CN113862683A - Cleaning agent and cleaning process for stainless steel polishing wax - Google Patents
Cleaning agent and cleaning process for stainless steel polishing wax Download PDFInfo
- Publication number
- CN113862683A CN113862683A CN202111285235.6A CN202111285235A CN113862683A CN 113862683 A CN113862683 A CN 113862683A CN 202111285235 A CN202111285235 A CN 202111285235A CN 113862683 A CN113862683 A CN 113862683A
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- CN
- China
- Prior art keywords
- parts
- cleaning agent
- acid
- stainless steel
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012459 cleaning agent Substances 0.000 title claims abstract description 168
- 238000004140 cleaning Methods 0.000 title claims abstract description 74
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 51
- 239000010935 stainless steel Substances 0.000 title claims abstract description 51
- 238000005498 polishing Methods 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000008569 process Effects 0.000 title claims abstract description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 88
- -1 unsaturated fatty acid ester Chemical class 0.000 claims abstract description 43
- 229910017053 inorganic salt Inorganic materials 0.000 claims abstract description 23
- 239000002253 acid Substances 0.000 claims abstract description 21
- 229930182470 glycoside Natural products 0.000 claims abstract description 20
- 229920000141 poly(maleic anhydride) Polymers 0.000 claims abstract description 20
- PTMHPRAIXMAOOB-UHFFFAOYSA-N phosphoramidic acid Chemical compound NP(O)(O)=O PTMHPRAIXMAOOB-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000002738 chelating agent Substances 0.000 claims abstract description 14
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 14
- 229920000642 polymer Polymers 0.000 claims abstract description 14
- 239000002904 solvent Substances 0.000 claims abstract description 14
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 13
- 239000010452 phosphate Substances 0.000 claims abstract description 13
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 12
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims abstract description 12
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims abstract description 7
- 239000003495 polar organic solvent Substances 0.000 claims abstract description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 54
- 230000002378 acidificating effect Effects 0.000 claims description 51
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 49
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 36
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 34
- 229920000058 polyacrylate Polymers 0.000 claims description 23
- 229940049964 oleate Drugs 0.000 claims description 22
- 229940120146 EDTMP Drugs 0.000 claims description 20
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 claims description 20
- 238000001035 drying Methods 0.000 claims description 19
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 17
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 16
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 15
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 claims description 13
- 235000019982 sodium hexametaphosphate Nutrition 0.000 claims description 13
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 12
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 10
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims description 10
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims description 10
- BAERPNBPLZWCES-UHFFFAOYSA-N (2-hydroxy-1-phosphonoethyl)phosphonic acid Chemical compound OCC(P(O)(O)=O)P(O)(O)=O BAERPNBPLZWCES-UHFFFAOYSA-N 0.000 claims description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 9
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 9
- 229910000402 monopotassium phosphate Inorganic materials 0.000 claims description 9
- 235000019796 monopotassium phosphate Nutrition 0.000 claims description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 9
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 claims description 9
- 229910052725 zinc Inorganic materials 0.000 claims description 9
- 239000011701 zinc Substances 0.000 claims description 9
- VUDJAFZYSMINQA-UHFFFAOYSA-L zinc metaphosphate Chemical compound [Zn+2].[O-]P(=O)=O.[O-]P(=O)=O VUDJAFZYSMINQA-UHFFFAOYSA-L 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 claims description 8
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 8
- MFXMOUUKFMDYLM-UHFFFAOYSA-L zinc;dihydrogen phosphate Chemical compound [Zn+2].OP(O)([O-])=O.OP(O)([O-])=O MFXMOUUKFMDYLM-UHFFFAOYSA-L 0.000 claims description 8
- 229940005740 hexametaphosphate Drugs 0.000 claims description 7
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 6
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052700 potassium Inorganic materials 0.000 claims description 6
- 239000011591 potassium Substances 0.000 claims description 6
- 229920005614 potassium polyacrylate Polymers 0.000 claims description 6
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 claims description 6
- 229940090960 diethylenetriamine pentamethylene phosphonic acid Drugs 0.000 claims description 5
- DUYCTCQXNHFCSJ-UHFFFAOYSA-N dtpmp Chemical compound OP(=O)(O)CN(CP(O)(O)=O)CCN(CP(O)(=O)O)CCN(CP(O)(O)=O)CP(O)(O)=O DUYCTCQXNHFCSJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- 229920002401 polyacrylamide Polymers 0.000 claims description 5
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 claims description 5
- 229910000165 zinc phosphate Inorganic materials 0.000 claims description 5
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims description 4
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 claims description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 4
- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 claims description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 4
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims description 4
- FATUQANACHZLRT-KMRXSBRUSA-L calcium glucoheptonate Chemical compound [Ca+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)C([O-])=O FATUQANACHZLRT-KMRXSBRUSA-L 0.000 claims description 4
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims description 4
- 229940050410 gluconate Drugs 0.000 claims description 4
- 229910000403 monosodium phosphate Inorganic materials 0.000 claims description 4
- 235000019799 monosodium phosphate Nutrition 0.000 claims description 4
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 claims description 4
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 4
- 235000011181 potassium carbonates Nutrition 0.000 claims description 4
- 229910000160 potassium phosphate Inorganic materials 0.000 claims description 4
- 235000011009 potassium phosphates Nutrition 0.000 claims description 4
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 claims description 4
- 239000001488 sodium phosphate Substances 0.000 claims description 4
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 4
- 235000011008 sodium phosphates Nutrition 0.000 claims description 4
- 229940095064 tartrate Drugs 0.000 claims description 4
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 4
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 claims description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 3
- XFJQZJBQLJFFRR-UHFFFAOYSA-N 2,3,4-trichloro-5,6-dihydrobenzo[b][1]benzoxepine Chemical compound ClC=1C(=C(C2=C(C1)OC1=C(C=CC=C1)CC2)Cl)Cl XFJQZJBQLJFFRR-UHFFFAOYSA-N 0.000 claims description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 3
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 claims description 3
