CN113851462A - Photoelectric sensor packaging structure, manufacturing method thereof and electronic equipment - Google Patents
Photoelectric sensor packaging structure, manufacturing method thereof and electronic equipment Download PDFInfo
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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Abstract
The invention relates to the technical field of semiconductors, and provides a packaging structure of a photoelectric sensor, a manufacturing method of the packaging structure and electronic equipment. The packaging structure comprises: the optical signal receiving device comprises a substrate, a first optical signal receiving unit and a second optical signal receiving unit, wherein the upper surface of the substrate is provided with a first mounting position and a second mounting position; the protective adhesive layer is formed on the upper surface of the substrate in an adhesive injection mode and comprises a first protective adhesive layer and a second protective adhesive layer which respectively cover the light emitting unit and the optical signal receiving unit; the light shielding glue layer is formed on the upper surface of the substrate in a glue injection mode and at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer; a first protective glue layer is arranged between the first light-shielding glue layer and the second light-shielding glue layer, and a second protective glue layer is arranged between the second light-shielding glue layer and the third light-shielding glue layer; the protective adhesive layer allows the optical signal of the light emitting unit to pass through; the light shielding glue layer is used for preventing the optical signal of the light emitting unit from passing through.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a packaging structure of a photoelectric sensor, a manufacturing method of the packaging structure and electronic equipment.
Background
With the rapid development of science and technology, the application of photoelectric reflection sensors is becoming more and more extensive, for example, heart rate detection and blood oxygen detection in the aspect of medical treatment, and the application of distance approach detection function to service robots in various fields (such as sweeping robots, logistics robots, contactless delivery robots, AGV unmanned transfer robots, etc.). For a remote detection sensor, a light emitting chip and a light signal receiving chip can be generally packaged separately, but with the development trend of integration and miniaturization, the existing integrated photoelectric sensor is easy to have the problems of transverse crosstalk of internal signals, detection misjudgment and the like. In particular, when a protective cover or a filter cover is added to a package of the photosensor, the crosstalk intensity of internal signals is increased, which leads to problems such as erroneous detection. In addition, the integrated photoelectric sensor in the prior art has a complex packaging structure and low implementation process flexibility.
Disclosure of Invention
The invention aims to provide a packaging structure of a photoelectric sensor, a manufacturing method thereof and electronic equipment, and aims to solve the problem that the integrated photoelectric sensor in the prior art is easy to generate internal signal crosstalk and cause detection misjudgment.
In order to achieve the purpose, the invention adopts the technical scheme that:
in a first aspect, the present invention provides a package structure of a photosensor, including:
the optical signal transmission device comprises a substrate, wherein a first mounting position and a second mounting position are arranged on the upper surface of the substrate, a light emitting unit is fixed on the first mounting position, and an optical signal receiving unit is fixed on the second mounting position;
the protective adhesive layer is formed on the upper surface of the substrate in an adhesive injection mode and comprises a first protective adhesive layer and a second protective adhesive layer; wherein the first protective adhesive layer and the second protective adhesive layer respectively cover the light emitting unit and the optical signal receiving unit;
the light shielding glue layer is formed on the upper surface of the substrate in a glue injection mode and at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer; a first protective glue layer is arranged between the first light shielding glue layer and the second light shielding glue layer, and a second protective glue layer is arranged between the second light shielding glue layer and the third light shielding glue layer;
the protective adhesive layer is used for protecting the light emitting unit and the optical signal receiving unit and allowing the optical signal of the light emitting unit to pass through; the light shielding glue layer is used for preventing the optical signal of the light emitting unit from passing through.
In one embodiment, a lower surface of the light shielding glue layer is lower than an upper surface of the light emitting unit;
and/or the lower surface of the light shielding glue layer is lower than the upper surface of the optical signal receiving unit.
In one embodiment, the width of the second light shielding glue layer accounts for 30% -80% of the distance between the light emitting unit and the light signal receiving unit;
and the first light shielding glue layer and the third light shielding glue layer respectively account for 20% -60% of the width of the second light shielding glue layer.
In one embodiment, the sum of the coverage area of the protective glue layer on the upper surface of the substrate and the coverage area of the light shielding glue layer on the upper surface of the substrate is equal to the area of the upper surface of the substrate;
and/or the protective adhesive layer comprises an ambient light filtering material or a band-pass material, the ambient light filtering material is used for filtering optical signals which can generate interference in the external environment of the photoelectric sensor, and the band-pass material can enable light of a specific wave band to pass through.
In one embodiment, the upper surface of the substrate is provided with a first conductive potential, a first conductive connection site and a second conductive potential, a second conductive connection site, the first mounting site is arranged at the first conductive potential, and the second mounting site is arranged at the second conductive potential;
wherein the light emitting unit at the first mounting position is communicated with the first connecting conducting potential through a first conducting wire, and the light signal receiving unit at the second mounting position is communicated with the second connecting conducting potential through a second conducting wire.
