CN113851460A - Packaging structure, manufacturing method and equipment of photoelectric sensor capable of filtering optical signals - Google Patents
Packaging structure, manufacturing method and equipment of photoelectric sensor capable of filtering optical signals Download PDFInfo
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- CN113851460A CN113851460A CN202111203811.8A CN202111203811A CN113851460A CN 113851460 A CN113851460 A CN 113851460A CN 202111203811 A CN202111203811 A CN 202111203811A CN 113851460 A CN113851460 A CN 113851460A
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- H01—ELECTRIC ELEMENTS
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- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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Abstract
The disclosure relates to the technical field of semiconductors, and provides a packaging structure, a manufacturing method and equipment of a photoelectric sensor capable of filtering optical signals. The packaging structure comprises: the optical signal transmission device comprises a substrate, a first optical signal transmission unit and a second optical signal reception unit, wherein the upper surface of the substrate is provided with a first mounting position and a second mounting position; the light filtering glue layer is used for filtering ambient light signals and comprises a first light filtering glue layer and a second light filtering glue layer which respectively cover the light signal transmitting unit and the light signal receiving unit; and the light shielding adhesive layer at least comprises a first light shielding adhesive layer, a second light shielding adhesive layer and a third light shielding adhesive layer, and the light filtering adhesive layer comprises an ambient light filtering material or a band-pass material. According to the embodiment of the disclosure, various functional materials, such as an ambient light filtering material, are mixed in the light filtering adhesive layer to prevent ambient light which can interfere with detection signals from passing through the colloid, so that the accuracy of detection results is further improved, and the overall performance of the photoelectric sensor is improved.
Description
Technical Field
The present disclosure relates to the field of photoelectric sensor technology, and more particularly, to a package structure, a method and an apparatus for manufacturing a photoelectric sensor capable of filtering optical signals.
Background
Photoelectric sensors are applied more and more widely in the aspects of current intelligent medical treatment, intelligent home, industrial automation, portable equipment and the like, such as heart rate sensors, blood oxygen sensors, proximity sensors, distance sensors and the like, so that the work and life of human beings are more and more intelligent and convenient. With the improvement and development of technical requirements, in order to reduce the volume of the whole device, the components are more and more miniaturized, and the functions are integrated, and in order to reduce the packaging volume of such a photoelectric sensor, the light emitting part and the light signal receiving part are often prone to be packaged in the same unit component. Due to external ambient light interference and internal signal crosstalk, accurate feedback of a real signal by an optical signal receiving part can be greatly interfered, and a detection result is wrong or unstable.
Disclosure of Invention
The present disclosure aims to provide a package structure, a manufacturing method and a device of a photoelectric sensor capable of filtering optical signals, so as to solve the technical problem in the prior art that due to external ambient light interference and internal signal crosstalk, accurate feedback of a receiving part of the optical signals to real signals is greatly interfered, and a detection result is wrong or unstable.
In order to achieve the purpose, the technical scheme adopted by the disclosure is as follows:
in one aspect, the present disclosure provides a package structure of a filterable optical signal photosensor, including:
the optical signal transmission device comprises a substrate, wherein a first mounting position and a second mounting position are arranged on the upper surface of the substrate, an optical signal transmission unit is fixed on the first mounting position, and an optical signal receiving unit is fixed on the second mounting position;
the light filtering glue layer is used for filtering ambient light signals, is formed on the upper surface of the substrate in a glue injection mode and comprises a first light filtering glue layer and a second light filtering glue layer, wherein the first light filtering glue layer and the second light filtering glue layer respectively cover the light signal transmitting unit and the light signal receiving unit;
the light shielding glue layer is formed on the upper surface of the substrate in a glue injection mode and at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer, wherein a first light filtering glue layer is arranged between the first light shielding glue layer and the second light shielding glue layer, and a second light filtering glue layer is arranged between the second light shielding glue layer and the third light shielding glue layer;
the optical filtering adhesive layer is used for protecting the optical signal transmitting unit and the optical signal receiving unit and allowing the optical signal of the optical signal transmitting unit to pass through; the light shielding glue layer is used for preventing the optical signal of the optical signal transmitting unit from passing through.
In some embodiments, the filter paste layer is a filter paste layer for filtering optical signals below a preset threshold.
In some embodiments, the filter glue layer is a filter glue layer for filtering optical signals outside a predetermined wavelength band interval.
In some embodiments, the material of the optical filter glue layer is mixed by adding 2 to 30 weight percent of optical filter material into the transparent packaging material.