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 claims description 3
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims description 3
- QGJOPFRUJISHPQ-NJFSPNSNSA-N carbon disulfide-14c Chemical compound S=[14C]=S QGJOPFRUJISHPQ-NJFSPNSNSA-N 0.000 claims description 3
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims description 3
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- 239000011736 potassium bicarbonate Substances 0.000 claims description 3
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims description 3
- 235000015497 potassium bicarbonate Nutrition 0.000 claims description 3
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 3
- 235000017550 sodium carbonate Nutrition 0.000 claims description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 3
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 claims description 3
- 229940051841 polyoxyethylene ether Drugs 0.000 abstract description 26
- 229920000056 polyoxyethylene ether Polymers 0.000 abstract description 26
- 239000001993 wax Substances 0.000 description 38
- 230000000052 comparative effect Effects 0.000 description 22
- 239000000463 material Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 238000007689 inspection Methods 0.000 description 15
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 13
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 12
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 12
- 229940057995 liquid paraffin Drugs 0.000 description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 229960001484 edetic acid Drugs 0.000 description 6
- 230000001804 emulsifying effect Effects 0.000 description 6
- 239000002202 Polyethylene glycol Substances 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 239000008233 hard water Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000136 polysorbate Polymers 0.000 description 3
- 206010020751 Hypersensitivity Diseases 0.000 description 2
- NWGKJDSIEKMTRX-AAZCQSIUSA-N Sorbitan monooleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O NWGKJDSIEKMTRX-AAZCQSIUSA-N 0.000 description 2
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- 239000003112 inhibitor Substances 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
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- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 2
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- XFLNVMPCPRLYBE-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate;tetrahydrate Chemical compound O.O.O.O.[Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O XFLNVMPCPRLYBE-UHFFFAOYSA-J 0.000 description 2
- VPTUPAVOBUEXMZ-UHFFFAOYSA-N (1-hydroxy-2-phosphonoethyl)phosphonic acid Chemical compound OP(=O)(O)C(O)CP(O)(O)=O VPTUPAVOBUEXMZ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- QLCAGXDTDCDEGN-UHFFFAOYSA-N 3-sulfanylcarbonylhexanedioic acid Chemical compound OC(=O)CCC(C(O)=S)CC(O)=O QLCAGXDTDCDEGN-UHFFFAOYSA-N 0.000 description 1
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- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
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- 239000004115 Sodium Silicate Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- IJCWFDPJFXGQBN-RYNSOKOISA-N [(2R)-2-[(2R,3R,4S)-4-hydroxy-3-octadecanoyloxyoxolan-2-yl]-2-octadecanoyloxyethyl] octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCCCCCCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCCCCCCCCCCCC IJCWFDPJFXGQBN-RYNSOKOISA-N 0.000 description 1
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- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
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- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- XTOQOJJNGPEPMM-UHFFFAOYSA-N o-(2-oxo-1,3,2$l^{5}-dioxaphosphinan-2-yl)hydroxylamine Chemical compound NOP1(=O)OCCCO1 XTOQOJJNGPEPMM-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 235000010482 polyoxyethylene sorbitan monooleate Nutrition 0.000 description 1
- 229920000053 polysorbate 80 Polymers 0.000 description 1
- GNSKLFRGEWLPPA-UHFFFAOYSA-M potassium dihydrogen phosphate Chemical compound [K+].OP(O)([O-])=O GNSKLFRGEWLPPA-UHFFFAOYSA-M 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 235000011078 sorbitan tristearate Nutrition 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000004562 water dispersible granule Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/08—Iron or steel
- C23G1/088—Iron or steel solutions containing organic acids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
- C23G1/061—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
- C23G1/066—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/19—Iron or steel
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Detergent Compositions (AREA)
Abstract
The application discloses cleaner of stainless steel polishing wax, including acid cleaner and alkaline cleaner, wherein, the acid cleaner includes by 100 parts by weight: 20-30 parts of aminophosphonic acid, 10-20 parts of alkyl chain polymer with C ═ O group on a branched chain, 20-30 parts of phosphate, 20-30 parts of hydrolyzed polymaleic anhydride, 10-20 parts of chelating agent, 3-5 parts of unsaturated fatty acid ester containing polar group and the balance of water; the alkaline cleaning agent comprises the following components in parts by weight based on 100 parts by weight: 10-15 parts of strong-alkaline inorganic salt, 4-8 parts of weak-alkaline inorganic salt, 3-8 parts of alkyl glycoside, 5-10 parts of alkylphenol polyoxyethylene, 5-10 parts of octylphenol polyoxyethylene ether, 5-10 parts of solubilizer, 10-20 parts of non-polar organic solvent and the balance of water. The application also provides a cleaning process of the stainless steel polishing wax.
Description
Technical Field
The application relates to the technical field of cleaning reagents, in particular to a cleaning agent and a cleaning process for stainless steel polishing wax.
Background
The mobile phone camera shooting technology is developed more and more rapidly at present, and the requirement on the camera shooting module is correspondingly improved. The stainless steel material is used as a material for a high-end mobile phone, has the characteristics of light weight, hard texture, good metal texture and difficult deformation, and is widely applied to a camera module.
The metal component used in the camera part needs to polish and brighten the surface metal wire drawing part, and the production process is finishedWherein it is polished with a liquid polishing wax. After the polishing process, a relatively large amount of dirt remains on the surface of the stainless steel module and in the groove structure, and therefore the stainless steel module needs to be cleaned. Two main substances exist in the liquid polishing wax used for polishing: paraffin and alpha-alumina, wherein the paraffin is a non-polar substance and has a low melting point, and generates a high temperature in the polishing process, so that the roughness is high at the polished position of stainless steel, liquid paraffin is dissolved and adsorbed on the surface at a high temperature and is not easy to clean, and the alpha-alumina belongs to a trigonal system, oxygen ions are approximately densely packed and hexagonal, aluminum atoms are filled in the octahedral gaps, and the whole crystal can be seen as countless octahedrons [ AlO ]6]The large 'molecule' formed by coplanar combination has high stability, does not react with acid and alkali, has strong adhesive force on the surface of stainless steel due to electrostatic effect, and is not easy to clean.
