CN216120290U

CN216120290U - Photoelectric sensor packaging structure with shading layer and electronic equipment

Info

Publication number: CN216120290U
Application number: CN202122495212.XU
Authority: CN
Inventors: 刘丽铭; 申崇渝; 刘国旭
Original assignee: Beijing Yimei New Technology Co ltd
Current assignee: Beijing Yimei New Technology Co ltd
Priority date: 2021-10-15
Filing date: 2021-10-15
Publication date: 2022-03-22
Anticipated expiration: 2031-10-15

Abstract

The disclosure relates to the technical field of semiconductors, and provides a photoelectric sensor packaging structure provided with a light shielding layer and an electronic device. The packaging structure comprises: the optical signal transmission device comprises a substrate, a first optical signal transmission unit and a second optical signal reception unit, wherein the upper surface of the substrate is provided with a first mounting position and a second mounting position; the protective adhesive layer comprises a first protective adhesive layer and a second protective adhesive layer which respectively cover the optical signal transmitting unit and the optical signal receiving unit; a light-shielding layer including a first light-shielding layer and a second light-shielding layer; and the light shielding glue layer at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer. According to the embodiment of the disclosure, the second light shielding glue layer for shielding the light signal transmitting unit signal is arranged between the light signal transmitting unit and the light signal receiving unit, so that the transverse crosstalk of the internal signal can be eliminated or greatly reduced, and the detection accuracy of the photoelectric sensor is greatly improved.

Description

Photoelectric sensor packaging structure with shading layer and electronic equipment

Technical Field

The present invention relates to the field of photoelectric sensor technology, and more particularly, to a photoelectric sensor package structure and an electronic device having a light shielding layer.

Background

Photoelectric sensors are applied more and more widely in the aspects of current intelligent medical treatment, intelligent home, industrial automation, portable equipment and the like, such as heart rate sensors, blood oxygen sensors, proximity sensors, distance sensors and the like, so that the work and life of human beings are more and more intelligent and convenient. With the improvement and development of technical requirements, in order to reduce the volume of the whole device, the components are more and more miniaturized, and the functions are integrated, and in order to reduce the packaging volume of such a photoelectric sensor, the light emitting part and the light signal receiving part are often prone to be packaged in the same unit component. Because the light emitting angle of the emitting chip is relatively diffused, the package colloid is easy to cause refraction/reflection of internal light or reflection of external objects which are not to be detected to the light, accurate feedback of the light signal receiving part to a real signal is greatly interfered, and a detection result is wrong or unstable.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a photoelectric sensor package structure and an electronic device with a light shielding layer, so as to solve the technical problem in the prior art that a detection result is inaccurate due to the fact that a light emitting angle of an emitting chip is relatively diffused, and a package colloid easily causes refraction/reflection of internal light or reflection of external non-to-be-detected objects to light to cause signal interference.

In order to achieve the purpose, the technical scheme adopted by the disclosure is as follows:

in one aspect, the present disclosure provides a photosensor package structure with a light shielding layer, including:

the optical signal transmission device comprises a substrate, wherein a first mounting position and a second mounting position are arranged on the upper surface of the substrate, an optical signal transmission unit is fixed on the first mounting position, and an optical signal receiving unit is fixed on the second mounting position;

the protective adhesive layer is formed on the upper surface of the substrate in an adhesive injection mode and comprises a first protective adhesive layer and a second protective adhesive layer, wherein the first protective adhesive layer and the second protective adhesive layer respectively cover the optical signal transmitting unit and the optical signal receiving unit;

the shading layer covers the upper surfaces of the first protective adhesive layer and the second protective adhesive layer through a printing process, is provided with a directional light guide channel and comprises a first shading layer and a second shading layer; the directional light guide channels on the first light shielding layer and the second light shielding layer respectively cover the upper parts of the optical signal transmitting unit and the optical signal receiving unit;

the light shielding glue layer is formed on the upper surface of the substrate in a glue injection mode and at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer, wherein a first protective glue layer and a first light shielding layer are arranged between the first light shielding glue layer and the second light shielding glue layer, and a second protective glue layer and a second light shielding layer are arranged between the second light shielding glue layer and the third light shielding glue layer;

the protective adhesive layer is used for protecting the optical signal transmitting unit and the optical signal receiving unit and allowing the optical signal of the optical signal transmitting unit to pass through; the covering position of the shading layer does not allow the optical signal to pass through so as to ensure that the optical signal passes through the directional light guide channel; the light shielding glue layer is used for preventing the optical signal of the optical signal transmitting unit from passing through.