In some embodiments, the lower surface of the light shielding glue layer is lower than the upper surface of the optical signal emitting unit;
and/or the lower surface of the light shielding glue layer is lower than the upper surface of the optical signal receiving unit.
In some embodiments, the width of the second light shielding glue layer accounts for 20% -90% of the distance between the optical signal transmitting unit and the optical signal receiving unit;
and the first light shielding glue layer and the third light shielding glue layer respectively account for 20% -60% of the width of the second light shielding glue layer.
In some embodiments, the sum of the coverage area of the light filtering glue layer on the upper surface of the substrate and the coverage area of the light shielding glue layer on the upper surface of the substrate is equal to the area of the upper surface of the substrate;
and/or the filter glue layer comprises an ambient light filtering material or a band-pass material, the ambient light filtering material is used for filtering light signals of an environment which can generate interference outside the photoelectric sensor, and the band-pass material can enable light of a specific wave band to pass through.
In some embodiments, the upper surface of the substrate is provided with a first conductive potential, a first conductive connection site and a second conductive potential, a second conductive connection site, a first mounting site is arranged at the first conductive potential, and a second mounting site is arranged at the second conductive potential;
the optical signal transmitting unit located at the first installation position is communicated with the first conductive connection position through a first conductive wire, and the optical signal receiving unit located at the second installation position is communicated with the second conductive connection position through a second conductive wire.
In some embodiments, the lower surface of the substrate is provided with a third conducting potential, a third conducting connection site, a fourth conducting potential and a fourth conducting connection site which respectively correspond to the first conducting potential, the first conducting connection site, the second conducting potential and the second conducting connection site;
and a first through hole for connecting the first conducting potential and the third conducting potential, a second through hole for connecting the first conducting connecting position and the third conducting connecting position, a third through hole for connecting the second conducting potential and the fourth conducting connecting position and a fourth through hole for connecting the second conducting connecting position and the fourth conducting connecting position are respectively arranged on two sides of the substrate.
On the other hand, the present disclosure also provides a method for manufacturing a photoelectric sensor package structure, including:
providing a substrate, wherein a first mounting position and a second mounting position, a first conductive connecting position and a second conductive connecting position are arranged on the upper surface of the substrate;
respectively fixing the optical signal transmitting unit and the optical signal receiving unit to a first mounting position and a second mounting position of the substrate, and respectively connecting the optical signal transmitting unit and the optical signal receiving unit with a first conductive connecting position and a second conductive connecting position through a first conductive wire and a second conductive wire;
uniformly mixing the base material for manufacturing the light filtering adhesive layer and the light filtering material to obtain a target material;
forming a light filtering adhesive layer covering the whole upper surface on the upper surface of the substrate by using glue injection equipment, wherein the light filtering adhesive layer is prepared by a target material;
cutting off the light filtering glue layers between the light signal transmitting unit and the light signal receiving unit and on two sides of the light signal transmitting unit and the light signal receiving unit through a cutting process;
forming a light shielding glue layer covering the upper surface of the substrate on the upper surface of the substrate by using glue injection equipment;
the optical filtering glue layer comprises a first optical filtering glue layer and a second optical filtering glue layer, and the first optical filtering glue layer and the second optical filtering glue layer respectively cover the optical signal transmitting unit and the optical signal receiving unit; the light shielding glue layer at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer, a first light filtering glue layer is arranged between the first light shielding glue layer and the second light shielding glue layer, and a second light filtering glue layer is arranged between the second light shielding glue layer and the third light shielding glue layer;
the optical filtering adhesive layer is used for protecting the optical signal transmitting unit and the optical signal receiving unit and allowing the optical signal of the optical signal transmitting unit to pass through; the light shielding glue layer is used for preventing the optical signal of the optical signal transmitting unit from passing through.
In still another aspect, the present disclosure also provides an electronic device including the above-mentioned photosensor package structure,
or the electronic equipment comprises the photoelectric sensor packaging structure manufactured by the manufacturing method.
The beneficial effect of the packaging structure of the photoelectric sensor capable of filtering the optical signal provided by the present disclosure at least comprises:
(1) this openly can also be through mixing various functional material in filtering the glue film, for example ambient light filtering material to prevent to pass through the colloid to the ambient light that can produce the interference to the detected signal, further improve the accuracy of testing result, promote photoelectric sensor's wholeness ability.
(2) According to the photoelectric sensor, the second light shielding glue layer for shielding signals of the optical signal transmitting unit is arranged between the optical signal transmitting unit and the optical signal receiving unit, so that the transverse crosstalk of internal signals can be eliminated or greatly reduced, and the detection accuracy of the photoelectric sensor is greatly improved; in addition, the first light shielding adhesive layer and the third light shielding adhesive layer are arranged on the two sides of the optical signal transmitting unit and the optical signal receiving unit, so that the photoelectric sensor can play a role in shielding optical signals of other electronic devices in a specific application environment, and the detection accuracy of the photoelectric sensor is further improved.