In one embodiment, the lower surface of the substrate is provided with a third conducting potential, a third conducting connection site, a fourth conducting potential and a fourth conducting connection site which are respectively in one-to-one correspondence with the first conducting potential, the first conducting connection site, the second conducting potential and the second conducting connection site;
and a first through hole for connecting the first conductive potential and the third conductive potential, a second through hole for connecting the first conductive connecting position and the third conductive connecting position, a third through hole for connecting the second conductive connecting position and the fourth conductive connecting position and a fourth through hole for connecting the second conductive connecting position and the fourth conductive connecting position are respectively arranged on two sides of the substrate.
In a second aspect, the present invention further provides a method for manufacturing a photoelectric sensor, including:
providing a substrate; the upper surface of the substrate is at least provided with a first mounting position and a second mounting position;
fixing a light emitting unit and a light signal receiving unit to a first mounting position and a second mounting position of the substrate, respectively;
forming a protective adhesive layer and a light shielding adhesive layer on the upper surface of the substrate by using adhesive injection equipment, wherein the protective adhesive layer and the light shielding adhesive layer cover the upper surface of the substrate;
the protective adhesive layer comprises a first protective adhesive layer and a second protective adhesive layer, and the first protective adhesive layer and the second protective adhesive layer respectively cover the light emitting unit and the light signal receiving unit; the light shielding glue layer at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer, a first protection glue layer is arranged between the first light shielding glue layer and the second light shielding glue layer, and a second protection glue layer is arranged between the second light shielding glue layer and the third light shielding glue layer;
the protective adhesive layer is used for protecting the light emitting unit and the optical signal receiving unit and allowing the optical signal of the light emitting unit to pass through; the light shielding glue layer is used for preventing the optical signal of the light emitting unit from passing through.
In one embodiment, forming a protective adhesive layer and a light shielding adhesive layer on the upper surface of the substrate by using an adhesive injection device includes:
forming a first protective adhesive layer and a second protective adhesive layer on the upper surface of the substrate in a one-step forming mode by using special equipment;
forming a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer on the upper surface of the substrate by using special equipment;
or, forming a protection glue layer and a light shielding glue layer on the upper surface of the substrate by using glue injection equipment, wherein the protection glue layer and the light shielding glue layer cover the upper surface of the substrate, and the method comprises the following steps:
forming a protective adhesive layer covering the upper surface of the substrate on the upper surface of the substrate by using adhesive injection equipment;
cutting the protection glue layer to obtain a first protection glue layer, a second protection glue layer, a first glue filling position located on the left side of the first protection glue layer, a second glue filling position located between the first protection glue layer and the second protection glue layer, and a third glue filling position located on the right side of the second protection glue layer; cutting off the protective glue layers at the first glue filling position, the second glue filling position and the third glue filling position;
and forming light shielding glue filling layers at the first glue filling position, the second glue filling position and the third glue filling position respectively in a glue dispensing or glue filling mode.
In a third aspect, the present invention provides an electronic device, which includes the above-mentioned photosensor, or includes the photosensor manufactured by the above-mentioned manufacturing method.
The packaging structure of the photoelectric sensor provided by the invention has the beneficial effects that:
(1) according to the invention, the second light shielding glue layer for shielding the signal of the light emitting unit is arranged between the light emitting unit and the light signal receiving unit, so that the transverse crosstalk of the internal signal can be eliminated or greatly reduced, and the detection accuracy of the photoelectric sensor is greatly improved; moreover, the first light shielding adhesive layer and the third light shielding adhesive layer are arranged on the two sides of the light emitting unit and the light signal receiving unit, so that the photoelectric sensor can play a role in shielding light signals of other electronic devices in a specific application environment, and the detection accuracy of the photoelectric sensor is further improved.
(2) The invention can also prevent the ambient light which can interfere the detection signal from passing through the colloid by mixing various functional materials, such as ambient light filtering materials, in the protective adhesive layer, thereby further improving the accuracy of the detection result and improving the overall performance of the photoelectric sensor.