In some embodiments, the light-shielding layer has a thickness ranging from 20 to 200 μm.

In some embodiments, the material of the light-shielding layer is a black thermosetting material;

or the material of the light shielding layer is a black light-curing material.

In some embodiments, the shape of the directional light guide channel of the light shielding layer may be circular or square.

In some embodiments, the area of the directional light guide channel is 0.5 to 1.5 times the surface area of the corresponding optical signal transmitting unit or optical signal receiving unit.

In some embodiments, the light-shielding layer can be manufactured by screen printing, jet printing or 3D printing.

In some embodiments, the lower surface of the light shielding glue layer is lower than the upper surface of the optical signal emitting unit;

and/or the lower surface of the light shielding glue layer is lower than the upper surface of the optical signal receiving unit.

In some embodiments, the width of the second light shielding glue layer accounts for 20% -90% of the distance between the optical signal transmitting unit and the optical signal receiving unit;

and the first light shielding glue layer and the third light shielding glue layer respectively account for 20% -60% of the width of the second light shielding glue layer.

In some embodiments, the sum of the coverage area of the protective glue layer on the upper surface of the substrate and the coverage area of the light shielding glue layer on the upper surface of the substrate is equal to the area of the upper surface of the substrate;

and/or the protective adhesive layer comprises an ambient light filtering material or a band-pass material, the ambient light filtering material is used for filtering light signals of an environment which can generate interference outside the photoelectric sensor, and the band-pass material can enable light of a specific wave band to pass through.

In another aspect, the present disclosure further provides an electronic device, which includes the above-mentioned photoelectric sensor.

The photoelectric sensor with the light shielding layer provided by the present disclosure has the beneficial effects of at least comprising:

(1) according to the embodiment of the disclosure, the second light shielding glue layer for shielding the signal of the light signal transmitting unit is arranged between the light signal transmitting unit and the light signal receiving unit, so that the transverse crosstalk of the internal signal can be eliminated or greatly reduced, and the detection accuracy of the photoelectric sensor is greatly improved; in addition, the first light shielding adhesive layer and the third light shielding adhesive layer are arranged on the two sides of the optical signal transmitting unit and the optical signal receiving unit, so that the photoelectric sensor can play a role in shielding optical signals of other electronic devices in a specific application environment, and the detection accuracy of the photoelectric sensor is further improved.

(2) According to the embodiment of the disclosure, by arranging the light shielding layer and the directional light guide channel, the optical signal can only enter the photoelectric sensor through the directional light guide channel and is received by the optical signal receiving unit, and the interference of ambient light and the reflected light of the non-to-be-detected object to the detection result is reduced.

Drawings

To more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a photosensor provided in an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a first portion of a photosensor provided in an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a second portion of a photosensor provided by an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a third portion of a photosensor provided in an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a fourth portion of a photosensor provided in the embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a fifth part of a photosensor provided in the embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a sixth portion of a photosensor provided in an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of a second state of a photosensor provided in an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a third state of a photosensor according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a fourth state of a photosensor according to an embodiment of the present disclosure.