Therefore, how to develop a cleaning agent for cleaning stains on the surface of a stainless steel camera module after polishing liquid wax is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
In order to solve the above technical problems, a first object of the present invention is to provide a cleaning agent for stainless steel polishing wax; the second purpose of the invention is to provide a cleaning process of the stainless steel polishing wax; the application provides a cleaning agent and cleaning process of stainless steel polishing wax can effectively get rid of the remaining dirt in stainless steel metal surface and the recess, improves the washing yield of product, and simple process, easy operation, difficult anaphylaxis, environmental protection, low price.
The technical scheme provided by the invention is as follows:
a cleaning agent for stainless steel polishing wax comprises an acidic cleaning agent and an alkaline cleaning agent,
wherein the acidic cleaning agent comprises the following components in 100 parts by weight: 20-30 parts of aminophosphonic acid, 10-20 parts of alkyl chain polymer with C ═ O group on a branched chain, 20-30 parts of phosphate, 20-30 parts of hydrolyzed polymaleic anhydride, 10-20 parts of chelating agent, 3-5 parts of unsaturated fatty acid ester containing polar group and the balance of water;
the alkaline cleaning agent comprises the following components in parts by weight based on 100 parts by weight: 10-15 parts of strong-alkaline inorganic salt, 4-8 parts of weak-alkaline inorganic salt, 3-8 parts of alkyl glycoside, 10-20 parts of alkylphenol polyoxyethylene, 5-10 parts of solubilizer, 10-20 parts of nonpolar organic solvent and the balance of water.
Preferably, the chelating agent in the acidic cleaning agent is any one or more of ethylene diamine tetraacetic acid tetrasalt, ethylene diamine tetraacetic acid disalt, gluconate, glucoheptonate, nitrilotriacetic acid, hydroxyethylidene diphosphonic acid tetrasalt, citrate, tartrate, glycolic acid and hydroxyethyl ethylene diamine triacetic acid; and/or the presence of a gas in the gas,
the amino phosphonic acid in the acidic cleaning agent is any one or more of amino trimethylene phosphonic acid, hydroxy ethylidene diphosphonic acid, ethylene diamine tetramethylene phosphonic acid and diethylene triamine pentamethylene phosphonic acid.
Preferably, the strong alkaline inorganic salt in the alkaline cleaning agent is any one or more of sodium hydroxide, potassium hydroxide and lithium hydroxide;
the alkalescent inorganic salt is any one or more of sodium carbonate, sodium bicarbonate, potassium carbonate and potassium bicarbonate.
Preferably, the alkyl chain polymer with C ═ O groups in the branched chain in the acidic cleaning agent is any one or more of polyacrylate, polyacrylamide and polyacrylate;
the phosphate is one or more of sodium phosphate, potassium phosphate, zinc phosphate, sodium dihydrogen phosphate, potassium dihydrogen phosphate, zinc dihydrogen phosphate, disodium hydrogen phosphate, potassium dihydrogen phosphate, zinc dihydrogen phosphate, sodium hexametaphosphate, potassium hexametaphosphate, and zinc hexametaphosphate.
Preferably, the polyacrylate is any one or more of sodium polyacrylate, potassium polyacrylate and zinc polyacrylate.
Preferably, the solubilizer in the alkaline cleaning agent is any one or more of span and Tween; and/or the presence of a gas in the gas,
the polar group-containing unsaturated fatty acid ester in the acidic cleaning agent is specifically any one or more of ethylenediamine oleate and ethylene glycol oleate.
Preferably, the non-polar organic solvent in the alkaline cleaner is any one or more of isopropanol, pyridine, tetramethylethylenediamine, acetone, triethylamine, n-butanol, dioxane, tetrahydrofuran, methyl formate, tributylamine, methyl ethyl ketone, ethyl acetate, trioctylamine, dimethyl carbonate, diethyl ether, isopropyl ether, n-butyl ether, trichloroethylene, diphenyl ether, dichloromethane, chloroform, dichloroethane, toluene, benzene, carbon tetrachloride, carbon disulfide, cyclohexane, hexane, and petroleum ether.
A cleaning process of stainless steel polishing wax comprises the steps of using any one of the cleaning agents to clean stainless steel after polishing wax treatment by using an acidic cleaning agent and then using an alkaline cleaning agent.
Preferably, the stainless steel after being treated by the polishing wax is ultrasonically cleaned for 5-10min at 65-75 ℃ by using an acidic cleaning agent, and then ultrasonically cleaned for 3-8min at 65-75 ℃ by using an alkaline cleaning agent.
Preferably, the cleaning process specifically comprises the following steps:
ultrasonically cleaning the polished stainless steel for 5-10min at 65-75 ℃ by using an acid cleaning agent;
first ultrasonic cleaning using pure water;
ultrasonically cleaning with alkaline cleaning agent at 65-75 deg.C for 3-8 min;
second ultrasonic cleaning by using pure water;
and (5) drying.
Aiming at the problems in the prior art, the application provides a cleaning agent for stainless steel polishing wax, which comprises an acidic cleaning agent and an alkaline cleaning agent, wherein the acidic cleaning agent comprises specific parts by weight of aminophosphonic acid, an alkyl chain polymer with a branched chain having a C ═ O group, phosphate, hydrolyzed polymaleic anhydride, a chelating agent, unsaturated fatty acid ester containing polar groups and water; the alkaline cleaning agent comprises specific parts by weight of strongly alkaline inorganic salt, weakly alkaline inorganic salt, alkyl glycoside, alkylphenol polyoxyethylene, solubilizer, non-polar organic solvent and water. The application provides a cleaning agent belongs to the wax ash cleaning agent of water-based type, is different from the wax ash cleaning agent of solvent type, does not have low flash point, can not easily fire easily volatile easily explode, need not use purpose-made explosion-proof equipment, uses and stores in the transportation, and the safety risk is low.