(3) The photoelectric sensor packaging structure provided by the invention is simple, the process implementation mode is flexible and adjustable, the materials used for packaging and the packaging size can be flexibly adjusted, large-size packaging and small-size packaging can be realized, the packaging thickness can be flexibly adjusted by adjusting the amount of injected glue, and great flexibility is provided for adapting to different application requirements.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of a package structure of a photosensor according to an embodiment of the present invention;
fig. 2a is a schematic structural diagram of a first exploded portion of a photoelectric sensor according to an embodiment of the present invention;
fig. 2b is a schematic structural diagram of a second decomposition part of the photoelectric sensor according to the embodiment of the present invention;
fig. 2c is a schematic structural diagram of a third exploded portion of a photoelectric sensor according to an embodiment of the present invention;
fig. 2d is a schematic structural diagram of a fourth exploded portion of a photosensor according to an embodiment of the present invention;
fig. 2e is a schematic structural diagram of a fifth exploded portion of a photoelectric sensor according to an embodiment of the present invention;
FIG. 3a is a schematic structural diagram of an exploded portion of a photosensor according to another embodiment of the present invention;
fig. 3b is a schematic overall structure diagram of a photoelectric sensor according to another embodiment of the present invention;
fig. 4 is a main flowchart of a method for manufacturing a photosensor according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1, fig. 1 is a schematic view of an overall structure of a package structure of a photosensor according to an embodiment of the present invention. As shown in fig. 1, the package structure of the photo sensor provided in this embodiment mainly includes a substrate 1, a protective adhesive layer 2, and a light shielding adhesive layer 3. It should be noted that the package structure of the photosensor of the present embodiment is essentially the structure of the photosensor, and for convenience of description, the package structure of the photosensor is collectively referred to as the photosensor in the present embodiment.
The upper surface of the substrate 1 is provided with a first mounting position 11 and a second mounting position 12, the first mounting position 11 is fixed with the light emitting unit 100, and the second mounting position is fixed with the light signal receiving unit 200. As an example, the light emitting unit 100 may be an LED or a VCSEL, the chip structure may be vertical or flip chip, and the chip structure may be an infrared emitting chip or a green emitting chip according to different applications, but the chip is not limited to these types of chips, and those skilled in the art may select different bands and different types of chips according to practical applications, and this embodiment is not limited to this; the optical signal receiving unit 200 may be a photodiode or a phototransistor, but is not limited to the photodiode or the phototransistor, and may also be a dedicated ASIC chip, and those skilled in the art may flexibly select the optical signal receiving unit according to actual needs, and the embodiment does not limit the optical signal receiving unit. The shape of the basic 1 can be arbitrarily selected according to actual needs and flexibly adjusted. In addition, in the present embodiment, the substrate 1 may be a square or rectangular parallelepiped having a certain thickness, the upper surface and the lower surface are square or rectangular, that is, the upper surface and the lower surface of the substrate 1 are opposite, the light emitting unit 100 and the light signal receiving unit 200 are disposed on the same surface of the substrate 1 (that is, on the same surface or on the same surface of the lower surface), and since the upper surface and the lower surface of the substrate 1 are opposite, disposing the light emitting unit 100 and the light signal receiving unit 200 on the upper surface of the substrate 1 in the present embodiment does not mean limiting the light emitting unit 100 and the light signal receiving unit 200 on a certain surface of the substrate 1, in other words, disposing the light emitting unit 100 and the light signal receiving unit 200 on the same surface of the substrate 1 in the present embodiment is sufficient. It should be noted that the light emitting unit 100 and the light signal receiving unit 200 of the present embodiment may be fixed on the substrate 1, that is, the light emitting unit 100, the light signal receiving unit 200 and the substrate 1 are two separate components; in addition, the light emitting unit 100 and the light signal receiving unit 200 of the present embodiment can also be directly covered inside the substrate 1, i.e. integrated with the substrate 1.
The protective adhesive layer 2 is formed on the upper surface of the substrate 1 by an adhesive injection method, and includes a first protective adhesive layer 21 and a second protective adhesive layer 22, and the first protective adhesive layer 21 and the second protective adhesive layer 22 respectively cover the light emitting unit 100 and the optical signal receiving unit 200. As an example, the protective adhesive layer 2 of the present embodiment is generally transparent silicone or transparent epoxy, but is not limited to transparent silicone or transparent epoxy, and those skilled in the art can also select other materials with similar performance, so that the first protective adhesive layer 21 and the second protective adhesive layer 22 can not only protect the optical transmitting unit 100 and the optical signal receiving unit 200, thereby improving the reliability and stability of the package, but also allow the optical signal in the wavelength band emitted by the optical transmitting unit 100 to pass through. Optionally, other functional materials, such as an ambient light filter material that prevents ambient light signals that may cause interference from passing through or a band pass material that allows light in a specific wavelength band to pass through, may be mixed into the protective gel layer 2. Therefore, the protective adhesive layer 2 can prevent the ambient light which interferes with the detection signal from passing through the adhesive, so that the accuracy of the detection result of the photoelectric sensor is improved, and the overall performance of the photoelectric sensor is improved. In this embodiment, the functional material that can be mixed in the protective adhesive layer 2 is not limited to the above two materials, and those skilled in the art can flexibly select other functional materials according to the application requirements, which is not limited in this embodiment.