Wherein, in the figures, the respective reference numerals:

10	substrate	11	Optical signal transmitting unit
				12	Optical signal receiving unit	13	Protective adhesive layer
131	First protective glue layer	132	Second protective adhesive layer
				14	Light shielding layer	141	A first light-shielding layer
142	A second light-shielding layer	143	Directional light guide channel
				15	Light shielding glue layer	151	First light shielding glue layer
152	Second light shielding glue layer	153	Third light shielding glue layer
				16	First conductive site	17	A first conductive connection site
18	Second conductive site	19	Second conductive connection site
				20	First conductive line	21	Second conductive line
22	First through hole	23	Second through hole
				24	Third through hole	25	Fourth through hole

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present disclosure more clearly understood, the present disclosure is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the disclosure and are not intended to limit the disclosure.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

Referring to fig. 1, an embodiment of the present disclosure provides an overall structure schematic diagram of a photoelectric sensor package structure, including a substrate 10, an optical signal emitting unit 11, an optical signal receiving unit 12, a protective adhesive layer 13, a light shielding layer 14, and a light shielding layer. An optical signal transmitting unit 11 and an optical signal receiving unit 12 are fixed on the upper surface of the substrate 10; the optical signal transmitting unit 11 and the optical signal receiving unit 12 are respectively connected with the first conductive connecting position 17 and the second conductive connecting position 19 on the upper surface of the substrate 10 through a first conductive connecting line 20 and a second conductive line 21; the optical signal transmitting unit 11 and the optical signal receiving unit 12 are provided with a protective adhesive layer 13; a light shielding layer 14 is arranged on the upper surface of the protective adhesive layer 13, and a directional light guide channel 143 which covers the upper parts of the optical signal transmitting unit 11 and the optical signal receiving unit 12 is arranged on the light shielding layer 14; light shielding adhesive layers 15 are provided between and on both sides of the protective adhesive layers 13. It should be noted that the structure of the photosensor package provided with the light shielding layer in this embodiment is essentially the structure of the photosensor, and for convenience of description, the structure of the photosensor package provided with the light shielding layer is collectively referred to as the photosensor in this embodiment.

The photoelectric sensor provided with the light shielding layer 14 provided by the embodiment has at least the following beneficial effects:

(1) the second light shielding adhesive layer 152 for shielding the signal of the light signal transmitting unit 11 is arranged between the light signal transmitting unit 11 and the light signal receiving unit 12 in the embodiment of the disclosure, so that the transverse crosstalk of the internal signal can be eliminated or greatly reduced, and the detection accuracy of the photoelectric sensor is greatly improved; moreover, the first light shielding adhesive layer 151 and the third light shielding adhesive layer 153 are arranged on the two sides of the optical signal transmitting unit 11 and the optical signal receiving unit 12, so that the photoelectric sensor can play a role in shielding optical signals of other electronic devices in a specific application environment, and the detection accuracy of the photoelectric sensor is further improved.

(2) In the embodiment of the disclosure, by providing the light shielding layer 14 and the directional light guide channel 143, the optical signal can only enter the photosensor through the directional light guide channel 143 and is received by the optical signal receiving unit 12, so that interference of ambient light and reflected light of the non-object to be detected to the detection result is reduced.

Referring to fig. 2, in an embodiment, the substrate 10 is a rectangular substrate 10 having a certain thickness, and the shape of the substrate 10 may be changed by one skilled in the art according to different situations, which is not limited herein. A first conductive potential 16, a first conductive connection site 17, a second conductive potential 18 and a second conductive connection site 19 are arranged on the upper surface of the substrate 10, a third conductive potential, a third conductive connection site, a fourth conductive potential and a fourth conductive connection site which correspond to the first conductive potential 16, the first conductive connection site 17, the second conductive potential 18 and the second conductive connection site 19 respectively are arranged on the lower surface of the substrate 10, and the shapes and the sizes of the conductive sites corresponding to the upper part and the lower part of the substrate 10 can be different without limitation; a first through hole 22 for connecting the first conductive potential 16 and the third conductive potential, a second through hole 23 for connecting the first conductive connection site 17 and the third conductive connection site, a third through hole 24 for connecting the second conductive potential 18 and the fourth conductive potential, and a fourth through hole 25 for connecting the second conductive connection site 19 and the fourth conductive connection site are respectively disposed on both sides of the substrate 10.

