CN113257926A - Method for packaging image sensor and light filtering glue packaging sensor - Google Patents
Method for packaging image sensor and light filtering glue packaging sensor Download PDFInfo
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- CN113257926A CN113257926A CN202110516598.XA CN202110516598A CN113257926A CN 113257926 A CN113257926 A CN 113257926A CN 202110516598 A CN202110516598 A CN 202110516598A CN 113257926 A CN113257926 A CN 113257926A
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- image sensor
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- filter
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- 239000003292 glue Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 238000001914 filtration Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 239000000853 adhesive Substances 0.000 claims abstract description 44
- 230000001070 adhesive effect Effects 0.000 claims abstract description 44
- 230000003287 optical effect Effects 0.000 claims abstract description 27
- 238000001228 spectrum Methods 0.000 claims abstract description 9
- 238000012360 testing method Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 238000011056 performance test Methods 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 238000009954 braiding Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000009501 film coating Methods 0.000 abstract description 4
- 239000012788 optical film Substances 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 48
- 239000000047 product Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 10
- 238000003860 storage Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
Abstract
The embodiment of the invention discloses a method for packaging an image sensor and a filter adhesive packaging sensor, wherein the method comprises the following steps: fixing a full-spectrum photosensitive image sensor wafer on a substrate by using a conductive adhesive; curing the conductive adhesive; electrically connecting pads of the image sensor die with pads of the substrate; encapsulating the light filtering glue on the substrate by using a glue dispenser, and covering the image sensor wafer; and curing the optical filtering glue to obtain a packaged product. The process of using the embedment light filtering glue replaces the traditional mode of optical film coating on the surface of the wafer, so that the production cost and the technical difficulty are greatly reduced, the production efficiency is improved, and the encapsulation volume is effectively reduced compared with the mode of adhering a light filter on the surface.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a method for packaging an image sensor and a light filtering glue packaged sensor.
Background
An image sensor is a functional device that divides an optical image on its light-receiving surface into a plurality of small cells and converts them into usable electrical signals. Among them, a great deal of CMOS sensors are currently used in image sensors, and CMOS (Complementary Metal-Oxide-Semiconductor) sensors are internally composed of CMOS photosensitive arrays, which are often applied to products with lower image quality, and have low manufacturing cost and low power consumption, which is the development direction of image sensors.
Because the CMOS is sensitive to the full spectrum, in some special applications (infrared image sensors), in order to filter out the light component of the interference band, a method of spraying a narrow-band filter film on the surface of a wafer or a method of adding an infrared narrow-band filter on the structure to filter out the interference light source is generally adopted. However, the method of spraying the narrow-band light filter film on the surface of the wafer photosensitive area has complex process, high requirements on production equipment and technology, and high difficulty in controlling the production yield, which causes high cost and difficulty in production; as for the way of attaching the optical narrow-band filter on the surface of the sensor product to filter out the interference band light component, the filter is expensive in cost, and the product structure and volume are more complicated and bulky.
Thus, there is a need for a better method to solve the problems of the prior art.
Disclosure of Invention
In view of the above, the invention provides a method for packaging an image sensor and a filter glue packaged sensor, and the method uses a process of encapsulating the filter glue to replace the traditional mode of optical film coating on the surface of a wafer, thereby greatly reducing the production cost and the technical difficulty, improving the production efficiency, and effectively reducing the packaging volume compared with the mode of surface mounting a filter.
Specifically, the present invention proposes the following specific examples:
the embodiment of the invention provides a method for packaging an image sensor, which comprises the following steps:
fixing a full-spectrum photosensitive image sensor wafer on a substrate by using a conductive adhesive;
curing the conductive adhesive;
electrically connecting pads of the image sensor die with pads of the substrate;
encapsulating the light filtering glue on the substrate by using a glue dispenser, and covering the image sensor wafer;
and curing the optical filtering glue to obtain a packaged product.
In a specific embodiment, the image sensor die includes: a CMOS image sensor cell; the conductive adhesive comprises conductive silver adhesive.