The light shielding glue layer 3 is formed on the upper surface of the substrate 1 by glue injection, and the light shielding glue layer 3 at least comprises a first light shielding glue layer 31, a second light shielding glue layer 32 and a third light shielding glue layer 33; a first protective glue layer 21 is arranged between the first light shielding glue layer 31 and the second light shielding glue layer 32, and a second protective glue layer 22 is arranged between the second light shielding glue layer 32 and the third light shielding glue layer 33. That is, on the upper surface of the substrate 1, the first light-shielding glue layer 31, the first protective glue layer 21, the second light-shielding glue layer 32, the second protective glue layer 22, and the third light-shielding glue layer 33 are sequentially disposed from left to right (the direction shown in fig. 1). Wherein the light-shielding glue layer 3 is used for preventing the optical signal of the light-emitting unit 100 from passing through. In this way, since the second light-shielding adhesive layer 32 for shielding the signal of the light-emitting unit is disposed between the light-emitting unit 100 and the light-signal receiving unit 200, the internal signal lateral crosstalk can be eliminated or greatly reduced, and the detection accuracy of the photoelectric sensor is greatly improved. Moreover, the first light shielding adhesive layer 31 and the third light shielding adhesive layer 33 are arranged on two sides of the light emitting unit 100 and the light signal receiving unit 200, so that the photoelectric sensor can play a role of shielding light signals of other electronic devices in a specific application environment, and the detection accuracy of the photoelectric sensor is further improved.
By way of example, the light shielding glue layer 3 may be epoxy black glue or black silica gel, but is not limited to epoxy black glue or black silica gel, and those skilled in the art may also select other materials with similar performance, and this embodiment does not limit this. Further, the lower surface of the light shielding adhesive layer 3 is lower than the upper surfaces of the light emitting unit 100 and the light signal receiving unit 200, so as to perform a better shielding function on the light signal emitted by the light emitting unit 100.
As a specific embodiment, after the first protective glue layer 21, the second protective glue layer 22 and the light shielding glue layer 3 are formed on the upper surface of the substrate 1, the coverage area of the first protective glue layer 21 on the substrate 1, the coverage area of the second protective glue layer 22 on the substrate 1 and the coverage area of the light shielding glue layer 3 on the substrate 1 are equal to the total area of the upper surface of the substrate 1, that is, the first protective glue layer 21, the second protective glue layer 22 and the light shielding glue layer 3 collectively cover the entire upper surface of the substrate 1. Further, the width of the second light shielding adhesive layer 32 accounts for 30% -80% of the distance between the light emitting unit 100 and the light signal receiving unit 200, which not only ensures the safe distance between the light shielding adhesive layer 3 and the light emitting unit 100 and the light signal receiving unit 200, but also ensures that the light signal emitted by the light emitting unit 100 can be prevented from passing through; the first light-shielding glue layer 31 and the third light-shielding glue layer 33 respectively account for 20% -60% of the width of the second light-shielding glue layer 32. It should be noted that the width of the second light-shielding glue layer 32 is the distance from the left side wall to the right side wall of the second light-shielding glue layer 32 in fig. 1, and the distance between the light-emitting unit 100 and the light signal receiving unit 200 can be understood as the distance between the right end of the light-emitting unit 100 and the left end of the light signal receiving unit 200 in fig. 1. In other words, there is a certain distance between the light emitting unit 100 and the light shielding glue layer 3, there is a certain distance between the light signal receiving unit 200 and the light shielding glue layer 3, and the thickness of the second light shielding glue layer 3 is greater than the thickness of the first light shielding glue layer 31 and greater than the thickness of the third light shielding glue layer 33. As described above, in the photoelectric sensor provided in this embodiment, the second light-shielding adhesive layer 32 is disposed between the light-emitting unit 100 and the light-signal receiving unit 200, so as to eliminate or greatly reduce the internal signal lateral crosstalk, and greatly improve the detection accuracy, and meanwhile, the first light-shielding adhesive layer 31 and the third light-shielding adhesive layer 33 are disposed on two sides of the light-emitting unit 100 and the light-signal receiving unit 200, so that the photoelectric sensor can play a role in shielding the light signals of other electronic devices in a specific application environment, and improve the detection accuracy; various functional materials such as an ambient light filtering material can be mixed in the protective adhesive layer 2 to prevent ambient light which can interfere with detection signals from passing through the colloid, so that the accuracy of detection results is further improved, and the overall performance of the photoelectric sensor is improved.
In addition, the photoelectric sensor packaging structure of the embodiment is simple, the process implementation mode is flexible and adjustable, and materials used for packaging and the packaging size can be flexibly adjusted. The following describes the fabrication process of the photosensor according to this embodiment in detail with reference to specific examples.