Referring to fig. 3, a first conductive potential 16 and a second conductive potential 18 are disposed on the upper surface of the substrate 10, the optical signal transmitting unit 11 is fixed on the first conductive potential 16, and the optical signal receiving unit 12 is fixed on the second conductive potential 18. As an example, the optical signal emitting unit 11 may be an LED or a VCSEL, the chip structure may be vertical or flip, and the chip structure may be an infrared emitting chip or a green emitting chip according to different applications, but is not limited to these types of chips, and those skilled in the art may select different bands and different types of chips according to practical applications, and this embodiment is not limited to this; the optical signal receiving unit 12 may be a photodiode or a phototriode, but is not limited to the photodiode or the phototriode, and may also be a dedicated ASIC chip, and those skilled in the art may flexibly select the optical signal receiving unit according to actual needs, and the embodiment does not limit the optical signal receiving unit. It should be noted that the optical signal transmitting unit 11 and the optical signal receiving unit 12 of the present embodiment may be fixed on the substrate 10, that is, the optical signal transmitting unit 11, the optical signal receiving unit 12 and the substrate 10 are two separate components; in addition, the optical signal transmitting unit 11 and the optical signal receiving unit 12 of the present embodiment can also be directly covered inside the substrate 10, i.e. they are integrated with the substrate 10.

The protective adhesive layer 13 is formed on the upper surface of the substrate 10 by a glue injection method, and includes a first protective adhesive layer 131 and a second protective adhesive layer 132, and the first protective adhesive layer 131 and the second protective adhesive layer 132 respectively cover the optical signal transmitting unit 11, the optical signal receiving unit 12, and the conductive connection line. As shown in fig. 7, on the premise of completely covering the optical signal transmitting unit 11 and the optical signal receiving unit 12, the shape of the protective adhesive layer 13 may be a rectangular parallelepiped, a cylinder, a hexahedral cylinder, or the like, and is set as required, which is not limited herein; as an example, the protective adhesive layer 13 of the present embodiment is generally transparent silicone or transparent epoxy, but is not limited to transparent silicone or transparent epoxy, and those skilled in the art can also select other materials with similar performance, so that the first protective adhesive layer 131 and the second protective adhesive layer 132 can not only protect the optical signal transmitting unit 11 and the optical signal receiving unit 12, thereby improving the reliability and stability of the package, but also allow the optical signal in the wavelength band transmitted by the optical signal transmitting unit 11 to pass through. Optionally, other functional materials, such as an ambient light filter material or a band-pass material, may be mixed in the protective adhesive layer 13, wherein the ambient light filter material is used to prevent ambient light signals that may cause interference from passing through, and the band-pass material allows light of a specific wavelength band to pass through. So, protection glue film 13 can prevent to pass through the colloid to the ambient light that produces the interference to the detected signal to improve photoelectric sensor testing result's accuracy, and then promote photoelectric sensor's wholeness ability. In this embodiment, the functional materials that can be mixed in the protective adhesive layer 13 are not limited to the above two materials, and those skilled in the art can flexibly select other functional materials according to the application requirements, which is not limited in this embodiment.

The light shielding layer 14 covers the upper surfaces of the first protective adhesive layer 131 and the second protective adhesive layer 132, and the light shielding layer 14 is provided with an oriented light guide channel 143 which comprises a first light shielding layer 141 and a second light shielding layer 142; the directional light guide channels 143 on the first light shielding layer 141 and the second light shielding layer 142 are respectively covered above the optical signal transmitting unit 11 and the optical signal receiving unit 12.

Referring to fig. 6 or fig. 7, in some embodiments, the light-shielding layer 14 is disposed on the upper surfaces of the first protective adhesive layer 131 and the second protective adhesive layer 132, and includes a first light-shielding layer 141 and a second light-shielding layer 142; the first light shielding layer 141 and the second light shielding layer 142 are provided with directional light guide channels 143, which cover the upper sides of the optical signal transmitting unit 11 and the optical signal receiving unit 12, respectively. Alternatively, the thickness of the light shielding layer 14 is generally 20 to 200 μm, which ensures that the light shielding layer 14 shields the ambient light from entering the inside of the package from the covered portion of the light shielding layer 14, while preventing the optical signal of the optical signal emitting unit 11 from exiting from the covered portion of the printed layer.