Drawings
To more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a package structure of a photosensor provided in an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a first portion of a photosensor package structure according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a second portion of a package structure of a photosensor provided by an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a third portion of a package structure of a photosensor provided by an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a fourth portion of a package structure of a photosensor according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a fifth portion of a photosensor package structure according to an embodiment of the present disclosure;
fig. 7 is a flowchart of a method for manufacturing a package structure of a photosensor according to an embodiment of the present disclosure.
Wherein, in the figures, the respective reference numerals:
| 10 | |
11 | Optical |
| 12 | Optical |
13 | Light |
| 131 | First light |
132 | Second light |
| 14 | Light |
141 | First light |
| 142 | Second light |
143 | Third light |
| 15 | First conductive site | 16 | A first |
| 17 | Second |
18 | Second |
| 19 | First |
20 | Second |
| 21 | First through |
22 | Second through |
| 23 | Third through |
24 | Fourth through hole |
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present disclosure more clearly understood, the present disclosure is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the disclosure and are not intended to limit the disclosure.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1, an embodiment of the present disclosure provides an overall structure schematic diagram of a package structure of a photosensor, including a substrate 10, an optical signal emitting unit 11, an optical signal receiving unit 12, a filter glue layer 13, and a light shielding glue layer 14. An optical signal transmitting unit 11 and an optical signal receiving unit 12 are fixed on the upper surface of the substrate 10; the optical signal transmitting unit 11 and the optical signal receiving unit 12 are respectively connected with the first conductive connecting position 16 and the second conductive connecting position 18 on the upper surface of the substrate 10 through a first conductive connecting line 20 and a second conductive line 21; the optical signal transmitting unit 11 and the optical signal receiving unit 12 are provided with optical filtering glue layers 13; light shielding glue layers 14 are arranged between the light filtering glue layers 13 and on two sides of the light filtering glue layers. It should be noted that the package structure of the photosensor of the present embodiment is essentially the structure of the photosensor, and for convenience of description, the package structure of the photosensor is collectively referred to as the photosensor in the present embodiment.
The packaging structure of the photoelectric sensor capable of filtering the optical signal provided by the embodiment has the beneficial effects that:
(1) this openly can also be through mixing various functional materials in light filtering glue layer 13, for example ambient light filtering material to prevent to pass through the colloid to the ambient light that can produce the interference to the detected signal, further improve the accuracy of testing result, promote photoelectric sensor's wholeness ability.
(2) The second light shielding glue layer 142 for shielding the signal of the light signal transmitting unit 11 is arranged between the light signal transmitting unit 11 and the light signal receiving unit 12, so that the transverse crosstalk of the internal signal can be eliminated or greatly reduced, and the detection accuracy of the photoelectric sensor is greatly improved; moreover, the first light shielding adhesive layer 141 and the third light shielding adhesive layer 143 are arranged on the two sides of the optical signal transmitting unit 11 and the optical signal receiving unit 12, so that the photoelectric sensor can play a role in shielding optical signals of other electronic devices in a specific application environment, and the detection accuracy of the photoelectric sensor is further improved.
Referring to fig. 2, in an embodiment, the substrate 10 is a rectangular substrate 10 having a certain thickness, and the shape of the substrate 10 may be changed by one skilled in the art according to different situations, which is not limited herein. A first conductive potential 15, a first conductive connection site 16, a second conductive potential 17 and a second conductive connection site 18 are arranged on the upper surface of the substrate 10, a third conductive potential, a third conductive connection site, a fourth conductive potential and a fourth conductive connection site which correspond to the first conductive potential 15, the first conductive connection site 16, the second conductive potential 17 and the second conductive connection site 18 respectively are arranged on the lower surface of the substrate 10, and the shapes and the sizes of the conductive sites corresponding to the upper part and the lower part of the substrate 10 can be different without limitation; a first through hole 21 for connecting the first conductive potential 15 and the third conductive potential, a second through hole 22 for connecting the first conductive connection site 16 and the third conductive connection site, a third through hole 23 for connecting the second conductive potential 17 and the fourth conductive potential, and a fourth through hole 24 for connecting the second conductive connection site 18 and the fourth conductive connection site are respectively arranged on two sides of the substrate 10.