Referring to fig. 2a to 2e, fig. 2a to 2e are schematic structural diagrams of an exploded portion of a photoelectric sensor according to an embodiment of the present invention. As shown in fig. 2a-2e, in manufacturing the photoelectric sensor of the present embodiment, first, a substrate 1 (such as the substrate 1 shown in fig. 2 a) provided with a first mounting location 11 and a second mounting location 12 is provided, then, a light emitting unit 100 and a light signal receiving unit 200 are respectively fixed to the first mounting location 11 and the second mounting location 12 of the substrate 1 (such as shown in fig. 2 b), then, the substrate 1 may be placed into a dedicated Molding equipment, a protective glue layer 2 is obtained by Molding glue, and further, a cutting process is performed to cut off the protective glue layer at the left side of the light emitting unit 100, the protective glue layer between the light emitting unit 100 and the light signal receiving unit 200, and the protective glue layer at the right side of the light signal receiving unit 200, so as to obtain a first glue filling location 301, a second glue location 302, a third glue location 303, a first protective glue layer 21 and a second protective glue layer 22 (such as shown in fig. 2 e), finally, a first light shielding glue layer 31, a second light shielding glue layer 32 and a third light shielding glue layer 33 are respectively formed at the first glue filling position 301, the second glue filling position 302 and the third glue filling position 303 in a glue dispensing manner (as shown in fig. 1); the width of the second light-shielding adhesive layer 32 accounts for 30% -80% of the edge distance between the light-emitting unit 100 and the light signal receiving unit 200, and the width of the first light-shielding adhesive layer 31 and the width of the third light-shielding adhesive layer 33 respectively account for 20% -60% of the width of the second light-shielding adhesive layer 32.
Alternatively, in the above manufacturing process, the protective adhesive layer 2 is not limited to be molded by Molding, but those skilled in the art may first mold the adhesive to form the adhesive cake and then bond the adhesive cake to the substrate 1. The first light shielding adhesive layer 31, the second light shielding adhesive layer 32 and the third light shielding adhesive layer 33 are not limited to be formed at the first glue filling position 301, the second glue filling position 302 and the third glue filling position 303 by a glue dispensing manner, and may be formed at the first glue filling position 301, the second glue filling position 302 and the third glue filling position 303 by a Molding glue filling manner or an injection Molding manner. In addition to the above-mentioned formation of the first protective adhesive layer 21, the second protective adhesive layer 22 and the light shielding adhesive layer 3, the embodiment may further use a special mold to form the first protective adhesive layer 21 and the second protective adhesive layer 22 with the first glue filling position 301, the second glue filling position 302 and the third glue filling position 303 in one step. That is, the first protective adhesive layer 21, the second protective adhesive layer 22, and the light shielding adhesive layer 3, the first light shielding adhesive layer 31, the first protective adhesive layer 21, the second light shielding adhesive layer 32, the second protective adhesive layer 22, and the third light shielding adhesive layer 33 are formed in one step by using a special mold without forming the protective adhesive layer 2 and then cutting the adhesive filling site, thereby forming the light shielding adhesive layer 3 by adhesive filling. The specific dedicated mold is not described in this embodiment, and those skilled in the art can select a dedicated mold capable of implementing the above-described functions.
Due to the flexibility of the process, the overall packaging size of the photoelectric sensor of the embodiment can be flexibly adjusted according to the actual application requirements, so that large-size packaging and small-size packaging can be realized, such as 2.0mm multiplied by 1.0mm, 2.0mm multiplied by 1.6mm and the like, and the packaging thickness can be flexibly adjusted by adjusting the amount of injected glue; 0.7mm, 1.0mm and the like, and provides great flexibility for adapting to different application requirements.
In this embodiment, when manufacturing the photoelectric sensor, first, a substrate 1 (such as the substrate 1 shown in fig. 2 a) provided with a first mounting location 11 and a second mounting location 12 is provided, then, a light emitting unit 100 and a light signal receiving unit 200 are respectively fixed to the first mounting location 11 and the second mounting location 12 of the substrate 1 (such as shown in fig. 2 b), then, the substrate 1 may be placed into a dedicated Molding and potting device, a protective glue layer 2 (such as shown in fig. 2 d) is obtained by using glue-pouring Molding, and then, a protective glue layer on the left side of the light emitting unit 100, a protective glue layer between the light emitting unit 100 and the light signal receiving unit 200, and a protective glue layer on the right side of the light signal receiving unit 200 are cut off by a cutting process to obtain a first glue-pouring location 301, a second glue-pouring location 302, a second glue-location 11, and a second glue location 12, A third glue filling position 303, a fourth glue filling position 304, a fifth glue filling position 305, a first protective glue layer 21 and a second protective glue layer 22 (as shown in fig. 3 a), and finally, a first light shielding glue layer 31, a second light shielding glue layer 32, a third light shielding glue layer 33, a fourth light shielding glue layer 34 and a fifth light shielding glue layer 35 (as shown in fig. 3 b) are respectively formed at the first glue filling position 301, the second glue filling position 302, the third glue filling position 303, the fourth glue filling position 304 and the fifth glue filling position 305 by means of glue dispensing.