In some embodiments, the cross-sectional area of the directional light guide channel may be 0.5 to 1.5 times the surface area of the light emitting element or the light receiving element, less than 0.5 times may result in a reduction in effective emission or effective reception of the light signal, and more than 1.5 times may reduce the effect of the light guide channel against the ambient light interference. In addition, the cross-sectional shape of the directional light guide channel may be a circle as shown in fig. 8, a square as shown in fig. 9, or an ellipse, a semi-ellipse, a diamond, an inverted cone, or other shapes, and is specifically set as required. In some embodiments, the shape and size of the directional light guide channel 143 corresponding to the optical signal receiving unit 12 and the shape and size of the directional light guide channel 143 corresponding to the optical signal receiving unit 12 may be the same or different, as shown in fig. 8, and both the sizes and the shapes may be the same; as shown in fig. 9, the sizes of the two may be different; as shown in fig. 10, the shapes of the two may be different; the specific setting is as required, and is not limited herein.

In some embodiments, the material of the light shielding layer 14 may be a light-curing material such as black UV ink, a thermosetting material such as black silica gel, black epoxy resin, or other similar functional materials, which is not limited herein. In one embodiment, as shown in fig. 8, the light shielding layer 14 and the light shielding glue layer 15 are made of the same material, and are made of black silicone. In other embodiments, the light shielding layer 14 and the light shielding adhesive layer 15 may be made of the same or different materials, and are provided as needed.

In some embodiments, the light shielding layer 14 may be formed by a screen printing process, a spray printing process, a 3D printing process, or other flexible shape and size adjustment process. By adopting the preparation method, the shape and the size of the directional light guide channel 143 can be flexibly adjusted according to the needs, and the limitation that the traditional die cannot be adjusted due to fixation is avoided. In addition, because the accuracy requirements are different, in different application scenarios, different settings can be performed according to needs, and no limitation is made here.

The light shielding glue layer 15 is formed on the upper surface of the substrate 10 by glue injection, and the light shielding glue layer 15 at least comprises a first light shielding glue layer 151, a second light shielding glue layer 152 and a third light shielding glue layer 153; a first protective adhesive layer 131 and a first light shielding layer 141 are disposed between the first light shielding adhesive layer 151 and the second light shielding adhesive layer 152, and a second protective adhesive layer 132 and a second light shielding layer 142 are disposed between the second light shielding adhesive layer 152 and the third light shielding adhesive layer 153. That is, on the upper surface of the substrate 10, the first light-shielding adhesive layer 151, the first protective adhesive layer 131 (and the second light-shielding layer 142), the second light-shielding adhesive layer 152, the second protective adhesive layer 132 (and the second light-shielding layer 142), and the third light-shielding adhesive layer 153 are sequentially disposed from left to right (in the direction shown in fig. 1). The light shielding adhesive layer 15 is used to prevent the optical signal of the optical signal emitting unit 11 from passing through. In this way, since the second light shielding adhesive layer 152 for shielding the signal of the optical signal transmitting unit 11 is disposed between the optical signal transmitting unit 11 and the optical signal receiving unit 12, the internal signal lateral crosstalk can be eliminated or greatly reduced, and the detection accuracy of the photoelectric sensor can be greatly improved. Moreover, the first light shielding adhesive layer 151 and the third light shielding adhesive layer 153 are arranged on the two sides of the optical signal transmitting unit 11 and the optical signal receiving unit 12, so that the photoelectric sensor can play a role in shielding optical signals of other electronic devices in a specific application environment, and the detection accuracy of the photoelectric sensor is further improved.

By way of example, the light shielding glue layer 15 may be epoxy black glue or black silica gel, but is not limited to epoxy black glue or black silica gel, and those skilled in the art may also select other materials with similar performance, and this embodiment is not limited to this. Further, the lower surface of the light shielding adhesive layer 15 is lower than the upper surfaces of the optical signal transmitting unit 11 and the optical signal receiving unit 12, so as to perform a better shielding function on the optical signal transmitted by the optical signal transmitting unit 11.