In a specific embodiment, the "fixing the image sensor wafer on the substrate using the conductive paste" includes:
and fixing the bottom of the image sensor wafer at the center of the top of the substrate by using conductive adhesive through a die bonder.
In a specific embodiment, the "curing the conductive paste" includes:
and baking the substrate fixed with the image sensor wafer for 50-70 minutes at the temperature of 180-200 ℃ to solidify the conductive adhesive.
In a specific embodiment, the bottom of the image sensor die is provided with a bonding pad, and the substrate is provided with a bonding pad which is communicated with the top of the substrate and the bottom of the substrate;
the "electrically connecting the pads of the image sensor die with the pads of the substrate" includes:
and connecting the bonding pad of the image sensor wafer and the bonding pad of the substrate by using an alloy wire through a wire bonding machine.
In a specific embodiment, the optical filter is an infrared optical filter for filtering light with a wavelength below 800 nm.
In a specific embodiment, a groove for arranging the image sensor wafer is arranged on the substrate; the depth of the groove is greater than the thickness of the image sensor wafer;
"use point gum machine with filter glue embedment to on the base plate, and cover the image sensor wafer" includes:
and using a dispenser to encapsulate the light filtering glue in the groove on the substrate, so that the surface of the light filtering glue in the groove is flush with the edge of the substrate to cover the image sensor wafer.
In a specific embodiment, the "curing the filter paste" includes:
baking the optical filter glue encapsulated to the substrate at a temperature of 70-90 ℃ for 50-70 minutes to cure the optical filter glue.
In a specific embodiment, the method further comprises:
testing the photoelectric performance of the packaged product;
and (5) braiding the product which passes the photoelectric performance test.
The embodiment of the invention also provides a filter adhesive packaging sensor, which comprises: the image sensor comprises an image sensor wafer, a substrate, conductive glue and filter glue; the bottom of the image sensor wafer is fixed on the top of the substrate through the conductive adhesive, and a bonding pad at the bottom of the image sensor wafer is electrically connected with a bonding pad on the substrate; the top of the image sensor wafer is covered by the filter paste.
Therefore, the embodiment of the invention provides a method for packaging an image sensor and a filter adhesive packaging sensor, wherein the method comprises the following steps: fixing a full-spectrum photosensitive image sensor wafer on a substrate by using a conductive adhesive; curing the conductive adhesive; electrically connecting pads of the image sensor die with pads of the substrate; encapsulating the light filtering glue on the substrate by using a glue dispenser, and covering the image sensor wafer; and curing the optical filtering glue to obtain a packaged product. The method for packaging the image sensor provided by the invention uses the process of encapsulating the optical filter glue to replace the traditional mode of optical film coating on the surface of the wafer, greatly reduces the production cost and the technical difficulty, improves the production efficiency, and effectively reduces the packaging volume compared with the mode of surface mounting the optical filter.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings required to be used in the embodiments will be briefly described below, and it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope of the present invention. Like components are numbered similarly in the various figures.
Fig. 1 is a schematic flow chart illustrating a method of packaging an image sensor according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a front surface of a substrate involved in a method of packaging an image sensor according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a backside of a substrate involved in a method of packaging an image sensor according to an embodiment of the present invention;
fig. 4 is a schematic side view of a substrate involved in a method of packaging an image sensor according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating an image sensor fixed to a substrate by a conductive adhesive according to a method of packaging the image sensor according to an embodiment of the present invention;
fig. 6 is a schematic diagram illustrating a product obtained by a method for packaging an image sensor according to an embodiment of the present invention;
fig. 7 is a schematic diagram illustrating a substrate to be batch processed according to a method for packaging an image sensor according to an embodiment of the present invention;
fig. 8 shows a schematic diagram of a batch product obtained by a method for packaging an image sensor according to an embodiment of the present invention.