When the cleaning agent for the stainless steel polishing wax is used, firstly, an acid cleaning agent is used for cleaning a stainless steel workpiece, and inorganic alpha-alumina on the metal surface of the stainless steel is stripped and chelated; then cleaning with alkaline cleaning agent, and emulsifying and cleaning the organic molecular group of the liquid paraffin. The cleaning agent and the cleaning agent are combined, residual dirt on the surface of the stainless steel metal and in the groove can be effectively removed, the cleaning yield of products is improved, and the cleaning agent is simple in process, easy to operate, not easy to cause allergy, environment-friendly and low in price.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiments of the present application are written in a progressive manner.
The embodiment of the invention provides a cleaning agent for stainless steel polishing wax, which comprises an acidic cleaning agent and an alkaline cleaning agent,
wherein the acidic cleaning agent comprises the following components in 100 parts by weight: 20-30 parts of aminophosphonic acid, 10-20 parts of alkyl chain polymer with C ═ O group on a branched chain, 20-30 parts of phosphate, 20-30 parts of hydrolyzed polymaleic anhydride, 10-20 parts of chelating agent, 3-5 parts of unsaturated fatty acid ester containing polar group and the balance of water;
the alkaline cleaning agent comprises the following components in parts by weight based on 100 parts by weight: 10-15 parts of strong-alkaline inorganic salt, 4-8 parts of weak-alkaline inorganic salt, 3-8 parts of alkyl glycoside, 10-20 parts of alkylphenol polyoxyethylene, 5-10 parts of solubilizer, 10-20 parts of nonpolar organic solvent and the balance of water.
Aiming at the problems in the prior art, the application provides a cleaning agent for stainless steel polishing wax, which comprises an acidic cleaning agent and an alkaline cleaning agent, wherein the acidic cleaning agent comprises specific parts by weight of aminophosphonic acid, an alkyl chain polymer with a branched chain having a C ═ O group, phosphate, hydrolyzed polymaleic anhydride, a chelating agent, unsaturated fatty acid ester containing polar groups and water; the alkaline cleaning agent comprises specific parts by weight of strongly alkaline inorganic salt, weakly alkaline inorganic salt, alkyl glycoside, alkylphenol polyoxyethylene, solubilizer, non-polar organic solvent and water. The application provides a cleaning agent belongs to the wax ash cleaning agent of water-based type, is different from the wax ash cleaning agent of solvent type, does not have low flash point, can not easily fire easily volatile easily explode, need not use purpose-made explosion-proof equipment, uses and stores in the transportation, and the safety risk is low.
When the cleaning agent for the stainless steel polishing wax is used, firstly, an acid cleaning agent is used for cleaning a stainless steel workpiece, and inorganic alpha-alumina on the metal surface of the stainless steel is stripped and chelated; then cleaning with alkaline cleaning agent, and emulsifying and cleaning the organic molecular group of the liquid paraffin. The cleaning agent and the cleaning agent are combined, residual dirt on the surface of the stainless steel metal and in the groove can be effectively removed, the cleaning yield of products is improved, and the cleaning agent is simple in process, easy to operate, not easy to cause allergy, environment-friendly and low in price.
Specifically, the acidic cleaning agent is selected from aminophosphonic acid. The aminophosphonic acid is taken as a corrosion inhibitor and is chelated with a plurality of metal ions; meanwhile, the aminophosphonic acid contains phosphonate ions and amino groups which are electron donating groups, and the alpha-alumina disperses the alumina component in the dirt through lattice distortion and dispersion-coagulation under the strong action. Compared with sulfamic acid, the high-corrosion and high-irritation composite material has strong corrosion and stimulation to metal.
The alkyl chain polymer with the branched chain having the C ═ O group is taken as a macromolecular polymer, water absorption macromolecules are formed after the polymer is dissolved in water, and after the aminophosphonic acid is dissolved in water, a plurality of positive and negative ions can be ionized in an aqueous solution, and the amino phosphonic acid and the alkyl chain polymer with the anionic branched chain having the C ═ O group form a plurality of macromolecular net complexes which can be dispersed and attached to the metal surface.
The phosphate belongs to a prefilming agent, has strong dispersing ability, can form a protective film on the surface of metal in advance, assists aminophosphonic acid, protects a polishing layer on the surface of metal and prevents the polishing layer from being corroded. Meanwhile, the phosphate is used as a water softener, and the hard water resistance of the cleaning agent can be improved.
The hydrolyzed polymaleic anhydride plays a role in dispersing and stabilizing the whole cleaning agent system.
The chelating agent can chelate alumina in the dirt and has strong metal cleaning capability.
The polar group-containing unsaturated fatty acid ester has high emulsifying capacity and dissolving capacity for wax due to the similar intermiscibility of the unsaturated fatty hydrocarbon chain. The unsaturated fatty acid ester containing polar groups is selected to emulsify the liquid paraffin to form small molecular groups, and the small molecular groups are emulsified and dissolved in water to improve the cleaning effect.
The cleaning agent for the stainless steel polishing wax provided by the application can provide a strong alkaline environment by using the strong alkaline inorganic salt selected in the alkaline cleaning agent, and the emulsifying effect of the liquid paraffin is improved. Weakly basic inorganic salts provide basic ions and chelation. The alkyl glycoside and alkylphenol polyoxyethylene belong to nonionic surfactants, have strong hard water resistance, can ensure the cleaning activity in a strong alkaline environment, and have strong emulsifying and penetrating abilities. In addition, a solubilizer is also added into the alkaline cleaning agent, so that the whole system forms a uniform phase; and the nonpolar organic solvent is added, so that the liquid paraffin has certain dissolving capacity, and other oily components in the dirt can be dissolved.