As a specific embodiment, after the first protective glue layer 131, the second protective glue layer 132 and the light shielding glue layer 15 are formed on the upper surface of the substrate 10, the coverage area of the first protective glue layer 131 on the substrate 10, the coverage area of the second protective glue layer 132 on the substrate 10 and the coverage area of the light shielding glue layer 15 on the substrate 10 are equal to the total area of the upper surface of the substrate 10, that is, the first protective glue layer 131, the second protective glue layer 132 and the light shielding glue layer 15 together cover the entire upper surface of the substrate 10. Further, the width of the second light shielding adhesive layer 152 accounts for 20% -90% of the distance between the optical signal emitting unit 11 and the optical signal receiving unit 12, which not only ensures the safe distance between the light shielding adhesive layer 15 and the optical signal emitting unit 11 and the optical signal receiving unit 12, but also ensures that the optical signal emitted by the optical signal emitting unit 11 can be prevented from passing through; the first light-shielding adhesive layer 151 and the third light-shielding adhesive layer 153 respectively occupy 20% -60% of the width of the second light-shielding adhesive layer 152. It should be noted that the width of the second light-shielding adhesive layer 152 is a distance from the left side wall to the right side wall of the second light-shielding adhesive layer 152 in fig. 1, and the distance between the optical signal transmitting unit 11 and the optical signal receiving unit 12 can be understood as a distance between the right end of the optical signal transmitting unit 11 and the left end of the optical signal receiving unit 12 in fig. 1. In other words, there is a certain distance between the optical signal emitting unit 11 and the light shielding glue layer 15, and there is a certain distance between the optical signal receiving unit 12 and the light shielding glue layer 15. As described above, in the photoelectric sensor provided in this embodiment, the second light-shielding adhesive layer 152 is disposed between the optical signal transmitting unit 11 and the optical signal receiving unit 12 to eliminate or greatly reduce the internal signal lateral crosstalk, so as to greatly improve the detection accuracy, and meanwhile, the first light-shielding adhesive layer 151 and the third light-shielding adhesive layer 153 are disposed on two sides of the optical signal transmitting unit 11 and the optical signal receiving unit 12, so that the photoelectric sensor can play a role in shielding optical signals of other electronic devices in a specific application environment, so as to improve the detection accuracy; various functional materials such as an ambient light filtering material can be mixed in the protective adhesive layer 13 to prevent ambient light which can interfere with detection signals from passing through the colloid, so that the accuracy of detection results is further improved, and the overall performance of the photoelectric sensor is improved.

As shown in fig. 2-5, in manufacturing the photoelectric sensor of the present embodiment, first, a substrate 10 (the substrate 10 shown in fig. 2) provided with a first conductive potential 16 and a second conductive potential 18 is provided, then, an optical signal transmitting unit 11 and an optical signal receiving unit 12 are respectively fixed to the first conductive potential 16 and the second conductive potential 18 (shown in fig. 3) of the substrate 10, next, the substrate 10 may be placed into a dedicated Molding apparatus, a protective glue layer 13 (shown in fig. 5) is obtained by using glue Molding, and then, a light shielding layer 14 (fig. 6) with an oriented light guiding channel 143 is formed on the protective glue layer 13 by a screen printing process; further, the protection adhesive layer 13 on the left side of the optical signal transmitting unit 11, the protection adhesive layer 13 between the optical signal transmitting unit 11 and the optical signal receiving unit 12, and the protection adhesive layer 13 on the right side of the optical signal receiving unit 12 are cut off by a cutting process to obtain a first glue filling position, a second glue filling position, a third glue filling position, a first protection adhesive layer 131 (a first light shielding layer 141), and a second protection adhesive layer 132 (a second light shielding layer 142) (as shown in fig. 7), and finally, a first light shielding adhesive layer 151, a second light shielding adhesive layer 152, and a third adhesive layer 153 (as shown in fig. 1) are respectively formed at the first glue filling position, the second glue filling position, and the third glue filling position by means of glue dispensing; the width of the second light shielding adhesive layer 152 accounts for 20% -90% of the edge distance between the optical signal transmitting unit 11 and the optical signal receiving unit 12, and the width of the first light shielding adhesive layer 151 and the width of the third light shielding adhesive layer 153 account for 20% -60% of the width of the second light shielding adhesive layer 152.

