink according to claim 1 or 2, it is characterised in thatAnnular diversion trench on the inside of the cover plate can also be arranged to groove cylinder, the boss cylinder in apparatus main body and lid Groove cylindrical on the inside of plate is into the flow channel for liquids to interconnect.
- A kind of 4. heat sink according to claim 1, it is characterised in thatDescribed device main body is provided with sealing ring with cover plate and is fixedly connected by screw between the two.
- A kind of 5. heat sink according to claim 1, it is characterised in thatEntering liquid interface, going out liquid interface and be connected respectively by pipeline with peripheral hardware liquid pump, liquid cooling heat radiator for the heat sink, is realized The circulation cooling of liquid.
- A kind of 6. heat sink according to claim 1, it is characterised in thatIt is the cold liquid of liquid being filled with by peripheral hardware liquid pump in the flow channel for liquids, can is water or superconducting fluid.
- A kind of 7. heat sink according to claim 1, it is characterised in thatEntering liquid interface or going out for the heat sink sets temperature sensor at liquid interface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720769821.0U CN206918963U (en) | 2017-06-29 | 2017-06-29 | A kind of heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720769821.0U CN206918963U (en) | 2017-06-29 | 2017-06-29 | A kind of heat sink |
Publications (1)
Publication Number | Publication Date |
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CN206918963U true CN206918963U (en) | 2018-01-23 |
Family
ID=61322961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201720769821.0U Expired - Fee Related CN206918963U (en) | 2017-06-29 | 2017-06-29 | A kind of heat sink |
Country Status (1)
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CN (1) | CN206918963U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108759533A (en) * | 2018-05-29 | 2018-11-06 | 电子科技大学 | A kind of microchannel cold plates, radiator and device based on 3D bulk prints |
CN108980795A (en) * | 2018-07-06 | 2018-12-11 | 中国航空规划设计研究总院有限公司 | A kind of heat pipe-type lamps and lanterns cooling device |
CN111156841A (en) * | 2019-12-13 | 2020-05-15 | 山东大学 | Plate heat exchanger intelligently controlled according to outlet temperature |
CN111156840A (en) * | 2019-12-13 | 2020-05-15 | 山东大学 | Water-cooling plate heat exchanger with uniform heat exchange |
-
2017
- 2017-06-29 CN CN201720769821.0U patent/CN206918963U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108759533A (en) * | 2018-05-29 | 2018-11-06 | 电子科技大学 | A kind of microchannel cold plates, radiator and device based on 3D bulk prints |
CN108980795A (en) * | 2018-07-06 | 2018-12-11 | 中国航空规划设计研究总院有限公司 | A kind of heat pipe-type lamps and lanterns cooling device |
CN111156841A (en) * | 2019-12-13 | 2020-05-15 | 山东大学 | Plate heat exchanger intelligently controlled according to outlet temperature |
CN111156840A (en) * | 2019-12-13 | 2020-05-15 | 山东大学 | Water-cooling plate heat exchanger with uniform heat exchange |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180123 Termination date: 20200629 |
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CF01 | Termination of patent right due to non-payment of annual fee |