Preferably, the chelating agent in the acidic cleaning agent is any one or more of ethylene diamine tetraacetic acid tetrasalt, ethylene diamine tetraacetic acid disalt, gluconate, glucoheptonate, nitrilotriacetic acid, hydroxyethylidene diphosphonic acid tetrasalt, citrate, tartrate, glycolic acid and hydroxyethyl ethylene diamine triacetic acid; and/or the presence of a gas in the gas,
the amino phosphonic acid in the acidic cleaning agent is any one or more of amino trimethylene phosphonic acid, hydroxy ethylidene diphosphonic acid, ethylene diamine tetramethylene phosphonic acid and diethylene triamine pentamethylene phosphonic acid.
The chelating agent in the acidic cleaning agent can be selected from various chelating agents, such as one or more of ethylenediaminetetraacetic acid tetrasalt, ethylenediaminetetraacetic acid disalt, gluconate, glucoheptonate, nitrilotriacetic acid, hydroxyethylidene diphosphonic acid tetrasalt, citrate, tartrate, glycolic acid, and hydroxyethylethylenediaminetriacetic acid, and ethylenediaminetetraacetic acid tetrasodium salt (EDTA-4Na) is preferably used.
The aminophosphonic acid may be any one or more of aminotrimethylene phosphonic acid, hydroxyethylene diphosphonic acid, ethylene diamine tetramethylene phosphonic acid, and diethylene triamine pentamethylene phosphonic acid, more preferably ethylene diamine tetramethylene phosphonic acid (EDTMPA), which contains organic phosphonic acid and amine group, belongs to cationic corrosion inhibitor, and has formula C6H12O12N2P4H8. The EDTMPA can dissociate 8 positive and negative ions in the aqueous solution, namely 8 hydrogen ions ionize out to provide 8 negative ion positions, so that the EDTMPA can be chelated with a plurality of metal ions to form a monomer macromolecular reticular structure complex which is a soluble chelate. Meanwhile, phosphonate ions and amine groups of EDTMPA are electron donating groups, and alpha-alumina disperses alumina components in the dirt through lattice distortion and dispersion-aggregation under the strong action. Compare the strong corrosivity and the strong irritation that have and have the corrosive action to metal in sulfamic acid, the EDTMPA that this application chose for use is nontoxic pollution-free, can not cause the corruption to the metal, does not have special anticorrosive performance requirement to deplating equipment.
Preferably, the strong alkaline inorganic salt in the alkaline cleaning agent is any one or more of sodium hydroxide, potassium hydroxide and lithium hydroxide;
the alkalescent inorganic salt is any one or more of sodium carbonate, sodium bicarbonate, potassium carbonate and potassium bicarbonate.
Preferably, the strong alkaline inorganic salt in the alkaline cleaning agent is sodium hydroxide and/or potassium hydroxide;
the alkalescent inorganic salt is sodium carbonate and/or potassium carbonate.
The strongly basic inorganic salt in the alkaline cleaning agent is preferably sodium hydroxide; sodium carbonate is preferably used as the weakly basic inorganic salt.
Preferably, the alkyl chain polymer with C ═ O groups in the branched chain in the acidic cleaning agent is any one or more of polyacrylate, polyacrylamide and polyacrylate;
the phosphate is one or more of sodium phosphate, potassium phosphate, zinc phosphate, sodium dihydrogen phosphate, potassium dihydrogen phosphate, zinc dihydrogen phosphate, disodium hydrogen phosphate, potassium dihydrogen phosphate, zinc dihydrogen phosphate, sodium hexametaphosphate, potassium hexametaphosphate, and zinc hexametaphosphate.
Preferably, the polyacrylate is any one or more of sodium polyacrylate, potassium polyacrylate and zinc polyacrylate.
The alkyl chain polymer with a branched C ═ O group used herein is specifically any one or more of polyacrylate, polyacrylamide, and polyacrylate. The polyacrylate can be one or more of sodium polyacrylate, potassium polyacrylate and zinc polyacrylate, and the phosphate can be one or more of sodium phosphate, potassium phosphate, zinc phosphate, sodium dihydrogen phosphate, potassium dihydrogen phosphate, zinc dihydrogen phosphate, disodium hydrogen phosphate, potassium dihydrogen phosphate, zinc dihydrogen phosphate, sodium hexametaphosphate, potassium hexametaphosphate and zinc hexametaphosphate. The hexametaphosphate is preferably used, can generate a soluble complex for metal ions, does not generate new dirt, and is easy to wash, and specifically is any one or more of sodium hexametaphosphate, potassium hexametaphosphate and zinc hexametaphosphate. More preferably, the polyacrylate is zinc polyacrylate, or the phosphate is zinc hexametaphosphate. The zinc polyacrylate is used as an organic macromolecular chelating agent; or the zinc hexametaphosphate is taken as an inorganic chelating agent and is compounded with the hydrolytic polymaleic anhydride, so that the corrosion can be effectively prevented; more preferably, the zinc polyacrylate and the zinc hexametaphosphate are used simultaneously, and free phosphate ions and polyacrylic acid macromolecules are crosslinked to form a complex to form a passivation protective film, so that the anticorrosion effect is achieved.
Preferably, the solubilizer in the alkaline cleaning agent is any one or more of span and Tween; and/or the presence of a gas in the gas,
the polar group-containing unsaturated fatty acid ester in the acidic cleaning agent is specifically any one or more of ethylenediamine oleate and ethylene glycol oleate.
The solubilizer in the alkaline cleaning agent can be span and tween, such as span-80, span-65, tween-80, tween-60 and the like, preferably span-80.
The polar group-containing unsaturated fatty acid ester in the acidic cleaning agent is specifically any one or more of ethylenediamine oleate and ethylene glycol oleate, and ethylenediamine oleate is more preferably used. The ethylene diamine oleate not only has the similar intermiscibility characteristic of unsaturated aliphatic hydrocarbon chains, has strong emulsifying capacity and dissolving capacity on wax, but also has good hard water resistance effect, complete wax removal and strong wetting property, is commonly called as a powerful wax remover and also has an antirust function.