Alternatively, in the above manufacturing process, the protective adhesive layer 13 is not limited to be molded by Molding, and those skilled in the art may form the adhesive into a rubber cake and then bond the rubber cake to the substrate 10. The first light shielding adhesive layer 151, the second light shielding adhesive layer 152 and the third light shielding adhesive layer 153 are not limited to be formed at the first glue filling position, the second glue filling position and the third glue filling position in a dispensing manner, and may also be formed at the first glue filling position, the second glue filling position and the third glue filling position in a Molding manner or an injection Molding manner. In addition to the above-mentioned formation of the first protective adhesive layer 131, the second protective adhesive layer 132 and the light shielding adhesive layer 15, the embodiment may also use a special mold to form the protective adhesive layer 13 with the first light shielding adhesive layer 151, the second light shielding adhesive layer 152 and the third light shielding adhesive layer 153 in one step, i.e. the first protective adhesive layer 13, the second light shielding adhesive layer 132 and the third light shielding adhesive layer 153 are formed in one step by using the special mold instead of forming the first protective adhesive layer 13 and then cutting the glue filling position and further filling the glue to form the light shielding adhesive layer 15, and then the first light shielding adhesive layer 151, the second light shielding adhesive layer 152 and the third light shielding adhesive layer 153 are formed in one step by using the special mold. The specific dedicated mold is not described in this embodiment, and those skilled in the art can select a dedicated mold capable of implementing the above-described functions.

Alternatively, in the above manufacturing process, the light shielding layer 14 is not limited to be formed by screen printing, and those skilled in the art may also realize the formation by a spray printing process, a 3D printing process, or the like.

Due to the flexibility of the process, the overall packaging size of the photoelectric sensor of the embodiment can be flexibly adjusted according to the actual application requirements, so that large-size packaging and small-size packaging can be realized, such as 2.0mm multiplied by 1.0mm, 2.0mm multiplied by 1.6mm and the like, and the packaging thickness can be flexibly adjusted by adjusting the amount of injected glue; 0.7mm, 1.0mm and the like, and provides great flexibility for adapting to different application requirements.

In a more specific embodiment, the upper surface and the lower surface of the substrate 10 of the present embodiment are each provided with four conductive potentials. Specifically, referring to fig. 4, a first conductive potential 16, a first conductive connection site 17, a second conductive potential 18 and a second conductive connection site 19 are disposed on the upper surface of the substrate 10, the first mounting site is disposed on the first conductive potential 16, and the second mounting site is disposed on the second conductive potential 18; the optical signal transmitting unit 11 at the first installation position is communicated with the first conductive connection position 17 through a first conductive wire 20, and the optical signal receiving unit 12 at the second installation position is communicated with the second conductive connection position 19 through a second conductive wire 21. The position of the first mounting position on the first conductive potential 16 and the position of the second mounting position on the second conductive potential 18 can be flexibly adjusted according to practical application, in other words, it can also be understood that the optical signal transmitting unit 11 and the optical signal receiving unit 12 are directly fixed to the first conductive potential 16 and the second conductive potential 18, respectively.

The lower surface of the substrate 10 is provided with a third conductive potential, a third connection conductive potential, a fourth conductive potential, and a fourth connection conductive potential (not shown in the figure) corresponding to the first conductive potential 16, the first conductive connection site 17, the second conductive potential 18, and the second conductive connection site 19, respectively. And, a first via hole 22 for connecting the first conductive potential 16 and the third conductive potential, a second via hole 23 for connecting the first conductive connection site 17 and the third connection conductive potential, a third via hole 24 for connecting the second conductive potential 18 and the fourth conductive potential, and a fourth via hole 25 for connecting the second conductive connection site 19 and the fourth connection conductive potential are respectively provided on both sides of the substrate 10. These vias may serve to electrically connect the upper and lower conductive sites of the substrate 10. Optionally, the shapes and sizes of the four conductive potentials disposed on the upper surface and the lower surface of the substrate 10 may be flexibly adjusted according to practical applications or heat dissipation requirements, which is not limited in this embodiment.