That is, in this embodiment, the light-shielding glue layer 3 further includes a fourth light-shielding layer 34 and a fifth light-shielding layer 35; between the fourth light shielding layer 34 and the fifth light shielding layer 35 are the first protective glue layer 21 and the second protective glue layer 22, so that the first light shielding layer 31, the third light shielding layer 33, the fourth light shielding layer 34 and the fifth light shielding layer 35 are disposed around the first protective glue layer 21 and the second protective glue layer 22. In other words, the lengths of the first protective adhesive layer 21 and the second protective adhesive layer 22 in this embodiment are smaller than the length of the substrate 1, so that a certain gap is reserved between the two ends of the first protective adhesive layer 21 and the second protective adhesive layer 22 and the two ends of the substrate 1, and the gap is filled with the fourth light shielding layer 34 and the fifth light shielding layer 35. Thus, the optical signal interference of other electronic devices can be shielded in all directions.
In a more specific embodiment, the upper surface and the lower surface of the substrate 1 of the present embodiment are each provided with four conductive potentials. Specifically, referring to fig. 2a, a first conductive potential 101, a first connection conductive potential 102, a second conductive potential 103, and a second connection conductive potential 104 are provided on the upper surface of the substrate 1, a first mounting site 11 is provided on the first conductive potential 101, and a second mounting site 12 is provided on the second conductive potential 103; wherein the light emitting unit 100 at the first mounting location 11 is in communication with the first conductive connection 102 via a first conductive line 105, and the light signal receiving unit 200 at the second mounting location 12 is in communication with the second conductive connection 104 via a second conductive line 106. The position of the first mounting location 11 at the first conductive potential 102 and the position of the second mounting location 12 at the second conductive potential 103 can be flexibly adjusted according to practical applications, in other words, it can also be understood that the light emitting unit 100 and the light signal receiving unit 200 are directly fixed to the first conductive potential 102 and the second conductive potential 103, respectively.
The lower surface of the substrate 1 is provided with a third conduction potential, a third connection conduction potential, a fourth conduction potential, and a fourth connection conduction potential (not shown) corresponding to the first conduction potential 101, the first connection conduction potential 102, the second conduction potential 103, and the second connection conduction potential 104, respectively. And a first via 1001 for connecting the first conductive potential 101 and the third conductive potential, a second via 1002 for connecting the first connection conductive potential 102 and the third connection conductive potential, a third via 1003 for connecting the second conductive potential 103 and the fourth conductive potential, and a fourth via 1004 for connecting the second connection conductive potential 104 and the fourth connection conductive potential are provided on both sides of the substrate 1, respectively. These through holes may serve to electrically connect the upper and lower conductive sites of the substrate 1. Optionally, the shapes and sizes of the four conductive potentials disposed on the upper surface and the lower surface of the substrate 1 may be flexibly adjusted according to practical applications or heat dissipation requirements, which is not limited in this embodiment.
According to the above design, when manufacturing the photoelectric sensor, after the light emitting unit 100 and the optical signal receiving unit 200 are respectively fixed on the substrate 1, the light emitting unit 100 and the optical signal receiving unit 200 are further respectively connected with the first connection conductive potential 102 and the second connection conductive potential 104 of the substrate 1 through the first conductive line 105 and the second conductive line 106, and then the subsequent operation of the glue injection process is performed. It should be noted that the photoelectric sensor of the present embodiment is not limited to the above-mentioned design (i.e. the way of setting four conductive potentials on the upper and lower surfaces of the substrate 1 and then connecting the light emitting unit 100 and the light signal receiving unit 200 through the conductive wires), and those skilled in the art can flexibly design the substrate 1, the light emitting unit 100 and the light signal receiving unit 200 according to actual needs without departing from the protection scope of the present specification.
Referring to fig. 4, fig. 4 is a main flowchart of a method for manufacturing a photosensor according to an embodiment of the present invention. As shown in fig. 4, the method includes:
s410: a substrate is provided.
In this step, the upper surface of the substrate is at least provided with a first mounting location and a second mounting location, and for a specific exemplary structure of the substrate, reference may be made to the structural description of the substrate 1 above, which is not repeated herein.
S420: and fixing the light emitting unit and the light signal receiving unit to a first mounting position and a second mounting position of the substrate respectively.
In this step, the above description is referred to for the light emitting unit and the light signal receiving unit, and is not repeated herein.
S430: and forming a protective adhesive layer and a light shielding adhesive layer on the upper surface of the substrate by using glue injection equipment, wherein the protective adhesive layer and the light shielding adhesive layer cover the upper surface of the substrate.