Preferably, the non-polar organic solvent in the alkaline cleaner is any one or more of isopropanol, pyridine, tetramethylethylenediamine, acetone, triethylamine, n-butanol, dioxane, tetrahydrofuran, methyl formate, tributylamine, methyl ethyl ketone, ethyl acetate, trioctylamine, dimethyl carbonate, diethyl ether, isopropyl ether, n-butyl ether, trichloroethylene, diphenyl ether, dichloromethane, chloroform, dichloroethane, toluene, benzene, carbon tetrachloride, carbon disulfide, cyclohexane, hexane, and petroleum ether.
The nonpolar organic solvent has a certain dissolving power for the liquid paraffin, and isopropyl alcohol is preferably used. The isopropanol is a cheap solvent, can be mixed and dissolved with water in any proportion, has certain dissolving capacity on the liquid paraffin, and can dissolve the liquid paraffin and other oily components in dirt.
A cleaning process of stainless steel polishing wax comprises the steps of using any one of the cleaning agents to clean stainless steel after polishing wax treatment by using an acidic cleaning agent and then using an alkaline cleaning agent.
Preferably, the stainless steel after being treated by the polishing wax is ultrasonically cleaned for 5-10min at 65-75 ℃ by using an acidic cleaning agent, and then ultrasonically cleaned for 3-8min at 65-75 ℃ by using an alkaline cleaning agent.
Preferably, the cleaning process specifically comprises the following steps:
ultrasonically cleaning the polished stainless steel for 5-10min at 65-75 ℃ by using an acid cleaning agent;
first ultrasonic cleaning using pure water;
ultrasonically cleaning with alkaline cleaning agent at 65-75 deg.C for 3-8 min;
second ultrasonic cleaning by using pure water;
and (5) drying.
The application also provides a process for cleaning the stainless steel polishing wax by using the cleaning agent. Preferably, the cleaning agent is used in combination with ultrasonic cleaning, and pure water can be used between the acidic cleaning agent and the alkaline cleaning agent for ultrasonic cleaning. Among them, hot air drying is preferable for drying. Preferably, the product is subjected to full inspection after drying.
The cleaning process provided by the application can be carried out together with a polishing process of polishing wax. The stainless steel product is placed in a nine-tank cleaning machine, polishing wax is used for fine polishing, and then single-tank ultrasonic cleaning and pure water first ultrasonic cleaning are carried out by using an acidic cleaning agent, single-tank ultrasonic cleaning is carried out by using an alkaline cleaning agent, and second ultrasonic cleaning is carried out by using pure water.
Example 1
Acid cleaning agent: the water-soluble polyethylene glycol monobasic carboxylic acid comprises, by weight, 100 parts of all components including 20 parts of ethylenediamine tetramethylene phosphonic acid, 13 parts of sodium polyacrylate, 23 parts of sodium hexametaphosphate, 23 parts of hydrolyzed polymaleic anhydride, 12 parts of tetrasodium ethylenediamine tetraacetate, 3 parts of ethylenediamine oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 10 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 75 ℃ for 5min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 75 ℃ for 3min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
Example 2
Acid cleaning agent: the water-soluble polymer comprises, by weight, 100 parts of all components including 30 parts of ethylenediamine tetramethylene phosphonic acid, 10 parts of polyacrylamide, 20 parts of sodium hexametaphosphate, 20 parts of hydrolyzed polymaleic anhydride, 10 parts of tetrasodium ethylenediamine tetraacetate, 3 parts of ethylenediamine oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 13 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 65 ℃ for 10min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 75 ℃ for 3min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
Example 3
Acid cleaning agent: the water-soluble acrylate-modified ethylene diamine tetraacetic acid water dispersible granule comprises, by weight, 100 parts of all components, 25 parts of ethylene diamine tetramethylene phosphonic acid, 15 parts of polyacrylate, 20 parts of sodium hexametaphosphate, 20 parts of hydrolyzed polymaleic anhydride, 12 parts of tetrasodium ethylene diamine tetraacetate, 3 parts of ethylene diamine oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 15 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 75 ℃ for 5min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 65 ℃ for 8min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
Example 4
Acid cleaning agent: the water-soluble polyethylene glycol di-n-butyl ether comprises, by weight, 100 parts of all components, 20 parts of ethylene diamine tetramethylene phosphonic acid, 20 parts of potassium polyacrylate, 20 parts of potassium hexametaphosphate, 21 parts of hydrolyzed polymaleic anhydride, 10 parts of ethylene diamine tetraacetic acid tetrasodium salt, 3 parts of ethylene glycol oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 15 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 65 ℃ for 10min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 65 ℃ for 8min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
Example 5
Acid cleaning agent: the water-soluble polyethylene glycol monobasic carboxylic acid comprises, by weight, 100 parts of all components including 20 parts of ethylenediamine tetramethylene phosphonic acid, 20 parts of zinc polyacrylate, 20 parts of zinc hexametaphosphate, 21 parts of hydrolyzed polymaleic anhydride, 10 parts of ethylene diamine tetraacetic acid tetrasodium salt, 3 parts of ethylenediamine oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 15 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 65 ℃ for 10min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 65 ℃ for 8min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
Example 6
Acid cleaning agent: the water-based paint comprises, by weight, 100 parts of all the components, 20 parts of aminotrimethylene phosphoric acid, 20 parts of potassium polyacrylate, 20 parts of monopotassium phosphate, 21 parts of hydrolyzed polymaleic anhydride, 10 parts of ethylene diamine tetraacetic acid tetrasodium, 3 parts of ethylene diamine oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 15 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 65 ℃ for 10min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 65 ℃ for 8min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
Example 7
Acid cleaning agent: the paint comprises, by weight, 100 parts of all components, 20 parts of diethylenetriamine pentamethylenephosphonic acid, 20 parts of zinc polyacrylate, 20 parts of zinc phosphate, 21 parts of hydrolyzed polymaleic anhydride, 10 parts of ethylene diamine tetraacetic acid tetrasodium salt, 3 parts of ethylene glycol oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 15 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 65 ℃ for 10min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 65 ℃ for 8min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
Comparative example 1
An acidic lotion was prepared according to the following formulation using the protocol described in patent CN 109536293 a: 12% of carboxyethyl thiosuccinic acid, 10% of amino acid active agent N-acyl glutamic acid, 4% of glycolic acid, 4% of fatty alcohol-polyoxyethylene ether, 1.5% of sodium citrate, 11% of glycerol and the balance of water.