Illustration of the drawings:
1-a substrate; 11-substrate pad; 12-a groove;
2-an image sensor die; 3-conductive adhesive; 4-light filtering glue.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Hereinafter, the terms "including", "having", and their derivatives, which may be used in various embodiments of the present invention, are only intended to indicate specific features, numbers, steps, operations, elements, components, or combinations of the foregoing, and should not be construed as first excluding the existence of, or adding to, one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing.
Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present invention belong. The terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their contextual meaning in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in various embodiments of the present invention.
Example 1
As shown in fig. 1, a method for packaging an image sensor proposed in embodiment 1 of the present invention includes the following steps:
step S101, fixing a full-spectrum photosensitive image sensor wafer on a substrate 1 by using conductive adhesive;
as shown in fig. 2, fig. 3 and fig. 4, which are schematic views of the substrate 1, in this case, the "fixing the image sensor wafer 2 on the substrate 1 using the conductive paste 3" in step S101 includes:
the bottom of the image sensor wafer 2 is fixed at the center of the top of the substrate 1 by a conductive adhesive 3 through a die bonder.
Specifically, the bottom of the image sensor wafer 2 is provided with a bonding pad, and the bottom of the image sensor wafer 2 is fixed at the central position of the top of the substrate 1 (specifically, for example, the central position is preset with a central coordinate, which is convenient for solid crystal identification and positioning), so that subsequent wiring operation of the bonding pad can be facilitated, and a lead can be led out.
Specifically, the substrate 1 may be a light-emitting diode (LED) package substrate, or may be an IC (Integrated Circuit Chip) package substrate with a mold opening or other structure, and the filter glue is encapsulated.
Furthermore, the top of the substrate 1 may be further provided with a groove 12, the bottom of the image sensor wafer 2 is fixed in the groove 12, and for better fixation, the conductive adhesive 3 is used to fix the image sensor wafer 2 with full spectrum light sensing on the substrate 1.
Adopt conductive adhesive 3 fixed image sensor wafer 2 that once can be fine, two conductive adhesive 3 still have heat conduction and electrically conductive effect, from this, can pass through the heat dissipation of base plate 1 with the heat that image sensor wafer 2 during operation produced, life-span that can effectual promotion sensor.
In addition, the bottom of the image sensor wafer 2 is also provided with a bonding pad, and subsequent wiring operation cannot be influenced due to the conductivity during subsequent welding.
Specifically, the image sensor cell 2 includes: a CMOS image sensor cell; besides CMOS image sensor cells, other image sensor cells that can achieve full spectrum light sensing are also possible.
The conductive adhesive 3 comprises conductive silver adhesive. The conductive silver adhesive mainly comprises a resin matrix, conductive particles, a dispersing additive, an auxiliary agent and the like, has electrical conductivity and thermal conductivity, has an easy curing effect, can be well suitable for the requirements of fixing the image sensor wafer 2 and the substrate 1 in the scheme, and ensures the reliable and stable operation of the image sensor wafer 2.
Step S102, solidifying the conductive adhesive;
specifically, the step S102 of "curing the conductive paste" includes:
and baking the substrate 1 fixed with the image sensor wafer 2 for 50-70 minutes at the temperature of 180-200 ℃ to cure the conductive adhesive 3.
Further, for example, the temperature of an oven is set, and the fixed substrate 1 is baked for 1 hour at 190 ℃ to cure the silver colloid; the specific temperature may be 181, 182, 183, 184, 185, 186, 187, 188, 189, 191, 192, 193, 194, 195, 196, 197 degrees celsius, and the specific time may be any length of time from 50 to 70 minutes, for example.
After the above steps, the image sensor wafer 2 and the substrate 1 after the conductive adhesive 3 is cured are as shown in fig. 5.
Step S103, electrically connecting a pad of the image sensor die with a pad of the substrate;
further, as shown in fig. 2, 3 and 4, the bottom of the image sensor die 2 is provided with a bonding pad (not shown), and the substrate 1 is provided with a bonding pad (such as the substrate bonding pad 11 in fig. 2, 3 and 4) connecting the top of the substrate 1 and the bottom of the substrate 1;
the step S103 of "electrically connecting the pads of the image sensor die and the pads of the substrate" includes:
the bonding pads of the image sensor die 2 and the bonding pads of the substrate 1 are connected by a bonding wire machine using alloy wires.