Referring to fig. 3, a first conductive potential 15 and a second conductive potential 17 are disposed on the upper surface of the substrate 10, the optical signal transmitting unit 11 is fixed on the first conductive potential 15, and the optical signal receiving unit 12 is fixed on the second conductive potential 17. As an example, the optical signal emitting unit 11 may be an LED or a VCSEL, the chip structure may be vertical or flip, and the chip structure may be an infrared emitting chip or a green emitting chip according to different applications, but is not limited to these types of chips, and those skilled in the art may select different bands and different types of chips according to practical applications, and this embodiment is not limited to this; the optical signal receiving unit 12 may be a photodiode or a phototriode, but is not limited to the photodiode or the phototriode, and may also be a dedicated ASIC chip, and those skilled in the art may flexibly select the optical signal receiving unit according to actual needs, and the embodiment does not limit the optical signal receiving unit. It should be noted that the optical signal transmitting unit 11 and the optical signal receiving unit 12 of the present embodiment may be fixed on the substrate 10, that is, the optical signal transmitting unit 11, the optical signal receiving unit 12 and the substrate 10 are two separate components; in addition, the optical signal transmitting unit 11 and the optical signal receiving unit 12 of the present embodiment can also be directly covered inside the substrate 10, i.e. they are integrated with the substrate 10.
The optical filter adhesive layer 13 is formed on the upper surface of the substrate 10 by glue injection, and includes a first optical filter adhesive layer 131 and a second optical filter adhesive layer 132, and the first optical filter adhesive layer 131 and the second optical filter adhesive layer 132 respectively cover the optical signal transmitting unit 11, the optical signal receiving unit 12 and the conductive connection lines. As shown in fig. 6, on the premise of completely covering the optical signal transmitting unit 11 and the optical signal receiving unit 12, the shape of the optical filter layer 13 may be a rectangular parallelepiped, a cylinder, a hexahedral cylinder, etc., and is set as required, which is not limited herein; as an example, the base material of the optical filter adhesive layer 13 of the present embodiment is generally transparent silicone or transparent epoxy, but is not limited to transparent silicone or transparent epoxy, and those skilled in the art may also select other materials with similar performance, so that the first optical filter adhesive layer 131 and the second optical filter adhesive layer 132 not only can protect the optical signal transmitting unit 11 and the optical signal receiving unit 12, thereby improving the reliability and stability of the package, but also can allow the optical signal of the wavelength band transmitted by the optical signal transmitting unit 11 to pass through. Optionally, other functional materials, such as an ambient light filter material that prevents ambient light signals that may cause interference from passing through or a band pass material that allows light in a specific wavelength band to pass through, may be mixed in the filter glue layer 13. Thus, the filtering glue layer 13 can prevent the ambient light interfering with the detection signal from passing through the glue body, so that the accuracy of the detection result of the photoelectric sensor is improved, and the overall performance of the photoelectric sensor is improved. In this embodiment, the functional materials that can be mixed in the filter glue layer 13 are not limited to the above two materials, and those skilled in the art can flexibly select other functional materials according to the application requirements, which is not limited in this embodiment.
The light shielding glue layer 14 is formed on the upper surface of the substrate 10 by glue injection, and the light shielding glue layer 14 at least comprises a first light shielding glue layer 141, a second light shielding glue layer 142 and a third light shielding glue layer 143; a first light filtering glue layer is arranged between the first light shielding glue layer 141 and the second light shielding glue layer 142, and a second light filtering glue layer 132 is arranged between the second light shielding glue layer 142 and the third light shielding glue layer 143. That is, on the upper surface of the substrate 10, the first light-shielding glue layer 141, the first light-filtering glue layer 131, the second light-shielding glue layer 142, the second light-filtering glue layer 132, and the third light-shielding glue layer 143 are sequentially disposed from left to right (the direction shown in fig. 1). Wherein, the light shielding glue layer 14 is used for preventing the optical signal of the optical signal emitting unit 11 from passing through. In this way, since the second light shielding adhesive layer 142 for shielding the signal of the optical signal transmitting unit 11 is disposed between the optical signal transmitting unit 11 and the optical signal receiving unit 12, the internal signal lateral crosstalk can be eliminated or greatly reduced, and the detection accuracy of the photoelectric sensor can be greatly improved. Moreover, the first light shielding adhesive layer 141 and the third light shielding adhesive layer 143 are arranged on the two sides of the optical signal transmitting unit 11 and the optical signal receiving unit 12, so that the photoelectric sensor can play a role in shielding optical signals of other electronic devices in a specific application environment, and the detection accuracy of the photoelectric sensor is further improved.