The cleaning agent for ultrasonic alkaline cleaning comprises the following components: 15% of sodium hydroxide, 4% of ethylene diamine tetraacetic acid tetrasodium, 6% of sodium silicate, 12% of alkyl glycoside, 5% of sodium citrate and the balance of water.
And soaking the metal piece in the acidic cleaning agent, wherein the mass concentration of the acidic cleaning agent is 5%, washing with water after acidic soaking, sequentially carrying out ultrasonic alkaline washing, washing with water again, drying, carrying out appearance inspection, and carrying out next procedure processing on qualified products.
Comparative example 2
The acidic cleaning agent provided by the application is not used, and only the alkaline cleaning agent is used.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 15 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished wax material for 10min in a single tank at 75 ℃ by using pure water, then ultrasonically cleaning the polished wax material for 8min in the single tank at 75 ℃ by using an alkaline cleaning agent, ultrasonically cleaning the polished wax material by using the pure water, then ultrasonically cleaning the polished wax material by using the pure water, drying the polished wax material by using hot air, and performing full inspection.
Comparative example 3
The alkaline cleaner provided by the application is not used, and only the acidic cleaner is used.
The acid cleaning agent comprises, by weight, 100 parts of all components, 20 parts of ethylenediamine tetramethylene phosphonic acid, 13 parts of sodium polyacrylate, 25 parts of sodium hexametaphosphate, 20 parts of hydrolyzed polymaleic anhydride, 12 parts of tetrasodium ethylenediamine tetraacetate, 3 parts of ethylenediamine oleate and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine, carrying out single-tank ultrasonic cleaning on the polished material of the polishing wax for 10min at 75 ℃ by using an acid cleaning agent, then carrying out ultrasonic cleaning by using pure water, then carrying out single-tank ultrasonic cleaning for 8min at 75 ℃ by using pure water, then carrying out ultrasonic cleaning by using the pure water, drying by hot air, and carrying out full inspection.
Comparative example 4
Acid cleaning agent: the water-soluble polyethylene glycol monobasic carboxylic acid comprises, by weight, 100 parts of all components including 25 parts of ethylenediamine tetramethylene phosphonic acid, 13 parts of sodium polyacrylate, 25 parts of sodium hexametaphosphate, 0 part of hydrolyzed polymaleic anhydride, 12 parts of tetrasodium ethylenediamine tetraacetate, 3 parts of ethylenediamine oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 15 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 75 ℃ for 5min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 75 ℃ for 3min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
Comparative example 5
Acid cleaning agent: the composition comprises, by weight, 100 parts of all components, 20 parts of hydroxyethylidene diphosphonic acid, 13 parts of sodium polyacrylate, 20 parts of sodium hexametaphosphate, 20 parts of hydrolyzed polymaleic anhydride, 12 parts of tetrasodium ethylene diamine tetraacetate, 3 parts of ethylenediamine oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 15 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 75 ℃ for 5min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 75 ℃ for 8min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
Comparative example 6
Acid cleaning agent: the water-soluble acrylic acid modified polyester resin comprises, by weight, 100 parts of all components, 20 parts of citric acid, 13 parts of sodium polyacrylate, 20 parts of sodium hexametaphosphate, 20 parts of hydrolyzed polymaleic anhydride, 12 parts of tetrasodium ethylene diamine tetraacetate, 3 parts of ethylenediamine oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 15 parts of sodium hydroxide, 4 parts of sodium carbonate, 5 parts of alkyl glycoside, 5 parts of nonylphenol polyoxyethylene ether, 5 parts of octylphenol polyoxyethylene ether, 5 parts of span-805, 10 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 75 ℃ for 10min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 75 ℃ for 8min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
Comparative example 7
Acid cleaning agent: the water-soluble polyethylene glycol monobasic carboxylic acid comprises, by weight, 100 parts of all components including 10 parts of ethylenediamine tetramethylene phosphonic acid, 5 parts of sodium polyacrylate, 10 parts of sodium hexametaphosphate, 35 parts of hydrolyzed polymaleic anhydride, 25 parts of tetrasodium ethylenediamine tetraacetate, 6 parts of ethylenediamine oleate and the balance of water.
The alkaline cleaning agent comprises, by weight, 100 parts of all components, 30 parts of sodium hydroxide, 10 parts of sodium carbonate, 10 parts of alkyl glycoside, 2 parts of nonylphenol polyoxyethylene ether, 10 parts of octylphenol polyoxyethylene ether, 20 parts of span-802, 20 parts of isopropanol and the balance of water.
The cleaning process comprises the following steps: and (3) using a nine-tank cleaning machine to ultrasonically clean the polished material with an acidic cleaning agent at 75 ℃ for 10min, then using pure water for ultrasonic cleaning, then using an alkaline cleaning agent for ultrasonic cleaning at 75 ℃ for 8min, then using pure water for ultrasonic cleaning, drying with hot air, and performing full inspection.
The products cleaned in the examples 1 to 7 and the comparative examples 1 to 7 are detected, whether the cleaning is qualified or not is confirmed, and the products are judged to be qualified without the problems of dirt, scratch and the like by visual inspection.
The final yield was measured at 100pcs for each group as shown in the table below:
group of | Input amount | Yield of |
Example 1 | 100pcs | 98.8% |
Example 2 | 100pcs | 99.5% |
Example 3 | 100pcs | 97.7% |
Example 4 | 100pcs | 98.3% |
Example 5 | 100pcs | 98.6% |
Example 6 | 100pcs | 99.3% |
Example 7 | 100pcs | 99.5% |
Comparative example 1 | 100pcs | 3% |
Comparative example 2 | 100pcs | 10% |
Comparative example 3 | 100pcs | 0% |
Comparative example 4 | 100pcs | 1% |
Comparative example 5 | 100pcs | 3% |
Comparative example 6 | 100pcs | 6% |
Comparative example 7 | 100pcs | 0% |
The results were analyzed as follows:
examples 1-7, varying the composition and process parameters, all achieved 95% cleaning yield.