The light emitting unit and the light signal receiving unit are respectively covered by the first protective adhesive layer and the second protective adhesive layer; the light shielding glue layer at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer, a first protection glue layer is arranged between the first light shielding glue layer and the second light shielding glue layer, and a second protection glue layer is arranged between the second light shielding glue layer and the third light shielding glue layer; the protective adhesive layer is used for protecting the light emitting unit and the optical signal receiving unit and allowing the optical signal of the light emitting unit to pass through; the light shielding glue layer is used for preventing the optical signal of the light emitting unit from passing through.
As an example, in step S430, after the first protective glue layer and the second protective glue layer are formed on the upper surface of the substrate by one-step molding using a dedicated apparatus, the first light-shielding glue layer, the second light-shielding glue layer and the third light-shielding glue layer may be formed on the upper surface of the substrate by using a dedicated apparatus. The glue injection equipment can be special equipment capable of realizing the mode.
As another example, in step S430, a protective glue layer covering the upper surface of the substrate may be formed on the upper surface of the substrate by using a glue injection device (e.g., a dedicated Molding glue injection device), and then the protective glue layer is cut to obtain a first protective glue layer and a second protective glue layer, as well as a first glue injection site located on the left side of the first protective glue layer, a second glue injection site located between the first protective glue layer and the second protective glue layer, and a third glue injection site located on the right side of the second protective glue layer; and cutting off the protective glue layers at the first glue filling position, the second glue filling position and the third glue filling position, and forming corresponding light shielding glue layers at the glue filling positions in a glue dispensing or glue filling mode.
For a more detailed description of the manufacturing method, reference may be made to the description of the photosensor above, and further description is omitted here. Due to the flexibility of the process, the overall packaging size of the photoelectric sensor of the embodiment can be flexibly adjusted according to the actual application requirements, so that large-size packaging and small-size packaging can be realized, such as 2.0mm multiplied by 1.0mm, 2.0mm multiplied by 1.6mm and the like, and the packaging thickness can be flexibly adjusted by adjusting the amount of injected glue; 0.7mm, 1.0mm and the like, and provides great flexibility for adapting to different application requirements.
Based on the same inventive concept, the embodiment also provides an electronic device, which includes the above-mentioned photosensor, or includes the photosensor manufactured by the above-mentioned manufacturing method.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A packaging structure of a photoelectric sensor is characterized by comprising:
the optical signal transmission device comprises a substrate, wherein a first mounting position and a second mounting position are arranged on the upper surface of the substrate, a light emitting unit is fixed on the first mounting position, and an optical signal receiving unit is fixed on the second mounting position;
the protective adhesive layer is formed on the upper surface of the substrate in an adhesive injection mode and comprises a first protective adhesive layer and a second protective adhesive layer, wherein the first protective adhesive layer and the second protective adhesive layer respectively cover the light emitting unit and the optical signal receiving unit;
the light shielding glue layer is formed on the upper surface of the substrate in a glue injection mode and at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer, wherein a first protection glue layer is arranged between the first light shielding glue layer and the second light shielding glue layer, and a second protection glue layer is arranged between the second light shielding glue layer and the third light shielding glue layer;
the protective adhesive layer is used for protecting the light emitting unit and the optical signal receiving unit and allowing the optical signal of the light emitting unit to pass through; the light shielding glue layer is used for preventing the optical signal of the light emitting unit from passing through.
2. The package structure of the photoelectric sensor according to claim 1, wherein a lower surface of the light shielding adhesive layer is lower than an upper surface of the light emitting unit;
and/or the lower surface of the light shielding glue layer is lower than the upper surface of the optical signal receiving unit.
3. The packaging structure of the photoelectric sensor as claimed in claim 1, wherein the width of the second light shielding glue layer is 30% -80% of the distance between the light emitting unit and the light signal receiving unit;
and the first light shielding glue layer and the third light shielding glue layer respectively account for 20% -60% of the width of the second light shielding glue layer.
4. The package structure of the photoelectric sensor of claim 1, wherein the sum of the area covered by the protective adhesive layer on the upper surface of the substrate and the area covered by the light shielding adhesive layer on the upper surface of the substrate is equal to the area of the upper surface of the substrate.
5. The package structure of the photoelectric sensor of claim 1, wherein the protective adhesive layer comprises an ambient light filtering material or a band-pass material, the ambient light filtering material is used for filtering an optical signal that can generate interference from the external environment of the photoelectric sensor, and the band-pass material is capable of passing light of a specific wavelength band.
6. The package structure of the photoelectric sensor as claimed in any one of claims 1 to 5, wherein a first conductive potential, a first conductive connection site, a second conductive potential, and a second conductive connection site are disposed on the upper surface of the substrate, the first mounting site is disposed at the first conductive potential, and the second mounting site is disposed at the second conductive potential;
wherein the light emitting unit at the first mounting position is communicated with the first connecting conducting potential through a first conducting wire, and the light signal receiving unit at the second mounting position is communicated with the second connecting conducting potential through a second conducting wire.