By way of example, the light shielding glue layer 14 may be epoxy black glue or black silica gel, but is not limited to epoxy black glue or black silica gel, and those skilled in the art may also select other materials with similar performance, and the embodiment is not limited thereto. Further, the lower surface of the light shielding adhesive layer 14 is lower than the upper surfaces of the optical signal transmitting unit 11 and the optical signal receiving unit 12, so as to perform a better shielding function on the optical signal transmitted by the optical signal transmitting unit 11.
As a specific implementation, after the first filter glue layer 131, the second filter glue layer 132 and the light shielding glue layer 14 are formed on the upper surface of the substrate 10, the coverage area of the first filter glue layer 131 on the substrate 10, the coverage area of the second filter glue layer 132 on the substrate 10 and the coverage area of the light shielding glue layer 14 on the substrate 10 are equal to the total area of the upper surface of the substrate 10, that is, the first filter glue layer 131, the second filter glue layer 132 and the light shielding glue layer 14 together cover the entire upper surface of the substrate 10. Further, the width of the second light shielding adhesive layer 142 accounts for 20% -90% of the distance between the optical signal emitting unit 11 and the optical signal receiving unit 12, which not only ensures the safe distance between the light shielding adhesive layer 14 and the optical signal emitting unit 11 and the optical signal receiving unit 12, but also ensures that the optical signal emitted by the optical signal emitting unit 11 can be prevented from passing through; the first light-shielding glue layer 141 and the third light-shielding glue layer 143 respectively occupy 20% -60% of the width of the second light-shielding glue layer 142. It should be noted that the width of the second light-shielding glue layer 142 is the distance from the left side wall to the right side wall of the second light-shielding glue layer 142 in fig. 1, and the distance between the optical signal transmitting unit 11 and the optical signal receiving unit 12 can be understood as the distance between the right end of the optical signal transmitting unit 11 and the left end of the optical signal receiving unit 12 in fig. 1. In other words, there is a certain distance between the optical signal emitting unit 11 and the light shielding glue layer 14, and there is a certain distance between the optical signal receiving unit 12 and the light shielding glue layer 14. As described above, in the photoelectric sensor provided in this embodiment, the second light-shielding adhesive layer 142 is disposed between the optical signal transmitting unit 11 and the optical signal receiving unit 12, so as to eliminate or greatly reduce the internal signal lateral crosstalk, and greatly improve the detection accuracy, and meanwhile, the first light-shielding adhesive layer 141 and the third light-shielding adhesive layer 143 are disposed on two sides of the optical signal transmitting unit 11 and the optical signal receiving unit 12, so that the photoelectric sensor can play a role in shielding optical signals of other electronic devices in a specific application environment, and improve the detection accuracy; various functional materials, such as an ambient light filtering material, can be mixed in the light filtering adhesive layer 13 to prevent ambient light which can interfere with detection signals from passing through the colloid, so that the accuracy of detection results is further improved, and the overall performance of the photoelectric sensor is improved.
As shown in fig. 2-5, when manufacturing the photoelectric sensor of the present embodiment, first, a substrate 10 (the substrate 10 shown in fig. 2) provided with a first conductive potential 15 and a second conductive potential 17 is provided, then the optical signal transmitting unit 11 and the optical signal receiving unit 12 are respectively fixed to the first conductive potential 15 and the second conductive potential 17 (shown in fig. 3) of the substrate 10, and next, the substrate 10 may be placed into a dedicated Molding apparatus, and a filter glue layer 13 (shown in fig. 5) is obtained by Molding glue through glue filling; further, the filter glue layer 13 on the left side of the optical signal emitting unit 11, the filter glue layer 13 between the optical signal emitting unit 11 and the optical signal receiving unit 12, and the filter glue layer 13 on the right side of the optical signal receiving unit 12 are cut off by a cutting process to obtain a first glue filling position, a second glue filling position, a third glue filling position, a first filter glue layer 131, and a second filter glue layer 132 (as shown in fig. 6), and finally, a first light shielding glue layer 141, a second light shielding glue layer 142, and a third light shielding glue layer 143 (as shown in fig. 1) are respectively formed at the first glue filling position, the second glue filling position, and the third glue filling position by a glue dispensing manner; the width of the second light shielding adhesive layer 142 accounts for 20% -90% of the edge distance between the optical signal transmitting unit 11 and the optical signal receiving unit 12, and the width of the first light shielding adhesive layer 141 and the width of the third light shielding adhesive layer 143 respectively account for 20% -60% of the width of the second light shielding adhesive layer 142.