Specifically, when the soldering operation is performed, the solidified conductive adhesive 3 may be cooled before the soldering operation.
Step S104, encapsulating the filter glue on a substrate by using a glue dispenser, and covering the image sensor wafer;
specifically, the optical filter 4 may be an infrared optical filter 4 that filters light having a wavelength of 800nm or less. In addition, the filter glue 4 can also adopt other filter glues 4 for filtering light with other wavelength lengths so as to meet different requirements. For example, the components of the filter glue can be changed to produce an image sensor working at other wavelengths, for example, the filter glue can only pass green (550nm) filter glue, and only green objects can be imaged, so that the effect of color identification is achieved.
Further, a groove 12 for arranging the image sensor wafer 2 is arranged in the middle of the substrate 1; the depth of the groove 12 is greater than the thickness of the image sensor wafer 2;
the "potting filter paste onto the substrate using a dispenser and covering the image sensor wafer" in step S104 includes:
using a dispenser to encapsulate the groove 12 on the substrate 1 with the filter glue 4, so that the surface of the filter glue 4 in the groove 12 is flush with the edge of the substrate 1 to cover the image sensor wafer 2.
As shown in fig. 6, in order to fill and seal the substrate 1 with the filter paste 4, the image sensor wafer 2 is already covered, and the light obtained by the subsequent image sensor wafer 2 is filtered by the filter paste 4.
And S105, curing the optical filtering glue to obtain a packaged product.
Specifically, the step S105 of "curing the optical filter paste" includes:
baking the filter paste 4 potted to the substrate 1 at a temperature of 70-90 ℃ for 50-70 minutes to cure the filter paste 4.
Further, in a specific embodiment, the semi-finished product filled with the optical filter glue 4 may be baked for 1 hour at 80 ℃ to cure the optical filter glue 4; the specific temperature and time can be flexibly selected according to the curing requirements of different optical filter adhesives 4, so that the optical filter adhesives 4 can be finally cured. For example, the temperature may be 71, 72, 73, 74, 75, 76, 77, 78, 81, 82, 83, 84, 85, 86, or the like, and the specific time may be any time length within the range of 50 to 70 minutes.
In addition, as shown in fig. 7 and 8, the above steps can be performed simultaneously for a plurality of substrates 1 and a plurality of image sensor dies 2, so as to increase the efficiency of the package.
After the encapsulating, the method may further include: and carrying out photoelectric performance test on the packaged product.
The specific photoelectric performance test can be performed by selecting different test items according to different image sensor wafers 2 and different requirements. Specifically, the packaged image sensor die 2 may be tested using test equipment.
After the testing is performed, the method may further comprise: and (5) braiding the product which passes the photoelectric performance test.
Specifically, an automatic taping machine can be used for taping the product passing the test, so as to facilitate subsequent operations such as storage, transportation and the like.
Example 2
Specifically, other related technical features are also disclosed in embodiment 2 of the present invention, and for details, reference is made to the description in embodiment 1 for the other related technical features, which are not described herein again.