7. The package structure of the photoelectric sensor according to claim 6, wherein a third conducting potential, a third conducting connection site, a fourth conducting potential, and a fourth conducting connection site, which correspond to the first conducting potential, the first conducting connection site, the second conducting potential, and the second conducting connection site one to one, are disposed on the lower surface of the substrate;
and a first through hole for connecting the first conductive potential and the third conductive potential, a second through hole for connecting the first conductive connecting position and the third conductive connecting position, a third through hole for connecting the second conductive connecting position and the fourth conductive connecting position and a fourth through hole for connecting the second conductive connecting position and the fourth conductive connecting position are respectively arranged on two sides of the substrate.
8. A method of fabricating a photosensor, comprising:
providing a substrate, wherein the upper surface of the substrate is at least provided with a first mounting position and a second mounting position;
fixing a light emitting unit and a light signal receiving unit to a first mounting position and a second mounting position of the substrate, respectively;
forming a protective adhesive layer and a light shielding adhesive layer on the upper surface of the substrate by using adhesive injection equipment, wherein the protective adhesive layer and the light shielding adhesive layer cover the upper surface of the substrate;
the protective adhesive layer comprises a first protective adhesive layer and a second protective adhesive layer, and the first protective adhesive layer and the second protective adhesive layer respectively cover the light emitting unit and the light signal receiving unit; the light shielding glue layer at least comprises a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer, a first protection glue layer is arranged between the first light shielding glue layer and the second light shielding glue layer, and a second protection glue layer is arranged between the second light shielding glue layer and the third light shielding glue layer;
the protective adhesive layer is used for protecting the light emitting unit and the optical signal receiving unit and allowing the optical signal of the light emitting unit to pass through; the light shielding glue layer is used for preventing the optical signal of the light emitting unit from passing through.
9. The manufacturing method according to claim 8, wherein forming a protective adhesive layer and a light shielding adhesive layer on the upper surface of the substrate by using an adhesive injection device includes:
forming a first protective adhesive layer and a second protective adhesive layer on the upper surface of the substrate in a one-step forming mode by using special equipment;
forming a first light shielding glue layer, a second light shielding glue layer and a third light shielding glue layer on the upper surface of the substrate by using special equipment;
or, forming a protection glue layer and a light shielding glue layer on the upper surface of the substrate by using glue injection equipment, wherein the protection glue layer and the light shielding glue layer cover the upper surface of the substrate, and the method comprises the following steps:
forming a protective adhesive layer covering the upper surface of the substrate on the upper surface of the substrate by using adhesive injection equipment;
cutting the protection glue layer to obtain a first protection glue layer, a second protection glue layer, a first glue filling position located on the left side of the first protection glue layer, a second glue filling position located between the first protection glue layer and the second protection glue layer, and a third glue filling position located on the right side of the second protection glue layer; cutting off the protective glue layers at the first glue filling position, the second glue filling position and the third glue filling position;
and forming light shielding glue filling layers at the first glue filling position, the second glue filling position and the third glue filling position respectively in a glue dispensing or glue filling mode.
10. An electronic device, characterized in that the electronic device comprises the photosensor of any one of claims 1 to 6;
alternatively, the electronic device comprises the photoelectric sensor manufactured by the manufacturing method of claim 8 or 9.
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| CN202111203829.8A CN113851462A (en) | 2021-10-15 | 2021-10-15 | Photoelectric sensor packaging structure, manufacturing method thereof and electronic equipment |
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| CN202111203829.8A CN113851462A (en) | 2021-10-15 | 2021-10-15 | Photoelectric sensor packaging structure, manufacturing method thereof and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298761A (en) * | 2016-09-24 | 2017-01-04 | 苏州捷研芯纳米科技有限公司 | Photosensor package part, semi-finished product and batch method for packing |
| CN113257926A (en) * | 2021-05-12 | 2021-08-13 | 深圳市汇春科技股份有限公司 | Method for packaging image sensor and light filtering glue packaging sensor |
| CN216818334U (en) * | 2021-10-15 | 2022-06-24 | 北京易美新创科技有限公司 | Photoelectric sensor's packaging structure and electronic equipment |
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2021
- 2021-10-15 CN CN202111203829.8A patent/CN113851462A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298761A (en) * | 2016-09-24 | 2017-01-04 | 苏州捷研芯纳米科技有限公司 | Photosensor package part, semi-finished product and batch method for packing |
| CN113257926A (en) * | 2021-05-12 | 2021-08-13 | 深圳市汇春科技股份有限公司 | Method for packaging image sensor and light filtering glue packaging sensor |
| CN216818334U (en) * | 2021-10-15 | 2022-06-24 | 北京易美新创科技有限公司 | Photoelectric sensor's packaging structure and electronic equipment |
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