Alternatively, in the above manufacturing process, the filter glue layer 13 is not limited to be formed by Molding glue, and those skilled in the art may form the glue into a glue cake and then bond the glue cake to the substrate 10. The first light shielding adhesive layer 141, the second light shielding adhesive layer 142 and the third light shielding adhesive layer 143 are not limited to be formed at the first glue filling position, the second glue filling position and the third glue filling position by a glue dispensing method, and may also be formed at the first glue filling position, the second glue filling position and the third glue filling position by a Molding glue filling method or an injection Molding method. In addition to the above-mentioned formation of the first light filtering glue layer 131, the second light filtering glue layer 132 and the light shielding glue layer 14, the embodiment may also use a special mold to form the light filtering glue layer 13 with the first light shielding glue layer 141, the second light shielding glue layer 142 and the third light shielding glue layer 143 in one step, i.e. it is not necessary to form the light filtering glue layer 13 first and then cut out the glue filling position, and then glue filling is performed to form the light shielding glue layer 14, but the special mold is used to form the first light filtering glue layer 131 and the second light filtering glue layer 132 in one step, and then the special mold is used to form the first light shielding glue layer 141, the second light shielding glue layer 142 and the third light shielding glue layer 143 in one step. The specific dedicated mold is not described in this embodiment, and those skilled in the art can select a dedicated mold capable of implementing the above-described functions.
Due to the flexibility of the process, the overall packaging size of the photoelectric sensor of the embodiment can be flexibly adjusted according to the actual application requirements, so that large-size packaging and small-size packaging can be realized, such as 2.0mm multiplied by 1.0mm, 2.0mm multiplied by 1.6mm and the like, and the packaging thickness can be flexibly adjusted by adjusting the amount of injected glue; 0.7mm, 1.0mm and the like, and provides great flexibility for adapting to different application requirements.
In a more specific embodiment, the upper surface and the lower surface of the substrate 10 of the present embodiment are each provided with four conductive potentials. Specifically, referring to fig. 4, the upper surface of the substrate 10 is provided with a first conductive potential 15, a first conductive connection site 16, a second conductive potential 17, and a second conductive connection site 18, wherein the first mounting site is provided at the first conductive potential 15, and the second mounting site is provided at the second conductive potential 17; the optical signal transmitting unit 11 at the first installation position is connected to the first conductive connection position 16 through a first conductive line 19, and the optical signal receiving unit 12 at the second installation position is connected to the second conductive connection position 18 through a second conductive line 20. The position of the first mounting position on the first conductive potential 15 and the position of the second mounting position on the second conductive potential 17 can be flexibly adjusted according to practical application, in other words, it can also be understood that the optical signal transmitting unit 11 and the optical signal receiving unit 12 are directly fixed to the first conductive potential 15 and the second conductive potential 17, respectively.
The lower surface of the substrate 10 is provided with a third conductive potential, a third connection conductive potential, a fourth conductive potential, and a fourth connection conductive potential (not shown in the figure) corresponding to the first conductive potential 15, the first conductive connection site 16, the second conductive potential 17, and the second conductive connection site 18, respectively. And, a first via 21 for connecting the first conductive potential 15 and the third conductive potential, a second via 22 for connecting the first conductive connection site 16 and the third connection conductive potential, a third via 23 for connecting the second conductive potential 17 and the fourth conductive potential, and a fourth via 24 for connecting the second conductive connection site 18 and the fourth connection conductive potential are respectively provided on both sides of the substrate 10. These vias may serve to electrically connect the upper and lower conductive sites of the substrate 10. Optionally, the shapes and sizes of the four conductive potentials disposed on the upper surface and the lower surface of the substrate 10 may be flexibly adjusted according to practical applications or heat dissipation requirements, which is not limited in this embodiment.
According to the above design, when manufacturing the photoelectric sensor, after the optical signal transmitting unit 11 and the optical signal receiving unit 12 are respectively fixed on the substrate 10, the optical signal transmitting unit 11 and the optical signal receiving unit 12 are further respectively connected with the first conductive connection position 16 and the second conductive connection position 18 of the substrate 10 through the first conductive wire 19 and the second conductive wire 20, and then the subsequent operation of the glue injection process is performed. It should be noted that the photoelectric sensor of the present embodiment is not limited to the above-mentioned design (i.e. the way of setting four conductive potentials on the upper and lower surfaces of the substrate 10 and then connecting the optical signal transmitting unit 11 and the optical signal receiving unit 12 through the conductive wires), and those skilled in the art can flexibly design the substrate 10, the optical signal transmitting unit 11 and the optical signal receiving unit 12 according to actual needs without departing from the scope of the present disclosure.