Comparative example 1 is the use of a proprietary cleaning agent which does not meet the current cleaning process requirements.
Comparative example 2 and comparative example 3, change the cleaning process flow, can't reach and wash the requirement, can't wash the dirt completely, show that the flow of the patent of the invention is suitable for the polishing process cleaning of liquid paraffin.
Comparative example 4 was conducted without addition of water to depolymerize maleic anhydride and as a result, the cleaning requirements were not met.
Comparative example 5 replacement of ethylenediamine tetramethylene phosphonic acid with hydroxyethylidene diphosphonic acid did not result in cleaning.
Comparative example 6, where ethylenediamine tetramethylene phosphonic acid was replaced with citric acid, did not meet the cleaning requirements.
Comparative example 7 shows that the respective raw material components are out of the ranges defined in the present application, and as a result, the cleaning requirements are not met.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A cleaning agent for stainless steel polishing wax is characterized by comprising an acidic cleaning agent and an alkaline cleaning agent,
wherein the acidic cleaning agent comprises the following components in 100 parts by weight: 20-30 parts of aminophosphonic acid, 10-20 parts of alkyl chain polymer with C ═ O group on a branched chain, 20-30 parts of phosphate, 20-30 parts of hydrolyzed polymaleic anhydride, 10-20 parts of chelating agent, 3-5 parts of unsaturated fatty acid ester containing polar group and the balance of water;
the alkaline cleaning agent comprises the following components in parts by weight based on 100 parts by weight: 10-15 parts of strong-alkaline inorganic salt, 4-8 parts of weak-alkaline inorganic salt, 3-8 parts of alkyl glycoside, 10-20 parts of alkylphenol polyoxyethylene, 5-10 parts of solubilizer, 10-20 parts of nonpolar organic solvent and the balance of water.
2. The cleaning agent for stainless steel polishing wax according to claim 1, wherein the chelating agent in the acidic cleaning agent is any one or more of ethylenediaminetetraacetic acid tetrasalt, ethylenediaminetetraacetic acid disalt, gluconate, glucoheptonate, aminotriacetic acid, hydroxyethylidene diphosphonic acid tetrasalt, citrate, tartrate, glycolic acid, and hydroxyethylethylenediaminetriacetic acid; and/or the presence of a gas in the gas,
the amino phosphonic acid in the acidic cleaning agent is any one or more of amino trimethylene phosphonic acid, hydroxy ethylidene diphosphonic acid, ethylene diamine tetramethylene phosphonic acid and diethylene triamine pentamethylene phosphonic acid.
3. The cleaning agent for stainless steel polishing wax according to claim 1, wherein the strongly basic inorganic salt in the alkaline cleaning agent is any one or more of sodium hydroxide, potassium hydroxide and lithium hydroxide;
the alkalescent inorganic salt is any one or more of sodium carbonate, sodium bicarbonate, potassium carbonate and potassium bicarbonate.
4. The cleaning agent for stainless steel polishing wax according to claim 1, wherein the alkyl chain polymer with C ═ O group at the branched chain in the acidic cleaning agent is one or more of polyacrylate, polyacrylamide and polyacrylate;
the phosphate in the acidic cleaning agent is any one or more of sodium phosphate, potassium phosphate, zinc phosphate, sodium dihydrogen phosphate, potassium dihydrogen phosphate, zinc dihydrogen phosphate, disodium hydrogen phosphate, potassium dihydrogen phosphate, zinc dihydrogen phosphate, sodium hexametaphosphate, potassium hexametaphosphate and zinc hexametaphosphate.
5. The cleaning agent for stainless steel polishing wax as claimed in claim 4, wherein the polyacrylate is one or more of sodium polyacrylate, potassium polyacrylate and zinc polyacrylate.
6. The cleaning agent for the stainless steel polishing wax as claimed in claim 1, wherein the solubilizer in the alkaline cleaning agent is any one or more of span and spit-warm water; and/or the presence of a gas in the gas,
the polar group-containing unsaturated fatty acid ester in the acidic cleaning agent is specifically any one or more of ethylenediamine oleate and ethylene glycol oleate.
7. The cleaning agent for stainless steel polishing wax according to claim 1, wherein the non-polar organic solvent in the alkaline cleaning agent is any one or more of isopropyl alcohol, pyridine, tetramethylethylenediamine, acetone, triethylamine, n-butanol, dioxane, tetrahydrofuran, methyl formate, tributylamine, methyl ethyl ketone, ethyl acetate, trioctylamine, dimethyl carbonate, diethyl ether, isopropyl ether, n-butyl ether, trichloroethylene, diphenyl ether, dichloromethane, chloroform, dichloroethane, toluene, benzene, carbon tetrachloride, carbon disulfide, cyclohexane, hexane, petroleum ether.
8. A cleaning process of stainless steel polishing wax, which is characterized in that the cleaning agent of any one of claims 1 to 7 is used, and the stainless steel treated by the polishing wax is cleaned by using an acidic cleaning agent and then cleaned by using an alkaline cleaning agent.
9. The cleaning process of the stainless steel polishing wax according to claim 8, wherein the stainless steel after polishing wax treatment is ultrasonically cleaned at 65-75 ℃ for 5-10min by using an acidic cleaning agent, and then ultrasonically cleaned at 65-75 ℃ for 3-8min by using an alkaline cleaning agent.
10. The cleaning process of the stainless steel polishing wax according to any one of claims 8 to 9, which is characterized by comprising the following steps:
ultrasonically cleaning the polished stainless steel for 5-10min at 65-75 ℃ by using an acid cleaning agent;
first ultrasonic cleaning using pure water;
ultrasonically cleaning with alkaline cleaning agent at 65-75 deg.C for 3-8 min;
second ultrasonic cleaning by using pure water;
and (5) drying.
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