Therefore, the embodiment of the invention provides a method for packaging an image sensor and a filter adhesive packaging sensor, wherein the method comprises the following steps: fixing a full-spectrum photosensitive image sensor wafer on the substrate 1 by using a conductive adhesive 3; curing the conductive adhesive 3; electrically connecting pads of the image sensor die with pads of the substrate 1; encapsulating the filter glue 4 on the substrate 1 by using a glue dispenser, and covering the image sensor wafer; and curing the filter glue 4 to obtain the packaged product. The method for packaging the image sensor provided by the invention uses the process of encapsulating the optical filter glue 4 to replace the traditional mode of optical film coating on the surface of the wafer, greatly reduces the production cost and the technical difficulty, improves the production efficiency, and effectively reduces the packaging volume compared with the mode of surface mounting the optical filter.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method can be implemented in other ways. The apparatus embodiments described above are merely illustrative and, for example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
In addition, each functional module or unit in each embodiment of the present invention may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
The functions, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention or a part of the technical solution that contributes to the prior art in essence can be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a smart phone, a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (10)
1. A method of packaging an image sensor, comprising:
fixing a full-spectrum photosensitive image sensor wafer on a substrate by using a conductive adhesive;
curing the conductive adhesive;
electrically connecting pads of the image sensor die with pads of the substrate;
encapsulating the light filtering glue on the substrate by using a glue dispenser, and covering the image sensor wafer;
and curing the optical filtering glue to obtain a packaged product.
2. The method of claim 1, wherein the image sensor die comprises: a CMOS image sensor cell; the conductive adhesive comprises conductive silver adhesive.
3. The method according to claim 1 or 2, wherein said "fixing the image sensor wafer on the substrate using the conductive paste" comprises:
and fixing the bottom of the image sensor wafer at the center of the top of the substrate by using conductive adhesive through a die bonder.
4. The method of claim 1 or 2, wherein said "curing said conductive paste" comprises:
and baking the substrate fixed with the image sensor wafer for 50-70 minutes at the temperature of 180-200 ℃ to solidify the conductive adhesive.
5. The method according to claim 1, wherein a bottom of the image sensor die is provided with a pad, and the substrate is provided with a pad communicating a top of the substrate with a bottom of the substrate;
the "electrically connecting the pads of the image sensor die with the pads of the substrate" includes:
and connecting the bonding pad of the image sensor wafer and the bonding pad of the substrate by using an alloy wire through a wire bonding machine.
6. The method of claim 1 or 2, wherein the optical filter is an infrared filter that filters light having a wavelength of 800nm or less.
7. The method according to claim 1, wherein a recess for disposing the image sensor wafer is provided on the substrate; the depth of the groove is greater than the thickness of the image sensor wafer;
"use point gum machine with filter glue embedment to on the base plate, and cover the image sensor wafer" includes:
and using a dispenser to encapsulate the light filtering glue in the groove on the substrate, so that the surface of the light filtering glue in the groove is flush with the edge of the substrate to cover the image sensor wafer.
8. The method of claim 1, wherein said "curing said filter glue" comprises:
baking the optical filter glue encapsulated to the substrate at a temperature of 70-90 ℃ for 50-70 minutes to cure the optical filter glue.
9. The method of claim 1, further comprising:
testing the photoelectric performance of the packaged product;
and (5) braiding the product which passes the photoelectric performance test.
10. An optical filter adhesive package sensor, comprising: the image sensor comprises an image sensor wafer, a substrate, conductive glue and filter glue; the bottom of the image sensor wafer is fixed on the top of the substrate through the conductive adhesive, and a bonding pad at the bottom of the image sensor wafer is electrically connected with a bonding pad on the substrate; the top of the image sensor wafer is covered by the filter paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110516598.XA CN113257926A (en) | 2021-05-12 | 2021-05-12 | Method for packaging image sensor and light filtering glue packaging sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110516598.XA CN113257926A (en) | 2021-05-12 | 2021-05-12 | Method for packaging image sensor and light filtering glue packaging sensor |
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| CN113257926A true CN113257926A (en) | 2021-08-13 |
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| CN202110516598.XA Pending CN113257926A (en) | 2021-05-12 | 2021-05-12 | Method for packaging image sensor and light filtering glue packaging sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113885154A (en) * | 2021-09-26 | 2022-01-04 | 武汉光迅科技股份有限公司 | Optical filter assembly and manufacturing method thereof |
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| US20090159900A1 (en) * | 2007-12-21 | 2009-06-25 | Avagon Tewchnologies General Ip (Singapore) Pte. Ltd. | Infrared Proximity Sensor Package with Reduced Crosstalk |
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Application publication date: 20210813 |