The present disclosure also provides a method of manufacturing a package structure of a filtered light signal photosensor, as shown in fig. 7, including:
s30: a substrate 10 is provided, wherein a first mounting location and a second mounting location, a first conductive connection location 16 and a second conductive connection location 18 are provided on an upper surface of the substrate 10.
S31: the optical signal transmitting unit 11 and the optical signal receiving unit 12 are respectively fixed at a first mounting position and a second mounting position of the substrate 10, and are respectively connected with the first conductive connection position 16 and the second conductive connection position 18 through a first conductive line 19 and a second conductive line 20.
S32: and uniformly mixing the base material for manufacturing the filter glue layer 13 and the optical filter material to obtain the target material.
S33: and forming a filter glue layer 13 covering the whole upper surface on the upper surface of the substrate 10 by using glue injection equipment, wherein the filter glue layer 13 is prepared by a target material.
S34: and cutting off the filter glue layer 13 between the optical signal transmitting unit 11 and the optical signal receiving unit 12 and on two sides of the optical signal transmitting unit and the optical signal receiving unit by a cutting process.
S35: and forming a light shielding glue layer 14 covering the upper surface of the substrate 10 on the upper surface of the substrate 10 by using glue injection equipment.
The optical filter adhesive layer 13 includes a first optical filter adhesive layer 131 and a second optical filter adhesive layer 132, and the first optical filter adhesive layer 131 and the second optical filter adhesive layer 132 respectively cover the optical signal transmitting unit 11 and the optical signal receiving unit 12; the light shielding glue layer 14 at least comprises a first light shielding glue layer 141, a second light shielding glue layer 142 and a third light shielding glue layer 143, the first light filtering glue layer 131 is arranged between the first light shielding glue layer 141 and the second light shielding glue layer 142, and the second light filtering glue layer 132 is arranged between the second light shielding glue layer 142 and the third light shielding glue layer 143.
The optical filter adhesive layer 13 is used for protecting the optical signal transmitting unit 11 and the optical signal receiving unit 12 and allowing the optical signal of the optical signal transmitting unit 11 to pass through; the light shielding glue layer 14 is used for preventing the optical signal of the optical signal emitting unit 11 from passing through.
The specific implementation of steps S30-S35 can refer to the above description, and will not be described herein.
Based on the same inventive concept, the present disclosure further provides an electronic device, where the electronic device includes the package structure of the optical signal-filterable photosensor in the above embodiment, or the electronic device includes the package structure of the optical signal-filterable photosensor manufactured by the manufacturing method of the package structure of the optical signal-filterable photosensor.
The present disclosure is to be considered as limited only by the preferred embodiments and not limited to the specific embodiments described herein, and all changes, equivalents and modifications that come within the spirit and scope of the disclosure are desired to be protected.
Claims (10)
1. A package structure of a photosensor capable of filtering optical signals is characterized by comprising:
the optical signal transmission device comprises a substrate, wherein a first mounting position and a second mounting position are arranged on the upper surface of the substrate, an optical signal transmission unit is fixed on the first mounting position, and an optical signal receiving unit is fixed on the second mounting position;
the light filtering glue layer is formed on the upper surface of the substrate in a glue injection mode and comprises a first light filtering glue layer and a second light filtering glue layer, wherein the first light filtering glue layer and the second light filtering glue layer respectively cover the light signal transmitting unit and the light signal receiving unit;
the light shielding glue layer is formed on the upper surface of the substrate in a glue injection mode and at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer, wherein the first light filtering glue layer is arranged between the first light shielding glue layer and the second light shielding glue layer, and the second light filtering glue layer is arranged between the second light shielding glue layer and the third light shielding glue layer;
the optical filtering adhesive layer is used for protecting the optical signal transmitting unit and the optical signal receiving unit and allowing the optical signal of the optical signal transmitting unit to pass through; the light shielding glue layer is used for preventing the optical signal of the optical signal transmitting unit from passing through.
2. The package structure of a filtered light signal photosensor according to claim 1, wherein the filter layer is a filter layer for filtering light signals below a predetermined threshold.
3. The package structure of the optical signal filtering photosensor according to claim 1, wherein the filter adhesive layer is a filter adhesive layer for filtering optical signals outside a predetermined wavelength band interval.
4. The package structure of a photosensor with a filterable optical signal as claimed in claim 1, wherein the material of the filter glue layer is mixed by adding 2% to 30% by weight of optical filter material to the transparent package material.
5. The package structure of a filtered optical signal photosensor according to claim 1, wherein the lower surface of the light shielding glue layer is lower than the upper surface of the optical signal emitting unit;
and/or the lower surface of the light shielding glue layer is lower than the upper surface of the optical signal receiving unit.