According to the above design, when manufacturing the photoelectric sensor, after the optical signal transmitting unit 11 and the optical signal receiving unit 12 are respectively fixed on the substrate 10, the optical signal transmitting unit 11 and the optical signal receiving unit 12 are further respectively connected with the first conductive connection position 17 and the second conductive connection position 19 of the substrate 10 through the first conductive wire 20 and the second conductive wire 21, and then the subsequent operation of the glue injection process is performed. It should be noted that the photoelectric sensor of the present embodiment is not limited to the above-mentioned design (i.e. the way of setting four conductive potentials on the upper and lower surfaces of the substrate 10 and then connecting the optical signal transmitting unit 11 and the optical signal receiving unit 12 through the conductive wires), and those skilled in the art can flexibly design the substrate 10, the optical signal transmitting unit 11 and the optical signal receiving unit 12 according to actual needs without departing from the scope of the present disclosure.

Based on the same concept, the present disclosure also provides an electronic device including the photosensor package structure provided with the light shielding layer in the above embodiments.

The present disclosure is to be considered as limited only by the preferred embodiments and not limited to the specific embodiments described herein, and all changes, equivalents and modifications that come within the spirit and scope of the disclosure are desired to be protected.

Claims

1. A photoelectric sensor packaging structure provided with a light shielding layer is characterized by comprising:

the light shielding glue layer is formed on the upper surface of the substrate in a glue injection mode and at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer, wherein the first protective glue layer and the first light shielding layer are arranged between the first light shielding glue layer and the second light shielding glue layer, and the second protective glue layer and the second light shielding layer are arranged between the second light shielding glue layer and the third light shielding glue layer;

the protective adhesive layer is used for protecting the optical signal transmitting unit and the optical signal receiving unit and allowing the optical signal of the optical signal transmitting unit to pass through; the covering position of the light shielding layer does not allow the optical signal to pass through so as to ensure that the optical signal passes through the directional light guide channel; the light shielding glue layer is used for preventing the optical signal of the optical signal transmitting unit from passing through.

2. The photoelectric sensor package structure provided with a light shielding layer according to claim 1, wherein the light shielding layer has a thickness in a range of 20 to 200 μm.

3. The photoelectric sensor packaging structure provided with the light shielding layer according to claim 1, wherein the material of the light shielding layer is a black thermosetting material;

or the material of the light shielding layer is a black light-curing material.

4. The photo-sensor package structure provided with a light shielding layer according to claim 1, wherein the shape of the directional light guide channel of the light shielding layer is circular or square.

5. The photosensor package structure with a light shielding layer according to claim 1, wherein the area of the directional light guide channel is 0.5 to 1.5 times the surface area of the corresponding light signal emitting unit or light signal receiving unit.

6. The photoelectric sensor packaging structure provided with the light shielding layer according to claim 1, wherein the light shielding layer can be manufactured by screen printing, jet printing or 3D printing.

7. The photosensor package structure with a light shielding layer as claimed in claim 1, wherein a lower surface of the light shielding adhesive layer is lower than an upper surface of the optical signal emitting unit;

8. The photoelectric sensor packaging structure provided with the light shielding layer according to claim 1, wherein the width of the second light shielding glue layer accounts for 20% -90% of the distance between the optical signal transmitting unit and the optical signal receiving unit;

9. The photosensor package structure with a light shielding layer according to any one of claims 1 to 8, wherein the sum of the area covered by the protective adhesive layer on the upper surface of the substrate and the area covered by the light shielding adhesive layer on the upper surface of the substrate is equal to the area of the upper surface of the substrate.

10. An electronic device, characterized in that the electronic device comprises the photosensor package structure of any one of claims 1 to 9.