6. The package structure of a filtered optical signal photosensor according to claim 1, wherein the width of the second light shielding glue layer is 20% -90% of the distance between the optical signal emitting unit and the optical signal receiving unit;
and the first light shielding glue layer and the third light shielding glue layer respectively account for 20% -60% of the width of the second light shielding glue layer.
7. The package structure of the photoelectric sensor as claimed in any one of claims 1 to 6, wherein a first conductive potential, a first conductive connection site, a second conductive potential, and a second conductive connection site are disposed on the upper surface of the substrate, the first mounting site is disposed at the first conductive potential, and the second mounting site is disposed at the second conductive potential;
the optical signal transmitting unit located at the first installation position is communicated with the first conductive connection position through a first conductive wire, and the optical signal receiving unit located at the second installation position is communicated with the second conductive connection position through a second conductive wire.
8. The package structure of the photoelectric sensor as claimed in claim 7, wherein a third conducting potential, a third conducting connection site, a fourth conducting potential, and a fourth conducting connection site are disposed on the lower surface of the substrate, the third conducting potential, the third conducting connection site, the fourth conducting connection site, and the fourth conducting connection site respectively corresponding to the first conducting potential, the first conducting connection site, the second conducting potential, and the second conducting connection site;
and a first through hole for connecting the first conductive potential and the third conductive potential, a second through hole for connecting the first conductive connecting position and the third conductive connecting position, a third through hole for connecting the second conductive connecting position and the fourth conductive connecting position and a fourth through hole for connecting the second conductive connecting position and the fourth conductive connecting position are respectively arranged on two sides of the substrate.
9. A method for manufacturing a photoelectric sensor packaging structure is characterized by comprising the following steps:
providing a substrate, wherein a first mounting position and a second mounting position, a first conductive connecting position and a second conductive connecting position are arranged on the upper surface of the substrate;
respectively fixing an optical signal transmitting unit and an optical signal receiving unit to a first mounting position and a second mounting position of the substrate, and respectively connecting the optical signal transmitting unit and the optical signal receiving unit with the first conductive connecting position and the second conductive connecting position through a first conductive wire and a second conductive wire;
uniformly mixing the base material for manufacturing the light filtering adhesive layer and the light filtering material to obtain a target material;
forming a light filtering adhesive layer covering the whole upper surface on the upper surface of the substrate by using glue injection equipment, wherein the light filtering adhesive layer is prepared by the target material;
cutting off the light filtering glue layers between the light signal transmitting unit and the light signal receiving unit and at two sides of the light signal transmitting unit and the light signal receiving unit through a cutting process;
forming a light shielding glue layer covering the upper surface of the substrate on the upper surface of the substrate by using glue injection equipment;
the optical filtering glue layer comprises a first optical filtering glue layer and a second optical filtering glue layer, and the first optical filtering glue layer and the second optical filtering glue layer respectively cover the optical signal transmitting unit and the optical signal receiving unit; the light shielding glue layer at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer, the first light filtering glue layer is arranged between the first light shielding glue layer and the second light shielding glue layer, and the second light filtering glue layer is arranged between the second light shielding glue layer and the third light shielding glue layer;
the optical filtering adhesive layer is used for protecting the optical signal transmitting unit and the optical signal receiving unit and allowing the optical signal of the optical signal transmitting unit to pass through; the light shielding glue layer is used for preventing the optical signal of the optical signal transmitting unit from passing through.
10. An electronic device, characterized in that the electronic device comprises the photosensor package structure of any one of claims 1 to 8;
alternatively, the first and second electrodes may be,
the electronic device comprises the photoelectric sensor packaging structure manufactured by the manufacturing method of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111203811.8A CN113851460A (en) | 2021-10-15 | 2021-10-15 | Packaging structure, manufacturing method and equipment of photoelectric sensor capable of filtering optical signals |
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|---|---|---|---|
| CN202111203811.8A CN113851460A (en) | 2021-10-15 | 2021-10-15 | Packaging structure, manufacturing method and equipment of photoelectric sensor capable of filtering optical signals |
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| CN113851460A true CN113851460A (en) | 2021-12-28 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115755074A (en) * | 2022-10-29 | 2023-03-07 | 芯思杰技术(深圳)股份有限公司 | Display device and electronic apparatus |
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2021
- 2021-10-15 CN CN202111203811.8A patent/CN113851460A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115755074A (en) * | 2022-10-29 | 2023-03-07 | 芯思杰技术(深圳)股份有限公司 | Display device and electronic apparatus |
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